Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659833
M. Hornung, O. Brand, O. Paul, H. Baltes, C. Kuratli, Q. Huang
We report on a packaged miniaturized ultrasound based distance measurement system. The measurement principle is based on acoustic resonances between object and sensor, similar to the Fabry-Perot principle known in optics. The sensor system consists of two micromachined membrane resonators acting as ultrasound transmitter and receiver. The proximity sensor can measure distances in air in the range of 1 to 10 cm with an accuracy better than 0.8 mm.
{"title":"Micromachined acoustic Fabry-Perot system for distance measurement","authors":"M. Hornung, O. Brand, O. Paul, H. Baltes, C. Kuratli, Q. Huang","doi":"10.1109/MEMSYS.1998.659833","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659833","url":null,"abstract":"We report on a packaged miniaturized ultrasound based distance measurement system. The measurement principle is based on acoustic resonances between object and sensor, similar to the Fabry-Perot principle known in optics. The sensor system consists of two micromachined membrane resonators acting as ultrasound transmitter and receiver. The proximity sensor can measure distances in air in the range of 1 to 10 cm with an accuracy better than 0.8 mm.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125010516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659830
A. Leung, J. Jones, E. Czyzewska, J. Chen, B. Woods
A micromachined thermal accelerometer that is simple, reliable, and inexpensive to make has been developed at Simon Fraser University. The operating principle of this accelerometer is based on the free-convection heat transfer of a small hot air bubble in a sealed chamber. An experimental device that requires only four masking steps to fabricate has been built. This device has demonstrated a 0.6 milli-g sensitivity that can theoretically be extended to sub-micro-g level: A 2-axis accelerometer based on the same operating principle has also been fabricated and tested.
{"title":"Micromachined accelerometer based on convection heat transfer","authors":"A. Leung, J. Jones, E. Czyzewska, J. Chen, B. Woods","doi":"10.1109/MEMSYS.1998.659830","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659830","url":null,"abstract":"A micromachined thermal accelerometer that is simple, reliable, and inexpensive to make has been developed at Simon Fraser University. The operating principle of this accelerometer is based on the free-convection heat transfer of a small hot air bubble in a sealed chamber. An experimental device that requires only four masking steps to fabricate has been built. This device has demonstrated a 0.6 milli-g sensitivity that can theoretically be extended to sub-micro-g level: A 2-axis accelerometer based on the same operating principle has also been fabricated and tested.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127184382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659794
L. Guérin, O. Dubochet, J.-F. Zeberli, P. Clot, P. Renaud
Many microvalves have already been designed and developed. Two types can be found: passive check valves and active valves. However, for some applications, it is needed to open a flow channel only once in order, for example, to trigger a mixing reaction on a micro-bioreactor or to deliver drug sample in smart micropills. In this paper, a new simple one-shot microvalve for single-use applications is described.
{"title":"Miniature one-shot valve","authors":"L. Guérin, O. Dubochet, J.-F. Zeberli, P. Clot, P. Renaud","doi":"10.1109/MEMSYS.1998.659794","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659794","url":null,"abstract":"Many microvalves have already been designed and developed. Two types can be found: passive check valves and active valves. However, for some applications, it is needed to open a flow channel only once in order, for example, to trigger a mixing reaction on a micro-bioreactor or to deliver drug sample in smart micropills. In this paper, a new simple one-shot microvalve for single-use applications is described.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130894355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659765
K. Muller, W. Bacher, M. Heckele
A great variety of uses of microsystems opens up when sensors and actuators are supplemented by powerful electronics. In silicon technology, the monolithic integration of micromechanical and microelectronic components into one system is possible in a sequence of process steps, although only very few basic sensor and actuator principles can be put into effect. LIGA technology, with the latitude it offers with regard to lateral geometry at high aspect ratios, and its great variety of materials, allows many different sensor and actuator principles to be put into effect. However, integration with microelectronics circuits so far has been possible only in a hybrid way. The new process described in this paper is characterized by the separation of the molding process from the positioning and bonding processes. First, a microstructured polymer film is produced by hot embossing on an auxiliary substrate. Next this self-supporting polymer film is joined to the prestructured wafer by thermal bonding. In this way it is possible, irrespective of the size of the molding tool and the embossing conditions, to position microstructures on a variety of substrates, e.g. by the pick-and-place technique. Finally, the quality of the joint between substrate and microstructured polymer film is demonstrated by using the film as lost form for galvanoforming metallic microstructures on top of the wafer.
{"title":"Flexible integration of nonsilicon microstructures on microelectronic circuits","authors":"K. Muller, W. Bacher, M. Heckele","doi":"10.1109/MEMSYS.1998.659765","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659765","url":null,"abstract":"A great variety of uses of microsystems opens up when sensors and actuators are supplemented by powerful electronics. In silicon technology, the monolithic integration of micromechanical and microelectronic components into one system is possible in a sequence of process steps, although only very few basic sensor and actuator principles can be put into effect. LIGA technology, with the latitude it offers with regard to lateral geometry at high aspect ratios, and its great variety of materials, allows many different sensor and actuator principles to be put into effect. However, integration with microelectronics circuits so far has been possible only in a hybrid way. The new process described in this paper is characterized by the separation of the molding process from the positioning and bonding processes. First, a microstructured polymer film is produced by hot embossing on an auxiliary substrate. Next this self-supporting polymer film is joined to the prestructured wafer by thermal bonding. In this way it is possible, irrespective of the size of the molding tool and the embossing conditions, to position microstructures on a variety of substrates, e.g. by the pick-and-place technique. Finally, the quality of the joint between substrate and microstructured polymer film is demonstrated by using the film as lost form for galvanoforming metallic microstructures on top of the wafer.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130287084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659822
Pang-Cheng Hsu, C. Mastrangelo, K. D. Wise
This paper presents the analysis, design, fabrication, and testing of a condenser microphone utilizing a thin low-stress polycrystalline silicon diaphragm suspended above a p+ perforated back plate. The microphone is fabricated using a combination of surface and bulk micromachining techniques in a single wafer process without the need of wafer bonding. The device shows sensitivities of -34 dB (ref. To 1 V/Pa) for 2 mm diaphragms with bias of 13 V and -37 dB for 2.6 mm-wide diaphragms at 10 V in good agreement with expected performance calculations.
{"title":"A high sensitivity polysilicon diaphragm condenser microphone","authors":"Pang-Cheng Hsu, C. Mastrangelo, K. D. Wise","doi":"10.1109/MEMSYS.1998.659822","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659822","url":null,"abstract":"This paper presents the analysis, design, fabrication, and testing of a condenser microphone utilizing a thin low-stress polycrystalline silicon diaphragm suspended above a p+ perforated back plate. The microphone is fabricated using a combination of surface and bulk micromachining techniques in a single wafer process without the need of wafer bonding. The device shows sensitivities of -34 dB (ref. To 1 V/Pa) for 2 mm diaphragms with bias of 13 V and -37 dB for 2.6 mm-wide diaphragms at 10 V in good agreement with expected performance calculations.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129244176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659814
R. Linnemann, P. Woias, C.-D. Senfft, J. Ditterich
In this paper a novel silicon micropump for liquids and gases is presented, which is tolerant towards gas-bubbles and which is able to prime itself. The micropump is based on a piezoelectrically driven diaphragm actuator, which is combined with a valve unit consisting of two cantilever valves. The self-priming and bubble-tolerant operation mode was achieved by maximizing the compression ratio, which was realized by minimizing the dead volume of the valve unit as well as of the actuator unit and by maximizing the stroke volume of the pump diaphragm. The optimization of the actuator is based on simulations and experimental investigations of the pump diaphragm displacement. These studies yield the optimal dimensions of the pump diaphragm and the piezoactuator. The piezoelectrically actuated micropump was characterized by investigating the pump rate in dependence of the actuation frequency and the pressure on the inlet and the outlet port of the micropump. As essential results a maximum pumprate of 1 mY/min and a maximum backpressure of about I bar were measured for water. For gases the pumprate ranges up to 3 ml/min.
{"title":"A self-priming and bubble-tolerant piezoelectric silicon micropump for liquids and gases","authors":"R. Linnemann, P. Woias, C.-D. Senfft, J. Ditterich","doi":"10.1109/MEMSYS.1998.659814","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659814","url":null,"abstract":"In this paper a novel silicon micropump for liquids and gases is presented, which is tolerant towards gas-bubbles and which is able to prime itself. The micropump is based on a piezoelectrically driven diaphragm actuator, which is combined with a valve unit consisting of two cantilever valves. The self-priming and bubble-tolerant operation mode was achieved by maximizing the compression ratio, which was realized by minimizing the dead volume of the valve unit as well as of the actuator unit and by maximizing the stroke volume of the pump diaphragm. The optimization of the actuator is based on simulations and experimental investigations of the pump diaphragm displacement. These studies yield the optimal dimensions of the pump diaphragm and the piezoactuator. The piezoelectrically actuated micropump was characterized by investigating the pump rate in dependence of the actuation frequency and the pressure on the inlet and the outlet port of the micropump. As essential results a maximum pumprate of 1 mY/min and a maximum backpressure of about I bar were measured for water. For gases the pumprate ranges up to 3 ml/min.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126173312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659795
N. Hey, M. Freygang, H. Gruhler, H. Sandmaier, R. Zengerle
A new multifunctional device is presented for the first time dosing liquids of high precision in the range of a few picoliter up to 230 nanoliter by a single free liquid jet. In contrast to the working principle of ink jet heads the device is comprising two operating modes, the novel high dynamic volume ejection for nanoliter dosage, named LiquiJet-Mode, in addition to the acoustic wave technique of ink jet heads used for picoliter dosage (LiquiDrop-Mode). The device has been realized and successfully tested with liquids in the viscosity range from 1 mPas to 80 mPas.
{"title":"A new device for multifunctional dosage of liquids by a free jet","authors":"N. Hey, M. Freygang, H. Gruhler, H. Sandmaier, R. Zengerle","doi":"10.1109/MEMSYS.1998.659795","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659795","url":null,"abstract":"A new multifunctional device is presented for the first time dosing liquids of high precision in the range of a few picoliter up to 230 nanoliter by a single free liquid jet. In contrast to the working principle of ink jet heads the device is comprising two operating modes, the novel high dynamic volume ejection for nanoliter dosage, named LiquiJet-Mode, in addition to the acoustic wave technique of ink jet heads used for picoliter dosage (LiquiDrop-Mode). The device has been realized and successfully tested with liquids in the viscosity range from 1 mPas to 80 mPas.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"518 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120929535","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659821
E. Kalvesten, L. Smith, L. Tenerz, G. Stemme
A surface micromachined pressure sensor for blood pressure measurements has been commercialized. Using a polysilicon surface micromachining process, a silicon chip with the dimensions of 100/spl times/150/spl times/1300 /spl mu/m and a polysilicon diaphragm area of 103/spl times/103 /spl mu/m has been fabricated. The piezoresistive pressure sensor has a typical pressure sensitivity of 2.0 /spl mu/V/V mmHg which results in a blood pressure measurement accuracy better than 2 mmHg. This new pressure sensor is used clinically for blood pressure measurements in balloon angioplasty applications.
{"title":"The first surface micromachined pressure sensor for cardiovascular pressure measurements","authors":"E. Kalvesten, L. Smith, L. Tenerz, G. Stemme","doi":"10.1109/MEMSYS.1998.659821","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659821","url":null,"abstract":"A surface micromachined pressure sensor for blood pressure measurements has been commercialized. Using a polysilicon surface micromachining process, a silicon chip with the dimensions of 100/spl times/150/spl times/1300 /spl mu/m and a polysilicon diaphragm area of 103/spl times/103 /spl mu/m has been fabricated. The piezoresistive pressure sensor has a typical pressure sensitivity of 2.0 /spl mu/V/V mmHg which results in a blood pressure measurement accuracy better than 2 mmHg. This new pressure sensor is used clinically for blood pressure measurements in balloon angioplasty applications.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116586722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659755
K. Feindt, A. Harnisch, V. Zoppig, D. Hűlsenberg, E. Kallenbach
Up to now it is possible to etch through the whole wafer or in a defined depth, but not with the same etching process. Structures with a defined depth had to be produced with a second UV-exposure followed by a second etching process. A new technology allows a 3D etching process in photosensitive glass. A lot of lines with a defined width and pattern are made in a chromium layer on vitreous silica. A pattern of different grey scales can be produced with that technology. The grey scale mask results in different intensities of W-light during the exposure. Due to the different intensities, the exposure of different areas is in various depths. The advantage of this technology is that structures not only with a defined depth but also with a defined design can be produced.
{"title":"3D-structuring of photosensitive glasses","authors":"K. Feindt, A. Harnisch, V. Zoppig, D. Hűlsenberg, E. Kallenbach","doi":"10.1109/MEMSYS.1998.659755","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659755","url":null,"abstract":"Up to now it is possible to etch through the whole wafer or in a defined depth, but not with the same etching process. Structures with a defined depth had to be produced with a second UV-exposure followed by a second etching process. A new technology allows a 3D etching process in photosensitive glass. A lot of lines with a defined width and pattern are made in a chromium layer on vitreous silica. A pattern of different grey scales can be produced with that technology. The grey scale mask results in different intensities of W-light during the exposure. Due to the different intensities, the exposure of different areas is in various depths. The advantage of this technology is that structures not only with a defined depth but also with a defined design can be produced.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125166521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659806
T. Ono, M. Esashi
Utilizing evanescent fields (optical near field), we demonstrate a novel processing beyond the diffraction limits of lights. One is relating to a pattern transfer in a nano-scale dimension. The other is a manipulation of micro-objects. The nano-scaled patterns beyond the diffraction limits were successfully transferred by using evanescent field generated near metal slits. For this purpose, masks having the metal slits and apertures were fabricated by using an electron beam (EB) and an atomic force microscope (AFM). AFM-based fabrication method was applied to fabricate nano-apertures of which diameters are below 50 nm. UV was irradiated using a mercury lamp keeping the mask in contact with a wafer on which conventional photo-resist was coated. For obtaining a small pattern, it is required to come the mask into contact with the substrate completely. Deformable silicon membrane was effective for this purpose. The nano-scale patterns having a size below 200 nm were successfully obtained by transferring the mask pattern onto the conventional photo-resist. On the other hands, fundamental experiments about the manipulation of particles with the evanescent field were made by using a patterned thin metal. It was confirmed experimentally that the evanescent field created on the metal-slits and thin metal film gives the particles a force. By using this force, trappings, arrangements and movements were demonstrated.
{"title":"Evanescent-field-controlled nano-pattern transfer and micro-manipulation","authors":"T. Ono, M. Esashi","doi":"10.1109/MEMSYS.1998.659806","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659806","url":null,"abstract":"Utilizing evanescent fields (optical near field), we demonstrate a novel processing beyond the diffraction limits of lights. One is relating to a pattern transfer in a nano-scale dimension. The other is a manipulation of micro-objects. The nano-scaled patterns beyond the diffraction limits were successfully transferred by using evanescent field generated near metal slits. For this purpose, masks having the metal slits and apertures were fabricated by using an electron beam (EB) and an atomic force microscope (AFM). AFM-based fabrication method was applied to fabricate nano-apertures of which diameters are below 50 nm. UV was irradiated using a mercury lamp keeping the mask in contact with a wafer on which conventional photo-resist was coated. For obtaining a small pattern, it is required to come the mask into contact with the substrate completely. Deformable silicon membrane was effective for this purpose. The nano-scale patterns having a size below 200 nm were successfully obtained by transferring the mask pattern onto the conventional photo-resist. On the other hands, fundamental experiments about the manipulation of particles with the evanescent field were made by using a patterned thin metal. It was confirmed experimentally that the evanescent field created on the metal-slits and thin metal film gives the particles a force. By using this force, trappings, arrangements and movements were demonstrated.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131418943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176
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