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2011 IEEE Radio Frequency Integrated Circuits Symposium最新文献

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X-to-K band broadband watt-level power amplifier using stacked-FET unit cells x - k波段宽带瓦特级功率放大器,采用堆叠fet单元电池
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940620
Youngrak Park, Youngmin Kim, W. Choi, J. Woo, Y. Kwon
A broadband watt-level stacked-FET power amplifier (PA) has been developed using 0.15 µm GaAs pHEMT's. A triple-stacked FET structure is used as a unit cell to combine RF voltage swings to achieve high output power and broad bandwidth at the same time. Special care has been taken to solve thermal and instability problems of stacked-FET cells for watt-level applications as well as to optimize the subsequent power combiner for bandwidth. The fabricated PA shows a peak power of 33.7 dBm with a power added efficiency (PAE) of 29.5% at frequency of 18 GHz, and higher than 32 dBm output power from 10 to 21 GHz. The fractional 3 dB output power bandwidth is 84%.
采用0.15µm GaAs pHEMT材料,研制了一种宽带瓦级叠置场效应晶体管功率放大器。采用三层堆叠FET结构作为单元单元,组合射频电压振荡,同时实现高输出功率和宽带宽。特别注意解决了用于瓦级应用的堆叠fet电池的热和不稳定性问题,以及优化后续功率合成器的带宽。该放大器在18 GHz频率下的峰值功率为33.7 dBm,功率附加效率(PAE)为29.5%,在10 ~ 21 GHz频率下的输出功率高于32 dBm。分数3db输出功率带宽为84%。
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引用次数: 28
On-chip vertically coiled solenoid inductors and transformers for RF SoC using 90nm CMOS interconnect technology 片上垂直卷曲螺线管电感和变压器射频SoC使用90nm CMOS互连技术
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940640
H. Namba, T. Hashimoto, M. Furumiya
This paper presents very small on-chip vertically coiled solenoid inductors (V-solenoid) using 90nm CMOS multilevel interconnect technology. In addition, a variety of areas-saving (10um × 20um) transformers without any additional processing steps are demonstrated: a V-solenoid surrounded by another different inside-diameter V-solenoid (dual-tube transformer), a V-solenoid coiled around another one with same dimensions (a double-helix or DNA-like transformer), and face-to-face V-solenoids (face-to-face transformer). Radio-frequency characteristics were evaluated on the basis of 2-port S-parameter measurements. Measured self-resonance frequencies resulted in higher than 40GHz, and coupling coefficients were larger than 0.6.
本文介绍了一种采用90纳米CMOS多层互连技术的非常小的片上垂直卷曲电磁电感器(v -螺线管)。此外,还展示了各种节省面积(10um × 20um)的变压器,无需任何额外的加工步骤:一个v型螺线管被另一个不同内径的v型螺线管(双管变压器)包围,一个v型螺线管绕在另一个相同尺寸的v型螺线管上(双螺旋或dna样变压器),面对面的v型螺线管(面对面变压器)。基于2端口s参数测量评估射频特性。测量的自共振频率大于40GHz,耦合系数大于0.6。
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引用次数: 14
All-digital transmitter based on ADPLL and phase synchronized delta sigma modulator 基于ADPLL和相位同步δ σ调制器的全数字发射机
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940595
Jian Chen, Liang Rong, F. Jonsson, Lirong Zheng
A novel architecture of all-digital polar transmitters is proposed, mainly composed of an all digital PLL (ADPLL) for phase modulation, a 1-bit low-pass delta sigma (ΔΣ) modulator for envelop modulation and a high efficiency class-D PA. The low noise ADPLL and high oversample ΔΣ modulator relax filter design, enabling the use of a on-chip filter. The differential signaling scheme enhances the power of the fundamental tone and suppresses DC and high harmonics. The transmitter was fabricated in a 90nm digital CMOS process, occupying 1.4 mm2. The measurement results demonstrate effectiveness of the architecture. The digital transmitter consumes 58 mW power from a 1 V supply, delivering a 6.81-dBm output.
提出了一种新的全数字极极发射机结构,主要由用于相位调制的全数字锁相环(ADPLL)、用于包络调制的1位低通ΔΣ (ΔΣ)调制器和高效d类PA组成。低噪声ADPLL和高过采样ΔΣ调制器放松滤波器设计,可以使用片上滤波器。差分信号方案提高了基频的功率,抑制了直流和高次谐波。发射机采用90nm数字CMOS工艺制造,占地1.4 mm2。测试结果证明了该体系结构的有效性。数字发射机从1 V电源消耗58 mW功率,输出6.81 dbm。
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引用次数: 12
A fully integrated 802.11n radio with 24GHz harmonic LO generation for low-cost, low power, multi-standard systems 完全集成的802.11n无线电,具有24GHz谐波LO产生,适用于低成本,低功耗,多标准系统
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940592
R. Sadhwani, A. Ben-Bassat, R. Banin, H. Shang, B. Jann, O. Degani
We report a novel harmonic LOG based direct conversion RF transceiver for 802.11n radio. This multi-comm transceiver consists of Bluetooth SoC and WiFi, it includes 19–24GHz VCO, integrated front-end including WiFi T/R and WiFi-BT switches. Fabricated in 90nm digital CMOS technology, this IC consumes 422/560mW (Rx/Tx 802.11n 300/150Mbps), 110mW in BT mode, with an area of approx 19mm2. A peak saturated power of 24/9dBm is achieved at antenna in WiFi/BT mode.
我们报告了一种新的基于谐波LOG的802.11n无线电直接转换射频收发器。该多通信收发器由蓝牙SoC和WiFi组成,包括19-24GHz VCO,集成前端包括WiFi T/R和WiFi- bt交换机。该IC采用90nm数字CMOS技术制造,功耗为422/560mW (Rx/Tx 802.11n 300/150Mbps), BT模式下功耗为110mW,面积约为19mm2。在WiFi/BT模式下,天线峰值饱和功率达到24/9dBm。
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引用次数: 3
A V-band self-healing power amplifier with adaptive feedback bias control in 65 nm CMOS
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940683
J. Liu, A. Tang, N. Wang, Q. Gu, R. Berenguer, H. Hsieh, Po-Yi Wu, C. Jou, Mau-Chung Frank Chang
A self-healing two-stage 60 GHz power amplifier (PA) with amplitude/phase compensation is realized in 65 nm CMOS. An adaptive feedback bias scheme with three control knobs is proposed to extend the linear operating region and enhance chip-to-chip performance yield; allowing a 5.5 dB improvement of the output 1-dB compression point (P1dB) and a less than 2% chip-to-chip gain variation. At a 1 V supply, the fully differential PA achieves a saturation output power (Psat) of 14.85 dBm with a peak power-added-efficiency (PAE) of 16.2%. With the on-chip amplitude compensation, the P1dB is extended to 13.7 dBm. With the on-chip phase compensation, the output phase variation is minimized to less than 0.5 degree. To the best of our knowledge, this PA provides the highest Psat and P1dB with simultaneous high PAE for a single PA reported to date. The PA delivers a linear gain of 9.7 dB and has a 7 GHz bandwidth from 55.5 to 62.5 GHz with a very compact area of 0.042 mm2.
实现了一种具有幅相补偿功能的自修复两级60 GHz功率放大器(PA)。提出了一种带有三个控制旋钮的自适应反馈偏置方案,扩大了线性工作区域,提高了片间性能成品率;允许输出1dB压缩点(P1dB)提高5.5 dB,芯片间增益变化小于2%。在1 V电源下,全差分放大器的饱和输出功率(Psat)为14.85 dBm,峰值功率附加效率(PAE)为16.2%。通过片上幅度补偿,P1dB扩展到13.7 dBm。通过片上相位补偿,将输出相位变化减小到小于0.5度。据我们所知,这种PA提供了迄今为止报道的最高Psat和P1dB,同时具有高PAE。该放大器提供9.7 dB的线性增益,具有55.5至62.5 GHz的7 GHz带宽,面积非常紧凑,仅为0.042 mm2。
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引用次数: 27
Low power, fully differential SiGe IR-UWB transmitter and correlation receiver ICs 低功耗,全差分SiGe IR-UWB发射器和相关接收器ic
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940611
D. Lin, A. Trasser, H. Schumacher
In this paper a 3.1–10.6 GHz impulse-radio ultra-wideband (IR-UWB) transmitter and a receiver front-end are presented. The transmitter comprises a differential impulse generator mounted chip-on-board on a dipole fed circular slot antenna. It has a low power consumption of 6.6 mW at 200 MHz impulse repetition rate. The receiver front-end, mounted at the feed-point of another dipole antenna, is realized with a fully differential low noise amplifier, an analog multiplier-based correlator and a template impulse generator. The measurement results show a motion tracking capability in the mm range.
本文介绍了一种3.1-10.6 GHz脉冲无线电超宽带(IR-UWB)发射机和接收机前端。该发射机包括安装在偶极子馈电圆槽天线上的片上差分脉冲发生器。它在200 MHz脉冲重复率下具有6.6 mW的低功耗。接收机前端安装在另一个偶极子天线的馈点上,由一个全差分低噪声放大器、一个基于模拟乘频器的相关器和一个模板脉冲发生器实现。测量结果表明,该系统具有毫米范围内的运动跟踪能力。
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引用次数: 5
Double quadrature harmonic rejection architecture insensitive to gain and phase mismatch for analog/digital TV tuner IC 模拟/数字电视调谐器集成电路中对增益和相位失配不敏感的双正交谐波抑制结构
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940674
Jaeyoung Ryu, Seung-Yong Cho, Jeongsu Lee, Jongjin Kim, Yeonwoo Ku, K. Kwon, Hyunkoo Kang
Image rejection and harmonic rejection are important performance parameters in wideband low-IF TV system. In this paper, double quadrature harmonic rejection architecture insensitive to gain and/or phase mismatch is proposed to satisfy stringent image rejection ratio (IRR) and harmonic rejection ratio (HRR) for analog/digital TV tuner ICs. Fabricated in 0.13µm CMOS process, more than 60dB of the IRR is achieved over 42–864MHz RF frequency and more than 69dB of the 3rd HRR is achieved over 42–306MHz RF frequency without any calibration.
图像抑制和谐波抑制是宽带低中频电视系统的重要性能参数。本文提出了一种对增益和/或相位失配不敏感的双正交谐波抑制结构,以满足模拟/数字电视调谐器ic严格的图像抑制比(IRR)和谐波抑制比(HRR)要求。在0.13µm CMOS工艺下,在42-864MHz的射频频率上实现了超过60dB的IRR,在42-306MHz的射频频率上实现了超过69dB的第三HRR,而无需任何校准。
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引用次数: 2
A simple, unified phase noise model for injection-locked oscillators 注入锁定振荡器的简单、统一相位噪声模型
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940707
Sachin Kalia, M. Elbadry, B. Sadhu, S. Patnaik, J. Qiu, R. Harjani
This paper presents a simple, unified phase noise model for injection-locked oscillators (ILO). We show that an ILO is identical to a type-I first-order PLL in its noise behavior within the lock range. The model predicts the phase noise of injection-locked oscillators (ILO), injection-locked frequency dividers (ILFD), and injection-locked frequency multipliers (ILFM) as a function of the injection source phase noise and the oscillator phase noise. Measurement results from a discrete 57MHz Colpitts ILO, an integrated 6.5GHz ILFD, and an integrated 24GHz ILFM are presented to validate the theoretical predictions.
本文提出了一种简单、统一的注入锁定振荡器相位噪声模型。我们表明,在锁定范围内,ILO的噪声行为与i型一阶锁相环相同。该模型预测了注入锁定振荡器(ILO)、注入锁定分频器(ILFD)和注入锁定倍频器(ILFM)的相位噪声作为注入源相位噪声和振荡器相位噪声的函数。给出了一个分立的57MHz Colpitts ILO、一个集成的6.5GHz ILFD和一个集成的24GHz ILFM的测量结果来验证理论预测。
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引用次数: 29
Full-duplex crystalless CMOS transceiver with an on-chip antenna for wireless communication in engine controller board of hybrid electric vehicles
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940591
Kyujin Oh, S. Sankaran, Hsin-Ta Wu, Jau-Jr Lin, M. Hwang, K. O. Kenneth
A full-duplex transceiver for wireless inter-chip data communication in an engine controller board of hybrid electric vehicles that for the first time integrates an on-chip antenna and a duplexer, as well as allowing operation without a crystal frequency reference is demonstrated. The BER degradation of RX due to the TX operation is negligible when the input power is greater than −44dBm necessary to achieve BER of less than 10−12. The transceiver fabricated in 0.13µm CMOS consumes 245mW.
在混合动力汽车的发动机控制板中,首次集成了片上天线和双工器,并允许在没有晶体频率参考的情况下工作,用于无线芯片间数据通信的全双工收发器。当输入功率大于- 44dBm以达到小于10 - 12的误码率时,由于TX操作导致的RX误码率下降可以忽略不计。在0.13µm CMOS中制造的收发器消耗245mW。
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引用次数: 2
60GHz antenna integrated on High Resistivity silicon technologies targeting WHDMI applications 60GHz天线集成高电阻硅技术针对WHDMI应用
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940637
D. Titz, R. Pilard, F. Ferrero, F. Gianesello, D. Gloria, C. Luxey, P. Brachat, G. Jacquemod
During past years, various research team have been implied in the development of 60GHz chipset solution, using both BiCMOS or advanced CMOS technologies. But for the 60GHz market to flourish, not only low cost RFICs are required, low cost antennas and packages also are. In order to address these issues, we review in this paper achievable antenna performance using High Resistivity (HR) silicon technologies, by discussing possible integration schemes, antenna design and 3D on wafer characterization. Antenna gain of 3.9 dBi @ 60GHz has been measured making HR Si a promising technbology to address applications packaged in millimeter-wave low cost technology.
在过去的几年里,各种研究团队都在开发60GHz芯片组解决方案,使用BiCMOS或先进的CMOS技术。但是60GHz市场要想蓬勃发展,不仅需要低成本的rfic,还需要低成本的天线和封装。为了解决这些问题,本文通过讨论可能的集成方案,天线设计和晶圆上3D表征,回顾了使用高电阻率(HR)硅技术可实现的天线性能。经测量,天线增益为3.9 dBi @ 60GHz,使HR Si成为解决毫米波低成本技术封装应用的有前途的技术。
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引用次数: 14
期刊
2011 IEEE Radio Frequency Integrated Circuits Symposium
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