Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546455
D. Ishikawa, H. Nakako, Yuki Kawana, Chie Sugama, Motohiro Negishi, Y. Ejiri, Suguru Ueda, B. An, H. Wurst, B. Leyrer, T. Blank, Marc Weber
this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressure less in 100% H2 or under pressure in 100% N2 atmospheres. The as-sintered density, thermal conductivity and resistivity of pressure less-sintered Cu (in 100% H2, 300 °C, 1 h) is found to be 7S%, 180 Wm^-1K^-1 and 4.3 $muOmegacdot cm$, respectively. The pressurelesssintered Cu has higher 0.2% proof stress than the pressure-sintered Ag (sintered density =87%, in air, 300 °C 10 MPa, 10min) as a comparison material in a three-point bending test. The die-shear strength of appropriate pressurelesssintered Cu on four different metal adherends (Cu, Ni, Ag and Au) was 30 MPa or higher. The die-shear strength of pressure- sintered Cu in 100% N2 was 36 MPa or higher. A thermal cycle tolerance of 1000 cycles or greater was shown in a power device test package which was bonded using the pressurelesssintered Cu and encapsulated with an epoxy molding compound. The Cu sinter paste can be used as a reliable die-bonding material for power modules operating at high temperatures.
本文介绍了高温功率器件用铜(Cu)模压烧结浆料的烧结性能和键合性能。铜膏体的烧结压力在100℃以下% H2 or under pressure in 100% N2 atmospheres. The as-sintered density, thermal conductivity and resistivity of pressure less-sintered Cu (in 100% H2, 300 °C, 1 h) is found to be 7S%, 180 Wm^-1K^-1 and 4.3 $muOmegacdot cm$, respectively. The pressurelesssintered Cu has higher 0.2% proof stress than the pressure-sintered Ag (sintered density =87%, in air, 300 °C 10 MPa, 10min) as a comparison material in a three-point bending test. The die-shear strength of appropriate pressurelesssintered Cu on four different metal adherends (Cu, Ni, Ag and Au) was 30 MPa or higher. The die-shear strength of pressure- sintered Cu in 100% N2 was 36 MPa or higher. A thermal cycle tolerance of 1000 cycles or greater was shown in a power device test package which was bonded using the pressurelesssintered Cu and encapsulated with an epoxy molding compound. The Cu sinter paste can be used as a reliable die-bonding material for power modules operating at high temperatures.
{"title":"Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties","authors":"D. Ishikawa, H. Nakako, Yuki Kawana, Chie Sugama, Motohiro Negishi, Y. Ejiri, Suguru Ueda, B. An, H. Wurst, B. Leyrer, T. Blank, Marc Weber","doi":"10.1109/ESTC.2018.8546455","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546455","url":null,"abstract":"this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressure less in 100% H2 or under pressure in 100% N2 atmospheres. The as-sintered density, thermal conductivity and resistivity of pressure less-sintered Cu (in 100% H2, 300 °C, 1 h) is found to be 7S%, 180 Wm^-1K^-1 and 4.3 $muOmegacdot cm$, respectively. The pressurelesssintered Cu has higher 0.2% proof stress than the pressure-sintered Ag (sintered density =87%, in air, 300 °C 10 MPa, 10min) as a comparison material in a three-point bending test. The die-shear strength of appropriate pressurelesssintered Cu on four different metal adherends (Cu, Ni, Ag and Au) was 30 MPa or higher. The die-shear strength of pressure- sintered Cu in 100% N2 was 36 MPa or higher. A thermal cycle tolerance of 1000 cycles or greater was shown in a power device test package which was bonded using the pressurelesssintered Cu and encapsulated with an epoxy molding compound. The Cu sinter paste can be used as a reliable die-bonding material for power modules operating at high temperatures.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125877692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546508
Zaineb Jebri, I. B. Majek, C. Delafosse, Y. Ousten
An adjustable capacitor generally consists in a stator and a rotor. The stator is made of the dielectric tube and the fixed electrode which is affixed in the outer. The rotor is the conductive body that acts as the variable electrode, and it moves axially in the housing. Furthermore, this entire structure is held together with a combination of screws, clips, soldering and other connection mechanisms. As a composed component, manufacturing time and cost increase. These capacitors are made for sharp domains that require their own conditions. These constraints need additional steps in the manufacturing process and increase the percentage of device failures, so this also drives down the profitability of the process.In order to create a new range of non-magnetic trimmers (adjustable capacitors) more performant to meet the Nuclear magnetic resonance (NMR) requirements, as MRI (Magnetic Resonance Imaging) applications, electrical modeling is an important step to improve empirical research results so to provide a high level of quality and to reduce manufacturing time and cost while.In this context ANSYS is used to design innovative electromechanical devices, simulate electrostatic performance of the component and then estimate a large number of trimmer parameters (material properties, capacitance value, breakdown voltage) and anticipate critical electrical effects (corona, point and edge effects).
{"title":"Electrical modeling approach and manufacturing of a new adjustable capacitor for medical applications","authors":"Zaineb Jebri, I. B. Majek, C. Delafosse, Y. Ousten","doi":"10.1109/ESTC.2018.8546508","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546508","url":null,"abstract":"An adjustable capacitor generally consists in a stator and a rotor. The stator is made of the dielectric tube and the fixed electrode which is affixed in the outer. The rotor is the conductive body that acts as the variable electrode, and it moves axially in the housing. Furthermore, this entire structure is held together with a combination of screws, clips, soldering and other connection mechanisms. As a composed component, manufacturing time and cost increase. These capacitors are made for sharp domains that require their own conditions. These constraints need additional steps in the manufacturing process and increase the percentage of device failures, so this also drives down the profitability of the process.In order to create a new range of non-magnetic trimmers (adjustable capacitors) more performant to meet the Nuclear magnetic resonance (NMR) requirements, as MRI (Magnetic Resonance Imaging) applications, electrical modeling is an important step to improve empirical research results so to provide a high level of quality and to reduce manufacturing time and cost while.In this context ANSYS is used to design innovative electromechanical devices, simulate electrostatic performance of the component and then estimate a large number of trimmer parameters (material properties, capacitance value, breakdown voltage) and anticipate critical electrical effects (corona, point and edge effects).","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125939386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546488
V. Osipova, B. Wunderle, J. Arnold, J. Heilmann, T. Mahanta
In this paper we summarize extensive literature review on the fatigue of thin metal films. Additionally we describe our custom-made set-up for isothermal mechanical cycling of thin films on cantilever-like reflective substrates. The device is made for in-resonance testing in the frequency ranges from 10 Hz to 1000 Hz and allows detection of failure by shift in stiffness of the sample.
{"title":"Accelerated Vibrational Fatigue Testing of Thin Aluminum and Copper Films at Different Temperatures","authors":"V. Osipova, B. Wunderle, J. Arnold, J. Heilmann, T. Mahanta","doi":"10.1109/ESTC.2018.8546488","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546488","url":null,"abstract":"In this paper we summarize extensive literature review on the fatigue of thin metal films. Additionally we describe our custom-made set-up for isothermal mechanical cycling of thin films on cantilever-like reflective substrates. The device is made for in-resonance testing in the frequency ranges from 10 Hz to 1000 Hz and allows detection of failure by shift in stiffness of the sample.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128707560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546397
Masashi Okaniwa, Takenori Takiguchi, Kohei Higashiguchi, Takahito Sekido, K. Ihara, Tsuyoshi Kida, Shuuji Yoshida, T. Oshima
TCB (Thermal Compression Bonding) process with NCF (Non Conductive Film) is expected as an effective solution for fine pitch applications brought by the progress of IoT (Internet of Things), however the production volume is limited to small level because of its expensive assembly cost. To mitigate the cost impact, some multiple die bonding methods are being introduced by many players. So far, several NCFs were evaluated for these bonding processes, unfortunately, it is becoming clear that approaches coupled with conventional thermosetting resin compositions are very difficult to achieve required process-ability of the bonding processes due to miss-match between reactivity of the resins and process conditions. That is why the new type of pre-applied under-fill material specialized for multiple die bonding process was desired in the market and has been developed in this study. The developed NCF was designed to survive long time thermal exposure on a bonding stage of TCB bonder so that multiple die bonding such as collective bonding could be successfully performed with enough process margin. To achieve the target specifications, this study has started with the design of new resin composition applied to the developed NCF. Finally, TCB was demonstrated with the developed NCF and it was confirmed that reliable solder joints were formed and no abnormality was observed even after 180mins thermal exposure at 130degC on the bonding stage. Moreover, the developed NCF showed good insulation reliability in HAST. The final reliability tests on package level are ongoing and the results will be visible in no time.
{"title":"Novel Pre-applied Under-fill Material Specialized for Multiple Die Bonding Process","authors":"Masashi Okaniwa, Takenori Takiguchi, Kohei Higashiguchi, Takahito Sekido, K. Ihara, Tsuyoshi Kida, Shuuji Yoshida, T. Oshima","doi":"10.1109/ESTC.2018.8546397","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546397","url":null,"abstract":"TCB (Thermal Compression Bonding) process with NCF (Non Conductive Film) is expected as an effective solution for fine pitch applications brought by the progress of IoT (Internet of Things), however the production volume is limited to small level because of its expensive assembly cost. To mitigate the cost impact, some multiple die bonding methods are being introduced by many players. So far, several NCFs were evaluated for these bonding processes, unfortunately, it is becoming clear that approaches coupled with conventional thermosetting resin compositions are very difficult to achieve required process-ability of the bonding processes due to miss-match between reactivity of the resins and process conditions. That is why the new type of pre-applied under-fill material specialized for multiple die bonding process was desired in the market and has been developed in this study. The developed NCF was designed to survive long time thermal exposure on a bonding stage of TCB bonder so that multiple die bonding such as collective bonding could be successfully performed with enough process margin. To achieve the target specifications, this study has started with the design of new resin composition applied to the developed NCF. Finally, TCB was demonstrated with the developed NCF and it was confirmed that reliable solder joints were formed and no abnormality was observed even after 180mins thermal exposure at 130degC on the bonding stage. Moreover, the developed NCF showed good insulation reliability in HAST. The final reliability tests on package level are ongoing and the results will be visible in no time.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132463246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546393
D. Epp, G. Storeck, S. Vogelgesang, M. Sivis, S. Schafer, C. Ropers
We report the development of an ultrafast miniaturized pulsed electron gun for the implementation of timeresolved low-energy electron diffraction. This electron gun consists of a nanotip photocathode and an einzel lens for beam collimation. Assembly and electrical contacting of the gun is achieved in a multistep process involving photolithography and focused-ion-beam etching. First applications in a backscattering geometry were demonstrated with a temporal resolution of 1 ps at an electron energy of 80 eV.
{"title":"Ultrafast miniaturized pulsed electron gun for timeresolved surface measurements","authors":"D. Epp, G. Storeck, S. Vogelgesang, M. Sivis, S. Schafer, C. Ropers","doi":"10.1109/ESTC.2018.8546393","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546393","url":null,"abstract":"We report the development of an ultrafast miniaturized pulsed electron gun for the implementation of timeresolved low-energy electron diffraction. This electron gun consists of a nanotip photocathode and an einzel lens for beam collimation. Assembly and electrical contacting of the gun is achieved in a multistep process involving photolithography and focused-ion-beam etching. First applications in a backscattering geometry were demonstrated with a temporal resolution of 1 ps at an electron energy of 80 eV.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123010653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546490
Han He, Xiaochen Chen, O. Mokhtari, H. Nishikawa, L. Ukkonen, J. Virkki
In this study, antennas for passive UHF RFID tags were created from a carbon-based stretchable conductor on a stretchable elastic band by brush-painting. The antennamicrochip interconnections were fabricated by two different ways: 1) by using already commonly reported gluing with conductive silver epoxy and 2) by sewing the IC with conductive yarn. In addition to wireless evaluation of the fabricated RFID tags before and after stretching, we evaluated the effects of the interconnection type on tag performance and reliability. The achieved read ranges of around 1.5 meters are suitable for versatile textile-integrated RFID applications. Stretching causes permanent decrease to the tag read range but they remain functional even after 100 stretching cycles. In addition, the tags with the embroidered interconnections were found to be more reliable towards harsh stretching, compared to the tags with glued ICs. These initial results are very encouraging, considering the current trend towards more ecofriendly and cost-effective materials in electronics.
{"title":"Textile-Integrated Stretchable Structures for Wearable Wireless Platforms","authors":"Han He, Xiaochen Chen, O. Mokhtari, H. Nishikawa, L. Ukkonen, J. Virkki","doi":"10.1109/ESTC.2018.8546490","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546490","url":null,"abstract":"In this study, antennas for passive UHF RFID tags were created from a carbon-based stretchable conductor on a stretchable elastic band by brush-painting. The antennamicrochip interconnections were fabricated by two different ways: 1) by using already commonly reported gluing with conductive silver epoxy and 2) by sewing the IC with conductive yarn. In addition to wireless evaluation of the fabricated RFID tags before and after stretching, we evaluated the effects of the interconnection type on tag performance and reliability. The achieved read ranges of around 1.5 meters are suitable for versatile textile-integrated RFID applications. Stretching causes permanent decrease to the tag read range but they remain functional even after 100 stretching cycles. In addition, the tags with the embroidered interconnections were found to be more reliable towards harsh stretching, compared to the tags with glued ICs. These initial results are very encouraging, considering the current trend towards more ecofriendly and cost-effective materials in electronics.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126690258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546413
Steffen Bickel, Shawon Sen, Jörg Meyer, I. Panchenko, M. Wolf
Cu-In fine pitch interconnects are a promising approach for low-temperature technologies in 3D heterogeneous integration. With decreasing structure sizes, the solder material is consumed within little joining durations. The resulting interconnection zone completely exists of intermetallic compounds (IMCs). Due to the unqiue properties of Cu-In-IMCs the interconnection quality of Cu-In fine-pitch interconnects can be affected in a quite tremendous manner when processing conditions are altered. In this work, we address the influence of the bonding duration, the bonding pressure as well as the storage time of as-plated Cu-In microbumps prior to the bonding process.
{"title":"Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality","authors":"Steffen Bickel, Shawon Sen, Jörg Meyer, I. Panchenko, M. Wolf","doi":"10.1109/ESTC.2018.8546413","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546413","url":null,"abstract":"Cu-In fine pitch interconnects are a promising approach for low-temperature technologies in 3D heterogeneous integration. With decreasing structure sizes, the solder material is consumed within little joining durations. The resulting interconnection zone completely exists of intermetallic compounds (IMCs). Due to the unqiue properties of Cu-In-IMCs the interconnection quality of Cu-In fine-pitch interconnects can be affected in a quite tremendous manner when processing conditions are altered. In this work, we address the influence of the bonding duration, the bonding pressure as well as the storage time of as-plated Cu-In microbumps prior to the bonding process.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116690899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/estc.2018.8546380
B. Albrecht, G. Alavi, Mourad Elsobky, S. Ferwana, U. Passlack, C. Harendt, J. Burghartz
{"title":"Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems","authors":"B. Albrecht, G. Alavi, Mourad Elsobky, S. Ferwana, U. Passlack, C. Harendt, J. Burghartz","doi":"10.1109/estc.2018.8546380","DOIUrl":"https://doi.org/10.1109/estc.2018.8546380","url":null,"abstract":"","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115527787","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546411
O. Krammer, T. Hurtony
In our research the fine microstructure was compared between manganese-doped SnAgCuand traditional SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys. The composition of the manganese-doped alloys was (Sn/Ag0.3/Cu0.7/Mn-x), where x is 0.1, 0.4, 0.7% wt%Solder bumps were prepared on FR4 testboards with reflow soldering technology. After the soldering, cross-sections of the samples were prepared and were investigated by Scanning Electron Microscopy. Backscattered Electrons detector was utilised and EDX (energy-dispersive Xray spectroscopy) analysis were performed. Samples were etched with selective electrochemical etching in order to reveal the fine microstructure of the samples prepared from the conventional and from manganese-doped SAC alloys. It was found that precipitates with relatively high Mn formed in the solder joint, which can influence the mechanical properties of the solder bulk. The manganese altered the formation of Cu-Sn intermetallic compounds, which were formed in very sharp, needle-like structures Additionally, particle-type Ag3 Sn intermetallic compounds readily formed next to the Mn precipitates; they are not distributed uniformly in the solder bulk at all.
{"title":"Investigating the Fine Microstructure of Mn-doped SnAgCu Solder Alloys by Selective Electrochemical Etching","authors":"O. Krammer, T. Hurtony","doi":"10.1109/ESTC.2018.8546411","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546411","url":null,"abstract":"In our research the fine microstructure was compared between manganese-doped SnAgCuand traditional SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys. The composition of the manganese-doped alloys was (Sn/Ag0.3/Cu0.7/Mn-x), where x is 0.1, 0.4, 0.7% wt%Solder bumps were prepared on FR4 testboards with reflow soldering technology. After the soldering, cross-sections of the samples were prepared and were investigated by Scanning Electron Microscopy. Backscattered Electrons detector was utilised and EDX (energy-dispersive Xray spectroscopy) analysis were performed. Samples were etched with selective electrochemical etching in order to reveal the fine microstructure of the samples prepared from the conventional and from manganese-doped SAC alloys. It was found that precipitates with relatively high Mn formed in the solder joint, which can influence the mechanical properties of the solder bulk. The manganese altered the formation of Cu-Sn intermetallic compounds, which were formed in very sharp, needle-like structures Additionally, particle-type Ag3 Sn intermetallic compounds readily formed next to the Mn precipitates; they are not distributed uniformly in the solder bulk at all.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115744417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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