Extreme thermal control technology based on phase change heat storage has important scientific value and practical significance for ultra-high heat flux density thermal control serving aerospace, high-power electronic equipment, and semiconductor integrated circuits. This study addresses the critical limitations of traditional phase change materials (PCM), including low thermal conductivity and latent heat, leakage, and rigidity, by developing a novel flexible composite PCM (CPCM) for advanced thermal management. The CPCM was fabricated via a hybrid hot-press method using paraffin (PA) as the phase change matrix, olefin block copolymer (OBC) and styrene-ethylene-butylene-styrene (SEBS) as encapsulation supports, and expanded graphite (EG) as a thermal conductive filler. The optimized CPCM with a PA/OBC/SEBS ratio of 16:2:2 and containing 5 wt % EG exhibited a leakage rate of 4.75 % after 70 thermal cycles. Its mechanical flexibility was significantly enhanced, with the maximum strain increasing from 36 % to 122 %, while the thermal conductivity improved by 66.7 % to 0.60 W/(m·K), all while maintaining a high latent heat of up to 194 J/g. Numerical simulations of a battery pack consisting of 16 cells further demonstrate that, with PCM-based cooling, the average battery temperature can be effectively regulated and stabilized in the vicinity of the PCM melting temperature (35 °C), even under the 4C discharge condition. Specifically, the average temperature was maintained at 35.13 °C, which is 7.7 °C lower than that achieved using natural convection. These results demonstrate superior temperature uniformity and thermal management performance, highlighting the strong potential of the proposed CPCM for applications in high-power electronics and extreme operating environments.
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