In this paper, the effects of ACFs material properties on the dynamic bending reliability was investigated not only at room temperature but also at heated and humid conditions. There are two ACFs material properties improving the dynamic bending reliability of CIF packages. The first is the increase of resin modulus of ACFs, and the second is the increase of adhesion strength of ACFs. For experiments, 4 types of ACFs with different modulus and adhesion strengthes were prepared. Dynamic bending tests of ACFs-assembled CIF packages were performed up to 160,000 bending cycles with the bending radius of 6 mm at room temperature. In addition, the environmental reliability of ACFs-assembled CIF packages were also evaluated at the 85°C/85% RH thermal humidity storage test for 1,000 hours using a bending rod of 6 mm radius. As a result, it was found out that the most effective method to obtain higher bending reliability of CIF packages is increasing the modulus of ACFs not only at room temperature but also at thermal and humid conditions.
{"title":"Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF (Chip-in-Flex) Packages at Humid Environment","authors":"Ji-hye Kim, Tae-Ik Lee, Taek‐Soo Kim, K. Paik","doi":"10.1109/ECTC.2018.00349","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00349","url":null,"abstract":"In this paper, the effects of ACFs material properties on the dynamic bending reliability was investigated not only at room temperature but also at heated and humid conditions. There are two ACFs material properties improving the dynamic bending reliability of CIF packages. The first is the increase of resin modulus of ACFs, and the second is the increase of adhesion strength of ACFs. For experiments, 4 types of ACFs with different modulus and adhesion strengthes were prepared. Dynamic bending tests of ACFs-assembled CIF packages were performed up to 160,000 bending cycles with the bending radius of 6 mm at room temperature. In addition, the environmental reliability of ACFs-assembled CIF packages were also evaluated at the 85°C/85% RH thermal humidity storage test for 1,000 hours using a bending rod of 6 mm radius. As a result, it was found out that the most effective method to obtain higher bending reliability of CIF packages is increasing the modulus of ACFs not only at room temperature but also at thermal and humid conditions.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"10 1","pages":"2319-2325"},"PeriodicalIF":0.0,"publicationDate":"2018-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89289114","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this study, the effects of the adhesion strength on the bending fatigue properties of Cu pattern laminated fabrics were investigated. Cu pattern was laminated onto polyester fabrics using the B-stage non-conductive films (NCFs). In order to improve the adhesion strength, a coupling agent was treated. The bending properties of Cu/NCFs/fabric laminates were evaluated using a dynamic bending fatigue test, and the effects of NCFs moduli and adhesion strengths on the Cu bending fatigue behavior were investigated. When the coupling agent was directly treated onto the fabrics, the adhesion strength was significantly improved with a little change in the modulus properties and theoretical bending stresses. By using coupling agent-treated fabrics, the numbers of dynamic cycles to Cu pattern failure increased. Cross-section SEM analysis and digital image correlation (DIC) method were used to investigate the effects of adhesion improvement on the Cu pattern failure modes and the actual bending strain applied on the Cu pattern during the dynamic bending test.
{"title":"Effects of the Adhesion Strength on the Bending Fatigue Behavior of Cu Pattern Laminated Fabrics Using B-Stage Non-Conductive Films (NCFs)","authors":"Seung-Yoon Jung, K. Paik","doi":"10.1109/ECTC.2018.00346","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00346","url":null,"abstract":"In this study, the effects of the adhesion strength on the bending fatigue properties of Cu pattern laminated fabrics were investigated. Cu pattern was laminated onto polyester fabrics using the B-stage non-conductive films (NCFs). In order to improve the adhesion strength, a coupling agent was treated. The bending properties of Cu/NCFs/fabric laminates were evaluated using a dynamic bending fatigue test, and the effects of NCFs moduli and adhesion strengths on the Cu bending fatigue behavior were investigated. When the coupling agent was directly treated onto the fabrics, the adhesion strength was significantly improved with a little change in the modulus properties and theoretical bending stresses. By using coupling agent-treated fabrics, the numbers of dynamic cycles to Cu pattern failure increased. Cross-section SEM analysis and digital image correlation (DIC) method were used to investigate the effects of adhesion improvement on the Cu pattern failure modes and the actual bending strain applied on the Cu pattern during the dynamic bending test.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"3 1","pages":"2301-2306"},"PeriodicalIF":0.0,"publicationDate":"2018-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77792937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jongho Park, Hanmin Lee, Seyoung A. Lee, Youjin Kyung, Jung Hak Kim, Kwangjoo Lee, K. Paik
Recently, the fan out semiconductor packaging technology has been developed due to the demand for miniaturization and high performance of package products. The Wafer or Panel-Level Fan-Out Packages (FOPs) without package substrates such as Printed Circuit Boards (PCBs) can significantly reduce the package size and thickness and enhance electrical performances compared with conventional CSP(Chip Size Package) packages. As the Wafer or Panel-Level FOPs have been receiving more attention, FOPs related materials and processing techniques are becoming important too. At present, the transfer molding method using liquid or granular Epoxy Molding Compounds (EMCs) has been widely used to passivate chips and act as substrates. However, as wafers become larger and panel level FOPs are introduced, passivation methods using current liquid, granule, or pellet type EMCs are reaching some materials non-uniformity and thickness control limitations. To overcome these limitations, new Epoxy Molding Films (EMFs) type materials and processes have been introduced to replace the current liquid, granule and pellet type EMCs. The main roles of EMFs are to passivate semiconductor devices and act as substrates at the same time. In order to protect the semiconductor device from impact, heat, and moisture from the outside, the EMFs should have higher modulus, Glass Transition Temperature (Tg), adhesion, and lower Coefficient of Thermal Expansion (CTE). In this study, mixture of solid and liquid epoxies was used. Solid epoxy was used to provide lower CTE and higher modulus, and liquid epoxy was also used to provide higher adhesion property. After optimizing solid and liquid epoxies, the modulus, Tg, and CTE properties were significantly improved by adding the 5 µm diameter size silica filler content up to 70 wt% using. And the viscosity of EMFs was also affected by silica content. In order to improve the flow characteristics of EMFs, lower viscosities at the minimum temperature was recommended. In addition, the viscosity of the EMFs can be also decreased by the solvent content. The 10 cm × 10 cm size and the 400 µm thick EMFs were prepared for molding 10 mm × 10 mm size and 200 µm thick chips for the FOPs testing. The molding processes of EMFs were performed at various temperatures using a hot press equipment. The voids inside the EMFs were investigated using the Scanning Acoustic Microscopy (SAM) equipment to obtain optimized process conditions with no voids. And the warpage characteristics of EMFs were also observed using the Shadow Moire equipment. Finally, thermal cycle (T/C) test and 85 °C / 85% RH were performed to evaluate the effects of void, delamination, and moisture of EMFs on FOPs reliability.
近年来，由于封装产品小型化和高性能的需求，扇形半导体封装技术得到了发展。与传统的CSP(Chip size package)封装相比，没有印刷电路板(pcb)等封装基板的晶圆级或面板级扇出封装(FOPs)可以显著减小封装尺寸和厚度，提高电气性能。随着晶圆级或面板级FOPs受到越来越多的关注，与FOPs相关的材料和加工技术也变得越来越重要。目前，使用液态或粒状环氧树脂模塑化合物(EMCs)的传递模塑方法已被广泛应用于芯片的钝化和作为衬底。然而，随着晶圆变大和面板级FOPs的引入，使用当前液体、颗粒或颗粒型EMCs的钝化方法正在达到一些材料不均匀性和厚度控制的限制。为了克服这些限制，新的环氧成型薄膜(EMFs)类型的材料和工艺已经被引入，以取代目前的液体、颗粒和颗粒型EMCs。电磁场的主要作用是钝化半导体器件，同时充当衬底。为了保护半导体器件免受外部冲击、热量和湿气的影响，emf应该具有更高的模量、玻璃化转变温度(Tg)、粘附性和较低的热膨胀系数(CTE)。本研究采用固液混合环氧树脂。固体环氧树脂可以提供更低的CTE和更高的模量，液体环氧树脂也可以提供更高的粘附性能。在对固体和液体环氧树脂进行优化后，通过添加直径为5µm尺寸的二氧化硅填料，使其含量达到70 wt%，可以显著提高树脂的模量、Tg和CTE性能。二氧化硅含量对电磁场的粘度也有影响。为了改善电磁场的流动特性，建议在最低温度下降低粘度。此外，溶剂的含量也会降低电磁场的粘度。制备10 cm × 10 cm尺寸和400µm厚度的emf，用于成型10 mm × 10 mm尺寸和200µm厚度的芯片，用于FOPs测试。利用热压设备在不同温度下进行了电磁场的成型过程。利用扫描声学显微镜(SAM)设备研究了电磁场内部的空隙，获得了无空隙的优化工艺条件。并利用阴影云纹仪观察了电磁场的翘曲特性。最后，通过热循环(T/C)测试和85°C / 85% RH来评估EMFs的空隙、分层和水分对FOPs可靠性的影响。
{"title":"Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages","authors":"Jongho Park, Hanmin Lee, Seyoung A. Lee, Youjin Kyung, Jung Hak Kim, Kwangjoo Lee, K. Paik","doi":"10.1109/ECTC.2018.00111","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00111","url":null,"abstract":"Recently, the fan out semiconductor packaging technology has been developed due to the demand for miniaturization and high performance of package products. The Wafer or Panel-Level Fan-Out Packages (FOPs) without package substrates such as Printed Circuit Boards (PCBs) can significantly reduce the package size and thickness and enhance electrical performances compared with conventional CSP(Chip Size Package) packages. As the Wafer or Panel-Level FOPs have been receiving more attention, FOPs related materials and processing techniques are becoming important too. At present, the transfer molding method using liquid or granular Epoxy Molding Compounds (EMCs) has been widely used to passivate chips and act as substrates. However, as wafers become larger and panel level FOPs are introduced, passivation methods using current liquid, granule, or pellet type EMCs are reaching some materials non-uniformity and thickness control limitations. To overcome these limitations, new Epoxy Molding Films (EMFs) type materials and processes have been introduced to replace the current liquid, granule and pellet type EMCs. The main roles of EMFs are to passivate semiconductor devices and act as substrates at the same time. In order to protect the semiconductor device from impact, heat, and moisture from the outside, the EMFs should have higher modulus, Glass Transition Temperature (Tg), adhesion, and lower Coefficient of Thermal Expansion (CTE). In this study, mixture of solid and liquid epoxies was used. Solid epoxy was used to provide lower CTE and higher modulus, and liquid epoxy was also used to provide higher adhesion property. After optimizing solid and liquid epoxies, the modulus, Tg, and CTE properties were significantly improved by adding the 5 µm diameter size silica filler content up to 70 wt% using. And the viscosity of EMFs was also affected by silica content. In order to improve the flow characteristics of EMFs, lower viscosities at the minimum temperature was recommended. In addition, the viscosity of the EMFs can be also decreased by the solvent content. The 10 cm × 10 cm size and the 400 µm thick EMFs were prepared for molding 10 mm × 10 mm size and 200 µm thick chips for the FOPs testing. The molding processes of EMFs were performed at various temperatures using a hot press equipment. The voids inside the EMFs were investigated using the Scanning Acoustic Microscopy (SAM) equipment to obtain optimized process conditions with no voids. And the warpage characteristics of EMFs were also observed using the Shadow Moire equipment. Finally, thermal cycle (T/C) test and 85 °C / 85% RH were performed to evaluate the effects of void, delamination, and moisture of EMFs on FOPs reliability.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"31 1","pages":"712-717"},"PeriodicalIF":0.0,"publicationDate":"2018-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79375943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Seyong Lee, Hanmin Lee, Jongho Park, Sangmyung Shin, W. Kim, Taejin Choi, K. Paik
In order to investigate the effect of the SnAg solder joint morphology on the thermal cycle reliability of Cu-pillar/SnAg micro bump interconnection, conventional single layer non-conductive films (NCFs) and double layer NCFs(D-NCFs) were compared. D-NCFs consisted of two NCF layers can successfully prevent SnAg wetting on the Cu bump sidewall. Due to the coefficient of thermal expansion (CTE) mismatch of several materials at the solder joint, the assembled solder joints can be significantly affected by the solder joint morphologies during the thermal cycle test. In this study, two kinds of solder joints were prepared using two conventional single layer NCFs and one D-NCFs with different thermo-mechanical properties such as CTE and modulus. As a result, assembled interconnections using D-NCFs showed much better thermal cycle reliability than that of conventional single NCFs, because the remaining Sn at the solder joint reduced the CTE mismatch damages and significantly enhanced the solder joint reliability.
{"title":"The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection","authors":"Seyong Lee, Hanmin Lee, Jongho Park, Sangmyung Shin, W. Kim, Taejin Choi, K. Paik","doi":"10.1109/ECTC.2018.00103","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00103","url":null,"abstract":"In order to investigate the effect of the SnAg solder joint morphology on the thermal cycle reliability of Cu-pillar/SnAg micro bump interconnection, conventional single layer non-conductive films (NCFs) and double layer NCFs(D-NCFs) were compared. D-NCFs consisted of two NCF layers can successfully prevent SnAg wetting on the Cu bump sidewall. Due to the coefficient of thermal expansion (CTE) mismatch of several materials at the solder joint, the assembled solder joints can be significantly affected by the solder joint morphologies during the thermal cycle test. In this study, two kinds of solder joints were prepared using two conventional single layer NCFs and one D-NCFs with different thermo-mechanical properties such as CTE and modulus. As a result, assembled interconnections using D-NCFs showed much better thermal cycle reliability than that of conventional single NCFs, because the remaining Sn at the solder joint reduced the CTE mismatch damages and significantly enhanced the solder joint reliability.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"25 1","pages":"649-655"},"PeriodicalIF":0.0,"publicationDate":"2018-05-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78264523","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Libot, F. Dulondel, P. Milesi, J. Alexis, L. Arnaud, O. Dalverny
Despite being widely investigated for the last two decades, solder joints thermomechanical durability assessment remains a major concern for industries wishing to switch from lead-based (SnPb) to lead-free electronics. Amongst the variety of lead-free solder compositions, 96.5Sn-3.0Ag-0.5Cu (SAC305) solder alloy has become the preferred substitute to classic SnPb solders. However, unlike SnPb assemblies, the return on experience is limited and the microstructure is very different for SAC305 solder joints. The use of SAC305 solder paste requires to understand the mechanical and fatigue behaviors of the soldered interconnects. This paper presents the experimentation based on strain gages measurements, allowing the determination of the shear stress-strain response of SAC305 solder joints subjected to different thermal cycling conditions. The area of the experimental shear strain-stress hysteresis loops gives the values of the strain energy density corresponding to each thermomechanical loading. The finite element modeling of the test assembly showed a good correlation between experimental and numerical strain energy densities. The experimental shear strain-stress curves also provide the necessary data to derive SAC305 solder joints constitutive laws.
{"title":"Experimental Strain Energy Density Dissipated in SAC305 Solder Joints During Different Thermal Cycling Conditions Using Strain Gages Measurements","authors":"J. Libot, F. Dulondel, P. Milesi, J. Alexis, L. Arnaud, O. Dalverny","doi":"10.1109/ECTC.2018.00116","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00116","url":null,"abstract":"Despite being widely investigated for the last two decades, solder joints thermomechanical durability assessment remains a major concern for industries wishing to switch from lead-based (SnPb) to lead-free electronics. Amongst the variety of lead-free solder compositions, 96.5Sn-3.0Ag-0.5Cu (SAC305) solder alloy has become the preferred substitute to classic SnPb solders. However, unlike SnPb assemblies, the return on experience is limited and the microstructure is very different for SAC305 solder joints. The use of SAC305 solder paste requires to understand the mechanical and fatigue behaviors of the soldered interconnects. This paper presents the experimentation based on strain gages measurements, allowing the determination of the shear stress-strain response of SAC305 solder joints subjected to different thermal cycling conditions. The area of the experimental shear strain-stress hysteresis loops gives the values of the strain energy density corresponding to each thermomechanical loading. The finite element modeling of the test assembly showed a good correlation between experimental and numerical strain energy densities. The experimental shear strain-stress curves also provide the necessary data to derive SAC305 solder joints constitutive laws.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"1 1","pages":"748-755"},"PeriodicalIF":0.0,"publicationDate":"2018-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82476237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. Tetsi, Isabelle Bord Majek, G. Philippot, C. Aymonier, R. Lemire, J. Audet, L. Béchou, D. Drouin
The integration of decoupling capacitors with high capacitance density on interposers for 3D electronics packaging requires innovative approaches for dielectric layer deposition. In this paper, we report the development of a novel and low-cost spray coating technique for the fabrication of thin film metal-insulator-metal (MIM) capacitors. We focus on thin films based on Ba0.6Sr0.4TiO3 nanoparticles synthetized using the continuous and scalable supercritical fluid process. The obtained capacitance density agrees with the state-of-the art and a reduction of the leakage current is achievable by grafting specific ligands on the nanoparticle surface. Despite the presence of leakage current which must be still optimized, the overall performance is promising for 3D electronic packaging
{"title":"Fabrication of High Capacitance Density Capacitor Using Spray Coated Ba0.6Sr0.4TiO3 Thin Films","authors":"E. Tetsi, Isabelle Bord Majek, G. Philippot, C. Aymonier, R. Lemire, J. Audet, L. Béchou, D. Drouin","doi":"10.1109/ECTC.2018.00212","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00212","url":null,"abstract":"The integration of decoupling capacitors with high capacitance density on interposers for 3D electronics packaging requires innovative approaches for dielectric layer deposition. In this paper, we report the development of a novel and low-cost spray coating technique for the fabrication of thin film metal-insulator-metal (MIM) capacitors. We focus on thin films based on Ba0.6Sr0.4TiO3 nanoparticles synthetized using the continuous and scalable supercritical fluid process. The obtained capacitance density agrees with the state-of-the art and a reduction of the leakage current is achievable by grafting specific ligands on the nanoparticle surface. Despite the presence of leakage current which must be still optimized, the overall performance is promising for 3D electronic packaging","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"22 1","pages":"1389-1395"},"PeriodicalIF":0.0,"publicationDate":"2018-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78000453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Quelennec, Y. Ayadi, Quentin Vandier, É. Duchesne, H. Frémont, D. Drouin
The interest in very-large-scale integration technology combined with market pressure to reduce materials and process costs introduce new packaging yield and reliability challenges. The use of organic substrates in flip-chip packages, rather than ceramics, led to thermal and moisture related issues. The organic laminate coefficient of thermal expansion substantially differs from the chip one, potentially leading to interfacial delamination and interconnect rupture. Moreover, organic substrates are permeable to water, potentially leading to electrochemical migration, corrosion of alloys, delamination and short-circuits. Thus temperature and moisture variation can have baneful consequences on flip-chip packages. Here, the internal module temperature and moisture quantities of a flip-chip package are measured using microscopic embedded carbon nanotube-based sensors. Those sensors are fabricated near interconnects and are positioned to provide spatial and real-time mapping of moisture and temperature in the package, for a better interconnect reliability study or package aging monitoring.
{"title":"Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package","authors":"A. Quelennec, Y. Ayadi, Quentin Vandier, É. Duchesne, H. Frémont, D. Drouin","doi":"10.1109/ECTC.2018.00247","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00247","url":null,"abstract":"The interest in very-large-scale integration technology combined with market pressure to reduce materials and process costs introduce new packaging yield and reliability challenges. The use of organic substrates in flip-chip packages, rather than ceramics, led to thermal and moisture related issues. The organic laminate coefficient of thermal expansion substantially differs from the chip one, potentially leading to interfacial delamination and interconnect rupture. Moreover, organic substrates are permeable to water, potentially leading to electrochemical migration, corrosion of alloys, delamination and short-circuits. Thus temperature and moisture variation can have baneful consequences on flip-chip packages. Here, the internal module temperature and moisture quantities of a flip-chip package are measured using microscopic embedded carbon nanotube-based sensors. Those sensors are fabricated near interconnects and are positioned to provide spatial and real-time mapping of moisture and temperature in the package, for a better interconnect reliability study or package aging monitoring.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"14 1","pages":"1639-1644"},"PeriodicalIF":0.0,"publicationDate":"2018-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88983746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Operation of the Laser Power Supply (LPS) module provides the dual challenge of high power dissipation, and the need for strict dielectric isolation, while needing to survive in an environment on Mars that will see a chilly night-time temperature of -123°C, and to a daytime instrument environment in excess of 50°C. Additionally, power restrictions prevent the use of survival heating during the night. The harsh mechanical vibration environment of launch and landing provides an additional challenge to reliability. A multi-physics simulation was created that took into account temperature property variations, as well as solving the transient analysis that also included rapid variation in power-pulsing during the operation of the laser. The steady state analysis employed a more traditional finite element based analysis, but with provisions for Mars gas convection and thermal radiation.
{"title":"Mars 2020 Rover Laser Power Supply Thermomechanical Analysis","authors":"J. Cepeda-Rizo, D. Tuman","doi":"10.1109/ECTC.2018.00209","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00209","url":null,"abstract":"Operation of the Laser Power Supply (LPS) module provides the dual challenge of high power dissipation, and the need for strict dielectric isolation, while needing to survive in an environment on Mars that will see a chilly night-time temperature of -123°C, and to a daytime instrument environment in excess of 50°C. Additionally, power restrictions prevent the use of survival heating during the night. The harsh mechanical vibration environment of launch and landing provides an additional challenge to reliability. A multi-physics simulation was created that took into account temperature property variations, as well as solving the transient analysis that also included rapid variation in power-pulsing during the operation of the laser. The steady state analysis employed a more traditional finite element based analysis, but with provisions for Mars gas convection and thermal radiation.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"90 1","pages":"1371-1374"},"PeriodicalIF":0.0,"publicationDate":"2018-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80412973","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Electroplating Enhanced Silver Nanowire Networks are successfully applied in transparent heaters that ensure the performance of electronic devices under various environmental conditions. Comparing with the simple heating process, the electroplating method can produce an applicable electrode for transparent heaters within a shorter time. The final Ag NWs film products reach 13.2 ?·sq-1 at a transmittance of 80% after electroplating for 10 s. Moreover, the core/shell structure promote the working stability of silver nanowire networks under high-temperature (110°C for 2 h). The high-efficiency method could extend the use of Ag NW films in more potential applied conditions, such as transparent heaters, high-power devices, and solar cells.
{"title":"Electroplating Enhanced Silver Nanowire Networks for Transparent Heaters","authors":"Shang Wang, Yanhong Tian","doi":"10.1109/ECTC.2018.00263","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00263","url":null,"abstract":"Electroplating Enhanced Silver Nanowire Networks are successfully applied in transparent heaters that ensure the performance of electronic devices under various environmental conditions. Comparing with the simple heating process, the electroplating method can produce an applicable electrode for transparent heaters within a shorter time. The final Ag NWs film products reach 13.2 ?·sq-1 at a transmittance of 80% after electroplating for 10 s. Moreover, the core/shell structure promote the working stability of silver nanowire networks under high-temperature (110°C for 2 h). The high-efficiency method could extend the use of Ag NW films in more potential applied conditions, such as transparent heaters, high-power devices, and solar cells.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"67 1","pages":"1751-1756"},"PeriodicalIF":0.0,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75624720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
F. Selbmann, M. Baum, M. Wiemer, Y. Joseph, T. Otto
A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a certain thickness shall realize the second electrical isolation according to the double isolation requirements of the research project. Parylene encapsulation and isolation is one approach to improve the performance and functionalities of electronic and micro systems. By using such kind of innovative and outstanding materials new application fields will be explored, requiring new materials with advanced properties.
{"title":"Parylene as a Dielectric Material for Electronic Applications in Space","authors":"F. Selbmann, M. Baum, M. Wiemer, Y. Joseph, T. Otto","doi":"10.1109/ECTC.2018.00331","DOIUrl":"https://doi.org/10.1109/ECTC.2018.00331","url":null,"abstract":"A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a certain thickness shall realize the second electrical isolation according to the double isolation requirements of the research project. Parylene encapsulation and isolation is one approach to improve the performance and functionalities of electronic and micro systems. By using such kind of innovative and outstanding materials new application fields will be explored, requiring new materials with advanced properties.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"16 1","pages":"2205-2210"},"PeriodicalIF":0.0,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74706646","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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