Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393749
John T. Jeng
TSMC's risk management department (RM) initiated the first phase of its Supply Chain Risk Management Project in 2003, which included a risk assessment of the company's single-source raw material suppliers. RM worked jointly with the procurement department on this project to assess potential supply chain risks from single-source suppliers located in throughout the world. Suppliers participated in the risk assessment by providing survey responses on key risk issues, which were then evaluated based on key supply risk factors that could interrupt company operations, such as geographic, contingency planning, factory, replacement, and supply/demand. This work provides an overview of the methodology used for this project, and the techniques applied to conduct the risk assessment.
{"title":"Supply chain risk management","authors":"John T. Jeng","doi":"10.1109/SMTW.2004.1393749","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393749","url":null,"abstract":"TSMC's risk management department (RM) initiated the first phase of its Supply Chain Risk Management Project in 2003, which included a risk assessment of the company's single-source raw material suppliers. RM worked jointly with the procurement department on this project to assess potential supply chain risks from single-source suppliers located in throughout the world. Suppliers participated in the risk assessment by providing survey responses on key risk issues, which were then evaluated based on key supply risk factors that could interrupt company operations, such as geographic, contingency planning, factory, replacement, and supply/demand. This work provides an overview of the methodology used for this project, and the techniques applied to conduct the risk assessment.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"222 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116026439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The advanced facility monitoring and diagnosis system provide a comprehensive solution to most of the possible problems in manufacturing. This article proposes an advanced facility monitoring and diagnosis system framework - APCSuite-ECMXpert, which consists of equipment condition monitoring system (ECMS), and advanced process control toolkit - APCSuite. The methodologies applied on facility condition monitoring and the application cases for monitoring the facility equipments in semiconductor plant are illustrated in This work.
{"title":"Unified framework for facility condition monitoring, detection, and diagnostics","authors":"Huei-Shyang You, Tzu-Chi Wang, Wen-Yao Chang, Chih-Wei Lai, Ming-Wei Lee, Kei-wei Zuo","doi":"10.1109/SMTW.2004.1393712","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393712","url":null,"abstract":"The advanced facility monitoring and diagnosis system provide a comprehensive solution to most of the possible problems in manufacturing. This article proposes an advanced facility monitoring and diagnosis system framework - APCSuite-ECMXpert, which consists of equipment condition monitoring system (ECMS), and advanced process control toolkit - APCSuite. The methodologies applied on facility condition monitoring and the application cases for monitoring the facility equipments in semiconductor plant are illustrated in This work.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126091845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393742
Y. Chuo, D. Shu, L. Lee, W. Hsieh, M. Tsai, A. Wang, S. Hung, P. Tzeng, Y. Chou
HfO2-based dielectrics are most promising high k materials to substitute SiO2 for the MOS gate dielectric. To guarantee the deposition process under well control, an in-line inspection to characterize the thickness and uniformity of both HfO2 and Hf metal ultra-thin films must be established. In this work, we proposed an in-line, non-destructive optical method to measure thickness of both films, and this method has potential to be inducted into production control. Upon spectroscopic ellipsometry (SE), reactive DC sputtered HfO2 and Hf metal ultra-thin films with featured-thickness of 40 Aring or larger were well analyzed, and accuracy of wafer mapping measurement fell in 3 Aring
{"title":"In-line inspection on thickness of sputtered HfO/sub 2/ and Hf metal ultra-thin films by spectroscopic ellipsometry","authors":"Y. Chuo, D. Shu, L. Lee, W. Hsieh, M. Tsai, A. Wang, S. Hung, P. Tzeng, Y. Chou","doi":"10.1109/SMTW.2004.1393742","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393742","url":null,"abstract":"HfO2-based dielectrics are most promising high k materials to substitute SiO2 for the MOS gate dielectric. To guarantee the deposition process under well control, an in-line inspection to characterize the thickness and uniformity of both HfO2 and Hf metal ultra-thin films must be established. In this work, we proposed an in-line, non-destructive optical method to measure thickness of both films, and this method has potential to be inducted into production control. Upon spectroscopic ellipsometry (SE), reactive DC sputtered HfO2 and Hf metal ultra-thin films with featured-thickness of 40 Aring or larger were well analyzed, and accuracy of wafer mapping measurement fell in 3 Aring","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"10 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133173302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393718
Chun-Hung Tsai, Kung-Yao Chung, Chun-Mine Wang
The cleanroom control systems should be designed according to different climatic regions. This work investigates how the climatic difference affects the design of the make-up-air unit, MAU, which controls temperature and humidity in a cleanroom. We recommend suitable designs for different climatic regions around the world. We also establish a database for MAU design of different climatic regions.
{"title":"Considerations for cleanroom control in different climatic regions","authors":"Chun-Hung Tsai, Kung-Yao Chung, Chun-Mine Wang","doi":"10.1109/SMTW.2004.1393718","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393718","url":null,"abstract":"The cleanroom control systems should be designed according to different climatic regions. This work investigates how the climatic difference affects the design of the make-up-air unit, MAU, which controls temperature and humidity in a cleanroom. We recommend suitable designs for different climatic regions around the world. We also establish a database for MAU design of different climatic regions.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"398 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133480070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Chemical mechanical planarization(CMP) has become part of important processing module in semiconductor manufacturing due to the shallow trench isolation technique. It is known that many different sources of variations are commonly found in CMP process. Hence the run-to-run control scheme which can specify how the recipe for the process should be updated is appropriate for CMP process control. This work tries to treat the issue of practical application of run-to-run control with metrology delay for CMP system. The module characteristics and real operating conditions of CMP processes are first studied and demonstrated by CMP data collected from fab. By considering the effects of metrology delay, the process model and parameters of the observer are properly modified to improve the performance of the double EWMA controller. To sum up, based on the collected CMP data, the process capability index Cpk can be enhanced several times by use of the proposed run-to-run control approach
{"title":"Wafer by wafer control in CMP system with metrology delay","authors":"Gow-Bin Wang, E-Hon Lin, Huei-Shyang You, Ming-Wei Lee, Fu-Kuan Hsiao, Chih-Wei Lai","doi":"10.1109/SMTW.2004.1393759","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393759","url":null,"abstract":"Chemical mechanical planarization(CMP) has become part of important processing module in semiconductor manufacturing due to the shallow trench isolation technique. It is known that many different sources of variations are commonly found in CMP process. Hence the run-to-run control scheme which can specify how the recipe for the process should be updated is appropriate for CMP process control. This work tries to treat the issue of practical application of run-to-run control with metrology delay for CMP system. The module characteristics and real operating conditions of CMP processes are first studied and demonstrated by CMP data collected from fab. By considering the effects of metrology delay, the process model and parameters of the observer are properly modified to improve the performance of the double EWMA controller. To sum up, based on the collected CMP data, the process capability index Cpk can be enhanced several times by use of the proposed run-to-run control approach","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"104 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116195540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393717
Caixia Liao, Y. Chang, D. Yang, B. Jiang
This article was introduced the example of water saving in 8-inches semiconductor plant of UMC-8E plant. The technology and strategy was established by the water character, which included the recovery source, POU demand, environmental impact and running cost. We select the RO as a main unit in recovery system of waste water because the condition of environment and cost can be matched. The process recovery rate can be exceeded 85% after this saving strategy was practiced. This accomplishment was hard to achieve for the old plant, so we obtained the honor of water saving in 2002.
{"title":"Strategy and benefit analysis of water saving in 8\" semiconductor fab","authors":"Caixia Liao, Y. Chang, D. Yang, B. Jiang","doi":"10.1109/SMTW.2004.1393717","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393717","url":null,"abstract":"This article was introduced the example of water saving in 8-inches semiconductor plant of UMC-8E plant. The technology and strategy was established by the water character, which included the recovery source, POU demand, environmental impact and running cost. We select the RO as a main unit in recovery system of waste water because the condition of environment and cost can be matched. The process recovery rate can be exceeded 85% after this saving strategy was practiced. This accomplishment was hard to achieve for the old plant, so we obtained the honor of water saving in 2002.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114850516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Nowadays, the automation is the fundamental element of a 300 mm Fab. FOUP transportation, lot dispatching and data processing and other production requirements are integrated by the system. On the other hand, dispatching is getting more and more important due to the complicated process routing and reentry process flow in semiconductor Fab. It is important to optimize the batching size in furnace area, since most of furnace EQP are designed to accommodate up to 100 wafers in 300 mm Fab. In order to fully utilize the furnace, some waiting time is allowed to maximize the batch size. Beside, the furnace dispatching must consider the other issue, such as queue time limit. The pre-clean start time or form batch time must be well controlled to prevent product from queue time over and to keep machine from idle. This work describes an auto forming batch system for furnace operation, which is implemented in the real time dispatching system of PSC FAB 12A. The auto form batch rate is raised up to 85% form Q3 2003 to now. And finally, it has been proved that the auto form batch dispatching system not only improve furnace utilization but also reduces the cycle time between wet and furnace operation. Headings of This work are as follows: (1) introduction, (2) RTD system structure for furnace batch dispatching, (3) batch forming time model and furnace dispatching, (4) result and discussion, and (5) future direction and conclusion.
如今，自动化是300mm晶圆厂的基本要素。FOUP运输、批量调度和数据处理等生产需求由系统集成。另一方面，由于半导体晶圆厂复杂的工艺路线和返工流程，调度变得越来越重要。优化炉面积的配料尺寸是很重要的，因为大多数炉EQP设计为在300毫米Fab中容纳多达100片晶圆。为了充分利用炉子，允许一些等待时间，以最大限度地提高批次大小。此外，加热炉调度还必须考虑排队时间限制等问题。必须控制好预清洁开始时间或成型批时间，以防止产品超时排队，防止机器闲置。本文介绍了在PSC FAB 12A实时调度系统中实现的炉膛自动成型批量系统。自2003年第三季度至今，自动成批率提高到85%。实践证明，该自动成型批量调度系统不仅提高了炉膛利用率，而且缩短了湿法与加热炉之间的循环时间。本工作的标题如下:(1)绪论;(2)炉批调度RTD系统结构;(3)炉批成型时间模型与炉调度;(4)结果与讨论;(5)未来方向与结论。
{"title":"Automatically form batch via real time dispatcher for furnace operation in 300 mm fab","authors":"De-Lung Wu, Hsi-Lo Lo, Cheng-Chung Pan, Yu-Ting Chang, Chin-Lang Peng","doi":"10.1109/SMTW.2004.1393707","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393707","url":null,"abstract":"Nowadays, the automation is the fundamental element of a 300 mm Fab. FOUP transportation, lot dispatching and data processing and other production requirements are integrated by the system. On the other hand, dispatching is getting more and more important due to the complicated process routing and reentry process flow in semiconductor Fab. It is important to optimize the batching size in furnace area, since most of furnace EQP are designed to accommodate up to 100 wafers in 300 mm Fab. In order to fully utilize the furnace, some waiting time is allowed to maximize the batch size. Beside, the furnace dispatching must consider the other issue, such as queue time limit. The pre-clean start time or form batch time must be well controlled to prevent product from queue time over and to keep machine from idle. This work describes an auto forming batch system for furnace operation, which is implemented in the real time dispatching system of PSC FAB 12A. The auto form batch rate is raised up to 85% form Q3 2003 to now. And finally, it has been proved that the auto form batch dispatching system not only improve furnace utilization but also reduces the cycle time between wet and furnace operation. Headings of This work are as follows: (1) introduction, (2) RTD system structure for furnace batch dispatching, (3) batch forming time model and furnace dispatching, (4) result and discussion, and (5) future direction and conclusion.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"25 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134554976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393710
Jer-Wei Hsu, Hsi-Lo Lo, Cheng-Chung Pan, Yi-Ming Chen, T. Hsieh
Test wafers are used in wafer fabrication to monitor equipment stability and product quality. Any shortage causes the loss of equipment capacity and production move. On the contrary, to prepare more test wafers to avoid shortage spends more cost, occupies more storage space, and lowers transfer efficiency. Considering the wafer cost and FAB productivity, an efficient control system of test wafer in 300 mm FAB is much more important than formerly.
{"title":"Test wafer control system in 300 mm FAB","authors":"Jer-Wei Hsu, Hsi-Lo Lo, Cheng-Chung Pan, Yi-Ming Chen, T. Hsieh","doi":"10.1109/SMTW.2004.1393710","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393710","url":null,"abstract":"Test wafers are used in wafer fabrication to monitor equipment stability and product quality. Any shortage causes the loss of equipment capacity and production move. On the contrary, to prepare more test wafers to avoid shortage spends more cost, occupies more storage space, and lowers transfer efficiency. Considering the wafer cost and FAB productivity, an efficient control system of test wafer in 300 mm FAB is much more important than formerly.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124219562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393761
M.F. Chen, M. Huang
Every module setup lot of charts to monitor off-line process data. Most of charts are sensitive to inline process data. Although each of charts had set control limit and specification to warn the process while trending up or down, there are still have risk to cause product fail due to narrow process window. It's very difficult and impossible to take care of all charts on manufacturing to find which of them are not stable. The paper shows a new methodology to take care of all of chart on manufacturing. The engineers only have to group the charts having the same process property (ex, resist THK, CD, Overlay, ETH, Etch-Rate, etc...) on system. This system will automatic create report and send the warning messages to engineer through the e-mail. It is very helpful for the module to find out which are the worst or getting worse charts. Engineer can take action early before the chart going worst and all of abnormal event can be prevented in advance. This new methodology not only increased the stability of production line, but also saved lot of manpower to handle abnormal event
{"title":"SPC precaution system","authors":"M.F. Chen, M. Huang","doi":"10.1109/SMTW.2004.1393761","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393761","url":null,"abstract":"Every module setup lot of charts to monitor off-line process data. Most of charts are sensitive to inline process data. Although each of charts had set control limit and specification to warn the process while trending up or down, there are still have risk to cause product fail due to narrow process window. It's very difficult and impossible to take care of all charts on manufacturing to find which of them are not stable. The paper shows a new methodology to take care of all of chart on manufacturing. The engineers only have to group the charts having the same process property (ex, resist THK, CD, Overlay, ETH, Etch-Rate, etc...) on system. This system will automatic create report and send the warning messages to engineer through the e-mail. It is very helpful for the module to find out which are the worst or getting worse charts. Engineer can take action early before the chart going worst and all of abnormal event can be prevented in advance. This new methodology not only increased the stability of production line, but also saved lot of manpower to handle abnormal event","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129739636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-09DOI: 10.1109/SMTW.2004.1393751
Yi-Chun Chang, Ming-Wei Lee, Kewei Zuo, Tzxy-Chyi Wang, Huei-Shyang You
A framework for improving alarm performance is proposed and a more detailed flowchart is also described in this paper. Alarm systems are complicated and the improvement requires long-term efforts. The proposed procedure has reduced unnecessary alarms effectively. The architecture of an Internet service is also proposed
{"title":"Alarm performance retention via Web-base diagnostic platform","authors":"Yi-Chun Chang, Ming-Wei Lee, Kewei Zuo, Tzxy-Chyi Wang, Huei-Shyang You","doi":"10.1109/SMTW.2004.1393751","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393751","url":null,"abstract":"A framework for improving alarm performance is proposed and a more detailed flowchart is also described in this paper. Alarm systems are complicated and the improvement requires long-term efforts. The proposed procedure has reduced unnecessary alarms effectively. The architecture of an Internet service is also proposed","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127625496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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