Microelectronic Engineering最新文献

High density nanofluidic channels were successfully fabricated by a novel process, nicknamed as self-sealing process, for the detection of metal nanoparticles dispersed in water using color changes excited by polarized electromagnetic waves. The permittivities of aqueous solutions with various concentrations of metal nanoparticles were calculated by a corrected plasma model. Systematic simulations using finite difference time domain method were carried out in investigating the detection capabilities of the nanofluidic channels for silver, beryllium and copper nanoparticles in water. The pronounced color shifts indicates that the channels possess high sensitivity in the metal nanoparticles detection. The designed nanofluidic channels were then fabricated by a direct flood deposition of a silica film on a pre-replicated hydrogen silsesquioxan (HSQ) grating using electron beam lithography (EBL). The self-sealing technique possesses advantages in simplified processing, encapsulation free and potential of multi-layer nanochannels.

Backside Power Delivery Network (BSPDN) is a crucial technology for integrated circuits at sub-3 nm technology nodes. The primary challenge resides in utilizing nano through silicon via (nano-TSV) to establish connections between the backside power network and buried power rails, thereby facilitating transistor powering. The key technology is to ensure a smooth sidewall morphology and prevent damage to buried power rails (BPR) due to over-etching. In this study, non-Bosch and Bosch techniques are compared using simulation. The results demonstrate that while the non-Bosch technique yields smooth sidewalls, it inevitably leads to over-etching, whereas Bosch effectively avoids over-etching. The etching of scallop-free nano-TSV is achieved by optimizing the Bosch process, which involves the use of inductively coupled plasma (ICP). Finally, metal filling of nano-TSV is successfully achieved. Thus, the nano-TSV etching method is established as viable for BSPDN.

In response to the urgent imperative of combating global warming and advancing sustainable energy solutions, an innovative approach has emerged, capitalizing on bicycles and road bike lane infrastructure. This solution integrates a Smart Lithium Battery Charging System with a Sustainable Energy Harvesting Pad (SEHP) designed for cyclists. The SEHP harnesses piezoelectric energy from mechanical vibrations and kinetic energy from lightweight vehicles. It produces clean, renewable electricity as an alternative to traditional power sources. Comprehensive assessments of the SEHP's energy generation performance at various proficiency levels have revealed impressive capabilities. An electronic emulator system is developed to support academic and research communities, simulating scenarios on bike lanes to efficiently charge 36.36 Wh lithium batteries at various cycling proficiency levels. The study involved specific circuit design, seamless integration with the custom Smart Lithium Battery Charging System, and optimization using Microcontroller hardware and software solutions. Practical prototypes verified the emulator's functionality and real-world applicability, making it an authentic replica of the SEHP's outcomes. This innovative technology enhances our understanding of SEHP and enables comparative analysis against other energy sources, contributing to a more sustainable future.

This paper presents a low-profile wide scan angle multibeam conformal antenna array system with a novel feeding network for $28$ GHz mm-wave 5G applications. The proposed antenna system utilizes two conventional branch-line couplers as its beamforming network. A novel feeding technique is applied to generate $7$ beams with these couplers that are usually capable of generating $2$ beams. The proposed solution provides a wide scanning range with a minimum realized gain of $5$ dBi from $-{90}^{°}$ to ${90}^{°}$ owing to this feeding approach and the peculiar placement of the array elements on a $0.15$ mm thick R-F775 bendable substrate. The generated beams at their steer direction have the minimum and maximum gain values of $6.5$ dBi and $9.7$ dBi, respectively. A low-cost PCB manufacturing technique based on soft lithography and wet etching is used. The system dimensions excluding extra connector sections are $67\times 15\times 3{\mathrm{mm}}^3$. The proposed flexible design is suitable for lightweight 5G communication systems and handsets with its compact low-complexity beamforming network, and wide ${180}^{°}$ continuous covering angle.

Control of surface molecular contamination (SMC) for components used in chemical vapor deposition (CVD), atomic layer deposition (ALD) and EUV photolithography is important to maintaining high yield and optimal tool operation at the latest process nodes in leading edge semiconductor manufacturing. High temperature thermal desorption spectroscopy (TDS) is a versatile tool for analyzing the cleanliness of surfaces, simulating thermal vacuum processes and studying the kinetics of desorption processes. A basic analysis of TD spectra allows for full characterization of volatile outgassing from surfaces, while detailed analysis can provide chemical information about the substrate surface.

In fundamental studies, TDS is often carried out from low temperatures to room temperature or for small samples. However, for microelectronics applications, high temperature studies of large (100 mm or greater) samples are of greater interest due to direct applications for cleanliness testing and thermal vacuum simulation. A limitation for TDS sensitivity is the outgassing of sample stage materials, particularly when analyzing gases that may be present in the chamber background such as water, CO and CO₂. Typical sample stages are often tested only for total pressure or at room temperature.

In this study, we present a simple ultra-high vacuum (UHV) compatible sample heating stage for trace outgassing analysis of 100 mm samples at high temperatures. Simulation results are presented to support the feasibility of the concept. Experimental results verify the cleanliness of the stage via room temperature residual gas analysis (RGA) analysis and X-ray photoelectron spectroscopy (XPS) of stage components. Finally, use of this stage in a TDS analysis of a 100 mm Si witness wafer and comparison to room temperature RGA demonstrates operational capability.

The sample heating stage is both shown to be clean at high temperature and capable of analyzing 100 mm wafers to higher sensitivity than room temperature RGA for all m/z at the 1 × 10⁻⁹ mbar level. Despite its high performance, the heating stage is also easily produced by any laser machining service, greatly improving the accessibility of UHV science for all researchers.

The new radiator incorporated with nanocomposites improve radiation characteristics of nonagon shaped antenna. The design comprise two nanocomposite materials loaded in slots that separately enhance lower and upper band radiation. The CPW antenna consists of nonagon shaped ring with heptagon radiating element that consists of inverted U and rigid shaped slots. The longer slot has been deliberately chosen to accommodate mid-frequency of two resonance frequencies and shorter slot isolates surface current distributed along radiating patch, left and right side. The Poly (3, 4 ethyelene dioxythiophene): Polystyrene Sulfonate-Silver nanowire (PEDOT:PSS-AgNW) nanocomposite filled in shorter slot improves gain, bandwidth and return loss of upper band, magnetite - Polyaniline (Fe₃O₄-PANI) filled in longer slot enhance lower band. The measured result proved to improve bandwidth, gain, radiation efficiency and polarization of lower, upper band. The flexible attributes of radiator studied extensively by wearable application by placing them on wrist and jeans. The fabricated antenna produce a bandwidth of 2.12–3.29 GHz in lower band, 4.51–6.00 GHz in upper band for 2.40/5.20/5.80 GHz WLAN, 2.50/5.50 GHz WiMAX, 2.40/4.90/5.20/5.50/5.80 GHz WiFi, 5G SUB-6 GHz and ISM bands.