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Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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Growth of chromium doped semi-insulating InP by MOVPE MOVPE生长掺铬半绝缘InP
M. Harlow, W. J. Duncan, I. Lealman, P. Spurdens
Growth of chromium doped InP by atmospheric pressure metal-organic vapour phase epitaxy is reported. Hexacarbonyl chromium and bis-benzene chromium are both shown to be efficient Cr precursors although significant co-incorporation of carbon is a limitation of the former. Structural and electrical properties of the layers are described. A compensating deep donor concentration of up to 3/spl times/10/sup 16/ cm/sup -3/ has been achieved. The resistivity of p-InP/Cr-InP/p-InP structures is as high as 3/spl times/10/sup 8/ /spl Omega/ cm. When this structure is incorporated in buried heterostructure lasers for current blocking, improved performance compared with conventional iron doped structures is observed.<>
报道了常压金属-有机气相外延法生长掺杂铬的InP。六羰基铬和二苯铬都被证明是有效的Cr前体,尽管碳的显著共掺入是前者的限制。描述了这些层的结构和电性能。补偿深层供体浓度可达3/spl倍/10/sup 16/ cm/sup -3/ sup。p-InP/Cr-InP/p-InP结构的电阻率高达3/spl倍/10/sup 8/ /spl ω / cm。当这种结构被加入到埋藏异质结构激光器中进行电流阻断时,与传统的掺铁结构相比,性能得到了改善。
{"title":"Growth of chromium doped semi-insulating InP by MOVPE","authors":"M. Harlow, W. J. Duncan, I. Lealman, P. Spurdens","doi":"10.1109/ICIPRM.1994.328161","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328161","url":null,"abstract":"Growth of chromium doped InP by atmospheric pressure metal-organic vapour phase epitaxy is reported. Hexacarbonyl chromium and bis-benzene chromium are both shown to be efficient Cr precursors although significant co-incorporation of carbon is a limitation of the former. Structural and electrical properties of the layers are described. A compensating deep donor concentration of up to 3/spl times/10/sup 16/ cm/sup -3/ has been achieved. The resistivity of p-InP/Cr-InP/p-InP structures is as high as 3/spl times/10/sup 8/ /spl Omega/ cm. When this structure is incorporated in buried heterostructure lasers for current blocking, improved performance compared with conventional iron doped structures is observed.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124948396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Photoluminescence of InGaAs/InP quantum dots InGaAs/InP 量子点的光致发光
S. Gu, E. Reuter, Q. Xu, R. Panepucci, H. Chang, A. Chen, I. Adesida, K. Cheng, S. G. Bishop
The spatial distribution of photo-excited carriers in dry etched InGaAs/InP quantum-well-dots (QWDs) has been investigated by photoluminescence (PL) spectroscopy and cathodoluminescence (CL) imaging. High resolution e-beam lithography and CH/sub 4H/sub 2/ reactive ion etching were used to fabricate QWDs from multiple quantum well (MQW) heterostructures with GaAs well thicknesses ranging from 1 to 15 nm. Low temperature CL spectra from a single QWD stack provided a measure of the layer-to-layer variation in intensity in such MQW dots. Lateral distributions of emission intensity in single quantum dots and dot-to-dot variations in emission intensity have been obtained from CL line scans. The QWD PL intensity from the thicker, bottom QWDs in a stack is found to increase relative to the PL from the thinner, top QWDs with increasing excitation intensity and increasing temperature. This observation is attributed to the diffusion of carriers generated in the InP substrate into the bottom quantum wells. The PL spectra of all five 128 nm diameter QWDs in the MQW stacks exhibit a blueshift of about 3 meV at the lowest excitation intensity.<>
通过光致发光 (PL) 光谱和阴极射线发光 (CL) 成像研究了干蚀刻 InGaAs/InP 量子阱点 (QWD) 中光激发载流子的空间分布。利用高分辨率电子束光刻和 CH/sub 4H/sub 2/ 反应离子刻蚀技术,从 GaAs 阱厚度为 1 至 15 nm 的多量子阱 (MQW) 异质结构中制造出了 QWD。单个 QWD 叠层的低温 CL 光谱可用于测量此类 MQW 点的层间强度变化。通过 CL 线扫描获得了单个量子点发射强度的横向分布以及点与点之间发射强度的变化。研究发现,随着激发强度的增加和温度的升高,堆栈中底部较厚量子点的聚光强度相对于顶部较薄量子点的聚光强度会增加。这一现象归因于 InP 衬底中产生的载流子扩散到底部量子阱。在最低激发强度下,MQW 堆中所有五个直径为 128 nm 的 QWD 的 PL 光谱都会出现约 3 meV 的蓝移。
{"title":"Photoluminescence of InGaAs/InP quantum dots","authors":"S. Gu, E. Reuter, Q. Xu, R. Panepucci, H. Chang, A. Chen, I. Adesida, K. Cheng, S. G. Bishop","doi":"10.1109/ICIPRM.1994.328268","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328268","url":null,"abstract":"The spatial distribution of photo-excited carriers in dry etched InGaAs/InP quantum-well-dots (QWDs) has been investigated by photoluminescence (PL) spectroscopy and cathodoluminescence (CL) imaging. High resolution e-beam lithography and CH/sub 4H/sub 2/ reactive ion etching were used to fabricate QWDs from multiple quantum well (MQW) heterostructures with GaAs well thicknesses ranging from 1 to 15 nm. Low temperature CL spectra from a single QWD stack provided a measure of the layer-to-layer variation in intensity in such MQW dots. Lateral distributions of emission intensity in single quantum dots and dot-to-dot variations in emission intensity have been obtained from CL line scans. The QWD PL intensity from the thicker, bottom QWDs in a stack is found to increase relative to the PL from the thinner, top QWDs with increasing excitation intensity and increasing temperature. This observation is attributed to the diffusion of carriers generated in the InP substrate into the bottom quantum wells. The PL spectra of all five 128 nm diameter QWDs in the MQW stacks exhibit a blueshift of about 3 meV at the lowest excitation intensity.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129574802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Temperature and transverse mode characteristics of InGaAsP (1.3 /spl mu/m) vertical cavity lasers on GaAs substrates GaAs衬底InGaAsP (1.3 /spl mu/m)垂直腔激光器的温度和横模特性
J. J. Dudley, D. Babic, R. Mirin, L. Yang, B. Miller, E. Hu, J. Bowers
We present the transverse mode and temperature characteristics of a novel InGaAsP (1.3 /spl mu/m) vertical cavity laser structure which employs a lattice mismatched GaAs/AlAs mirror and one dielectric mirror. The devices lase in a linearly polarized, single transverse mode up to 2 times threshold. The characteristic temperature of 11 /spl mu/m diameter devices is 67 K at room temperature.<>
本文提出了一种新型的InGaAsP (1.3 /spl mu/m)垂直腔激光结构,该结构采用晶格错配GaAs/AlAs反射镜和一个介电反射镜。该器件以线偏振、单横向模式发射,最高可达2倍阈值。11 /spl mu/m直径器件在室温下的特征温度为67 K。
{"title":"Temperature and transverse mode characteristics of InGaAsP (1.3 /spl mu/m) vertical cavity lasers on GaAs substrates","authors":"J. J. Dudley, D. Babic, R. Mirin, L. Yang, B. Miller, E. Hu, J. Bowers","doi":"10.1109/ICIPRM.1994.328233","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328233","url":null,"abstract":"We present the transverse mode and temperature characteristics of a novel InGaAsP (1.3 /spl mu/m) vertical cavity laser structure which employs a lattice mismatched GaAs/AlAs mirror and one dielectric mirror. The devices lase in a linearly polarized, single transverse mode up to 2 times threshold. The characteristic temperature of 11 /spl mu/m diameter devices is 67 K at room temperature.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129029000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Proton bombardment technique for high speed (>1 Gbit/s) 4 section bistable DBR wavelength converter 高速(>1 Gbit/s) 4段双稳态DBR波长转换器的质子轰击技术
E. Gaumont-Goarin, J. Jacquet, S. Adevah-Poeuf, C. Labourie, O. Le Gouezigou, F. Gaborit, F. Serre, C. Fortin, G. Ripoche, P. Pagnod, A. Jourdan, P. Ottolenghi, P. Landais, G. Duan
Wavelength conversion is a key function for optical switching using wavelength routing. Among the different solutions (gain saturation in semi-conductor amplifiers or in DBR lasers) bistable lasers based on saturable absorption are attractive with their signal reshaping capability but they have been limited in speed by the carrier lifetime of the absorption section. To overcome this limitation, we have optimised a proton bombardment technique of the saturable absorber and applied it to the realisation of (4 section) high speed bistable DBR lasers. Wavelength conversion is thus demonstrated at 1 Gbit/s together with Extinction Ratio regeneration.<>
波长转换是波长路由光交换的关键功能。在半导体放大器的增益饱和和DBR激光器的增益饱和两种解决方案中,基于饱和吸收的双稳态激光器因其信号重塑能力而具有吸引力,但其速度受到吸收段载流子寿命的限制。为了克服这一限制,我们优化了可饱和吸收体的质子轰击技术,并将其应用于实现(4节)高速双稳态DBR激光器。从而证明了波长转换速度为1gbit /s,同时具有消光比再生。
{"title":"Proton bombardment technique for high speed (>1 Gbit/s) 4 section bistable DBR wavelength converter","authors":"E. Gaumont-Goarin, J. Jacquet, S. Adevah-Poeuf, C. Labourie, O. Le Gouezigou, F. Gaborit, F. Serre, C. Fortin, G. Ripoche, P. Pagnod, A. Jourdan, P. Ottolenghi, P. Landais, G. Duan","doi":"10.1109/ICIPRM.1994.328155","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328155","url":null,"abstract":"Wavelength conversion is a key function for optical switching using wavelength routing. Among the different solutions (gain saturation in semi-conductor amplifiers or in DBR lasers) bistable lasers based on saturable absorption are attractive with their signal reshaping capability but they have been limited in speed by the carrier lifetime of the absorption section. To overcome this limitation, we have optimised a proton bombardment technique of the saturable absorber and applied it to the realisation of (4 section) high speed bistable DBR lasers. Wavelength conversion is thus demonstrated at 1 Gbit/s together with Extinction Ratio regeneration.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127771681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Optical monitoring of growth surfaces-reflectance-difference spectroscopy 生长表面的光学监测-反射-差分光谱学
I. Kamiya
Due to the recent development of optical probes, monitoring of surface structures during organometallic chemical vapor deposition (OMCVD) has now become possible. Reflectance-difference spectroscopy (RDS) revealed that the (001)GaAs surface under OMCVD conditions reconstructs into structures similar or identical to those that occur in ultrahigh vacuum as encountered during molecular beam epitaxy (MBE). Here, the author reviews recent real-time studies on the OMCVD and MBE growth using RDS and complementary techniques such as grazing-incidence X-ray scattering.<>
由于光学探针的发展,有机金属化学气相沉积(OMCVD)过程中的表面结构监测现在已经成为可能。反射率-差谱分析(RDS)表明,在OMCVD条件下,(001)GaAs表面重建成与分子束外延(MBE)过程中超高真空中相似或相同的结构。在这里,作者回顾了最近使用RDS和互补技术(如掠入射x射线散射)对OMCVD和MBE生长的实时研究。
{"title":"Optical monitoring of growth surfaces-reflectance-difference spectroscopy","authors":"I. Kamiya","doi":"10.1109/ICIPRM.1994.328309","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328309","url":null,"abstract":"Due to the recent development of optical probes, monitoring of surface structures during organometallic chemical vapor deposition (OMCVD) has now become possible. Reflectance-difference spectroscopy (RDS) revealed that the (001)GaAs surface under OMCVD conditions reconstructs into structures similar or identical to those that occur in ultrahigh vacuum as encountered during molecular beam epitaxy (MBE). Here, the author reviews recent real-time studies on the OMCVD and MBE growth using RDS and complementary techniques such as grazing-incidence X-ray scattering.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116046404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Selective area processing of InGaAsP InGaAsP的选择性区域处理
S. Pearton, C. Abernathy, F. Ren
The electrical activation characteristics of Si/sup +/ and Be/sup +/ ions implanted into InGaAsP (/spl lambda/=1-3 /spl mu/m) grown lattice-matched to InP by metalorganic molecular beam epitaxy were studied as a function of ion dose (5/spl times/10/sup 12/-5/spl times/10/sup 14/ cm/sup -2/), annealing time (3-60 sec) and annealing temperature (575-750/spl deg/C). Maximum doping concentrations of /spl sim/2/spl times/10/sup 19/ cm/sup -3/ were obtained for both Si/sup +/ and Be/sup +/, with activation energies for electrical activation of 0.58 eV and 0.39 eV, respectively. Multiple energy F/sup +/ or H/sup +/ implants can be used to produce high resistance layers for isolation purposes - maximum sheet resistances of /spl sim/8/spl times/10/sup 6/ /spl Omega/spl square/ or /spl sim/10/sup 6/ /spl Omega/spl square/ for initially p/sup +/ or n/sup +/InGaAsP, respectively, were obtained for F/sup +/ implants followed by annealing near 450/spl deg/C. Smooth, anisotropic dry etching of the InGaAsP is obtained with electron cyclotron resonance CH/sub 4H/sub 2Ar discharges at low DC biases. The etch rates are the same for both n/sup +/ and p/sup +/ quaternary layers and are independent of the doping level.<>
采用金属有机分子束外延法将Si/sup +/和Be/sup +/离子注入到与InP相匹配的InGaAsP (/spl λ /=1 ~ 3 /spl mu/m)中,研究了离子剂量(5/spl次/10/sup 12/-5/spl次/10/sup 14/ cm/sup -2/)、退火时间(3 ~ 60秒)和退火温度(575 ~ 750/spl℃)对电活化特性的影响。Si/sup +/和Be/sup +/的最大掺杂浓度为/spl sim/2/spl倍/10/sup 19/ cm/sup -3/,电活化活化能分别为0.58 eV和0.39 eV。多层能量的F/sup +/或H/sup +/植片可用于生产高电阻层,以达到隔离的目的——对于最初的p/sup +/或n/sup +/InGaAsP, F/sup +/植片在接近450/spl度/C退火后,获得的最大薄片电阻分别为/spl sim/8/spl倍/10/sup 6/ /spl Omega/spl square/或/spl sim/10/sup 6/ /spl Omega/spl square/。在低直流偏置条件下,采用电子回旋共振CH/sub 4H/sub 2Ar放电,获得了InGaAsP光滑的各向异性干刻蚀。n/sup +/和p/sup +/四层的腐蚀速率相同,且与掺杂水平无关。
{"title":"Selective area processing of InGaAsP","authors":"S. Pearton, C. Abernathy, F. Ren","doi":"10.1109/ICIPRM.1994.328195","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328195","url":null,"abstract":"The electrical activation characteristics of Si/sup +/ and Be/sup +/ ions implanted into InGaAsP (/spl lambda/=1-3 /spl mu/m) grown lattice-matched to InP by metalorganic molecular beam epitaxy were studied as a function of ion dose (5/spl times/10/sup 12/-5/spl times/10/sup 14/ cm/sup -2/), annealing time (3-60 sec) and annealing temperature (575-750/spl deg/C). Maximum doping concentrations of /spl sim/2/spl times/10/sup 19/ cm/sup -3/ were obtained for both Si/sup +/ and Be/sup +/, with activation energies for electrical activation of 0.58 eV and 0.39 eV, respectively. Multiple energy F/sup +/ or H/sup +/ implants can be used to produce high resistance layers for isolation purposes - maximum sheet resistances of /spl sim/8/spl times/10/sup 6/ /spl Omega/spl square/ or /spl sim/10/sup 6/ /spl Omega/spl square/ for initially p/sup +/ or n/sup +/InGaAsP, respectively, were obtained for F/sup +/ implants followed by annealing near 450/spl deg/C. Smooth, anisotropic dry etching of the InGaAsP is obtained with electron cyclotron resonance CH/sub 4H/sub 2Ar discharges at low DC biases. The etch rates are the same for both n/sup +/ and p/sup +/ quaternary layers and are independent of the doping level.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128080263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization of plasma-induced traps in n-InP 等离子体诱导n-InP陷阱的表征
Y. Sakamoto, H. Ninomiya, K. Matsuda, T. Sugino, J. Shirafuji
Deep electron trap levels in n-InP treated with remote hydrogen and helium plasmas have been studied by isothermal capacitance transient spectroscopy (ICTS) measurement. The trap levels at E/sub c/-0.51 eV (E2) and E/sub c/-0.54 eV (E4) are induced by both plasma treatment. However, the E4 traps are related to phosphorus vacancies and are fully passivated in H/sub 2/ plasma treated sample. The existence of the E4 traps in H/sub 2/-plasma-treated sample can be revealed after 350/spl deg/C annealing. It is found that the width of the surface region in which the E2 traps are dominantly introduced becomes thicker with increasing acceleration voltage of He ions.<>
用等温电容瞬态光谱(ICTS)测量方法研究了远距氢和氦等离子体处理的n-InP中的深电子阱能级。两种等离子体处理均可诱导E/sub c/-0.51 eV (E2)和E/sub c/-0.54 eV (E4)的阱能级。然而,E4陷阱与磷空位有关,并且在H/sub /等离子体处理的样品中完全钝化。等离子体处理后的样品经350℃退火后,发现E4陷阱的存在。研究发现,随着He离子加速电压的增加,E2陷阱的主要引入区宽度变厚。
{"title":"Characterization of plasma-induced traps in n-InP","authors":"Y. Sakamoto, H. Ninomiya, K. Matsuda, T. Sugino, J. Shirafuji","doi":"10.1109/ICIPRM.1994.328191","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328191","url":null,"abstract":"Deep electron trap levels in n-InP treated with remote hydrogen and helium plasmas have been studied by isothermal capacitance transient spectroscopy (ICTS) measurement. The trap levels at E/sub c/-0.51 eV (E2) and E/sub c/-0.54 eV (E4) are induced by both plasma treatment. However, the E4 traps are related to phosphorus vacancies and are fully passivated in H/sub 2/ plasma treated sample. The existence of the E4 traps in H/sub 2/-plasma-treated sample can be revealed after 350/spl deg/C annealing. It is found that the width of the surface region in which the E2 traps are dominantly introduced becomes thicker with increasing acceleration voltage of He ions.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128129921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wafer bonding of InP and GaAs: interface characterization and device applications InP和GaAs晶圆键合:界面表征和器件应用
L. Yang, K. Carey, M. Ludowise, W. Perez, D. Mars, J. Fouquet, K. Nauka, S. J. Rosner, Rajeev J Ram, J. J. Dudley, D. Babic, J. Bowers
Wafer bonding is a technique used to form a single hybrid solid from dissimilar materials by rearrangement of surface bonds. While the bonding of silicon-related material has been studied extensively, very little work was devoted to the III-V material system. We have successfully bonded InP and GaAs. In spite of the 3.7% lattice-mismatch, excellent material quality can be preserved less than 0.2 /spl mu/m away from the bonded interface. Transmission electron micrograph (TEM), deep level transient spectroscopy (DLTS), electron beam induced current (EBIC), photoluminescence (PL) and optical reflection measurements were used to characterize the bonded interface, and consistent results were obtained.<>
晶圆键合是一种利用不同材料表面键的重排形成单一杂化固体的技术。虽然硅相关材料的键合已经得到了广泛的研究,但对III-V材料体系的研究却很少。我们已经成功地粘合了InP和GaAs。尽管存在3.7%的晶格失配,但在距离键合界面小于0.2 /spl mu/m的范围内仍能保持优异的材料质量。采用透射电子显微镜(TEM)、深能级瞬态光谱(DLTS)、电子束感应电流(EBIC)、光致发光(PL)和光反射等测量方法对键合界面进行了表征,得到了一致的结果。
{"title":"Wafer bonding of InP and GaAs: interface characterization and device applications","authors":"L. Yang, K. Carey, M. Ludowise, W. Perez, D. Mars, J. Fouquet, K. Nauka, S. J. Rosner, Rajeev J Ram, J. J. Dudley, D. Babic, J. Bowers","doi":"10.1109/ICIPRM.1994.328200","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328200","url":null,"abstract":"Wafer bonding is a technique used to form a single hybrid solid from dissimilar materials by rearrangement of surface bonds. While the bonding of silicon-related material has been studied extensively, very little work was devoted to the III-V material system. We have successfully bonded InP and GaAs. In spite of the 3.7% lattice-mismatch, excellent material quality can be preserved less than 0.2 /spl mu/m away from the bonded interface. Transmission electron micrograph (TEM), deep level transient spectroscopy (DLTS), electron beam induced current (EBIC), photoluminescence (PL) and optical reflection measurements were used to characterize the bonded interface, and consistent results were obtained.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115142203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Growth and characterisation of high quality GaInP/AlGaInP quantum wells by solid-source molecular beam epitaxy 高质量GaInP/AlGaInP量子阱的固体源分子束外延生长和表征
M. Hopkinson, J. David, O. P. Kowalski, D. Mowbray, M. S. Skolnick
Photoluminescence (PL), photoluminescence excitation (PLE) and X-ray diffraction (XRD) data on GaInP/Al(Ga)InP quantum wells (QW's) grown by solid source molecular beam epitaxy (SSMBE) is presented. The structural and optical properties of QW's grown with either ternary Al/sub 0.52/In/sub 0.48/P or quaternary (Al/sub x/Ga/sub 1-x/)/sub 0.52/In/sub 0.48/P (x/spl sim/0.53) barriers is contrasted. Both barrier types offer the prospect of high quality structures as demonstrated by narrow PL and XRD linewidths. The PL of thin QW's (/spl les/20 /spl Aring/) is however considerably degraded for the case of AlInP barriers due to reduced electron confinement compared to quaternary AlGaInP. PL and PLE measurements reveal a large Stokes' shift for these QW's, which is clear evidence for a change from type-I to type-II behavior. This observation, together with calculations based on PLE data for the E1-HH1 ground state energy, gives limits on the range of conduction band offsets that may be used which are consistent with the value /spl Delta/E/sub c/=0.67/spl Delta/E/sub g/ recently reported in the literature.<>
介绍了固体源分子束外延(SSMBE)生长GaInP/Al(Ga)InP量子阱的光致发光(PL)、光致发光激发(PLE)和x射线衍射(XRD)数据。对比了Al/sub 0.52/In/sub 0.48/P三元势垒和Al/sub x/Ga/sub 1-x/)/sub 0.52/In/sub 0.48/P (x/spl sim/0.53)四元势垒生长的量子阱的结构和光学性质。两种势垒类型都提供了高质量结构的前景,正如窄PL和XRD线宽所证明的那样。薄QW的PL (/spl les/20 /spl Aring/)在AlInP势垒的情况下,由于与第四季AlGaInP相比,电子约束减少,因此PL明显降低。PL和PLE测量揭示了这些QW的大斯托克斯位移,这是从i型行为转变为ii型行为的明确证据。这一观测结果,加上基于e1 - h1基态能量的PLE数据的计算,给出了可以使用的导带偏移范围的限制,该范围与最近文献中报道的值/spl Delta/E/sub c/=0.67/spl Delta/E/sub g/一致。
{"title":"Growth and characterisation of high quality GaInP/AlGaInP quantum wells by solid-source molecular beam epitaxy","authors":"M. Hopkinson, J. David, O. P. Kowalski, D. Mowbray, M. S. Skolnick","doi":"10.1109/ICIPRM.1994.328291","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328291","url":null,"abstract":"Photoluminescence (PL), photoluminescence excitation (PLE) and X-ray diffraction (XRD) data on GaInP/Al(Ga)InP quantum wells (QW's) grown by solid source molecular beam epitaxy (SSMBE) is presented. The structural and optical properties of QW's grown with either ternary Al/sub 0.52/In/sub 0.48/P or quaternary (Al/sub x/Ga/sub 1-x/)/sub 0.52/In/sub 0.48/P (x/spl sim/0.53) barriers is contrasted. Both barrier types offer the prospect of high quality structures as demonstrated by narrow PL and XRD linewidths. The PL of thin QW's (/spl les/20 /spl Aring/) is however considerably degraded for the case of AlInP barriers due to reduced electron confinement compared to quaternary AlGaInP. PL and PLE measurements reveal a large Stokes' shift for these QW's, which is clear evidence for a change from type-I to type-II behavior. This observation, together with calculations based on PLE data for the E1-HH1 ground state energy, gives limits on the range of conduction band offsets that may be used which are consistent with the value /spl Delta/E/sub c/=0.67/spl Delta/E/sub g/ recently reported in the literature.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"393 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116392589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Reactive ion etching-induced damage in InAlAs/InGaAs heterostructures 反应离子蚀刻诱导InAlAs/InGaAs异质结构的损伤
S. Agarwala, I. Adesida, C. Caneau, R. Bhat
Due to the advances in lithography and dry processing technologies it is now possible to fabricate devices with lateral dimensions in the nanometer range. Dry processes such as reactive ion etching (RIE) or chemically assisted ion beam etching (CAIBE), are generally required to provide the etch anisotropy needed to define such small structures. Unfortunately, the energetic ions in these ion beam processes introduce crystal damage which results in deterioration of electronic and optoelectronic properties of the semiconductor material. In order to exploit the full potential of the dry processes it is very important to characterize and understand the process-induced damage. This is particularly true in III-V semiconductor structures, where thermal annealing is often ineffective for restoring crystalline order. At present, the mechanism of damage introduction during dry etch processes is not clearly understood. The damage extends well beyond the calculated projected ion ranges. In addition, in RIE the energy and the flux of ions bombarding the etched wafer can only be controlled indirectly by adjusting the rf power, the pressure etc. Unless special techniques are used to measure the ion energy distribution, only the maximum possible ion energy is known from the value of the self-bias voltage. Also, in most situations the nature of the ions, their fluxes or the ion/neutral ratio are unknown. This lack of information further complicates the prediction of the extent of damage. Thus, the significance of characterization of dry etch induced damage in the fabrication of devices cannot be overemphasized. In this paper, we report the study of RIE-induced damage in the InAlAs/InGaAs material system which has great potential for applications in microwave devices and long-wavelength optical communications due to its excellent transport properties.<>
由于光刻技术和干法加工技术的进步,现在可以制造纳米级横向尺寸的器件。通常需要干法工艺,如反应离子蚀刻(RIE)或化学辅助离子束蚀刻(CAIBE),以提供定义此类小结构所需的蚀刻各向异性。不幸的是,这些离子束过程中的高能离子引入晶体损伤,导致半导体材料的电子和光电子性能恶化。为了充分利用干燥过程的潜力,表征和理解过程引起的损伤是非常重要的。在III-V型半导体结构中尤其如此,其中热退火通常对恢复晶体秩序无效。目前,对干蚀刻过程中损伤引入的机理还不清楚。损伤范围远远超出了计算出的预计离子范围。此外,在RIE中,离子轰击蚀刻晶片的能量和通量只能通过调节射频功率、压力等来间接控制。除非使用特殊技术来测量离子能量分布,否则只能从自偏置电压的值中知道最大可能的离子能量。此外,在大多数情况下,离子的性质、它们的通量或离子/中性比率是未知的。这种信息的缺乏使对破坏程度的预测进一步复杂化。因此,表征干蚀刻引起的损伤在器件制造中的重要性不能过分强调。在本文中,我们报道了在InAlAs/InGaAs材料体系中rie诱导损伤的研究,该材料体系由于其优异的传输特性在微波器件和长波光通信中具有很大的应用潜力。
{"title":"Reactive ion etching-induced damage in InAlAs/InGaAs heterostructures","authors":"S. Agarwala, I. Adesida, C. Caneau, R. Bhat","doi":"10.1109/ICIPRM.1994.328252","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328252","url":null,"abstract":"Due to the advances in lithography and dry processing technologies it is now possible to fabricate devices with lateral dimensions in the nanometer range. Dry processes such as reactive ion etching (RIE) or chemically assisted ion beam etching (CAIBE), are generally required to provide the etch anisotropy needed to define such small structures. Unfortunately, the energetic ions in these ion beam processes introduce crystal damage which results in deterioration of electronic and optoelectronic properties of the semiconductor material. In order to exploit the full potential of the dry processes it is very important to characterize and understand the process-induced damage. This is particularly true in III-V semiconductor structures, where thermal annealing is often ineffective for restoring crystalline order. At present, the mechanism of damage introduction during dry etch processes is not clearly understood. The damage extends well beyond the calculated projected ion ranges. In addition, in RIE the energy and the flux of ions bombarding the etched wafer can only be controlled indirectly by adjusting the rf power, the pressure etc. Unless special techniques are used to measure the ion energy distribution, only the maximum possible ion energy is known from the value of the self-bias voltage. Also, in most situations the nature of the ions, their fluxes or the ion/neutral ratio are unknown. This lack of information further complicates the prediction of the extent of damage. Thus, the significance of characterization of dry etch induced damage in the fabrication of devices cannot be overemphasized. In this paper, we report the study of RIE-induced damage in the InAlAs/InGaAs material system which has great potential for applications in microwave devices and long-wavelength optical communications due to its excellent transport properties.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"280 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116453219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)
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