Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105671
Lifei Lai, R. Sun, T. Zhao, Xiaoliang Zeng, Shuhui Yu
It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.
{"title":"Processing technology of embedded thin-film resistor materials","authors":"Lifei Lai, R. Sun, T. Zhao, Xiaoliang Zeng, Shuhui Yu","doi":"10.1109/ISAPM.2011.6105671","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105671","url":null,"abstract":"It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85260086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105755
Shunan Qiu, F. Zong, Tian Jiang
SIP (System in Package), enhanced power capability and high I/O count are three technological trends of semiconductor packaging. Power Stacked-die Multi-row Lead package could synthesize these three advanced features into one single package by utilizing the stacked-die structure, Al wires and multi-row leads. The manufacturing process flow consists of twice die bonding, wire bonding, molding and lead trimming and forming processes. This paper will also analyze the potential issues of manufacturing process and propose the corresponding solutions.
SIP (System in Package)、增强功率和高I/O数是半导体封装的三大技术趋势。功率堆芯多排引线封装利用堆芯结构、铝线和多排引线，将以上三个先进特性综合到一个封装中。制造工艺流程包括两次模具粘接，焊丝粘接，成型和引线修整和成型工艺。本文还将分析制造过程中可能存在的问题，并提出相应的解决方案。
{"title":"A new package structure with power stacked-die multi-row lead and process flow","authors":"Shunan Qiu, F. Zong, Tian Jiang","doi":"10.1109/ISAPM.2011.6105755","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105755","url":null,"abstract":"SIP (System in Package), enhanced power capability and high I/O count are three technological trends of semiconductor packaging. Power Stacked-die Multi-row Lead package could synthesize these three advanced features into one single package by utilizing the stacked-die structure, Al wires and multi-row leads. The manufacturing process flow consists of twice die bonding, wire bonding, molding and lead trimming and forming processes. This paper will also analyze the potential issues of manufacturing process and propose the corresponding solutions.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85727572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105680
Yinong Liu, Yiping Wu, B. An
The single LED package structure determines the light intensity distribution and the well-designed package structure will be conductive to light emitting and improve its external quantum efficiency. This paper based on the optical package structure of high power LED, in order to analyze the influence of the structure of LED package on optical performance and the feasibility of the packaging structure design, the simplified high power LED optical models were established in Tracepro software. The light distribution curve of LED was obtained and the difference between measured data and simulation result was compared. By changing the LED optical model parameters in the experiment, such as: the shape of reflector, lens design and the position of phosphors to get the light distribution curves under different parameters of package structure and then we analyze the effect of various packaging structures on optical performance to find the package structure optimization, so that it could be used in actual production getting a higher available luminous flux and the light extraction. What's more, designing a package structure which can be achieving the specific light intensity distribution meets the requirements of the LED light source in different areas.
{"title":"Optical simulation analysis of high power LED package structure","authors":"Yinong Liu, Yiping Wu, B. An","doi":"10.1109/ISAPM.2011.6105680","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105680","url":null,"abstract":"The single LED package structure determines the light intensity distribution and the well-designed package structure will be conductive to light emitting and improve its external quantum efficiency. This paper based on the optical package structure of high power LED, in order to analyze the influence of the structure of LED package on optical performance and the feasibility of the packaging structure design, the simplified high power LED optical models were established in Tracepro software. The light distribution curve of LED was obtained and the difference between measured data and simulation result was compared. By changing the LED optical model parameters in the experiment, such as: the shape of reflector, lens design and the position of phosphors to get the light distribution curves under different parameters of package structure and then we analyze the effect of various packaging structures on optical performance to find the package structure optimization, so that it could be used in actual production getting a higher available luminous flux and the light extraction. What's more, designing a package structure which can be achieving the specific light intensity distribution meets the requirements of the LED light source in different areas.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82257557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105702
Yujun Zhang, Hui Yu, Liangliang Li
Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.
{"title":"Synthesis and low-temperature sintering of tin-doped silver nanoparticles","authors":"Yujun Zhang, Hui Yu, Liangliang Li","doi":"10.1109/ISAPM.2011.6105702","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105702","url":null,"abstract":"Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80483258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105705
A. Jalar, M. Zulkifli, N. Othman, S. Abdullah
Wire bonding is the most popular interconnection technique that has been used in microelectronics packaging due to its maturity and cost effectiveness. The technology advances in the era of miniaturization and multifunction have urges the need for the smaller wire bond size to cope with the decrease of bond pad pitches. Ultimately, this will introduces al lot of technology challenges in the characterization and performance of wire bonding micromechanical properties. The conventional tests such as wire pull and ball shear tests provide inadequate information in respect of bonding and metallurgical response of the interconnection. This is because the evaluations of wire bond performance based on conventional tests are more into qualitative results or failure modes rather than detailed quantitative results. Furthermore, the results obtained through wire pull and ball shear tests will change and introduce a lot of variations as the ball bond diameter become smaller. In the present analysis, nanoindentation test was introduced in order to provide more adequate information about the quality of wire bond. Nanoindentation test provides the micromechanical properties in terms of hardness and reduced modulus value in the small length scale. This will facilitate the micromechanical properties measurement of the wire bond. In addition, the continuous measurement of stiffness provided from nanoindentation test realizes the qualitative results of materials such as deformation, strain hardening effect and creep behaviour. Wire bonding process was prepared using thermosonic wire bonding technology using 25 μm diameter of gold wire on the Aluminium bond pad. The nanoindentation test was conducted at various locations on the ball bond that has been cross-sectioned diagonally prior to the indentation process. To further investigate the micromechanical properties, the location of indentations was divided into two zones namely Zone 1 and Zone 2. Zone 1 is located at the area near to the intermetallic layer of Au and Al, while Zone 2 is located at deformed ball bond created from the inner chamfer of capillary. The results show that the micromechanical properties of ball bond vary throughout the location of indentations. The hardness and the reduced modulus for the indentations that located at the Zone 1 have higher average values compared to that of the indentations that located at the Zone 2. The average value of hardness and reduced modulus for the indentations at the Zone 1 are 1.011 GPa and 88.652 GPa, respectively. While the average value of hardness and reduced modulus for the indentations at the Zone 2 are 0.853 GPa and 70.652 GPa, respectively. In addition, indentation 1 of Zone 1 that located perpendicular to the effect of deformation created from the end of capillary has the highest value of hardness with value of 1.156 GPa. The value of hardness for the indentations 3 and 4 of Zone 1 has the lowest value of hardness with value of 0.928 GPa and 0.834 GPa, re
{"title":"The re-evaluation of mechanical properties of wire bonding","authors":"A. Jalar, M. Zulkifli, N. Othman, S. Abdullah","doi":"10.1109/ISAPM.2011.6105705","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105705","url":null,"abstract":"Wire bonding is the most popular interconnection technique that has been used in microelectronics packaging due to its maturity and cost effectiveness. The technology advances in the era of miniaturization and multifunction have urges the need for the smaller wire bond size to cope with the decrease of bond pad pitches. Ultimately, this will introduces al lot of technology challenges in the characterization and performance of wire bonding micromechanical properties. The conventional tests such as wire pull and ball shear tests provide inadequate information in respect of bonding and metallurgical response of the interconnection. This is because the evaluations of wire bond performance based on conventional tests are more into qualitative results or failure modes rather than detailed quantitative results. Furthermore, the results obtained through wire pull and ball shear tests will change and introduce a lot of variations as the ball bond diameter become smaller. In the present analysis, nanoindentation test was introduced in order to provide more adequate information about the quality of wire bond. Nanoindentation test provides the micromechanical properties in terms of hardness and reduced modulus value in the small length scale. This will facilitate the micromechanical properties measurement of the wire bond. In addition, the continuous measurement of stiffness provided from nanoindentation test realizes the qualitative results of materials such as deformation, strain hardening effect and creep behaviour. Wire bonding process was prepared using thermosonic wire bonding technology using 25 μm diameter of gold wire on the Aluminium bond pad. The nanoindentation test was conducted at various locations on the ball bond that has been cross-sectioned diagonally prior to the indentation process. To further investigate the micromechanical properties, the location of indentations was divided into two zones namely Zone 1 and Zone 2. Zone 1 is located at the area near to the intermetallic layer of Au and Al, while Zone 2 is located at deformed ball bond created from the inner chamfer of capillary. The results show that the micromechanical properties of ball bond vary throughout the location of indentations. The hardness and the reduced modulus for the indentations that located at the Zone 1 have higher average values compared to that of the indentations that located at the Zone 2. The average value of hardness and reduced modulus for the indentations at the Zone 1 are 1.011 GPa and 88.652 GPa, respectively. While the average value of hardness and reduced modulus for the indentations at the Zone 2 are 0.853 GPa and 70.652 GPa, respectively. In addition, indentation 1 of Zone 1 that located perpendicular to the effect of deformation created from the end of capillary has the highest value of hardness with value of 1.156 GPa. The value of hardness for the indentations 3 and 4 of Zone 1 has the lowest value of hardness with value of 0.928 GPa and 0.834 GPa, re","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76755149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105722
Weidong Huang, D. Bai, Andy Luo
Finite Element (FE) simulation is an effective approach to investigate the thermal stress status and the reliability trend when qualifying a new packaging material going through the reliability test. However, simulation of thermal stresses in gold wires was rarely reported in previous days due to the hardness in FE model building. This study performs 3D modeling to evaluate the thermal stresses in 2N gold wires with the full package model to identify which wires to peel for process control setup. The results from this modeling will be used to verify the second bond to file the process specification of wire peel test. The FE model in this paper describes a PBGA package with 2N gold wires surrounded by mold compound and other parts of the package. Stress evaluation is done through discussing the Von Mises stress, the equivalent plastic strain and the peeling stress. TC (temperature cycle) condition is applied in the modeling. The simulation results indicate that shorter wire(s) has higher stress than longer wire(s) and shorter corner wire(s) has the highest propensity to fail in TC. Different from the other wires, the highest peeling stress on bonding interface for the shorter center wire(s) is at the wire heel location instead of the tail end of the stitch bond. The wire heel location is usually regarded as the sensitive region related with the initial crack leading to the stitch bond failure. Thus, the shorter corner and center wire(s) should be regarded as high priority to be wire peeled and filed into wire peel specification. Besides, the relationship between stress status (reliability propensity) of stitch bond and the stitch bond shape is discussed. According to the measurement data of various stitch shapes, three typical stitch bond shapes (marked as A, B and C) are proposed and modeled. The modeling data show that the shortest stitch length (shape A) has the highest stress and plastic strain in the stitch bond comparing with the other shapes, and produces the highest peeling stress at bond interface. It might imply that the shortest stitch length could cause the higher propensity leading to bond lift in stress test. It could become a guideline for wire bond process that engineers should avoid forming the short stitch length when bonding 2N gold wires.
{"title":"Stress simulation for 2N gold wires and evaluation on the stitch bond shapes","authors":"Weidong Huang, D. Bai, Andy Luo","doi":"10.1109/ISAPM.2011.6105722","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105722","url":null,"abstract":"Finite Element (FE) simulation is an effective approach to investigate the thermal stress status and the reliability trend when qualifying a new packaging material going through the reliability test. However, simulation of thermal stresses in gold wires was rarely reported in previous days due to the hardness in FE model building. This study performs 3D modeling to evaluate the thermal stresses in 2N gold wires with the full package model to identify which wires to peel for process control setup. The results from this modeling will be used to verify the second bond to file the process specification of wire peel test. The FE model in this paper describes a PBGA package with 2N gold wires surrounded by mold compound and other parts of the package. Stress evaluation is done through discussing the Von Mises stress, the equivalent plastic strain and the peeling stress. TC (temperature cycle) condition is applied in the modeling. The simulation results indicate that shorter wire(s) has higher stress than longer wire(s) and shorter corner wire(s) has the highest propensity to fail in TC. Different from the other wires, the highest peeling stress on bonding interface for the shorter center wire(s) is at the wire heel location instead of the tail end of the stitch bond. The wire heel location is usually regarded as the sensitive region related with the initial crack leading to the stitch bond failure. Thus, the shorter corner and center wire(s) should be regarded as high priority to be wire peeled and filed into wire peel specification. Besides, the relationship between stress status (reliability propensity) of stitch bond and the stitch bond shape is discussed. According to the measurement data of various stitch shapes, three typical stitch bond shapes (marked as A, B and C) are proposed and modeled. The modeling data show that the shortest stitch length (shape A) has the highest stress and plastic strain in the stitch bond comparing with the other shapes, and produces the highest peeling stress at bond interface. It might imply that the shortest stitch length could cause the higher propensity leading to bond lift in stress test. It could become a guideline for wire bond process that engineers should avoid forming the short stitch length when bonding 2N gold wires.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90051608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105750
Ling Wang, Hongqin Wang, Chao Wan, Pengcheng Wang, Mingyu Li, Bin Du, Meiling Deng, Lijiao He
The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.
{"title":"Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED","authors":"Ling Wang, Hongqin Wang, Chao Wan, Pengcheng Wang, Mingyu Li, Bin Du, Meiling Deng, Lijiao He","doi":"10.1109/ISAPM.2011.6105750","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105750","url":null,"abstract":"The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90305229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/ISAPM.2011.6105735
Y. Li, Z. Xia, Y. Lei, Hu Zhou
The performance of additional vinyl liquid silicone rubber (LSR) were investigated based on accelerated aging test in different environment. The mechanical properties were studied in different experimental environments. Meanwhile, the cross-linking densities of the investigated samples were obtained by equilibrium swelling method. The article analyzed the changes of cross-linking density in different environments with time. The results showed that the tensile strength and elongation of vinyl LSR at high temperature and humidity conditions fluctuated gently, while the hardness increased greatly with time. The influence of salt spray corrosion on its performance was little, and its cross-linking density with its mechanical properties showed variation trend. The SEM image of the rubber's fracture topography showed that the cross-linking was compact and consistent.
{"title":"Study on the environmental performance of additional vinyl LSR","authors":"Y. Li, Z. Xia, Y. Lei, Hu Zhou","doi":"10.1109/ISAPM.2011.6105735","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105735","url":null,"abstract":"The performance of additional vinyl liquid silicone rubber (LSR) were investigated based on accelerated aging test in different environment. The mechanical properties were studied in different experimental environments. Meanwhile, the cross-linking densities of the investigated samples were obtained by equilibrium swelling method. The article analyzed the changes of cross-linking density in different environments with time. The results showed that the tensile strength and elongation of vinyl LSR at high temperature and humidity conditions fluctuated gently, while the hardness increased greatly with time. The influence of salt spray corrosion on its performance was little, and its cross-linking density with its mechanical properties showed variation trend. The SEM image of the rubber's fracture topography showed that the cross-linking was compact and consistent.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80223848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/ISAPM.2011.6105697
Libbert Peng, Bing Liu, Justan Sun
Both liquid film and dry film photoresists are used broadly in bumping technology. As of today, different strippers are used to remove them separately, which adds extra cost in handling different photoresist consumables in different process schemes. In this paper, a well-designed and unique stripper is introduced to address liquid film and dry film photoresist strip compatibility issue in mixed solvents system. The results indicate the stripper can remove both liquid film and dry film photoresists at the same operation temperature. Through the dissolution mechanism, the bumps and Cu substrate are well protected under different process time
{"title":"A novel photoresist stripper for bumping technology","authors":"Libbert Peng, Bing Liu, Justan Sun","doi":"10.1109/ISAPM.2011.6105697","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105697","url":null,"abstract":"Both liquid film and dry film photoresists are used broadly in bumping technology. As of today, different strippers are used to remove them separately, which adds extra cost in handling different photoresist consumables in different process schemes. In this paper, a well-designed and unique stripper is introduced to address liquid film and dry film photoresist strip compatibility issue in mixed solvents system. The results indicate the stripper can remove both liquid film and dry film photoresists at the same operation temperature. Through the dissolution mechanism, the bumps and Cu substrate are well protected under different process time","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82294448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/ISAPM.2011.6105725
Junyi Li, Hong Wang, Huiying Wang, Z. Zhang, P. Cheng, G. Ding
A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4∼32.9GPa and 574∼764MPa, respectively.
{"title":"Design and fabrication of Cu-TSV free-standing specimen for uniaxial micro-tensile test","authors":"Junyi Li, Hong Wang, Huiying Wang, Z. Zhang, P. Cheng, G. Ding","doi":"10.1109/ISAPM.2011.6105725","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105725","url":null,"abstract":"A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4∼32.9GPa and 574∼764MPa, respectively.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81872255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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