Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659785
J. Kang, H. Guckel, Y. Ahn
A highly sensitive magnetometer is demonstrated using a resonant amplitude detection method in an integrated vacuum encapsulated resonant microbeam which has a very high quality factor (Q). The magnetic field is efficiently converted to mechanical vibrations of the high Q microbeam by using the Lorentz force between a beam current and the applied magnetic field. The mechanical vibration causes an optical modulation during the transmission of the light through the layers of the resonator. The modulated light produces an electronic output signal at an embedded photodiode just below the microbeam. The optical detection of the beam vibration allows a simple resonator structure and good output signal isolation from the input current leading to a less noisy output. Measured Q-values of the fabricated devices are above 50,000 with die yield exceeding 90%. Measured magnetic sensitivities near 55,000 V/ATesla are much higher than those reported for Hall effect devices.
{"title":"Amplitude detecting micromechanical resonating beam magnetometer","authors":"J. Kang, H. Guckel, Y. Ahn","doi":"10.1109/MEMSYS.1998.659785","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659785","url":null,"abstract":"A highly sensitive magnetometer is demonstrated using a resonant amplitude detection method in an integrated vacuum encapsulated resonant microbeam which has a very high quality factor (Q). The magnetic field is efficiently converted to mechanical vibrations of the high Q microbeam by using the Lorentz force between a beam current and the applied magnetic field. The mechanical vibration causes an optical modulation during the transmission of the light through the layers of the resonator. The modulated light produces an electronic output signal at an embedded photodiode just below the microbeam. The optical detection of the beam vibration allows a simple resonator structure and good output signal isolation from the input current leading to a less noisy output. Measured Q-values of the fabricated devices are above 50,000 with die yield exceeding 90%. Measured magnetic sensitivities near 55,000 V/ATesla are much higher than those reported for Hall effect devices.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"374 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131646556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659777
Seungdo An, Young-Se Oh, B. L. Lee, Kwang-Il Park, S. J. Kang, S. O. Choi, Y. Go, Cimoo Song
A dual-axis microgyroscope is fabricated by a surface micromachining process. A 7.0 /spl mu/m-thick polysilicon layer deposited by LPCVD is used for the vibrating structure. We report the closed-loop rate detection of a microgyroscope based on the rotational vibration of the four plates. In particular, the structure utilizes a simple force-balancing torsional torque which does not need another top electrode layer to reduce the intrinsic nonlinearity of a capacitance-type sensor. The gyroscope is tested in a high vacuum chamber for a high Q-factor with hybrid signal-conditioning integrated circuit. The experiment resulted in a noise equivalent signal of 0.1 deg/sec.
{"title":"Dual-axis microgyroscope with closed-loop detection","authors":"Seungdo An, Young-Se Oh, B. L. Lee, Kwang-Il Park, S. J. Kang, S. O. Choi, Y. Go, Cimoo Song","doi":"10.1109/MEMSYS.1998.659777","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659777","url":null,"abstract":"A dual-axis microgyroscope is fabricated by a surface micromachining process. A 7.0 /spl mu/m-thick polysilicon layer deposited by LPCVD is used for the vibrating structure. We report the closed-loop rate detection of a microgyroscope based on the rotational vibration of the four plates. In particular, the structure utilizes a simple force-balancing torsional torque which does not need another top electrode layer to reduce the intrinsic nonlinearity of a capacitance-type sensor. The gyroscope is tested in a high vacuum chamber for a high Q-factor with hybrid signal-conditioning integrated circuit. The experiment resulted in a noise equivalent signal of 0.1 deg/sec.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116523216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659776
Jae-Joon Choi, R. Toda, K. Minami, M. Esashi
An angular resonance silicon gyroscope was fabricated by deep RIE and XeF/sub 2/ gas etching. Using these two etching methods, a sensor which has beams in the center of the thickness of its mass could be fabricated very precisely. The sensor has a glass-silicon-glass structure and its resonator is excited electrostatically and the vibration caused by the angular rate is measured capacitively. Sensor sensitivity obtained was 2.1 fF/(deg/sec).
{"title":"Silicon angular resonance gyroscope by deep ICPRIE and XeF/sub 2/ gas etching","authors":"Jae-Joon Choi, R. Toda, K. Minami, M. Esashi","doi":"10.1109/MEMSYS.1998.659776","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659776","url":null,"abstract":"An angular resonance silicon gyroscope was fabricated by deep RIE and XeF/sub 2/ gas etching. Using these two etching methods, a sensor which has beams in the center of the thickness of its mass could be fabricated very precisely. The sensor has a glass-silicon-glass structure and its resonator is excited electrostatically and the vibration caused by the angular rate is measured capacitively. Sensor sensitivity obtained was 2.1 fF/(deg/sec).","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132616330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659728
S.W. Lee, O. Jeong, S.S. Yang
This paper presents the fabrication of a micro injector which can be attached to the end of a micro intravascular endoscope for drug injection. The injector consists of a drug chamber and an actuator chamber which are separated by a silicone rubber membrane. The injector discharges some liquid drug less than one microliter through a nozzle. The injector is fabricated by anisotropic etch, boron deposition and metal evaporation. The silicone membrane is actuated by the bubbles which are generated by boiling or the electrolysis of the electrolyte in the actuator chamber. The deflection of the membrane for the each method has been measured. Also, the injection volume has been measured from the video images captured during the electrolysis of water or NaCl solution. The experimental results show that the actuation by the electrolysis of NaCl solution is effective.
{"title":"The fabrication of a micro injector actuated by boiling and/or electrolysis","authors":"S.W. Lee, O. Jeong, S.S. Yang","doi":"10.1109/MEMSYS.1998.659728","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659728","url":null,"abstract":"This paper presents the fabrication of a micro injector which can be attached to the end of a micro intravascular endoscope for drug injection. The injector consists of a drug chamber and an actuator chamber which are separated by a silicone rubber membrane. The injector discharges some liquid drug less than one microliter through a nozzle. The injector is fabricated by anisotropic etch, boron deposition and metal evaporation. The silicone membrane is actuated by the bubbles which are generated by boiling or the electrolysis of the electrolyte in the actuator chamber. The deflection of the membrane for the each method has been measured. Also, the injection volume has been measured from the video images captured during the electrolysis of water or NaCl solution. The experimental results show that the actuation by the electrolysis of NaCl solution is effective.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133667538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659793
Y. Haga, Y. Tanahashi, M. Esashi
Three kinds of active catheters whose outside diameters are less than 2 mm were fabricated. One uses polymer links, the other two are linkless active catheters using adhesive. Distributed shape memory alloy (SMA) coil were used as actuators for the active motion. There are endoskeletal type and exoskeletal type in the linkless active catheters. We have applied the endoskeletal type active catheter to intraureteral ultrasonography used in a kidney. Concept of an advanced multifunction active catheter is mentioned.
{"title":"Small diameter active catheter using shape memory alloy","authors":"Y. Haga, Y. Tanahashi, M. Esashi","doi":"10.1109/MEMSYS.1998.659793","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659793","url":null,"abstract":"Three kinds of active catheters whose outside diameters are less than 2 mm were fabricated. One uses polymer links, the other two are linkless active catheters using adhesive. Distributed shape memory alloy (SMA) coil were used as actuators for the active motion. There are endoskeletal type and exoskeletal type in the linkless active catheters. We have applied the endoskeletal type active catheter to intraureteral ultrasonography used in a kidney. Concept of an advanced multifunction active catheter is mentioned.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134104614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659823
Q.B. Zou, Z. Tan, Z.F. Wang, M. K. Lim, R. Lin, S. Yi, Z.J. Li
In this study, a novel principle "electret" microphone is proposed and implemented by a single-chip fabrication technique. The microphone uses a charged floating electrode surrounded by highly insulated materials as "electret" to excite electric field. Net free-electric-charges (not "bonded" charges as in traditional electret) in the floating electrode can be easily charged by use of the "hot" electron technique, available using the so-called avalanche-breakdown technique of p/sup +/-n junction. Thus the electret microphone is rechargeable, which can greatly increase the lifetime of the microphone. Preamplifier has been on-chip integrated in a JFET type by use of ion implantation. "Electret" charges are bonded in a deep potential trap, different from that of traditional electret of which the charges are in a surface shallow potential trap, thus this microphone can operate at high temperature (high as 300/spl deg/C) and has high stability and reliability. Experiments show that the prototype microphone has a 3 mV/Pa sensitivity and 2l kHz frequency bandwidth in a 1 mm /spl times/1 mm diaphragm area. Microphone performance can be further improved by use of the optimized processes and designs. The fabrication is completely IC-compatible, hence the microphone is promising in the integrated acoustic systems.
本研究提出了一种新型的“驻极体”传声器，并采用单片制造技术实现。麦克风使用一个被高度绝缘材料包围的带电浮动电极作为“驻极体”来激发电场。漂浮电极中的净自由电荷(不是传统驻极体中的“键合”电荷)可以通过使用“热”电子技术轻松充电，这种技术可以使用所谓的p/sup +/-n结的雪崩击穿技术。因此，驻极体麦克风是可充电的，这可以大大增加麦克风的使用寿命。利用离子注入将前置放大器集成到JFET型片上。“驻极体”电荷在深电位阱中键合，不同于传统驻极体电荷在表面浅电位阱中键合，因此该传声器可在高温(高达300/spl℃)下工作，具有较高的稳定性和可靠性。实验表明，该原型麦克风在1 mm /1倍/1 mm的膜片面积内具有3 mV/Pa的灵敏度和2l kHz的带宽。通过优化的工艺和设计，可以进一步提高麦克风的性能。该工艺完全兼容集成电路，因此在集成声学系统中具有广阔的应用前景。
{"title":"Design and fabrication of a novel integrated floating-electrode-\"electret\"-microphone (FFEM)","authors":"Q.B. Zou, Z. Tan, Z.F. Wang, M. K. Lim, R. Lin, S. Yi, Z.J. Li","doi":"10.1109/MEMSYS.1998.659823","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659823","url":null,"abstract":"In this study, a novel principle \"electret\" microphone is proposed and implemented by a single-chip fabrication technique. The microphone uses a charged floating electrode surrounded by highly insulated materials as \"electret\" to excite electric field. Net free-electric-charges (not \"bonded\" charges as in traditional electret) in the floating electrode can be easily charged by use of the \"hot\" electron technique, available using the so-called avalanche-breakdown technique of p/sup +/-n junction. Thus the electret microphone is rechargeable, which can greatly increase the lifetime of the microphone. Preamplifier has been on-chip integrated in a JFET type by use of ion implantation. \"Electret\" charges are bonded in a deep potential trap, different from that of traditional electret of which the charges are in a surface shallow potential trap, thus this microphone can operate at high temperature (high as 300/spl deg/C) and has high stability and reliability. Experiments show that the prototype microphone has a 3 mV/Pa sensitivity and 2l kHz frequency bandwidth in a 1 mm /spl times/1 mm diaphragm area. Microphone performance can be further improved by use of the optimized processes and designs. The fabrication is completely IC-compatible, hence the microphone is promising in the integrated acoustic systems.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114205050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659727
P. F. Man, C. Mastrangelo, M. Burns, D. T. Burke
This paper presents the design, fabrication, and testing of passive plastic microfluidic valves and active injectors driven by capillary forces. The passive valves stop the flow of a liquid inside a capillary using a capillary pressure barrier that develops when the channel cross section changes abruptly. Two types of valves with vertical and horizontal neck regions were fabricated yielding pressure barriers ranging from 1-6 kPa. Introducing asymmetry in the neck region, unidirectional valving action was achieved. The passive valving devices were used in combination with two electrodes to implement a sample injector. The injector uses an electrolytically-generated O/sub 2/ bubble that raises the liquid pressure beyond the barrier thus reestablishing flow with as little as 150 /spl mu/W of electrical power.
{"title":"Microfabricated capillarity-driven stop valve and sample injector","authors":"P. F. Man, C. Mastrangelo, M. Burns, D. T. Burke","doi":"10.1109/MEMSYS.1998.659727","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659727","url":null,"abstract":"This paper presents the design, fabrication, and testing of passive plastic microfluidic valves and active injectors driven by capillary forces. The passive valves stop the flow of a liquid inside a capillary using a capillary pressure barrier that develops when the channel cross section changes abruptly. Two types of valves with vertical and horizontal neck regions were fabricated yielding pressure barriers ranging from 1-6 kPa. Introducing asymmetry in the neck region, unidirectional valving action was achieved. The passive valving devices were used in combination with two electrodes to implement a sample injector. The injector uses an electrolytically-generated O/sub 2/ bubble that raises the liquid pressure beyond the barrier thus reestablishing flow with as little as 150 /spl mu/W of electrical power.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116873136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659805
C. Gui, G. Veldhuis, T. Koster, P. Lambeck, J. Berenschot, J. Gardeniers, M. Elwenspoek
This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.
{"title":"Nanomechanical optical devices fabricated with aligned wafer bonding","authors":"C. Gui, G. Veldhuis, T. Koster, P. Lambeck, J. Berenschot, J. Gardeniers, M. Elwenspoek","doi":"10.1109/MEMSYS.1998.659805","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659805","url":null,"abstract":"This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"233 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114992514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659758
S.N. Wang, J.F. Li, R. Toda, R. Watanabe, K. Minami, M. Esashi
A new process for the fabrication of fine scale, high aspect ratio PZT 1-3 composite structures has been developed. In this process, lost mold technique is utilized with a Si mold prepared by deep reactive ion etching (RIE). Due to the high strength and high melting point of Si, PZT sintering under high pressures without removing the mold becomes possible, leading to structures of highly condensed PZT in the precise shape of the mold. The typical PZT structures in this work are periodically arrayed rods 16 /spl mu/m in diameter, 100 /spl mu/m in height, resulting in an aspect ratio higher than six. The fabricated structures are to be applied to high resolution micro-ultrasonic transducers in the frequency range of 20 MHz for medical purpose.
{"title":"Novel processing of high aspect ratio 1-3 structures of high density PZT","authors":"S.N. Wang, J.F. Li, R. Toda, R. Watanabe, K. Minami, M. Esashi","doi":"10.1109/MEMSYS.1998.659758","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659758","url":null,"abstract":"A new process for the fabrication of fine scale, high aspect ratio PZT 1-3 composite structures has been developed. In this process, lost mold technique is utilized with a Si mold prepared by deep reactive ion etching (RIE). Due to the high strength and high melting point of Si, PZT sintering under high pressures without removing the mold becomes possible, leading to structures of highly condensed PZT in the precise shape of the mold. The typical PZT structures in this work are periodically arrayed rods 16 /spl mu/m in diameter, 100 /spl mu/m in height, resulting in an aspect ratio higher than six. The fabricated structures are to be applied to high resolution micro-ultrasonic transducers in the frequency range of 20 MHz for medical purpose.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"179 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124470661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659808
A. Ruzzu, J. Fahrenberg, M. Muller, C. Rembe, U. Wallrabe
A new type of cutter for the use in catheters for minimal invasive therapy is presented. The cutter is designed for removing sclerotic plaque inside partially occluded vessels by means of rotational ablation. It has a length of 5 mm and a variable diameter from 2 mm to 5 mm. The variation of the cutting diameter is obtained by the use of centrifugal forces at 30.000 to 100.090 rpm. Cutting tests in chalk have been successfully performed. The removal of other materials is currently under investigation.
{"title":"A cutter with rotational-speed dependent diameter for interventional catheter systems","authors":"A. Ruzzu, J. Fahrenberg, M. Muller, C. Rembe, U. Wallrabe","doi":"10.1109/MEMSYS.1998.659808","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659808","url":null,"abstract":"A new type of cutter for the use in catheters for minimal invasive therapy is presented. The cutter is designed for removing sclerotic plaque inside partially occluded vessels by means of rotational ablation. It has a length of 5 mm and a variable diameter from 2 mm to 5 mm. The variation of the cutting diameter is obtained by the use of centrifugal forces at 30.000 to 100.090 rpm. Cutting tests in chalk have been successfully performed. The removal of other materials is currently under investigation.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124275960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176
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