The rapid development of the integrated circuit (IC) industry has continuously increased the complexity of IC manufacturing processes. Massive data analysis, exemplified by Wafer Map analysis, poses growing challenges for engineers and technicians in the field. With the ongoing advancement and maturation of machine learning in artificial intelligence, the application of machine learning algorithms for automated recognition and classification of wafer map patterns, known as Wafer Map Pattern Recognition and Classification, has emerged as a prominent research focus within the industry over the past decade. This paper conducts a systematic and comprehensive study, analyzing various machine learning algorithms applied to the problem of wafer map pattern recognition and classification. Starting from traditional machine learning techniques to neural networks and deep learning, the study identifies convolutional neural networks (CNNs) as one of the most effective approaches for addressing this problem currently. The research also highlights the continuous optimization of deep learning algorithms, focusing on improvements in architecture, depth, feature fusion, and the introduction of attention mechanisms to enhance the extraction of fine local features. Furthermore, the paper addresses issues related to data dependency, emphasizing innovations such as data augmentation, data generation, and semi-supervised learning models to mitigate the adverse effects of data scarcity and imbalance on deep learning training. These advancements aim to facilitate superior results for deep learning algorithms in solving the problem of wafer map pattern recognition and classification, thereby contributing to the field's ongoing progress.
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