Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105686
L. Xu, X. H. Chen, X. J. Liu, Y. Yu, Y. R. Wu
The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot rolling. The thermal conductivity of the composites with different concentration of MWCNTs were measured. Although the coefficient of thermal conductivity decreases with the increase of the MWCNT content, it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the microhardness of the nanocomposites are much higher than that of pure copper, which is ascribed to the good dispersion of the MWCNTs in matrix.
{"title":"Thermal conductivity and microhardness of MWCNTs/copper nanocomposites","authors":"L. Xu, X. H. Chen, X. J. Liu, Y. Yu, Y. R. Wu","doi":"10.1109/ISAPM.2011.6105686","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105686","url":null,"abstract":"The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot rolling. The thermal conductivity of the composites with different concentration of MWCNTs were measured. Although the coefficient of thermal conductivity decreases with the increase of the MWCNT content, it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the microhardness of the nanocomposites are much higher than that of pure copper, which is ascribed to the good dispersion of the MWCNTs in matrix.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"5 1","pages":"26-30"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86678747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105740
Ge Dandong, C. Meng, Koh Liang Kng Ian, M. Walter
This report discloses an advanced approach to improve the prediction of electronic IC packages' reliability performance by studying packaging materials' thermo-mechanical properties at different high temperature storage conditions. Package level reliability has been well studied. However, during material screening stage, it is difficult to estimate the impact of IC packaging materials on package reliability performance based on typical material properties such as CTE, Tg and Storage Modulus determined at time zero stage. In this study, 3 types of Epoxy mold compounds (EMCs) were characterized with their thermo-mechanical properties by means of TGA, TMA and DMA at different 175°C high temperature storage (HTS) durations, i.e. 0hr, 1000hrs and 2000hrs respectively. Furthermore, simulation assessments for package stress are conducted for EMC evaluation at package level. The thermo-mechanical properties of EMC materials obtained are used as inputs for static linear simulation. Package stresses are retrieved from the simulation for relative comparison. The simulation results clearly show that the material degradation due to HTS has significant impact on the package stress level especially at high temperature range, which is critical for packages with stringent reliability requirement in automotive industry.
{"title":"A comparison study of thermal aging effect on mold compound and its impact on leadframe packages stress","authors":"Ge Dandong, C. Meng, Koh Liang Kng Ian, M. Walter","doi":"10.1109/ISAPM.2011.6105740","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105740","url":null,"abstract":"This report discloses an advanced approach to improve the prediction of electronic IC packages' reliability performance by studying packaging materials' thermo-mechanical properties at different high temperature storage conditions. Package level reliability has been well studied. However, during material screening stage, it is difficult to estimate the impact of IC packaging materials on package reliability performance based on typical material properties such as CTE, Tg and Storage Modulus determined at time zero stage. In this study, 3 types of Epoxy mold compounds (EMCs) were characterized with their thermo-mechanical properties by means of TGA, TMA and DMA at different 175°C high temperature storage (HTS) durations, i.e. 0hr, 1000hrs and 2000hrs respectively. Furthermore, simulation assessments for package stress are conducted for EMC evaluation at package level. The thermo-mechanical properties of EMC materials obtained are used as inputs for static linear simulation. Package stresses are retrieved from the simulation for relative comparison. The simulation results clearly show that the material degradation due to HTS has significant impact on the package stress level especially at high temperature range, which is critical for packages with stringent reliability requirement in automotive industry.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"34 1","pages":"403-409"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87430413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105680
Yinong Liu, Yiping Wu, B. An
The single LED package structure determines the light intensity distribution and the well-designed package structure will be conductive to light emitting and improve its external quantum efficiency. This paper based on the optical package structure of high power LED, in order to analyze the influence of the structure of LED package on optical performance and the feasibility of the packaging structure design, the simplified high power LED optical models were established in Tracepro software. The light distribution curve of LED was obtained and the difference between measured data and simulation result was compared. By changing the LED optical model parameters in the experiment, such as: the shape of reflector, lens design and the position of phosphors to get the light distribution curves under different parameters of package structure and then we analyze the effect of various packaging structures on optical performance to find the package structure optimization, so that it could be used in actual production getting a higher available luminous flux and the light extraction. What's more, designing a package structure which can be achieving the specific light intensity distribution meets the requirements of the LED light source in different areas.
{"title":"Optical simulation analysis of high power LED package structure","authors":"Yinong Liu, Yiping Wu, B. An","doi":"10.1109/ISAPM.2011.6105680","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105680","url":null,"abstract":"The single LED package structure determines the light intensity distribution and the well-designed package structure will be conductive to light emitting and improve its external quantum efficiency. This paper based on the optical package structure of high power LED, in order to analyze the influence of the structure of LED package on optical performance and the feasibility of the packaging structure design, the simplified high power LED optical models were established in Tracepro software. The light distribution curve of LED was obtained and the difference between measured data and simulation result was compared. By changing the LED optical model parameters in the experiment, such as: the shape of reflector, lens design and the position of phosphors to get the light distribution curves under different parameters of package structure and then we analyze the effect of various packaging structures on optical performance to find the package structure optimization, so that it could be used in actual production getting a higher available luminous flux and the light extraction. What's more, designing a package structure which can be achieving the specific light intensity distribution meets the requirements of the LED light source in different areas.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"25 1","pages":"99-103"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82257557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105737
Shufeng Zhao
The moisture absorption experiments of 8 kinds of molding compound and two kinds of organic substrate at 30°C/60% RH was performed to evaluate the moisture absorption performance. Organic substrate absorbed more moisture than molding compound, which provides validation of baking process before die attach during assembly, and possible cause of inter-layer popcorn during ball attach or solder reflow of some laminated substrate device. Influence of resin type and filler content on moisture absorption of molding compound was analyzed. Occurrence of moisture in condensed state is assumed to be cause of non-Fickian diffusion of moisture, and simulation result with corrected diffusion coefficient showed good explanation to the experimental absorption curve.
{"title":"Moisture absorption of molding compound and organic substrate","authors":"Shufeng Zhao","doi":"10.1109/ISAPM.2011.6105737","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105737","url":null,"abstract":"The moisture absorption experiments of 8 kinds of molding compound and two kinds of organic substrate at 30°C/60% RH was performed to evaluate the moisture absorption performance. Organic substrate absorbed more moisture than molding compound, which provides validation of baking process before die attach during assembly, and possible cause of inter-layer popcorn during ball attach or solder reflow of some laminated substrate device. Influence of resin type and filler content on moisture absorption of molding compound was analyzed. Occurrence of moisture in condensed state is assumed to be cause of non-Fickian diffusion of moisture, and simulation result with corrected diffusion coefficient showed good explanation to the experimental absorption curve.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"27 1","pages":"387-393"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84535786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105676
L. Guoguang, Huang Yun, Lei Zhifeng
The main failure mechanisms of high power diode lasers such as material defects, mirror damage and solder related failures as well as to methods which significantly suppress the occurrence of catastrophic failure and solder related failures are investigated in this paper. Meanwhile, in order to obtain the lifetime data of high power QCM cm-bar arrays, we have set up an automated diode array reliability experiment to examine the characteristics of high power QCW cm-bar arrays over time, and aging test results up to 2.0×109 shots at 25°C will be reported.
{"title":"Studies of the degradation mechanisms in high power diode lasers","authors":"L. Guoguang, Huang Yun, Lei Zhifeng","doi":"10.1109/ISAPM.2011.6105676","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105676","url":null,"abstract":"The main failure mechanisms of high power diode lasers such as material defects, mirror damage and solder related failures as well as to methods which significantly suppress the occurrence of catastrophic failure and solder related failures are investigated in this paper. Meanwhile, in order to obtain the lifetime data of high power QCM cm-bar arrays, we have set up an automated diode array reliability experiment to examine the characteristics of high power QCW cm-bar arrays over time, and aging test results up to 2.0×109 shots at 25°C will be reported.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"34 4 1","pages":"80-84"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89541873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105698
Yao-Ling Kuo, Kwang-Lung Lin
The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ∼ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni5Zn21 and NiZn3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.
{"title":"The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating","authors":"Yao-Ling Kuo, Kwang-Lung Lin","doi":"10.1109/ISAPM.2011.6105698","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105698","url":null,"abstract":"The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ∼ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni5Zn21 and NiZn3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"61 9","pages":"193-198"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91512127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105750
Ling Wang, Hongqin Wang, Chao Wan, Pengcheng Wang, Mingyu Li, Bin Du, Meiling Deng, Lijiao He
The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.
{"title":"Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED","authors":"Ling Wang, Hongqin Wang, Chao Wan, Pengcheng Wang, Mingyu Li, Bin Du, Meiling Deng, Lijiao He","doi":"10.1109/ISAPM.2011.6105750","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105750","url":null,"abstract":"The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"4 1","pages":"446-449"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90305229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/ISAPM.2011.6105735
Y. Li, Z. Xia, Y. Lei, Hu Zhou
The performance of additional vinyl liquid silicone rubber (LSR) were investigated based on accelerated aging test in different environment. The mechanical properties were studied in different experimental environments. Meanwhile, the cross-linking densities of the investigated samples were obtained by equilibrium swelling method. The article analyzed the changes of cross-linking density in different environments with time. The results showed that the tensile strength and elongation of vinyl LSR at high temperature and humidity conditions fluctuated gently, while the hardness increased greatly with time. The influence of salt spray corrosion on its performance was little, and its cross-linking density with its mechanical properties showed variation trend. The SEM image of the rubber's fracture topography showed that the cross-linking was compact and consistent.
{"title":"Study on the environmental performance of additional vinyl LSR","authors":"Y. Li, Z. Xia, Y. Lei, Hu Zhou","doi":"10.1109/ISAPM.2011.6105735","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105735","url":null,"abstract":"The performance of additional vinyl liquid silicone rubber (LSR) were investigated based on accelerated aging test in different environment. The mechanical properties were studied in different experimental environments. Meanwhile, the cross-linking densities of the investigated samples were obtained by equilibrium swelling method. The article analyzed the changes of cross-linking density in different environments with time. The results showed that the tensile strength and elongation of vinyl LSR at high temperature and humidity conditions fluctuated gently, while the hardness increased greatly with time. The influence of salt spray corrosion on its performance was little, and its cross-linking density with its mechanical properties showed variation trend. The SEM image of the rubber's fracture topography showed that the cross-linking was compact and consistent.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"114 1","pages":"378-382"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80223848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/ISAPM.2011.6105697
Libbert Peng, Bing Liu, Justan Sun
Both liquid film and dry film photoresists are used broadly in bumping technology. As of today, different strippers are used to remove them separately, which adds extra cost in handling different photoresist consumables in different process schemes. In this paper, a well-designed and unique stripper is introduced to address liquid film and dry film photoresist strip compatibility issue in mixed solvents system. The results indicate the stripper can remove both liquid film and dry film photoresists at the same operation temperature. Through the dissolution mechanism, the bumps and Cu substrate are well protected under different process time
{"title":"A novel photoresist stripper for bumping technology","authors":"Libbert Peng, Bing Liu, Justan Sun","doi":"10.1109/ISAPM.2011.6105697","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105697","url":null,"abstract":"Both liquid film and dry film photoresists are used broadly in bumping technology. As of today, different strippers are used to remove them separately, which adds extra cost in handling different photoresist consumables in different process schemes. In this paper, a well-designed and unique stripper is introduced to address liquid film and dry film photoresist strip compatibility issue in mixed solvents system. The results indicate the stripper can remove both liquid film and dry film photoresists at the same operation temperature. Through the dissolution mechanism, the bumps and Cu substrate are well protected under different process time","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"36 1","pages":"190-192"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82294448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/ISAPM.2011.6105725
Junyi Li, Hong Wang, Huiying Wang, Z. Zhang, P. Cheng, G. Ding
A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4∼32.9GPa and 574∼764MPa, respectively.
{"title":"Design and fabrication of Cu-TSV free-standing specimen for uniaxial micro-tensile test","authors":"Junyi Li, Hong Wang, Huiying Wang, Z. Zhang, P. Cheng, G. Ding","doi":"10.1109/ISAPM.2011.6105725","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105725","url":null,"abstract":"A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4∼32.9GPa and 574∼764MPa, respectively.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"29 1","pages":"318-321"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81872255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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