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Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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Long wavelength metal-semiconductor-metal photodetectors with Ti/Au and indium-tin-oxide electrodes 具有Ti/Au和铟锡氧化物电极的长波金属-半导体-金属光电探测器
I. Adesida, J. Seo, W. Wohlmuth, C. Caneau, R. Bhat
Metal-semiconductor-metal (MSM) photodiodes have been shown to be excellent detectors for optoelectronic integrated circuits (OEIC's) due to their potential for high speed, ease of fabrication, and compatibility with FET process technologies (1). A major disadvantage of MSM detectors is their low responsivity due to the blocking of incoming optical radiation by opaque metal electrodes. Since the signal-to-noise ratio of an optical receiver is strongly dependent on the responsivity of the photodetector, it is important to devise techniques to maximize responsivity. Backside illumination has been shown to increase responsivity since there are no interfering electrodes on the back of the substrate (2). Another avenue to improve this factor is through the use of transparent electrodes for MSMs. This has been successfully applied to GaAs MSMs operating at 850 nm (3). In this paper, we present a study of InAlAs/InGaAs MSMs utilizing transparent indium tin oxide (ITO) and Ti/Au electrodes. Transmission in the ITO is as high as 99% which has resulted in a responsivity of 0.76 A/W for ITO MSMs which is double the responsivity of 0.39 A/W obtained for Ti/Au MSMs.<>
金属-半导体-金属(MSM)光电二极管已被证明是光电子集成电路(OEIC)的优秀探测器,因为它们具有高速,易于制造和与场效应管工艺技术兼容的潜力(1)。MSM探测器的一个主要缺点是由于不透明金属电极阻挡入射光辐射而导致其响应率低。由于光接收器的信噪比很大程度上取决于光电探测器的响应度,因此设计出最大化响应度的技术是很重要的。由于衬底背面没有干扰电极,背面照明已被证明可以提高响应度(2)。另一种改善这一因素的途径是通过使用透明电极用于msm。这已经成功地应用于工作在850 nm的GaAs msm(3)。在本文中,我们提出了利用透明氧化铟锡(ITO)和Ti/Au电极的InAlAs/InGaAs msm的研究。ITO中的透射率高达99%,这导致ITO mmsm的响应率为0.76 a /W,是Ti/Au mmsm的响应率0.39 a /W的两倍
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引用次数: 5
High resistive undoped Al/sub 0.48/In/sub 0.52/As layers grown by MOCVD 通过 MOCVD 生长的高电阻未掺杂 Al/sub 0.48/In/sub 0.52/As 层
S. Ochi, T. Kimura, T. Ishida, T. Sonoda, S. Takamiya, S. Mitsui
It is shown that the resistivity and the conduction type of undoped MOCVD Al/sub 0.48/In/sub 0.52/As layers depend strongly on the growth temperature (450/spl deg/C-650/spl deg/C). The conduction type changes from n-type, semi-insulating and p-type with the decrease of the growth temperature. High resistivity over 2/spl times/10/sup 8/ /spl Omega/-cm is successfully obtained from undoped Al/sub 0.48/In/sub 0.52/As layers grown at 500/spl deg/C. With help of SIMS and ICTS, it is found that the resistivity is substantially determined by the incorporation of carbon whose incorporation rate depends strongly on the growth temperature. The incorporated carbon compensates the native deep donors. The good selective growth of undoped Al/sub 0.48/In/sub 0.52/As layers is also achieved at even low growth temperature of 500/spl deg/C.<>
研究表明,未掺杂 MOCVD Al/sub 0.48/In/sub 0.52/As 层的电阻率和传导类型与生长温度(450/spl deg/C-650/spl deg/C)密切相关。随着生长温度的降低,传导类型从 n 型、半绝缘型变为 p 型。在 500/spl deg/C 下生长的未掺杂 Al/sub 0.48/In/sub 0.52/As 层成功获得了超过 2/spl times/10/sup 8/ /spl Omega/-cm 的高电阻率。在 SIMS 和 ICTS 的帮助下,我们发现电阻率在很大程度上取决于碳的掺入,而碳的掺入率与生长温度密切相关。掺入的碳补偿了原生深供体。即使在 500/spl deg/C 的低生长温度下,也能实现未掺杂 Al/sub 0.48/In/sub 0.52/As 层的良好选择性生长。
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引用次数: 0
Behavior of InP growth by gas source molecular beam epitaxy on singular and vicinal substrates 气体源分子束外延在奇异基底和邻近基底上生长InP的行为
B.X. Yang, T. Ozeki, H. Hasegawa
Based on the vast data concerning molecular beam epitaxial (MBE) growth of GaAs, it is usually assumed that the growth rate in III-V MBE is limited by supply of the group-III flux as long as sufficient group-V flux is provided. It is also assumed that the growth rate can be calibrated by the period of reflection high-energy electron diffraction (RHEED) oscillation. Presently, these two basic assumptions form the basis of the standard procedure for predetermination of the growth rate in MBE growth of III-V compounds and their related heterostructures and quantum wells. The purpose of this paper is to clarify the behavior of the growth rate during gas source MBE growth of InP on singular and vicinal substrates. RHEED oscillations during growths with various growth conditions were investigated and compared with the real growth rates obtained from direct measurements of the layer thicknesses. Furthermore, effects of both growth conditions and substrate misorientation on the layers' properties were examined by Hall effect measurements and photoluminescence (PL) measurements. It is shown that the above two assumptions based on GaAs MBE experiences are not necessarily true in gas source MBE growth of InP. Namely, the growth rate shows a marked dependence on phosphorus pressure, and the RHEED oscillation is very sensitive to the substrate misorientation. It is also shown that use of the vicinal substrates has significant effects on incorporation process of the adatoms into the grown layers.<>
基于大量关于GaAs分子束外延(MBE)生长的数据,通常认为只要提供足够的v族通量,III-V族MBE的生长速率就会受到iii族通量供应的限制。并假设生长速率可以用反射高能电子衍射振荡周期来标定。目前,这两个基本假设构成了预测III-V型化合物及其相关异质结构和量子阱MBE生长速率的标准程序的基础。本文的目的是阐明InP在单一和邻近基质上气源MBE生长过程中生长速率的行为。研究了不同生长条件下的RHEED振荡,并与直接测量层厚度得到的实际生长速率进行了比较。此外,通过霍尔效应测量和光致发光(PL)测量,研究了生长条件和衬底取向错误对层性能的影响。结果表明,基于GaAs MBE经验的上述两个假设在InP气源MBE增长中并不一定成立。也就是说,生长速率对磷压力有明显的依赖性,并且RHEED振荡对底物取向错误非常敏感。邻近基质的使用对附着原子在生长层中的掺入过程也有显著影响
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引用次数: 0
Implant isolation and dry etching of InN 植体分离与干蚀刻
C. Abernathy, F. Ren, S. Pearton
Smooth, anisotropic dry etching of InN layers is demonstrated in low pressure (1-30 Torr) CH/sub 4H/sub 2/, Cl/sub 2H/sub 2/ or CCl/sub 2/F/sub 2Ar Electron Cyclotron Resonance discharges with additional dc biasing of the sample. Increasing the applied microwave power produces significant enhancements in etch rate. The presence of H/sub 2/ or F/sub 2/ in the gas chemistries is necessary to facilitate equi-rate removal of the group III and nitrogen etch products, leading to smooth surface morphologies. F/sup +/ implantation at doses of /spl sim/10/sup 15/ cm/sup -2/ produces sheet resistances >5/spl times/10/sup 3/ /spl Omega/spl square/ in initially degenerately n/sup +/(4/spl times/10/sup 20/ cm/sup -3/) InN, and values >10/sup 6/ /spl Omega/spl square/ in lower-doped (/spl les/3/spl times/10/sup 19/ cm/sup -3/) ternary alloys InGaN and InAlN.<>
在低压(1-30 Torr) CH/sub - 4H/sub - 2/、Cl/sub - 2H/sub - 2/或CCl/sub - 2/F/sub - 2Ar电子回旋共振放电条件下,对样品进行了光滑的各向异性干刻蚀。增加微波功率可以显著提高蚀刻速率。气体化学中H/sub 2/或F/sub 2/的存在对于促进等速去除III族和氮腐蚀产物是必要的,从而导致光滑的表面形态。F/sup +/注入剂量为/spl sim/10/sup 15/ cm/sup -2/时,产生片状电阻>5/spl倍/10/sup 3/ /spl Omega/spl平方/在初始简并n/sup +/(4/spl倍/10/sup 20/ cm/sup -3/) InN中,>值为10/sup 6/ /spl Omega/spl平方/在低掺杂(/spl les/3/spl倍/10/sup 19/ cm/sup -3/)三元合金InGaN和InAlN中。>
{"title":"Implant isolation and dry etching of InN","authors":"C. Abernathy, F. Ren, S. Pearton","doi":"10.1109/ICIPRM.1994.328251","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328251","url":null,"abstract":"Smooth, anisotropic dry etching of InN layers is demonstrated in low pressure (1-30 Torr) CH/sub 4H/sub 2/, Cl/sub 2H/sub 2/ or CCl/sub 2/F/sub 2Ar Electron Cyclotron Resonance discharges with additional dc biasing of the sample. Increasing the applied microwave power produces significant enhancements in etch rate. The presence of H/sub 2/ or F/sub 2/ in the gas chemistries is necessary to facilitate equi-rate removal of the group III and nitrogen etch products, leading to smooth surface morphologies. F/sup +/ implantation at doses of /spl sim/10/sup 15/ cm/sup -2/ produces sheet resistances >5/spl times/10/sup 3/ /spl Omega/spl square/ in initially degenerately n/sup +/(4/spl times/10/sup 20/ cm/sup -3/) InN, and values >10/sup 6/ /spl Omega/spl square/ in lower-doped (/spl les/3/spl times/10/sup 19/ cm/sup -3/) ternary alloys InGaN and InAlN.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128916721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Growth of InP on patterned substrates using AP-MOVPE 利用AP-MOVPE在图案化基质上生长InP
B.‐T. Lee, R. Logan
Metalorganic vapor phase epitaxy (MOVPE) growth of InP and related materials on the patterned substrates has been studied in many recent investigations to understand how the growth sequences are modified by the presence of the patterns, which is essential information to establish the fabrication process of a wide variety of new optoelectronic devices. In this work, details of the growth patterns around etched grooves and mesas on InP substrates are reported during the atmospheric pressure (AP) MOVPE of InP layers. Parameters studied include trichloroethane (TCA) addition to the H/sub 2/ carrier, groove/mesa orientation ([110] vs. [11~0]), and the shape V-like and rectangular). Emphasis was placed on the planarization of the grown layers as well as the growth evolution within the grooves since these are the most important aspects of device application.<>
金属有机气相外延(MOVPE)生长的InP和相关材料在图图化的衬底上已经进行了许多研究,以了解如何通过图案的存在改变生长序列,这是建立各种新型光电器件制造工艺的重要信息。在这项工作中,详细报道了在InP层的大气压(AP) MOVPE过程中,InP衬底上蚀刻凹槽和台面周围的生长模式。研究的参数包括三氯乙烷(TCA)加入H/sub /载体、槽/台面取向([110]vs.[11~0])、v形和矩形。重点放在生长层的平面化以及凹槽内的生长演变上,因为这些是器件应用中最重要的方面。
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引用次数: 0
A reliable ECR passivation technique on the 0.1 /spl mu/m InAlAs/InGaAs HEMT device 在0.1 /spl mu/m InAlAs/InGaAs HEMT器件上可靠的ECR钝化技术
K. C. Hwang, A. Reisinger, K. Duh, M. Kao, P. Chao, P. Ho, A. Swanson
We have developed a reliable nitride passivation technique on the 0.1/spl times/50 /spl mu/m InAlAs/InGaAs/InP high electron mobility transistor (HEMT) using electron cyclotron resonance (ECR) microwave plasma chemical vapor deposition (CVD). The nitride film was characterized by Fourier transform infrared spectroscopy (FTIR). The stress in the film was measured from wafer curvature. The ECR SiN passivation has almost no effect on the noise and gain performance of 0.1 /spl mu/m InP-HEMTs at 60 GHz. DC accelerated life tests were performed at base temperatures of 225/spl deg/C and 245/spl deg/C. The Median-Time-To-Failure (MTF) based upon a failure criterion of g/sub m/=-20% leads to an Arrhenius plot with an activation energy of 1.6 eV and a projected life of 10/sup 6/ hours at 150/spl deg/C base plate temperature, which is the best median life time ever reported for passivated InP-HEMTs.<>
利用电子回旋共振(ECR)微波等离子体化学气相沉积(CVD)技术,在0.1/spl倍/50 /spl mu/m的InAlAs/InGaAs/InP高电子迁移率晶体管(HEMT)上建立了可靠的氮化钝化技术。利用傅里叶变换红外光谱(FTIR)对氮化膜进行了表征。薄膜中的应力由晶圆曲率测量。ECR SiN钝化对0.1 /spl mu/m inp - hemt在60 GHz时的噪声和增益性能几乎没有影响。直流加速寿命试验分别在225/spl℃和245/spl℃的基准温度下进行。基于g/sub /=-20%失效准则的中位失效时间(MTF)得到的Arrhenius图在150/spl℃的基底温度下活化能为1.6 eV,预计寿命为10/sup / 6/小时,这是迄今为止钝化InP-HEMTs的最佳中位寿命。
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引用次数: 9
InP based carbon-doped base HBT technology: its recent advances and circuit applications InP基碳掺杂基HBT技术:最新进展及电路应用
J. Song, B.W.-P. Hong, C. Palmstrøm, K.B. Chough
Recent advances of carbon-doped InP/In/sub 0.53/Ga/sub 0.47/As singleand double-heterojunction bipolar transistor (SHBT and DHBT) technology, are reviewed. Chemical beam epitaxy (CBE) has been utilized to grow the device structures. Up to date, the SHBT having two 1.5 /spl mu/m/spl times/10 /spl mu/m emitter fingers has exhibited f/sub T/ and f/sub max(MAG/) of 186 GHz and 90 GHz, respectively. To our knowledge, the f/sub T/ of this device is the highest of any type of bipolar transistors yet reported. CW output power of 0.4 W (3.5 W/mm) with power-added efficiency of 36% has been achieved with the 12-finger DHBTs. The SMBT technology has been applied to realization of wideband amplifiers. A simple directly-coupled amplifier has shown a 3-dB bandwidth of over 20 GHz. The results indicate the great potential of carbon-doped base InP/InGaAs HBTs for high-speed and microwave applications.<>
综述了碳掺杂InP/In/sub 0.53/Ga/sub 0.47/As单、双异质结双极晶体管(SHBT和DHBT)技术的最新进展。化学束外延(CBE)已被用于器件结构的生长。迄今为止,具有两个1.5 /spl mu/m/spl倍/10 /spl mu/m发射指的SHBT,其f/sub T/和f/sub max(MAG/)分别为186 GHz和90 GHz。据我们所知,该器件的f/sub T/是迄今报道的任何类型的双极晶体管中最高的。连续输出功率为0.4 W (3.5 W/mm),功率增加效率为36%。SMBT技术已被应用于宽带放大器的实现。一个简单的直接耦合放大器显示了超过20 GHz的3db带宽。结果表明,碳掺杂碱InP/InGaAs HBTs在高速和微波应用方面具有巨大的潜力。
{"title":"InP based carbon-doped base HBT technology: its recent advances and circuit applications","authors":"J. Song, B.W.-P. Hong, C. Palmstrøm, K.B. Chough","doi":"10.1109/ICIPRM.1994.328284","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328284","url":null,"abstract":"Recent advances of carbon-doped InP/In/sub 0.53/Ga/sub 0.47/As singleand double-heterojunction bipolar transistor (SHBT and DHBT) technology, are reviewed. Chemical beam epitaxy (CBE) has been utilized to grow the device structures. Up to date, the SHBT having two 1.5 /spl mu/m/spl times/10 /spl mu/m emitter fingers has exhibited f/sub T/ and f/sub max(MAG/) of 186 GHz and 90 GHz, respectively. To our knowledge, the f/sub T/ of this device is the highest of any type of bipolar transistors yet reported. CW output power of 0.4 W (3.5 W/mm) with power-added efficiency of 36% has been achieved with the 12-finger DHBTs. The SMBT technology has been applied to realization of wideband amplifiers. A simple directly-coupled amplifier has shown a 3-dB bandwidth of over 20 GHz. The results indicate the great potential of carbon-doped base InP/InGaAs HBTs for high-speed and microwave applications.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121141701","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Surfactant-mediated molecular-beam epitaxy of highly-strained III-V semiconductor heterostructures 表面活性剂介导的高应变III-V型半导体异质结构的分子束外延
É. Tournié, K. Ploog, N. Grandjean, J. Massies
The epitaxial growth of strained-layer heterostructures (SLHs) is currently under intense investigation, driven by the desire to obtain new physical properties different from those of the individual constituents of the structure. Much work is directed toward controlling the epitaxial morphology, i.e. the growth mode, of strained layers because this eventually governs the properties of SLHs. Surfactant-mediated molecular-beam epitaxy (SM-MBE) is a technique recently developed to face this challenge. We summarize the main results achieved with this approach in the field of III-V SLHs.<>
应变层异质结构(SLHs)的外延生长目前正受到强烈的研究,这是由于人们希望获得不同于结构单个成分的新物理性质。许多工作都是针对控制外延形貌,即应变层的生长模式,因为这最终决定了SLHs的性质。表面活性剂介导的分子束外延(SM-MBE)是最近发展起来的一种技术来应对这一挑战。我们总结了该方法在III-V级SLHs领域取得的主要成果。
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引用次数: 1
InP islands on GaAs substrates: MOCVD growth of quantum-sized structures GaAs衬底上的InP岛:量子尺寸结构的MOCVD生长
C. Reaves, V. Bressler-Hill, M. Krishnamurthy, S. Varma, P. Petroff, W. Weinberg, S. Denbaars
The growth of InP on InGaP/GaAs(001) by metalorganic chemical vapor deposition (MOCVD) has been studied by atomic force microscopy (AFM), transmission electron microscopy (TEM), and photoluminescence (PL). Islands with irregular dimensions on the growth surface but with uniform height are observed at low coverages. With increasing coverages, uniform coherent islands are observed with a dramatic increase in height. An appreciable density of large dislocated islands become evident at still higher coverages. Photoluminescence from these structures is discussed.<>
采用原子力显微镜(AFM)、透射电镜(TEM)和光致发光(PL)等研究了金属有机化学气相沉积(MOCVD)在InGaP/GaAs(001)上生长InP的过程。在低覆盖度处观察到生长表面尺寸不规则但高度均匀的岛屿。随着覆盖率的增加,可以观察到高度急剧增加的均匀连贯的岛屿。在更高的覆盖率上,可以明显地看到大型错位岛屿的明显密度。讨论了这些结构的光致发光。
{"title":"InP islands on GaAs substrates: MOCVD growth of quantum-sized structures","authors":"C. Reaves, V. Bressler-Hill, M. Krishnamurthy, S. Varma, P. Petroff, W. Weinberg, S. Denbaars","doi":"10.1109/ICIPRM.1994.328306","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328306","url":null,"abstract":"The growth of InP on InGaP/GaAs(001) by metalorganic chemical vapor deposition (MOCVD) has been studied by atomic force microscopy (AFM), transmission electron microscopy (TEM), and photoluminescence (PL). Islands with irregular dimensions on the growth surface but with uniform height are observed at low coverages. With increasing coverages, uniform coherent islands are observed with a dramatic increase in height. An appreciable density of large dislocated islands become evident at still higher coverages. Photoluminescence from these structures is discussed.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115254897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Physics and behavior of asymmetrically recessed InP-based MODFET's fabricated with an electron beam resist process 电子束抗蚀剂制备非对称凹槽inp基MODFET的物理特性和性能
D.G. Ballegeer, I. Adesida, C. Caneau, R. Bhat
Despite their superior high frequency performance, InAlAs/InGaAs modulation-doped field effect transistors (MODFETs) consistently exhibit high output conductances and low gain-to-drain breakdown voltages. Two main cap designs have been used when fabricating these devices to improve these characteristics. The first design is the use of an undoped or depleted cap which has the adverse effect of increasing both the drain and the source resistances. In order to preserve the high frequency characteristic of these devices, an alternate design, often called a "double-recess" design, may be used. This design features a wide recess trench in a doped cap which extends farther on the drain side of the gate than on the source side and is therefore asymmetric about the gate. This has the advantage of preserving a low source resistance while increasing the drain resistance to the desired value. However, this design often requires a separate lithography step to define the asymmetric recess trench. Previously, a unique electron beam process was developed and presented which is to date the only reported process which enables both the asymmetric recess to be made and a submicron T-shaped gate to be metallized in a single lithography step. The process, which utilizes multiple layers of electron beam resist, allows a great deal of control of the extent of the cap recess on the drain side of the gate without the need for an alignment between two separate lithography steps. In this paper, MODFETs are fabricated on OMVPE-grown InAlAs/InGaAs structure both with and without the use of this electron beam resist process in order to investigate the effects of asymmetric recess on device performance. The DC and high frequency characteristics of these devices are reported as a function of the extent of the gate recess toward the drain. Values for the small-signal equivalent circuit model elements extracted from high frequency S-parameter measurements are also presented.<>
尽管具有优异的高频性能,InAlAs/InGaAs调制掺杂场效应晶体管(modfet)始终表现出高输出电导和低增益-漏极击穿电压。在制造这些装置时,使用了两种主要的帽设计来改善这些特性。第一种设计是使用未掺杂或耗尽的帽,这会增加漏极和源极电阻的不利影响。为了保持这些器件的高频特性,可以使用另一种设计,通常称为“双凹槽”设计。这种设计的特点是在掺杂帽中有一个宽的凹槽沟槽,它在栅极的漏极侧比源极侧延伸得更远,因此在栅极上是不对称的。这样做的优点是在保持低源电阻的同时将漏极电阻增加到所需值。然而,这种设计通常需要单独的光刻步骤来定义不对称凹槽沟槽。此前,一种独特的电子束工艺被开发并提出,这是迄今为止唯一报道的工艺,可以在单个光刻步骤中制造不对称凹槽和亚微米t形栅极。该工艺利用多层电子束抗蚀剂,可以对栅极漏极侧的凹槽进行大量控制,而无需在两个单独的光刻步骤之间进行校准。本文分别在omvpe生长的InAlAs/InGaAs结构上制备了modfet,研究了不对称凹槽对器件性能的影响。据报道,这些器件的直流和高频特性是栅极凹槽向漏极方向延伸的函数。给出了从高频s参数测量中提取的小信号等效电路模型元件的值。
{"title":"Physics and behavior of asymmetrically recessed InP-based MODFET's fabricated with an electron beam resist process","authors":"D.G. Ballegeer, I. Adesida, C. Caneau, R. Bhat","doi":"10.1109/ICIPRM.1994.328237","DOIUrl":"https://doi.org/10.1109/ICIPRM.1994.328237","url":null,"abstract":"Despite their superior high frequency performance, InAlAs/InGaAs modulation-doped field effect transistors (MODFETs) consistently exhibit high output conductances and low gain-to-drain breakdown voltages. Two main cap designs have been used when fabricating these devices to improve these characteristics. The first design is the use of an undoped or depleted cap which has the adverse effect of increasing both the drain and the source resistances. In order to preserve the high frequency characteristic of these devices, an alternate design, often called a \"double-recess\" design, may be used. This design features a wide recess trench in a doped cap which extends farther on the drain side of the gate than on the source side and is therefore asymmetric about the gate. This has the advantage of preserving a low source resistance while increasing the drain resistance to the desired value. However, this design often requires a separate lithography step to define the asymmetric recess trench. Previously, a unique electron beam process was developed and presented which is to date the only reported process which enables both the asymmetric recess to be made and a submicron T-shaped gate to be metallized in a single lithography step. The process, which utilizes multiple layers of electron beam resist, allows a great deal of control of the extent of the cap recess on the drain side of the gate without the need for an alignment between two separate lithography steps. In this paper, MODFETs are fabricated on OMVPE-grown InAlAs/InGaAs structure both with and without the use of this electron beam resist process in order to investigate the effects of asymmetric recess on device performance. The DC and high frequency characteristics of these devices are reported as a function of the extent of the gate recess toward the drain. Values for the small-signal equivalent circuit model elements extracted from high frequency S-parameter measurements are also presented.<<ETX>>","PeriodicalId":161711,"journal":{"name":"Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"200 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115718474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
期刊
Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM)
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