Soldering & Surface Mount Technology最新文献

Purpose

This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB₂, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB₂/AgCuTi or AgCu alloy/SLMed Ti/TiB₂ brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB₂ has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB₂ substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.

Design/methodology/approach

Brazing SLMed-Ti/TiB₂ in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).

Findings

The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti₂Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.

Originality/value

The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB₂ using AgCuTi and AgCu filler metals.

Purpose

This paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging.

Design/methodology/approach

The effects of Ag or Cu additions on the microstructure, interfacial metallic compound layer and shear strength of Sn–15Bi (Sn15Bi) based solder joints during were investigated. The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. The shear tests were carried out on the as-soldered and as-aged joints using a ball shear tester.

Findings

The results revealed that by adding Ag or Cu, the microstructure of Sn15Bi solder can be refined. Ag addition increased the tensile strength of Sn15Bi solder but had little effect on elongation. However, Cu addition decreased the tensile strength and elongation of Sn15Bi solder. For solder joints, Ag addition increased the shear strength and toughness of Sn15Bi/Cu joints but Cu addition decreased the shear strength and toughness of Sn15Bi/Cu joints.

Originality/value

The authors can potentially provide a replacement for Sn40Pb traditional solder with Sn15Bi solder by alloying Ag or Cu due to its lower cost and similar melting point as Sn–Pb solder.

Purpose

The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.

Design/methodology/approach

In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.

Findings

When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.

Research limitations/implications

The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.

Practical implications

The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.

Social implications

The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.

Originality/value

The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.

Purpose

This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability.

Design/methodology/approach

Finite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board.

Findings

The simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution.

Practical implications

This research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products.

Originality/value

The comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.

Purpose

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

Design/methodology/approach

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

Findings

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

Originality/value

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

Purpose

The purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By comparing the bending radius and strength across differently sized and treated chips, the study sought to understand the underlying mechanics that contribute to the flexibility of silicon-based electronic devices. This understanding is crucial for the development of advanced, robust and adaptable electronic systems that can withstand the rigors of manufacturing and everyday use.

Design/methodology/approach

This study explores the impact of silicon chip geometry and surface defects on flexibility through a multifaceted experimental approach. The methodology included preparing silicon chips of three distinct dimensions and subjecting them to thinning processes to achieve a uniform thickness verified via scanning electron microscopy (SEM). Finite element method (FEM) simulations and a series of four-point bending tests were used to analyze the bending flexibility theoretically and experimentally. The approach was comprehensive, examining both the intrinsic geometric factors and the extrinsic influence of surface defects induced by manufacturing processes.

Findings

The findings revealed a significant deviation between the theoretical predictions from FEM simulations and the experimental outcomes from the four-point bending tests. Rectangular-shaped chips demonstrated superior flexibility, with smaller dimensions leading to an increased bending strength. Surface defects, identified as critical factors affecting flexibility, were analyzed through SEM and atomic force microscopy, showing that etching processes could reduce defect density and enhance flexibility. Notably, the study concluded that surface defects have a more pronounced impact on silicon chip flexibility than geometric factors, challenging initial assumptions and highlighting the need for defect minimization in chip manufacturing.

Originality/value

This research contributes valuable insights into the design and fabrication of flexible electronic devices, emphasizing the significant role of surface defects over geometric considerations in determining silicon chip flexibility. The originality of the work lies in its holistic approach to dissecting the factors influencing silicon chip flexibility, combining theoretical simulations with practical bending tests and surface defect analysis. The findings underscore the importance of optimizing manufacturing processes to reduce surface defects, thereby paving the way for the creation of more durable and flexible electronic devices for future technologies.

Purpose

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

Design/methodology/approach

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

Findings

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

Originality/value

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

Purpose

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

Design/methodology/approach

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Findings

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

Originality/value

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

Purpose

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

Design/methodology/approach

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

Findings

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Practical implications

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Originality/value

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

Purpose

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Design/methodology/approach

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

Findings

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

Practical implications

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

Originality/value

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.