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Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442)最新文献

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MOS implementation of oscillatory neural Ellias-Grossberg model 振荡神经Ellias-Grossberg模型的MOS实现
G. A. Bahgat, A. M. Mahmoud, S. Mashali, A. Salama
The oscillatory neural networks are kind of networks that try to model the behavior of the biological neurons in the part of the nervous system responsible of the vision processing. These networks are developing fast in the applications of image processing. Although they consume a lot of processing time by computer simulations, their implementation on integrated circuit is still in the early stages. We develop a MOS transistor circuit that implements Ellias-Grossberg (EG) oscillatory model. This development came on three stages: the behavioral simulation stage, the pre-circuit level stage and the transistor level implementation stage. The behavior of the three levels of implementation is compared.
振荡神经网络是一种试图模拟神经系统中负责视觉处理的生物神经元行为的网络。这些网络在图像处理中的应用发展迅速。虽然通过计算机模拟需要耗费大量的处理时间,但在集成电路上的实现仍处于初级阶段。我们开发了一个MOS晶体管电路,实现了Ellias-Grossberg (EG)振荡模型。这一发展经历了三个阶段:行为模拟阶段、预电路阶段和晶体管级实现阶段。比较了三个层次实现的行为。
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引用次数: 0
Analysis and design of low-voltage CMOS current memory cells using switched current techniques 采用开关电流技术的低压CMOS电流存储单元的分析与设计
Y. Aki, M. El-Sayed, A. K. Aboul-Seoud
This paper presents a detailed temporal analysis of two-step switched current (S/sup 2/I) memory cells. Also, a new design of an SI current copier operating with a single 1V supply is presented. The analysis and design are supported and validated by SPICE simulations using 0.25 /spl mu/m CMOS process parameters.
本文对两步开关电流(S/sup 2/I)存储单元进行了详细的时序分析。此外,本文还提出了一种单电源1V的SI电流复制器的新设计。采用0.25 /spl μ m CMOS工艺参数的SPICE仿真验证了分析和设计的正确性。
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引用次数: 1
A logic CMOS compatible Flash EEPROM for small scale integration 用于小规模集成的逻辑CMOS兼容闪存EEPROM
M. Shalchian, S. M. Atarodi
A single-poly floating gate non volatile memory cell is presented. In this device the second poly layer is removed to make the device compatible with standard logic CMOS process. An array of cells with high storage density has been fabricated on a standard 0.25 /spl mu/m CMOS process with a special architecture. All memory cells tolerate 60000 cycles of endurance test and show 10 years of data retention. Using this cell, a small to medium size (typically 64 K*8b) Flash EEPROM array would be integrated in standard logic CMOS process.
提出了一种单聚浮栅非易失性存储单元。在该器件中,为了使器件与标准逻辑CMOS工艺兼容,将第二多晶硅层去除。采用标准的0.25 /spl μ m CMOS工艺,采用特殊的结构,制备了具有高存储密度的电池阵列。所有的记忆单元都能承受60000次的耐久性测试,并能保持10年的数据。使用该单元,一个小到中等尺寸(通常为64k *8b)的闪存EEPROM阵列将集成在标准逻辑CMOS工艺中。
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引用次数: 4
A study on the characteristic of UV curved die-attach films in stack CSP (Chip Scale Package) 层叠CSP(芯片级封装)中UV弯曲模贴膜特性的研究
C. Chung, S. Fu, T. Lin, A. Lu, M. Ho, D. Kuo, S. Chou
In this paper, a study on the relationship between UV cured die-attach film (UVDAF) characterizes, process design, and the failure mechanism of reliability test were reported. The novelty films were a multifunctional tape, which consists of the function for dicing tape and die bonding tape. It focused on investigation of the behavior under the JEDEC level 3 precondition conditions, pressure cook test (PCT) and thermal cycle test (TCT). Besides, the paper discusses the thermal history effect on the chemical stability of UVDAF for the reliability issue. For instance, initial crosslinkage temperature of UVDAF affect on effectually contact area after the die-mount process. The cure kinetic and thermal resistances of the UVDAF were analyzed by Differential Scanning Calorimetry (DSC) and Thermo gravimetric Analysis (TGA). The delamination surfaces were analysis by Scanning Acoustic Tomograph (SAT), Cross-section were scanned by electronic microscopy (SEM) and Optical Microscope (OM). The thermo-deformation and pressure-induced flow behaviors of UVDAF were evaluated by both penetration mode in Thermal Mechanical Analyzers (TMA) and dynamic mode in rheology test, respectively. Furthermore, OM and SEM results revealed that the chemical stability of UVDAF in process, from die-mount to molding, affect the final effectually adhesive area that obviously influenced the quality of stack CSP reliability.
本文研究了UV固化模贴膜(UVDAF)的特性、工艺设计与可靠性试验失效机理之间的关系。该新型薄膜是一种多功能胶带,具有切片胶带和粘模胶带的功能。重点研究了JEDEC 3级前置条件、压力烹饪试验(PCT)和热循环试验(TCT)下的性能。此外,针对UVDAF的可靠性问题,讨论了热历史对其化学稳定性的影响。例如,UVDAF的初始交联温度对模装后的有效接触面积有影响。采用差示扫描量热法(DSC)和热重分析法(TGA)分析了UVDAF的固化动力学和热阻。采用扫描声层析仪(SAT)对脱层表面进行了分析,并用电子显微镜(SEM)和光学显微镜(OM)对其进行了截面扫描。通过热力学分析仪(TMA)的渗透模式和流变试验的动态模式分别对UVDAF的热变形和压力诱导流动行为进行了评估。此外,OM和SEM结果表明,从模装到成型过程中,UVDAF的化学稳定性影响最终的有效粘接面积,从而明显影响堆叠CSP的质量可靠性。
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引用次数: 6
Analysis of direct cover algorithms for minimization of MVL functions 最小化MVL函数的直接覆盖算法分析
M. Abd-El-Barr, L. Al-Awami
There exist a number of algorithms for minimization of MVL functions. The main objective is to produce near minimal expressions for MVL functions at an affordable cost (measured in terms of CPU time). Among the proposed heuristic-based techniques, direct cover-based techniques have received the most attention. In this paper, we analyze two of the existing direct cover techniques in terms of the number of implicants needed to synthesize a given function. We introduce five modified techniques and analyze them as well. An overall comparison is conducted among the existing and the proposed techniques. The analysis is based on performance measures of these techniques for 50,000 2-variable 4-valued and 21,000 2-variable 5-valued randomly selected functions. The analysis shows that algorithm DM/spl I.bar/MIN-2 outperforms all other considered algorithms. The algorithm introduced by Besslich is outperformed by all considered algorithms.
存在许多最小化MVL函数的算法。主要目标是以可承受的成本(以CPU时间衡量)为MVL函数生成接近最小的表达式。在提出的基于启发式的技术中,直接基于覆盖的技术受到了最多的关注。在本文中,我们根据合成给定函数所需的隐含数来分析现有的两种直接覆盖技术。介绍了五种改进技术,并对其进行了分析。对现有的技术和提出的技术进行了全面的比较。分析是基于这些技术对50,000个2变量4值和21,000个2变量5值随机选择函数的性能度量。分析表明,算法DM/spl I.bar/MIN-2优于所有其他考虑的算法。Besslich引入的算法优于所有考虑的算法。
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引用次数: 12
Design of a new CMOS output buffer with low switching noise 一种新型低开关噪声CMOS输出缓冲器设计
L. Yang, J. Yuan
In this paper, a new CMOS output buffer with low switching noise and load adaptability is presented. Instead of using current source, the current limiter is proposed to reduce switching noise and the static power dissipation. The output ringing is lowered by automatically turning off one driving stage near the end of the output transition. Compared with the previous designs, the proposed buffer has less switching noise and optimized output ringing and speed. Without the feedback control circuit, the proposed method is simple and easy to be implemented.
本文提出了一种具有低开关噪声和负载适应性的CMOS输出缓冲器。采用限流器代替电流源,降低了开关噪声和静态功耗。通过在输出过渡结束时自动关闭一个驱动级来降低输出振铃。与以往的设计相比,该缓冲器具有更小的开关噪声和优化的输出振铃和速度。该方法不需要反馈控制电路,操作简单,易于实现。
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引用次数: 8
Gm-C complex transitional filter for low-IF wireless LAN application Gm-C复合过渡滤波器低中频无线局域网应用
T. Teo, E. Khoo, D. Uday
The design and implementation of a gm-C complex filter for low-IF WLAN is described. Fifth-order transitional complex Bessel-Chebyshev filter is implemented to compromise between high attenuation and low group-delay variation. The circuit is fabricated using 0.18 /spl mu/m CMOS process. Measured results show that the filter provides 30 dB to 40 dB image rejection and 18 dB adjacent channel rejection, while keeping a low group-delay variation of below 6.0ns within the pass-band. High frequency and wide bandwidth filter also requires stringent design specification of the circuitries. Differential inverter transconductor is optimized for this gm-C continuous-time filter design. The complete filter including on-chip tuning circuit and bandgap consumes only 7.5 mA with 1.8 V single supply voltage.
介绍了一种用于低中频WLAN的gm-C复合滤波器的设计与实现。实现了五阶过渡复贝塞尔-切比雪夫滤波器,兼顾了高衰减和低群延迟变化。电路采用0.18 /spl μ m CMOS工艺制作。测量结果表明,该滤波器具有30 ~ 40 dB的图像抑制和18 dB的相邻通道抑制,同时在通频带内保持低于6.0ns的低群延迟变化。高频宽频带滤波器对电路的设计也有严格的要求。差分逆变器的晶体管是优化这种gm-C连续时间滤波器设计。包括片上调谐电路和带隙在内的完整滤波器在1.8 V单电源电压下仅消耗7.5 mA。
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引用次数: 7
A SPICE model of a thyristor with high injection effects and conductivity modulation 具有高注入效应和电导率调制的晶闸管的SPICE模型
Gihan, Sayah, Abdel Halim A. Zekry, Hani F. Ragaie, Fouad A. Soliman
In this work a new SCR model is developed by applying the Gummel-Poon circuit model to the two-transistor configuration. This model naturally takes into consideration the high injection effects. Conductivity modulation is taken into consideration by using nonlinear current sources. The model parameters are defined and extracted according to a new methodology. The simulation results are compared with the measured results. The developed model satisfactorily describes the performance of the thyristor under practical operating conditions.
本文将Gummel-Poon电路模型应用于双晶体管结构,建立了一个新的可控硅模型。该模型自然考虑了高注入效应。采用非线性电流源进行电导率调制。根据一种新的方法对模型参数进行了定义和提取。仿真结果与实测结果进行了比较。所建立的模型令人满意地描述了晶闸管在实际工作条件下的性能。
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引用次数: 4
Recent trends in hardware/software description languages 硬件/软件描述语言的最新趋势
E. Aboulhamid, J. Lapalme
In this work. we review the evolution of hardware description languages. We describe the recent needs concerning platform based design. the challenges of the introduction of intellectual property block, the ever increasing part of software components in a digital systems and its impact on the evolution of modeling capabilities. We review the features of object oriented methodologies in dealing with these challenges and in providing design reuse capabilities as well as safe-modeling of hardware/software systems.
在这项工作中。我们回顾了硬件描述语言的发展。我们描述了基于平台的设计的最新需求。引入知识产权块的挑战,数字系统中不断增加的软件组件部分及其对建模能力演变的影响。我们回顾了面向对象方法在应对这些挑战、提供设计重用能力以及硬件/软件系统安全建模方面的特点。
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引用次数: 3
A new small-signal model of the dual-gate GaAs MESFET 一种新的双栅GaAs MESFET小信号模型
M. Ibrahim, B. Syrett, J. Bennett
A new small-signal model of the dual-gate GaAs MESFET (DGFET) is described. The model does not deal with the DGFET as a cascode connection of two single-gate FET (SGFET) parts but as a four-port device. The model parameters are extracted directly from the measured s-parameters. The new small-signal model is tested on sixteen devices at many bias conditions over the frequency range 0.5-26.5 GHz. The calculated S-parameters using the new small-signal model show very good agreement with the measured data.
介绍了一种新的双栅GaAs MESFET (DGFET)小信号模型。该模型不将DGFET作为两个单栅FET (SGFET)部件的级联连接处理,而是作为四端口器件处理。模型参数直接从测量的s参数中提取。在0.5-26.5 GHz的频率范围内,在16个设备上测试了新的小信号模型。用小信号模型计算的s参数与实测数据吻合良好。
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引用次数: 1
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Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442)
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