首页 > 最新文献

2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)最新文献

英文 中文
Correlating system test fmax with structural test fmax and process monitoring measurements 将系统测试fmax与结构测试fmax和过程监控测量相关联
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419846
Janine Chen, Jing Zeng, Li-C. Wang, Michael Mateja
System test has been the standard measurement to evaluate performance variability of high-performance microprocessors. The question of whether or not many of the lower-cost alternative tests can be used to reduce system test has been studied for many years. This paper utilizes a data-learning approach for correlating three test datasets, structural test, ring oscillator test, and scan flush test, with system test. With the data-learning approach, higher correlation can be found without altering test measurements or test conditions. Rather, the approach utilizes new optimization algorithms to extract more useful information in the three test datasets, with particular success using the structural test data. To further minimize test cost, process monitoring measurements (ring oscillator and scan flush tests) are used to reduce the need for high-frequency structural test. We demonstrate our methodology on a recent high-performance microprocessor design.
系统测试已成为评价高性能微处理器性能可变性的标准测量方法。是否可以使用许多低成本的替代测试来减少系统测试的问题已经研究了很多年。本文利用数据学习方法将结构测试、环振测试和扫描刷新测试三个测试数据集与系统测试相关联。使用数据学习方法,可以在不改变测试测量或测试条件的情况下发现更高的相关性。相反,该方法利用新的优化算法从三个测试数据集中提取更多有用的信息,特别是在结构测试数据上取得了特别的成功。为了进一步降低测试成本,使用过程监控测量(环形振荡器和扫描冲洗测试)来减少对高频结构测试的需求。我们在最近的高性能微处理器设计中展示了我们的方法。
{"title":"Correlating system test fmax with structural test fmax and process monitoring measurements","authors":"Janine Chen, Jing Zeng, Li-C. Wang, Michael Mateja","doi":"10.1109/ASPDAC.2010.5419846","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419846","url":null,"abstract":"System test has been the standard measurement to evaluate performance variability of high-performance microprocessors. The question of whether or not many of the lower-cost alternative tests can be used to reduce system test has been studied for many years. This paper utilizes a data-learning approach for correlating three test datasets, structural test, ring oscillator test, and scan flush test, with system test. With the data-learning approach, higher correlation can be found without altering test measurements or test conditions. Rather, the approach utilizes new optimization algorithms to extract more useful information in the three test datasets, with particular success using the structural test data. To further minimize test cost, process monitoring measurements (ring oscillator and scan flush tests) are used to reduce the need for high-frequency structural test. We demonstrate our methodology on a recent high-performance microprocessor design.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121379297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Generalised threshold gate synthesis based on AND/OR/NOT representation of boolean function 基于布尔函数与/或/非表示的广义阈值门合成
Pub Date : 2010-01-18 DOI: 10.5555/1899721.1899918
Marek A. Bawiec, Maciej Nikodem
This paper focuses on generalized threshold gates (GTGs) that implement boolean logic functions using elements with negative differential resistance (NDR). GTGs are capable of implementing boolean functions, however, no effective synthesis algorithms have been proposed so far. We present that GTGs can be effectively implemented using unate functions. Our synthesis algorithm ensures that the circuit implementing n variable boolean function consists of at most n+2 NDR elements and can be further optimized by reducing the number of switching elements.
本文研究了一种利用负差分电阻元件实现布尔逻辑函数的广义阈值门。gtg能够实现布尔函数,但目前还没有提出有效的合成算法。我们提出了使用unate函数可以有效地实现gtg。我们的综合算法确保实现n变量布尔函数的电路最多由n+2个NDR元件组成,并且可以通过减少开关元件的数量来进一步优化。
{"title":"Generalised threshold gate synthesis based on AND/OR/NOT representation of boolean function","authors":"Marek A. Bawiec, Maciej Nikodem","doi":"10.5555/1899721.1899918","DOIUrl":"https://doi.org/10.5555/1899721.1899918","url":null,"abstract":"This paper focuses on generalized threshold gates (GTGs) that implement boolean logic functions using elements with negative differential resistance (NDR). GTGs are capable of implementing boolean functions, however, no effective synthesis algorithms have been proposed so far. We present that GTGs can be effectively implemented using unate functions. Our synthesis algorithm ensures that the circuit implementing n variable boolean function consists of at most n+2 NDR elements and can be further optimized by reducing the number of switching elements.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128560688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A fast SPFD-based rewiring technique 基于spfd的快速重布线技术
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419920
P. Maidee, K. Bazargan
Circuit rewiring can be used to explore a larger solution space by modifying circuit structure to suit a given optimization problem. Among several rewiring techniques that have been proposed, SPFD-based rewiring has been shown to be more effective in terms of solution space coverage. However, its adoption in practice has been limited due to its long runtime. We propose a novel SAT-based algorithm that is much faster than the traditional BDD-based methods. Unlike BDD-based methods that completely specify all pairs of SPFD using BDDs, our algorithm uses a few SAT instances to perform rewiring for a given wire without explicitly enumerating all SPFDs. Experimental results show that our algorithm's runtime is only 13% of that of a conventional one when each wire has at most 25 candidate wires and the runtime scales well with the number of candidate wires considered. Our approach evaluates each rewiring instance independently in the order of milliseconds, rendering deployment of an SPFD-based rewiring inside the optimization loop of synthesis tools a possibility.
电路重布线可以通过修改电路结构以适应给定的优化问题来探索更大的解空间。在已经提出的几种重新布线技术中,基于spfd的重新布线已被证明在解决方案空间覆盖方面更有效。然而,由于其运行时间过长,其在实践中的采用受到了限制。我们提出了一种新的基于sat的算法,它比传统的基于bdd的方法要快得多。与使用bdd完全指定所有SPFD对的基于bdd的方法不同,我们的算法使用几个SAT实例来为给定的线路执行重新布线,而不显式枚举所有SPFD。实验结果表明,当每条线最多有25条候选线时,该算法的运行时间仅为传统算法的13%,并且随着候选线的数量考虑,运行时间可以很好地扩展。我们的方法以毫秒为单位独立评估每个重新布线实例,使得在合成工具的优化循环中部署基于spfd的重新布线成为可能。
{"title":"A fast SPFD-based rewiring technique","authors":"P. Maidee, K. Bazargan","doi":"10.1109/ASPDAC.2010.5419920","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419920","url":null,"abstract":"Circuit rewiring can be used to explore a larger solution space by modifying circuit structure to suit a given optimization problem. Among several rewiring techniques that have been proposed, SPFD-based rewiring has been shown to be more effective in terms of solution space coverage. However, its adoption in practice has been limited due to its long runtime. We propose a novel SAT-based algorithm that is much faster than the traditional BDD-based methods. Unlike BDD-based methods that completely specify all pairs of SPFD using BDDs, our algorithm uses a few SAT instances to perform rewiring for a given wire without explicitly enumerating all SPFDs. Experimental results show that our algorithm's runtime is only 13% of that of a conventional one when each wire has at most 25 candidate wires and the runtime scales well with the number of candidate wires considered. Our approach evaluates each rewiring instance independently in the order of milliseconds, rendering deployment of an SPFD-based rewiring inside the optimization loop of synthesis tools a possibility.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"25 9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115997754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
On process-aware 1-D standard cell design 关于过程感知的一维标准电池设计
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419686
Hongbo Zhang, Martin D. F. Wong, Kai-Yuan Chao
When VLSI technology scales down to sub-40nm process node, systematic variation introduced by the lithography is a persistent challenge to the manufacturability. The limitation of the resolution enhancement technologies (RETs) forces people to adopt a regular cell design methodology. In this paper, targeted on 1-D cell design, we use simulation data to analyze the relationship between the line-end gap distribution and printability. Based on the gap distribution preferences, an optimal algorithm is provided to efficiently extend the line ends and insert dummies, which will significantly improve the gap distribution and help printability. Experimental results on 45nm and 32nm processes show that significant improvement can be obtained on edge placement error (EPE).
当超大规模集成电路技术缩小到40nm以下制程节点时,光刻技术带来的系统变化是对可制造性的持续挑战。分辨率增强技术(RETs)的局限性迫使人们采用常规的单元设计方法。本文针对一维单元设计,利用仿真数据分析了线端间隙分布与可打印性之间的关系。基于间隙分布偏好,提出了一种有效延长线端和插入假人的优化算法,可显著改善间隙分布,提高印刷可印刷性。在45nm和32nm工艺上的实验结果表明,该方法可以显著改善边缘放置误差(EPE)。
{"title":"On process-aware 1-D standard cell design","authors":"Hongbo Zhang, Martin D. F. Wong, Kai-Yuan Chao","doi":"10.1109/ASPDAC.2010.5419686","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419686","url":null,"abstract":"When VLSI technology scales down to sub-40nm process node, systematic variation introduced by the lithography is a persistent challenge to the manufacturability. The limitation of the resolution enhancement technologies (RETs) forces people to adopt a regular cell design methodology. In this paper, targeted on 1-D cell design, we use simulation data to analyze the relationship between the line-end gap distribution and printability. Based on the gap distribution preferences, an optimal algorithm is provided to efficiently extend the line ends and insert dummies, which will significantly improve the gap distribution and help printability. Experimental results on 45nm and 32nm processes show that significant improvement can be obtained on edge placement error (EPE).","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117038518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Symmetry-aware TCG-based placement design under complex multi-group constraints for analog circuit layouts 基于对称感知的复杂多组约束下模拟电路布局设计
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419877
Rui He, Lihong Zhang
This paper presents a solution to handling complex multi-group symmetry constraints in the placement design using transitive closure graph (TCG) representation for analog layouts. We propose a set of symmetric-feasible conditions, which can automatically satisfy symmetry requirements. We also develop a new contour-based packing scheme with time complexity of O(g·n·lgn), where g is the number of symmetry groups and n is the number of the placed cells. Furthermore, we devise a set of perturbation operations with time complexity of O(n). Our experimental results show the effectiveness and superiority of this proposed scheme compared to the other state-of-the-art placement algorithms for analog layout design.
本文提出了一种利用传递闭包图(TCG)表示模拟布局的方法来处理布局设计中复杂的多群对称约束。我们提出了一组能自动满足对称性要求的对称可行条件。我们还开发了一种新的基于轮廓的填充方案,其时间复杂度为O(g·n·lgn),其中g为对称群的数量,n为放置的单元的数量。此外,我们设计了一组时间复杂度为O(n)的扰动运算。我们的实验结果表明,与其他最先进的布局算法相比,该方案的有效性和优越性用于模拟布局设计。
{"title":"Symmetry-aware TCG-based placement design under complex multi-group constraints for analog circuit layouts","authors":"Rui He, Lihong Zhang","doi":"10.1109/ASPDAC.2010.5419877","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419877","url":null,"abstract":"This paper presents a solution to handling complex multi-group symmetry constraints in the placement design using transitive closure graph (TCG) representation for analog layouts. We propose a set of symmetric-feasible conditions, which can automatically satisfy symmetry requirements. We also develop a new contour-based packing scheme with time complexity of O(g·n·lgn), where g is the number of symmetry groups and n is the number of the placed cells. Furthermore, we devise a set of perturbation operations with time complexity of O(n). Our experimental results show the effectiveness and superiority of this proposed scheme compared to the other state-of-the-art placement algorithms for analog layout design.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126620777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A unified Multi-Corner Multi-Mode static timing analysis engine 一个统一的多角多模式静态时序分析引擎
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419804
Jing-Jia Nian, Shihgeng Tsai, Chung-Yang Huang
In this paper, we proposed a unified multi-corner multi-mode (MCMM) static timing analysis (STA) engine that can efficiently compute the worst-case delay of the process corners in various very large scaled circuits. Our key contributions include: (1) a seamless integration of the path-and parameter-based branch-and-bound algorithms so that the engine is very robust for different kinds of circuits, (2) an improved search space pruning technique, (3) a simple yet efficient critical path delay bound for the initial search space pruning. Our experimental results show that our engine can significantly outperform the prior MCMM STA approaches in various benchmark circuits with different number of process parameters.
本文提出了一种统一的多角多模静态时序分析引擎,可以有效地计算各种超大规模电路中过程角的最坏情况延迟。我们的主要贡献包括:(1)基于路径和参数的分支定界算法的无缝集成,使引擎对不同类型的电路非常鲁棒;(2)改进的搜索空间修剪技术;(3)用于初始搜索空间修剪的简单而有效的关键路径延迟界。实验结果表明,在具有不同工艺参数数量的各种基准电路中,我们的引擎可以显著优于先前的MCMM STA方法。
{"title":"A unified Multi-Corner Multi-Mode static timing analysis engine","authors":"Jing-Jia Nian, Shihgeng Tsai, Chung-Yang Huang","doi":"10.1109/ASPDAC.2010.5419804","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419804","url":null,"abstract":"In this paper, we proposed a unified multi-corner multi-mode (MCMM) static timing analysis (STA) engine that can efficiently compute the worst-case delay of the process corners in various very large scaled circuits. Our key contributions include: (1) a seamless integration of the path-and parameter-based branch-and-bound algorithms so that the engine is very robust for different kinds of circuits, (2) an improved search space pruning technique, (3) a simple yet efficient critical path delay bound for the initial search space pruning. Our experimental results show that our engine can significantly outperform the prior MCMM STA approaches in various benchmark circuits with different number of process parameters.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126823006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
An industrial perspective of 3D IC integration technology from the viewpoint of design technology 从设计技术的角度看三维集成电路技术的产业前景
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419823
Kyu-Myung Choi
3D IC integration is very important to overcome the technology scaling barriers and to satisfy mobile devices' demand. In this paper, we describe the challenges we are facing in developing 3D IC design methodology, especially in the case of TSV-SiP (Logic-Memory die stacking). Also, appropriate development approaches are proposed. The EDA tools for TSV-SiP, which are initially provided by extending current conventional tools, will be gradually enhanced to better support 3D IC designs.
3D集成电路对于克服技术规模障碍,满足移动设备的需求具有重要意义。在本文中,我们描述了我们在开发3D IC设计方法中面临的挑战,特别是在TSV-SiP(逻辑内存芯片堆叠)的情况下。并提出了相应的开发方法。TSV-SiP的EDA工具最初是通过扩展现有的传统工具来提供的,将逐步增强以更好地支持3D IC设计。
{"title":"An industrial perspective of 3D IC integration technology from the viewpoint of design technology","authors":"Kyu-Myung Choi","doi":"10.1109/ASPDAC.2010.5419823","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419823","url":null,"abstract":"3D IC integration is very important to overcome the technology scaling barriers and to satisfy mobile devices' demand. In this paper, we describe the challenges we are facing in developing 3D IC design methodology, especially in the case of TSV-SiP (Logic-Memory die stacking). Also, appropriate development approaches are proposed. The EDA tools for TSV-SiP, which are initially provided by extending current conventional tools, will be gradually enhanced to better support 3D IC designs.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126349225","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
An embedded debugging/performance monitoring engine for a tile-based 3D graphics SoC development 一个嵌入式调试/性能监控引擎,用于基于tile的3D图形SoC开发
Pub Date : 2010-01-18 DOI: 10.1109/ASPDAC.2010.5419865
Liang-Bi Chen, Tsung-Yu Ho, Jiun-Cheng Ju, Cheng-Lung Chiang, Chung-Nan Lee, Ing-Jer Huang
This paper presents an embedded debugging/ performance monitoring engine (EDPME), which is capable of collect run time characteristics, detect AHB on-chip bus protocol error/inefficiency, and capture on-chip AHB bus traces at various abstraction levels with compression ratio up to 98% for a low cost tile-based 3D graphics SoC development.
本文提出了一种嵌入式调试/性能监控引擎(EDPME),它能够收集运行时特征,检测AHB片上总线协议错误/效率低下,并在各种抽象级别捕获片上AHB总线轨迹,压缩比高达98%,用于低成本的基于瓦片的3D图形SoC开发。
{"title":"An embedded debugging/performance monitoring engine for a tile-based 3D graphics SoC development","authors":"Liang-Bi Chen, Tsung-Yu Ho, Jiun-Cheng Ju, Cheng-Lung Chiang, Chung-Nan Lee, Ing-Jer Huang","doi":"10.1109/ASPDAC.2010.5419865","DOIUrl":"https://doi.org/10.1109/ASPDAC.2010.5419865","url":null,"abstract":"This paper presents an embedded debugging/ performance monitoring engine (EDPME), which is capable of collect run time characteristics, detect AHB on-chip bus protocol error/inefficiency, and capture on-chip AHB bus traces at various abstraction levels with compression ratio up to 98% for a low cost tile-based 3D graphics SoC development.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124155127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Built-in self at-speed Delay Binning And Calibration Mechanism in wireless test platform 无线测试平台中内置的自高速延迟绑定和校准机制
Pub Date : 2010-01-18 DOI: 10.5555/1899721.1899802
Chen-I Chung, Jyun-Sian Jhou, Ching-Hwa Cheng
An at-speed BIST delay testing technique is proposed. It differs from traditional circuit speed testing techniques by changing the system clock rate. This method supplies test pattern to the circuit using lower-speed clock frequency, then applies internal BIST circuit to adjust clock edge for circuit at-speed delay testing and speed binning. The self wide-range (26%∼76%), fine-scale (34ps) duty cycle adjustment technique with high-precision (28ps) calibration circuit is proposed for at-speed delay test and performance binning. The contribution of this work is the proposal of a feasible self at-speed delay testing technique. Test chip DFT strategies are fully validated by instruments and HOY wireless test system.
提出了一种高速BIST延迟测试技术。它不同于传统的电路速度测试技术,通过改变系统时钟速率。该方法采用低速时钟频率为电路提供测试模式,然后利用内部BIST电路调整时钟边,进行电路的高速延迟测试和速度分组。提出了自宽量程(26% ~ 76%)、精细(34ps)占空比调整技术和高精度(28ps)校准电路,用于高速延迟测试和性能合并。本工作的贡献在于提出了一种可行的自高速延迟测试技术。测试芯片DFT策略通过仪器和HOY无线测试系统进行了充分验证。
{"title":"Built-in self at-speed Delay Binning And Calibration Mechanism in wireless test platform","authors":"Chen-I Chung, Jyun-Sian Jhou, Ching-Hwa Cheng","doi":"10.5555/1899721.1899802","DOIUrl":"https://doi.org/10.5555/1899721.1899802","url":null,"abstract":"An at-speed BIST delay testing technique is proposed. It differs from traditional circuit speed testing techniques by changing the system clock rate. This method supplies test pattern to the circuit using lower-speed clock frequency, then applies internal BIST circuit to adjust clock edge for circuit at-speed delay testing and speed binning. The self wide-range (26%∼76%), fine-scale (34ps) duty cycle adjustment technique with high-precision (28ps) calibration circuit is proposed for at-speed delay test and performance binning. The contribution of this work is the proposal of a feasible self at-speed delay testing technique. Test chip DFT strategies are fully validated by instruments and HOY wireless test system.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124312289","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TLM automation for multi-core design TLM自动化多核设计
Pub Date : 2010-01-18 DOI: 10.5555/1899721.1899888
S. Abdi
Transaction Level Models (TLMs) are being increasingly used by multi-core system designers for design validation and embedded SW development. However, with well defined modeling semantics and TLM automation tools, it is also possible to use TLMs for multi-core design. This paper presents recent research in automatic generation of timed TLMs for early, yet reliable, evaluation of multi-core design decisions. The TLMs are automatically generated from a given mapping of a concurrent application to a multi-core platform. The application code is annotated with delays at the basic-block level of granularity. Similarly, the platform services, such as communication and scheduling, also include timing delays. The TLM automation methods have been implemented in the Embedded System Environment (ESE) toolset. Our experimental results with ESE demonstrate that multi-core TLMs can be generated in the order of seconds; they simulate close to host-compiled application execution speed, and are more than 90% accurate compared to board measurements on average for industrial size examples. Therefore, TLM automation enables early and reliable evaluation of multi-core design decisions.
事务级模型(tlm)越来越多地被多核系统设计人员用于设计验证和嵌入式软件开发。然而,通过定义良好的建模语义和TLM自动化工具,也可以将TLM用于多核设计。本文介绍了自动生成定时tlm的最新研究,用于多核设计决策的早期、可靠的评估。tlm是从并发应用程序到多核平台的给定映射自动生成的。应用程序代码在基本块级别的粒度上标注了延迟。同样,平台服务,如通信和调度,也包括时间延迟。TLM自动化方法已经在嵌入式系统环境(ESE)工具集中实现。我们在ESE上的实验结果表明,多核tlm可以在几秒内生成;它们模拟接近主机编译的应用程序执行速度,并且与工业规模示例的平均板测量相比,准确度超过90%。因此,TLM自动化能够对多核设计决策进行早期和可靠的评估。
{"title":"TLM automation for multi-core design","authors":"S. Abdi","doi":"10.5555/1899721.1899888","DOIUrl":"https://doi.org/10.5555/1899721.1899888","url":null,"abstract":"Transaction Level Models (TLMs) are being increasingly used by multi-core system designers for design validation and embedded SW development. However, with well defined modeling semantics and TLM automation tools, it is also possible to use TLMs for multi-core design. This paper presents recent research in automatic generation of timed TLMs for early, yet reliable, evaluation of multi-core design decisions. The TLMs are automatically generated from a given mapping of a concurrent application to a multi-core platform. The application code is annotated with delays at the basic-block level of granularity. Similarly, the platform services, such as communication and scheduling, also include timing delays. The TLM automation methods have been implemented in the Embedded System Environment (ESE) toolset. Our experimental results with ESE demonstrate that multi-core TLMs can be generated in the order of seconds; they simulate close to host-compiled application execution speed, and are more than 90% accurate compared to board measurements on average for industrial size examples. Therefore, TLM automation enables early and reliable evaluation of multi-core design decisions.","PeriodicalId":152569,"journal":{"name":"2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122732828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1