首页 > 最新文献

ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)最新文献

英文 中文
Low-power analog/RF circuit design based on the inversion coefficient 基于反转系数的低功耗模拟/射频电路设计
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313863
C. Enz, M. Chalkiadaki, A. Mangla
This paper discusses the concept of the inversion coefficient as an essential design parameter that spans the entire range of operating points from weak via moderate to strong inversion, including velocity saturation. Several figures-of-merit based on the inversion coefficient, especially suitable for the design of low-power analog and RF circuits, are presented. These figures-of-merit incorporate the various trade-offs encountered in analog and RF circuit design. The use of the inversion coefficient and the derived figures-of-merit for optimization and design is demonstrated through simple examples. Finally, the simplicity of the inversion coefficient based analytical models is emphasized by their favorable comparison against measurements of a commercial 40-nm bulk CMOS process as well as with simulations using the BSIM6 model.
本文讨论了反演系数作为一个重要的设计参数的概念,它涵盖了从弱、中、强反演的整个工作点范围,包括速度饱和度。提出了几种基于反转系数的优值,特别适用于低功耗模拟电路和射频电路的设计。这些指标综合了模拟和射频电路设计中遇到的各种权衡。通过简单的算例说明了反演系数和所得优值在优化设计中的应用。最后,通过与商业40纳米体CMOS工艺的测量结果以及使用BSIM6模型的模拟结果进行比较,强调了基于反转系数的分析模型的简单性。
{"title":"Low-power analog/RF circuit design based on the inversion coefficient","authors":"C. Enz, M. Chalkiadaki, A. Mangla","doi":"10.1109/ESSCIRC.2015.7313863","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313863","url":null,"abstract":"This paper discusses the concept of the inversion coefficient as an essential design parameter that spans the entire range of operating points from weak via moderate to strong inversion, including velocity saturation. Several figures-of-merit based on the inversion coefficient, especially suitable for the design of low-power analog and RF circuits, are presented. These figures-of-merit incorporate the various trade-offs encountered in analog and RF circuit design. The use of the inversion coefficient and the derived figures-of-merit for optimization and design is demonstrated through simple examples. Finally, the simplicity of the inversion coefficient based analytical models is emphasized by their favorable comparison against measurements of a commercial 40-nm bulk CMOS process as well as with simulations using the BSIM6 model.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84289336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
New frontiers in digital health: Remote monitoring of animal and human metabolism on our smartphones and tablets 数字健康的新领域:在我们的智能手机和平板电脑上远程监测动物和人类的新陈代谢
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313817
S. Carrara
{"title":"New frontiers in digital health: Remote monitoring of animal and human metabolism on our smartphones and tablets","authors":"S. Carrara","doi":"10.1109/ESSCIRC.2015.7313817","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313817","url":null,"abstract":"","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75924630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 13.2b optical proximity sensor system with 130klx ambient light rejection capable of heart rate and blood oximetry monitoring 一种132b光学近距离传感器系统,具有130klx的环境光抑制能力,能够监测心率和血氧饱和度
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313905
Luca Sant, A. Fant, S. Stojanovic, S. Fabbro, J. Ceballos
A system for measuring optical proximity based on reflection of modulated light is presented. Its novel input stage topology comprising an AC coupled TIA and a two stage DC rejection circuit based on a synthesized inductive impedance, provides readouts with a resolution better than 13.2 ENOB. This allows the sensor system to be used without modifications also for heart rate and blood oximetry monitoring.
提出了一种基于调制光反射的光学接近度测量系统。其新颖的输入级拓扑结构包括交流耦合TIA和基于合成电感阻抗的两级直流抑制电路,提供的读数分辨率优于13.2 ENOB。这使得传感器系统无需修改也可用于心率和血氧饱和度监测。
{"title":"A 13.2b optical proximity sensor system with 130klx ambient light rejection capable of heart rate and blood oximetry monitoring","authors":"Luca Sant, A. Fant, S. Stojanovic, S. Fabbro, J. Ceballos","doi":"10.1109/ESSCIRC.2015.7313905","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313905","url":null,"abstract":"A system for measuring optical proximity based on reflection of modulated light is presented. Its novel input stage topology comprising an AC coupled TIA and a two stage DC rejection circuit based on a synthesized inductive impedance, provides readouts with a resolution better than 13.2 ENOB. This allows the sensor system to be used without modifications also for heart rate and blood oximetry monitoring.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75282177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
An 890 mW stacked power amplifier using SiGe HBTs for X-band multifunctional chips 一种用于x波段多功能芯片的使用SiGe HBTs的890 mW堆叠功率放大器
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313830
Chao Liu, Qiang Li, Yihu Li, Xiang Li, Haitao Liu, Y. Xiong
This paper presents a stacked power amplifier (PA) for X-band multifunctional chips using 0.13-μm SiGe HBTs. To achieve high output power, two 5-stacked PAs with optimum inter-stage matching networks are combined with Wilkinson power combiners. Furthermore, a 3-stacked amplifier is used as the driving amplifier to increase the gain of the whole PA. During on-chip measurements, the X-band stacked PA achieves peak output power of 890 mW and maximum power added efficiency (PAE) of 17.8 %. The chip area is 1.9 × 1.4 mm2 including the testing pads. To the authors' knowledge, our proposed PA achieves the highest output power at X-band with a silicon-based technology.
提出了一种基于0.13 μm SiGe hbt的x波段多功能芯片堆叠功率放大器(PA)。为了获得高输出功率,两个具有最佳级间匹配网络的5堆叠PAs与威尔金森功率合成器相结合。此外,采用三叠放大器作为驱动放大器,提高了整个放大器的增益。在片上测量期间,x波段堆叠式PA的峰值输出功率为890 mW,最大功率附加效率(PAE)为17.8%。芯片面积为1.9 × 1.4 mm2,包括测试垫。据作者所知,我们提出的PA通过硅基技术在x波段实现了最高输出功率。
{"title":"An 890 mW stacked power amplifier using SiGe HBTs for X-band multifunctional chips","authors":"Chao Liu, Qiang Li, Yihu Li, Xiang Li, Haitao Liu, Y. Xiong","doi":"10.1109/ESSCIRC.2015.7313830","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313830","url":null,"abstract":"This paper presents a stacked power amplifier (PA) for X-band multifunctional chips using 0.13-μm SiGe HBTs. To achieve high output power, two 5-stacked PAs with optimum inter-stage matching networks are combined with Wilkinson power combiners. Furthermore, a 3-stacked amplifier is used as the driving amplifier to increase the gain of the whole PA. During on-chip measurements, the X-band stacked PA achieves peak output power of 890 mW and maximum power added efficiency (PAE) of 17.8 %. The chip area is 1.9 × 1.4 mm2 including the testing pads. To the authors' knowledge, our proposed PA achieves the highest output power at X-band with a silicon-based technology.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80057650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
A ratiometric readout circuit for thermal-conductivity-based resistive gas sensors 一种用于导热性电阻式气体传感器的比率读出电路
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313880
Z. Cai, R. V. Veldhoven, A. Falepin, H. Suy, E. Sterckx, K. Makinwa, M. Pertijs
This paper presents a readout circuit for thermal-conductivity-based resistive gas sensors. It digitizes the sensor's heat loss to its environment, which is a function of gas concentration, relative to that of a reference transducer, which is made of the same material and acts as a thermal-conductivity reference. Thus, dedicated voltage, power or temperature references are not needed. The ratiometric interface is based on a reconfigurable delta-sigma modulator that digitizes both the temperature and power ratio of the sensor and reference transducers, from which their thermal-conductivity ratio is calculated. It uses a dynamic baseline-resistance cancellation technique to relax the required dynamic range. In addition, dynamic element matching and 6-bit bias-current trimming are used to suppress errors due to transducer mismatch. The interface has been implemented in a standard 0.16 μm CMOS technology. Experimental results obtained in combination with CMOS-compatible tungsten-wire transducers show a CO2 resolution of 228 ppm (1σ), which is the highest resolution reported for thermal-conductivity-based CO2 sensors.
本文提出了一种基于热导率的电阻式气体传感器的读出电路。它将传感器对环境的热损失数字化,这是气体浓度的函数,相对于参考传感器的热量损失,参考传感器由相同的材料制成,充当导热系数参考。因此,不需要专用的电压、功率或温度参考。比率接口基于可重构的δ - σ调制器,该调制器将传感器和参考传感器的温度和功率比数字化,并由此计算其导热系数比。它使用动态基线电阻抵消技术来放松所需的动态范围。此外,采用动态元件匹配和6位偏置电流微调来抑制传感器失配引起的误差。该接口采用标准的0.16 μm CMOS技术实现。与cmos兼容的钨丝传感器相结合的实验结果显示,CO2分辨率为228 ppm (1σ),这是基于导热系数的CO2传感器的最高分辨率。
{"title":"A ratiometric readout circuit for thermal-conductivity-based resistive gas sensors","authors":"Z. Cai, R. V. Veldhoven, A. Falepin, H. Suy, E. Sterckx, K. Makinwa, M. Pertijs","doi":"10.1109/ESSCIRC.2015.7313880","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313880","url":null,"abstract":"This paper presents a readout circuit for thermal-conductivity-based resistive gas sensors. It digitizes the sensor's heat loss to its environment, which is a function of gas concentration, relative to that of a reference transducer, which is made of the same material and acts as a thermal-conductivity reference. Thus, dedicated voltage, power or temperature references are not needed. The ratiometric interface is based on a reconfigurable delta-sigma modulator that digitizes both the temperature and power ratio of the sensor and reference transducers, from which their thermal-conductivity ratio is calculated. It uses a dynamic baseline-resistance cancellation technique to relax the required dynamic range. In addition, dynamic element matching and 6-bit bias-current trimming are used to suppress errors due to transducer mismatch. The interface has been implemented in a standard 0.16 μm CMOS technology. Experimental results obtained in combination with CMOS-compatible tungsten-wire transducers show a CO2 resolution of 228 ppm (1σ), which is the highest resolution reported for thermal-conductivity-based CO2 sensors.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80997524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
5G wireless communication beyond 2020 2020年以后的5G无线通信
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313814
J. Hansryd
In the last twenty years we have seen a revolution comparable to the industrialization. We have gone from voice, to data, to mobile broadband to a situation where half of the two-year olds in Sweden use internet. We have changed how we are creating and sharing knowledge, how we interact with family and friends, how we work and how we do business. We have seen traditional industries transform... music, media ... and how more and more industries are rapidly digitalizing and mobilizing - realizing the need for good ICT solutions where mobility is becoming not only an opportunity, but a necessity.
在过去的二十年里,我们看到了一场堪比工业化的革命。我们已经从语音到数据,再到移动宽带,现在瑞典有一半两岁的孩子都在使用互联网。我们已经改变了我们创造和分享知识的方式,改变了我们与家人和朋友互动的方式,改变了我们工作和做生意的方式。我们看到了传统产业的转型……音乐、媒体……以及越来越多的行业如何快速数字化和动员——实现对良好ICT解决方案的需求,在这些行业中,移动性不仅是一个机会,而且是一种必需品。
{"title":"5G wireless communication beyond 2020","authors":"J. Hansryd","doi":"10.1109/ESSCIRC.2015.7313814","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313814","url":null,"abstract":"In the last twenty years we have seen a revolution comparable to the industrialization. We have gone from voice, to data, to mobile broadband to a situation where half of the two-year olds in Sweden use internet. We have changed how we are creating and sharing knowledge, how we interact with family and friends, how we work and how we do business. We have seen traditional industries transform... music, media ... and how more and more industries are rapidly digitalizing and mobilizing - realizing the need for good ICT solutions where mobility is becoming not only an opportunity, but a necessity.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89806624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Low power digitally controlled delay insertion unit and 1% accuracy 100MHz oscillator for precise dead-time insertion in DC-DC converters 低功耗数字控制延迟插入单元和1%精度100MHz振荡器,用于DC-DC转换器的精确死区插入
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313910
Dmytro Cherniak, Michael Aichner, R. Nonis, N. D. Dalt
This paper presents a digitally controlled delay insertion unit (DIU) for precise dead-time insertion in DC-DC converters. A fundamental building block is the 100MHz relaxation oscillator with better than +/-1% frequency accuracy in the temperature range from -40C to +150C, which is introduced for the first time with such accuracy in this frequency range. The DIU is capable of up to 32ns delay generation with 500ps step size. It is implemented in 130nm CMOS, occupies 0.098mm2 and consumes 0.45mW in ultra-low power mode.
本文提出了一种用于DC-DC变换器死区精确插入的数字控制延迟插入单元(DIU)。一个基本的组成部分是100MHz弛豫振荡器,在-40℃至+150℃的温度范围内,频率精度优于+/-1%,这是第一次在这个频率范围内以这样的精度推出。DIU能够以500ps的步长产生高达32ns的延迟。它采用130nm CMOS实现,在超低功耗模式下占地0.098mm2,功耗0.45mW。
{"title":"Low power digitally controlled delay insertion unit and 1% accuracy 100MHz oscillator for precise dead-time insertion in DC-DC converters","authors":"Dmytro Cherniak, Michael Aichner, R. Nonis, N. D. Dalt","doi":"10.1109/ESSCIRC.2015.7313910","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313910","url":null,"abstract":"This paper presents a digitally controlled delay insertion unit (DIU) for precise dead-time insertion in DC-DC converters. A fundamental building block is the 100MHz relaxation oscillator with better than +/-1% frequency accuracy in the temperature range from -40C to +150C, which is introduced for the first time with such accuracy in this frequency range. The DIU is capable of up to 32ns delay generation with 500ps step size. It is implemented in 130nm CMOS, occupies 0.098mm2 and consumes 0.45mW in ultra-low power mode.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82206617","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A 28.5–33.5GHz fractional-N PLL using a 3rd order noise shaping time-to-digital converter with 176fs resolution 采用三阶噪声整形时间-数字转换器的28.5-33.5GHz分数n锁相环,分辨率为176fs
Pub Date : 2015-11-02 DOI: 10.1109/ESSCIRC.2015.7313906
M. B. Dayanik, Nicholas Collins, M. Flynn
This paper presents a 65nm CMOS 28.5GHz-to-33.5GHz mostly digital fractional-N PLL based on a new 3rd order noise-shaping continuous time delta sigma time-to-digital converter (TDC). With a measured time resolution of 176fs, the TDC has the finest measured time resolution in a 1MHz bandwidth of any published TDC, to the best knowledge of the authors. The PLL achieves a normalized phase noise of -213dBc/Hz2 (at a 100kHz offset) and FoMJitter of -230dB (from 10kHz-to-1MHz). Both the normalized phase noise and FoMJitter are 5dB better than for any published digital integer or digital fractional-N high frequency (>20GHz) PLL.
本文提出了一种基于新型三阶噪声整形连续时间δ σ时间-数字转换器(TDC)的65nm CMOS 28.5 ghz ~ 33.5 ghz多数字分数n锁相环。据作者所知,该TDC在1MHz带宽下的测量时间分辨率为176fs,是所有已发布的TDC中测量时间分辨率最高的。锁相环的归一化相位噪声为-213dBc/Hz2(在100kHz偏移时),FoMJitter为-230dB(从10khz到1mhz)。归一化相位噪声和FoMJitter都比任何已发布的数字整数或数字小数n高频(>20GHz)锁相环好5dB。
{"title":"A 28.5–33.5GHz fractional-N PLL using a 3rd order noise shaping time-to-digital converter with 176fs resolution","authors":"M. B. Dayanik, Nicholas Collins, M. Flynn","doi":"10.1109/ESSCIRC.2015.7313906","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313906","url":null,"abstract":"This paper presents a 65nm CMOS 28.5GHz-to-33.5GHz mostly digital fractional-N PLL based on a new 3rd order noise-shaping continuous time delta sigma time-to-digital converter (TDC). With a measured time resolution of 176fs, the TDC has the finest measured time resolution in a 1MHz bandwidth of any published TDC, to the best knowledge of the authors. The PLL achieves a normalized phase noise of -213dBc/Hz2 (at a 100kHz offset) and FoMJitter of -230dB (from 10kHz-to-1MHz). Both the normalized phase noise and FoMJitter are 5dB better than for any published digital integer or digital fractional-N high frequency (>20GHz) PLL.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88803757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
European Solid-State Circuits Conference 欧洲固态电路会议
Pub Date : 2015-10-30 DOI: 10.1109/ESSCIRC.2015.7313885
T. Tikka, K. Stadius, J. Ryynanen, M. Kaltiokallio
This paper describes a wide-band receiver designed to be connected directly to a single-ended non-50 ohm antenna. The receiver is based on a four-phase mixer-first architecture and it includes an on-chip transformer balun. Reconfigurability in the balun extends the low-end operation band by 300 MHz. This design demonstrates that with an on-chip balun it is possible to achieve comparable performance to a similar receiver with an external high-performance balun. The receiver is implemented in 65-nm CMOS and it operates in 0.8-3 GHz band with 40 dB gain and 7 dB noise figure.
{"title":"European Solid-State Circuits Conference","authors":"T. Tikka, K. Stadius, J. Ryynanen, M. Kaltiokallio","doi":"10.1109/ESSCIRC.2015.7313885","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313885","url":null,"abstract":"This paper describes a wide-band receiver designed to be connected directly to a single-ended non-50 ohm antenna. The receiver is based on a four-phase mixer-first architecture and it includes an on-chip transformer balun. Reconfigurability in the balun extends the low-end operation band by 300 MHz. This design demonstrates that with an on-chip balun it is possible to achieve comparable performance to a similar receiver with an external high-performance balun. The receiver is implemented in 65-nm CMOS and it operates in 0.8-3 GHz band with 40 dB gain and 7 dB noise figure.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74779163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A 1.6 GS/s 3.17 mW 6-b passive pipelined binary-search ADC with memory effect canceller and reference voltage calibration 一个1.6 GS/s 3.17 mW 6-b无源流水线二值搜索ADC,具有记忆效应消除和参考电压校准功能
Pub Date : 2015-10-30 DOI: 10.1109/ESSCIRC.2015.7313893
Koki Tanaka, R. Saito, H. Ishikuro
A 6-bit high-speed and low-power pipelined binary-search ADC is presented. Over GHz conversion rate is achieved by passive pipeline operation without amplifier. “Memory effect” caused by charge sharing in the passive pipeline operation is cancelled by charge reset and flatness of frequency response of the converter is improved. Memory effect canceller also makes it easy to calibrate reference voltage to each comparator and to enhance SNDR. The prototype ADC fabricated in 40nm-CMOS achieved 29.21 dB SNDR with 1.6 GS/s at supply voltage of 0.9 V. The ADC achieved a FoM of 84.1 fJ/conv.step.
提出了一种6位高速低功耗流水线二值搜索ADC。通过无源流水线操作实现了GHz以上的转换速率,无需放大器。通过电荷复位消除了无源管道运行中电荷分担引起的“记忆效应”,提高了变流器频率响应的平整度。记忆效应消除器还可以方便地校准每个比较器的参考电压并增强SNDR。采用40nm-CMOS制作的原型ADC在0.9 V电源电压下以1.6 GS/s的速度实现了29.21 dB的SNDR。该ADC实现了84.1 fJ/ convstep的FoM。
{"title":"A 1.6 GS/s 3.17 mW 6-b passive pipelined binary-search ADC with memory effect canceller and reference voltage calibration","authors":"Koki Tanaka, R. Saito, H. Ishikuro","doi":"10.1109/ESSCIRC.2015.7313893","DOIUrl":"https://doi.org/10.1109/ESSCIRC.2015.7313893","url":null,"abstract":"A 6-bit high-speed and low-power pipelined binary-search ADC is presented. Over GHz conversion rate is achieved by passive pipeline operation without amplifier. “Memory effect” caused by charge sharing in the passive pipeline operation is cancelled by charge reset and flatness of frequency response of the converter is improved. Memory effect canceller also makes it easy to calibrate reference voltage to each comparator and to enhance SNDR. The prototype ADC fabricated in 40nm-CMOS achieved 29.21 dB SNDR with 1.6 GS/s at supply voltage of 0.9 V. The ADC achieved a FoM of 84.1 fJ/conv.step.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2015-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79505378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
期刊
ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1