Fused Deposition Modeling (FDM) is a common additive manufacturing method used to produce intricate three-dimensional structures from thermoplastics. Its affordability and adaptability have contributed to its widespread use in fields such as medicine, electronics, and aerospace. This research focused on analyzing the mechanical properties of PLA (Polylactic Acid) samples produced via FDM. Since polymers display viscoelastic behavior above their glass transition temperature, this effect was disregarded due to the complexity of computations. Instead, key material properties, including Young’s modulus, thermal expansion, and conductivity, were considered temperature-dependent. To support the simulations, Differential Scanning Calorimetry (DSC) and Thermomechanical Analysis (TMA) were conducted to determine the PLA’s glass transition temperature and thermal expansion coefficients. Tensile tests were carried out at four different temperatures (25, 55, 85, and 115 °C), with results compared to finite element simulations in Abaqus. The findings showed that at 25 °C, PLA samples were rigid and glassy, but as they approached the glass transition temperature, they became softer and more rubber-like, leading to a significant reduction in tensile strength. The highest tensile strength was observed in the horizontally printed sample (H1) at 25 °C (31.66 MPa), while the lowest tensile strength was recorded in the vertically printed sample (V1) at 115 °C (3.41 MPa). All samples were fabricated using 100% infill density to ensure structural integrity and accurate comparison. The greatest elongation was measured at 55 °C. Experimental stress–strain curves closely matched simulation results, with an error margin of less than 5%. An analysis of distortion revealed that vertically printed samples deformed more due to layer accumulation, weaker interlayer adhesion, and extended cooling times. In contrast, horizontally printed samples experienced minimal distortion, benefiting from stronger platform contact and a lower number of layers.