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2011 IEEE Radio Frequency Integrated Circuits Symposium最新文献

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A 77GHz CMOS VCO with 11.3GHz tuning range, 6dBm output power, and competitive phase noise in 65nm bulk CMOS 一种77GHz CMOS压控振荡器,具有11.3GHz调谐范围,6dBm输出功率和65nm块体CMOS竞争相位噪声
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940644
V. Trivedi, K. To, W. Huang
We demonstrate, using a foundry-based 65nm bulk technology, mmWave CMOS VCOs in the range of 38GHz and 77GHz with highest reported continuous tuning range (14%–25%), competitive phase noise (−88dBc/Hz at 1MHz offset at 77GHz), and high Pout (6dBm at 77GHz) needed to readily integrate with CMOS PA and to tolerate PVT variations. The DC power consumption of the 77GHz VCO is ∼190mW and that of the 38GHz VCOs is ∼60mW (∼16mW without buffer) from 1V supply (VDD). Device and design optimizations responsible for the high performance are presented. The impact of temperature and VDD variation (e.g., ∼2.6GHz shift in frequency and >5.3dB variation in Pout at 77GHz) is reported for the first time.
我们证明,使用基于代工厂的65nm体块技术,在38GHz和77GHz范围内的毫米波CMOS vco具有最高的连续调谐范围(14%-25%),竞争相位噪声(77GHz时1MHz偏移时- 88dBc/Hz)和高输出(77GHz时6dBm),需要容易地与CMOS PA集成并容忍PVT变化。在1V电源(VDD)下,77GHz VCO的直流功耗为~ 190mW, 38GHz VCO的直流功耗为~ 60mW(无缓冲)。提出了实现高性能的器件和设计优化。温度和VDD变化的影响(例如,频率漂移~ 2.6GHz和77GHz时Pout变化>5.3dB)首次被报道。
{"title":"A 77GHz CMOS VCO with 11.3GHz tuning range, 6dBm output power, and competitive phase noise in 65nm bulk CMOS","authors":"V. Trivedi, K. To, W. Huang","doi":"10.1109/RFIC.2011.5940644","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940644","url":null,"abstract":"We demonstrate, using a foundry-based 65nm bulk technology, mmWave CMOS VCOs in the range of 38GHz and 77GHz with highest reported continuous tuning range (14%–25%), competitive phase noise (−88dBc/Hz at 1MHz offset at 77GHz), and high Pout (6dBm at 77GHz) needed to readily integrate with CMOS PA and to tolerate PVT variations. The DC power consumption of the 77GHz VCO is ∼190mW and that of the 38GHz VCOs is ∼60mW (∼16mW without buffer) from 1V supply (VDD). Device and design optimizations responsible for the high performance are presented. The impact of temperature and VDD variation (e.g., ∼2.6GHz shift in frequency and >5.3dB variation in Pout at 77GHz) is reported for the first time.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133310852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
A 1.2V 0.1–3GHz software-defined radio receiver front-end in 130nm CMOS 一个1.2V 0.1-3GHz软件定义无线电接收机前端在130nm CMOS
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940699
Mengdi Cao, B. Chi, Chun Zhang, Zhihua Wang
A 1.2V 0.1–3GHz software-defined radio (SDR) receiver front-end in 130nm CMOS is presented. The current-driven passive mixer with 25% duty-cycle LO and reconfigurable inverter-based RF transconductor array (TCA) is utilized to satisfy the low 1/f noise and high linearity requirements. The current buffer is implemented as a like Tow-Thomas transimpedance biquad amplifier (TIA) with built-in 2nd-order filtering and reconfigurable gain/bandwidth. The scaling power consumption along with the gain and bandwidth is achieved by utilizing the switchable amplifier approach during TCA and TIA design. The measured results show that the front-end could provide reconfigurable conversion gain from 35dB to 55dB and signal bandwidth from 3MHz to 65MHz with scaling current consumption from 14.5mA to 48.5mA, from a power supply of 1.2V. The measured noise figure (NF) and output third-order intercept point (OIP3) with the maximum gain is 3.5∼6dB and higher than 10dBm, respectively, across 0.1∼3GHz frequency range, and the die area is 2.0×1.2 mm2.
提出了一种基于130nm CMOS的1.2V 0.1-3GHz软件定义无线电(SDR)接收机前端。电流驱动无源混频器采用25%占空比LO和基于可重构逆变器的射频收发器阵列(TCA)来满足低1/f噪声和高线性度要求。该电流缓冲器被实现为内置二阶滤波和可重构增益/带宽的双托马斯跨阻双置放大器(TIA)。通过在TCA和TIA设计期间利用可切换放大器方法来实现缩放功耗以及增益和带宽。测量结果表明,在1.2V的电源下,前端可以提供从35dB到55dB的可重构转换增益和从3MHz到65MHz的信号带宽,电流消耗从14.5mA缩放到48.5mA。在0.1 ~ 3GHz频率范围内,最大增益的测量噪声系数(NF)和输出三阶截距点(OIP3)分别为3.5 ~ 6dB和高于10dBm,芯片面积为2.0×1.2 mm2。
{"title":"A 1.2V 0.1–3GHz software-defined radio receiver front-end in 130nm CMOS","authors":"Mengdi Cao, B. Chi, Chun Zhang, Zhihua Wang","doi":"10.1109/RFIC.2011.5940699","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940699","url":null,"abstract":"A 1.2V 0.1–3GHz software-defined radio (SDR) receiver front-end in 130nm CMOS is presented. The current-driven passive mixer with 25% duty-cycle LO and reconfigurable inverter-based RF transconductor array (TCA) is utilized to satisfy the low 1/f noise and high linearity requirements. The current buffer is implemented as a like Tow-Thomas transimpedance biquad amplifier (TIA) with built-in 2nd-order filtering and reconfigurable gain/bandwidth. The scaling power consumption along with the gain and bandwidth is achieved by utilizing the switchable amplifier approach during TCA and TIA design. The measured results show that the front-end could provide reconfigurable conversion gain from 35dB to 55dB and signal bandwidth from 3MHz to 65MHz with scaling current consumption from 14.5mA to 48.5mA, from a power supply of 1.2V. The measured noise figure (NF) and output third-order intercept point (OIP3) with the maximum gain is 3.5∼6dB and higher than 10dBm, respectively, across 0.1∼3GHz frequency range, and the die area is 2.0×1.2 mm2.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132173061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Effects of the nonlinearity of the common-gate stage on the linearity of CMOS cascode low noise amplifier 共门级非线性对CMOS级联低噪声放大器线性度的影响
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940635
Chenglin Cui, Tae-Sung Kim, Seong-Kyun Kim, Jun-Kyung Cho, Su-Tae Kim, Byung-sung Kim
This work presents the effects of the common-gate (CG) stage nonlinearity on the linearity of the cascode amplifier. Conventionally, the CG stage is assumed as an ideal current buffer in the CMOS cascode low noise amplifier (LNA) design, but the analysis shows that the CG stage limits the linearity of the cascode LNA as the gain increases, due to the finite output resistance of the CG stage and the parasitic capacitance at the interstage node. Therefore, the simple linearization of the CS stage has difficulties to enhance the gain of LNA as the operating frequency increases. To confirm the analysis, a 2 GHz CMOS LNA was designed and the gain and the nonlinearity were measured. The measurement results show that there exists optimum load impedance to achieve the maximum OIP3 of the LNA as expected by the analysis.
本文研究了共门级非线性对级联放大器线性度的影响。传统上,CG级被认为是CMOS级联低噪声放大器(LNA)设计中理想的电流缓冲器,但分析表明,由于CG级的输出电阻有限和级间节点的寄生电容,随着增益的增加,CG级限制了级联LNA的线性度。因此,CS级的简单线性化很难随着工作频率的增加而提高LNA的增益。为了验证这一分析,设计了一个2 GHz的CMOS LNA,并测量了增益和非线性。测量结果表明,正如分析所期望的那样,存在使LNA达到最大OIP3的最佳负载阻抗。
{"title":"Effects of the nonlinearity of the common-gate stage on the linearity of CMOS cascode low noise amplifier","authors":"Chenglin Cui, Tae-Sung Kim, Seong-Kyun Kim, Jun-Kyung Cho, Su-Tae Kim, Byung-sung Kim","doi":"10.1109/RFIC.2011.5940635","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940635","url":null,"abstract":"This work presents the effects of the common-gate (CG) stage nonlinearity on the linearity of the cascode amplifier. Conventionally, the CG stage is assumed as an ideal current buffer in the CMOS cascode low noise amplifier (LNA) design, but the analysis shows that the CG stage limits the linearity of the cascode LNA as the gain increases, due to the finite output resistance of the CG stage and the parasitic capacitance at the interstage node. Therefore, the simple linearization of the CS stage has difficulties to enhance the gain of LNA as the operating frequency increases. To confirm the analysis, a 2 GHz CMOS LNA was designed and the gain and the nonlinearity were measured. The measurement results show that there exists optimum load impedance to achieve the maximum OIP3 of the LNA as expected by the analysis.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130852061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Large-signal characterization and modeling of MOSFET for PA applications 放大器应用中MOSFET的大信号特性和建模
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940715
Sunyoung Lee, Tzung-yin Lee
This paper presents the large-signal model requirements and generation as well as the 1- and 2-tone large-signal characterization for CMOS PA applications. The sensitivity of important parameters to the large-signal prediction for a transistor is discussed. It is demonstrated that an accurate modeling of Gm as a function of bias, as well as other important extrinsic transistor parameters, enables proper prediction of the 1-tone distortion behavior for a transistor, which in turn determines the quality of prediction for the 2-tone inter-modulation product up to the 5th order.
本文介绍了CMOS PA应用的大信号模型要求和生成,以及一音和二音大信号特性。讨论了重要参数对晶体管大信号预测的敏感性。结果表明,将Gm作为偏置函数以及其他重要的晶体管外部参数进行精确建模,可以正确预测晶体管的1音失真行为,从而决定了高达5阶的2音互调积的预测质量。
{"title":"Large-signal characterization and modeling of MOSFET for PA applications","authors":"Sunyoung Lee, Tzung-yin Lee","doi":"10.1109/RFIC.2011.5940715","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940715","url":null,"abstract":"This paper presents the large-signal model requirements and generation as well as the 1- and 2-tone large-signal characterization for CMOS PA applications. The sensitivity of important parameters to the large-signal prediction for a transistor is discussed. It is demonstrated that an accurate modeling of Gm as a function of bias, as well as other important extrinsic transistor parameters, enables proper prediction of the 1-tone distortion behavior for a transistor, which in turn determines the quality of prediction for the 2-tone inter-modulation product up to the 5th order.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121812753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A large-signal blocker robust transimpedance amplifier for coexisting radio receivers in 45nm CMOS 一种用于45nm CMOS共存无线电接收机的大信号阻断鲁棒跨阻放大器
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940696
Alfredo Perez-Carrillo, S. Taylor, J. Silva-Martínez, A. Karsilayan
A baseband transimpedance amplifier for coexisting radio receivers is presented. It exploits active feedback to improve out-of-band large-signal attenuation, minimizing in-band distortion due to close-in blockers. A fully-differential prototype of the proposed solution has been designed and implemented in 45nm CMOS. Experimental results show that it can handle linearly single tones of ±10mA, withstanding blocking currents of ±9mA at 50MHz and beyond before reaching P1dB in a 10MHz bandwidth. The fabricated device occupies 0.25mm2, largely MOM finger capacitors, and draws 17mA from a 2.5V supply.
提出了一种用于共存无线电接收机的基带跨阻放大器。它利用主动反馈来改善带外大信号衰减,最大限度地减少由于近距离阻塞引起的带内失真。该解决方案的全差分原型已在45nm CMOS上设计和实现。实验结果表明,它可以处理±10mA的线性单音,在50MHz及以上的带宽下承受±9mA的阻塞电流,在10MHz带宽下达到P1dB。制造的设备占地0.25mm2,主要是MOM手指电容器,并从2.5V电源中吸取17mA。
{"title":"A large-signal blocker robust transimpedance amplifier for coexisting radio receivers in 45nm CMOS","authors":"Alfredo Perez-Carrillo, S. Taylor, J. Silva-Martínez, A. Karsilayan","doi":"10.1109/RFIC.2011.5940696","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940696","url":null,"abstract":"A baseband transimpedance amplifier for coexisting radio receivers is presented. It exploits active feedback to improve out-of-band large-signal attenuation, minimizing in-band distortion due to close-in blockers. A fully-differential prototype of the proposed solution has been designed and implemented in 45nm CMOS. Experimental results show that it can handle linearly single tones of ±10mA, withstanding blocking currents of ±9mA at 50MHz and beyond before reaching P1dB in a 10MHz bandwidth. The fabricated device occupies 0.25mm2, largely MOM finger capacitors, and draws 17mA from a 2.5V supply.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127418693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Aging of 40nm MOSFET RF parameters under RF conditions from characterization to compact modeling for RF design 射频条件下40nm MOSFET射频参数的老化,从表征到射频设计的紧凑建模
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940645
L. Negre, D. Roy, F. Cacho, P. Scheer, S. Boret, A. Zaka, D. Gloria, G. Ghibaudo
In the framework of MOSFET reliability for mixed-analog application, a deep investigation of RF parameters degradation is performed. An innovative flow, composed of DC and RF stress with DC and RF aging characterization, is presented. Degradation kinetics of main parameters are physically explained and modeled using PSP compact model to predict the behavior of stressed devices.
在混合模拟应用的MOSFET可靠性框架下,对射频参数退化进行了深入研究。提出了一种由直流和射频应力组成的创新流,该流具有直流和射频老化特性。对主要参数的降解动力学进行了物理解释,并利用PSP紧凑模型建立了退化动力学模型,以预测受应力器件的行为。
{"title":"Aging of 40nm MOSFET RF parameters under RF conditions from characterization to compact modeling for RF design","authors":"L. Negre, D. Roy, F. Cacho, P. Scheer, S. Boret, A. Zaka, D. Gloria, G. Ghibaudo","doi":"10.1109/RFIC.2011.5940645","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940645","url":null,"abstract":"In the framework of MOSFET reliability for mixed-analog application, a deep investigation of RF parameters degradation is performed. An innovative flow, composed of DC and RF stress with DC and RF aging characterization, is presented. Degradation kinetics of main parameters are physically explained and modeled using PSP compact model to predict the behavior of stressed devices.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121096762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Integration of Antenna-on-Chip and signal detectors for applications from RF to THz frequency range in SiGe technology 集成天线片和信号探测器的应用从射频到太赫兹频率范围在SiGe技术
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940639
S. Wane, R. van Heijster, S. Bardy
This paper presents design solutions for signal detectors and Antenna on-Chip (AoC) using a state-of-the-art (SiGe) BiCMOS technology. Both CML (Current-Mode-Logic) and CMOS detectors are designed, fabricated and compared in terms of their performances such as conversion gain and robustness against process variations. Wide-band Antenna-on-Chip working in the range 60GHz to 94 GHz are designed, fabricated and characterized. Several Antenna-on-Chip structures are proposed to evaluate bandwidth and radiation efficiency performances. Near-field antenna couplings are experimentally evaluated using different technology variants with different silicon substrate thickness values. Schottky diodes are designed and characterized for feasibility analysis of THz detection, mixing and down-conversion.
本文介绍了使用最先进的(SiGe) BiCMOS技术的信号探测器和片上天线(AoC)的设计解决方案。CML(电流模式逻辑)和CMOS探测器都设计,制造和比较其性能,如转换增益和对工艺变化的鲁棒性。设计、制作并表征了工作在60GHz ~ 94ghz范围内的宽带片上天线。提出了几种片上天线结构来评估带宽和辐射效率性能。采用不同的技术变体和不同的硅衬底厚度值对近场天线耦合进行了实验评估。设计并表征了肖特基二极管,用于太赫兹探测、混频和下变频的可行性分析。
{"title":"Integration of Antenna-on-Chip and signal detectors for applications from RF to THz frequency range in SiGe technology","authors":"S. Wane, R. van Heijster, S. Bardy","doi":"10.1109/RFIC.2011.5940639","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940639","url":null,"abstract":"This paper presents design solutions for signal detectors and Antenna on-Chip (AoC) using a state-of-the-art (SiGe) BiCMOS technology. Both CML (Current-Mode-Logic) and CMOS detectors are designed, fabricated and compared in terms of their performances such as conversion gain and robustness against process variations. Wide-band Antenna-on-Chip working in the range 60GHz to 94 GHz are designed, fabricated and characterized. Several Antenna-on-Chip structures are proposed to evaluate bandwidth and radiation efficiency performances. Near-field antenna couplings are experimentally evaluated using different technology variants with different silicon substrate thickness values. Schottky diodes are designed and characterized for feasibility analysis of THz detection, mixing and down-conversion.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115914332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
A 19 dBm 0.13µm CMOS parallel class-E switching PA with minimal efficiency degradation under 6 dB back-off 一个19 dBm 0.13µm CMOS并联e类开关PA,在6 dB退退下效率下降最小
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940714
N. Singhal, N. Nidhi, Abhishek Ghosh, S. Pamarti
This paper implements a digital Zero Voltage Switching (ZVS) Contour based power amplifier previously proposed by the authors in [1]. The proposed PA implemented in 0.13µm digital CMOS technology, achieves a peak power of 19dBm at a peak drain efficiency of 23% and peak power added efficiency (PAE) of 18% at a center frequency of 800MHz from a 1.2V supply. The PA can maintain its peak efficiency over a 6dB dynamic range of output power by a simultaneous load and duty cycle modulation of a parallel class E PA. The PA achieves an average drain efficiency of 20% and an average PAE of 15% while generating 6dB peak to minimum ratio (PMR) OQPSK signal with bandwidths up to 20Mbps.
本文实现了作者先前在[1]中提出的基于数字零电压开关(ZVS)轮廓的功率放大器。该放大器采用0.13µm数字CMOS技术,在中心频率为800MHz的1.2V电源下,峰值功率为19dBm,峰值漏极效率为23%,峰值功率附加效率(PAE)为18%。通过同时对并联E级PA进行负载和占空比调制,该PA可以在6dB动态范围内保持其峰值效率。该放大器的平均漏极效率为20%,平均PAE为15%,同时产生6dB峰值最小比(PMR) OQPSK信号,带宽高达20Mbps。
{"title":"A 19 dBm 0.13µm CMOS parallel class-E switching PA with minimal efficiency degradation under 6 dB back-off","authors":"N. Singhal, N. Nidhi, Abhishek Ghosh, S. Pamarti","doi":"10.1109/RFIC.2011.5940714","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940714","url":null,"abstract":"This paper implements a digital Zero Voltage Switching (ZVS) Contour based power amplifier previously proposed by the authors in [1]. The proposed PA implemented in 0.13µm digital CMOS technology, achieves a peak power of 19dBm at a peak drain efficiency of 23% and peak power added efficiency (PAE) of 18% at a center frequency of 800MHz from a 1.2V supply. The PA can maintain its peak efficiency over a 6dB dynamic range of output power by a simultaneous load and duty cycle modulation of a parallel class E PA. The PA achieves an average drain efficiency of 20% and an average PAE of 15% while generating 6dB peak to minimum ratio (PMR) OQPSK signal with bandwidths up to 20Mbps.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"58 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116580359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A 60GHz-band 20dBm power amplifier with 20% peak PAE 60ghz频段20dBm功率放大器,峰值PAE为20%
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940687
Yi Zhao, J. Long, M. Spirito
A three-stage, 60GHz transformer-coupled differential power amplifier is implemented in 130nm SiGe-BiCMOS. Common-base differential pair stages extend BVCEO, while neutralization increases isolation, promoting stability. Self-shielded transformers, a parasitic-compensated 4∶1 output combiner and 2∶4 input splitter are designed for low insertion loss and compact dimensions on-chip. Measured small-signal gain is >20dB with over 10GHz −3dB bandwidth. Reverse isolation is better than 51dB across 50–65GHz. Maximum output power and peak-PAE are 20.5dBm and 20%, respectively, at 61.5GHz. The PA consumes 353mW from a 1.8V supply and 0.25mm2 active area.
在130nm SiGe-BiCMOS中实现了一个三级60GHz变压器耦合差分功率放大器。共基差分对级扩展BVCEO,而中和增加隔离,促进稳定性。设计了自屏蔽变压器、寄生补偿4∶1输出组合器和2∶4输入分路器,具有插入损耗低、片上尺寸小等优点。测量的小信号增益为>20dB,带宽超过10GHz - 3dB。在50-65GHz范围内,反向隔离优于51dB。在61.5GHz时,最大输出功率为20.5dBm,峰值pae为20%。PA从1.8V电源和0.25mm2有效面积消耗353mW。
{"title":"A 60GHz-band 20dBm power amplifier with 20% peak PAE","authors":"Yi Zhao, J. Long, M. Spirito","doi":"10.1109/RFIC.2011.5940687","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940687","url":null,"abstract":"A three-stage, 60GHz transformer-coupled differential power amplifier is implemented in 130nm SiGe-BiCMOS. Common-base differential pair stages extend BVCEO, while neutralization increases isolation, promoting stability. Self-shielded transformers, a parasitic-compensated 4∶1 output combiner and 2∶4 input splitter are designed for low insertion loss and compact dimensions on-chip. Measured small-signal gain is >20dB with over 10GHz −3dB bandwidth. Reverse isolation is better than 51dB across 50–65GHz. Maximum output power and peak-PAE are 20.5dBm and 20%, respectively, at 61.5GHz. The PA consumes 353mW from a 1.8V supply and 0.25mm2 active area.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116629129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 39
A fully integrated 96GHz 2×2 focal-plane array with On-Chip antenna 一个完全集成的96GHz 2×2焦平面阵列与片上天线
Pub Date : 2011-06-05 DOI: 10.1109/RFIC.2011.5940668
Chun-Cheng Wang, Zhiming Chen, Hsin-Cheng Yao, P. Heydari
A fully integrated 96GHz 2×2 focal-plane array (FPA) direct conversion imager in 0.18µm SiGe BiCMOS (fTmax=200/180GHz) employing four integrated antennas with Dicke switches and LO generation/distribution is presented. The PLL plus tripler achieves a locking range of 92.67–98.2GHz and phase noise of −93dBc/Hz at 96GHz measured at 1MHz offset. The 3.5×3mm2 chip achieves an average responsivity and NEP of 285MV/W and 8.1fW/√Hz, respectively, across 86–106GHz band and an NETD of 0.48K. The chip consumes 695mW from 1.8V/2.5V supplies.
提出了一种采用四根集成天线、Dicke开关和LO产生/分布的全集成96GHz 2×2焦平面阵列(FPA)直接转换成像仪,该成像仪采用0.18µm SiGe BiCMOS (fT/ƒmax=200/180GHz)。锁相环加三倍器实现了92.67-98.2GHz的锁定范围,在1MHz偏移量下测量的96GHz相位噪声为- 93dBc/Hz。3.5×3mm2芯片在86-106GHz频段的平均响应度和平均NEP分别为285MV/W和8.1fW/√Hz, NETD为0.48K。该芯片从1.8V/2.5V电源消耗695mW。
{"title":"A fully integrated 96GHz 2×2 focal-plane array with On-Chip antenna","authors":"Chun-Cheng Wang, Zhiming Chen, Hsin-Cheng Yao, P. Heydari","doi":"10.1109/RFIC.2011.5940668","DOIUrl":"https://doi.org/10.1109/RFIC.2011.5940668","url":null,"abstract":"A fully integrated 96GHz 2×2 focal-plane array (FPA) direct conversion imager in 0.18µm SiGe BiCMOS (f<inf>T</inf>/ƒ<inf>max</inf>=200/180GHz) employing four integrated antennas with Dicke switches and LO generation/distribution is presented. The PLL plus tripler achieves a locking range of 92.67–98.2GHz and phase noise of −93dBc/Hz at 96GHz measured at 1MHz offset. The 3.5×3mm<sup>2</sup> chip achieves an average responsivity and NEP of 285MV/W and 8.1fW/√Hz, respectively, across 86–106GHz band and an NETD of 0.48K. The chip consumes 695mW from 1.8V/2.5V supplies.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129775749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
期刊
2011 IEEE Radio Frequency Integrated Circuits Symposium
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