Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546350
M. Saito, J. Mizuno, Shunichi Koga, H. Nishikawa
We investigated the composition, morphology, and dissolution behavior of an Au-Ag nanoporous structure formed by electrodeposition and dealloying. Formation of the films was carried out by changing the bath composition and the annealing temperature. The amount of Ag decreased from 70 wt. % to 45–50 wt. % after dealloying. As seen from analysis by a glow discharge optical emission spectrometer (GDOES), not only the amount of Ag, but also that of Au was decreased after dealloying, and a highly concentrated Ag layer was generated at the surface. When the Ag dissolves, an underpotential deposition (UPD) might be introduced, followed by the generation of a high concentration of Ag. From the anodic polarization measurement, the anodic current densities of the samples under 1.5 V were larger than those of the samples under 1.0 V, resulting in the generation of many nanopores. It was confirmed that dealloying involved three processes: whole film dissolution (includes Au dissolution), defects dissolution at the grain boundary, and Ag-selective dissolution.
{"title":"Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying","authors":"M. Saito, J. Mizuno, Shunichi Koga, H. Nishikawa","doi":"10.1109/ESTC.2018.8546350","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546350","url":null,"abstract":"We investigated the composition, morphology, and dissolution behavior of an Au-Ag nanoporous structure formed by electrodeposition and dealloying. Formation of the films was carried out by changing the bath composition and the annealing temperature. The amount of Ag decreased from 70 wt. % to 45–50 wt. % after dealloying. As seen from analysis by a glow discharge optical emission spectrometer (GDOES), not only the amount of Ag, but also that of Au was decreased after dealloying, and a highly concentrated Ag layer was generated at the surface. When the Ag dissolves, an underpotential deposition (UPD) might be introduced, followed by the generation of a high concentration of Ag. From the anodic polarization measurement, the anodic current densities of the samples under 1.5 V were larger than those of the samples under 1.0 V, resulting in the generation of many nanopores. It was confirmed that dealloying involved three processes: whole film dissolution (includes Au dissolution), defects dissolution at the grain boundary, and Ag-selective dissolution.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128226034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546475
M. Myśliwiec, R. Kisiel
In this paper assembly techniques of monocrystalline GaN structures to DBC: sintering and hybrid: sintering + SLID are compared. As an comparison technique shear strength measurements was applied. Study was made on as-received samples, as well as structures aged in temperature above 300 °C for 500 h. Additionally metallographic cross-section of the joints were made and inspected by means of SEM and energy dispersive x-ray spectroscopy. Sintered joints are very porous and does not meet demands for assembly after long term ageing. Hybrid: sintering + SLID joints manufactured at 280 °C are far less porous and fulfil adhesion joint requirements for monocrystalline GaN assembly with excess.
{"title":"Applying Sintering and SLID Bonding for Assembly of GaN Chips Working at High Temperatures","authors":"M. Myśliwiec, R. Kisiel","doi":"10.1109/ESTC.2018.8546475","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546475","url":null,"abstract":"In this paper assembly techniques of monocrystalline GaN structures to DBC: sintering and hybrid: sintering + SLID are compared. As an comparison technique shear strength measurements was applied. Study was made on as-received samples, as well as structures aged in temperature above 300 °C for 500 h. Additionally metallographic cross-section of the joints were made and inspected by means of SEM and energy dispersive x-ray spectroscopy. Sintered joints are very porous and does not meet demands for assembly after long term ageing. Hybrid: sintering + SLID joints manufactured at 280 °C are far less porous and fulfil adhesion joint requirements for monocrystalline GaN assembly with excess.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129356491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546394
N. Subbiah, Qingming Feng, K. Ramirez, N. Feil, J. Wilde, G. Bruckner
Pressure sensors working at temperatures of about 500 °C impose new challenges in packaging due to thermal cross- sensitivity and temperature induced stresses on the package. One of the major issues is the identification of stress-tolerant sensor mounting technique with stable materials at high temperature. This research-based work will mainly focus on developing a flip-chip die attachment technique for pressure sensor assembly for applications up to 500 °C. A concept for this application was developed based on a deforming ceramic membrane. A micro- strain gauge is patterned onto a Langasite (LGS) crystal. It is attached to a ceramic substrate with a membrane (Al2O3) like a cantilever by flip-chip interconnection and glass. The deforming membrane induces a pressure dependent displacement at the free end of the cantilever. The strain produced on the cantilever is measured by the change of resistance of the microstrain gauge. This special design concept aims for the elimination of thermal stresses by having no constraints for thermal expansion at the free end of the cantilever. LGS is a well-established material for Surface Acoustic Wave (SAW) based applications. Later this resistive strain gauge could be replaced by a SAW delay line. In order to mount the sensing element like a cantilever, one side of the LGS strain gauge chip is fabricated with gold stud bumps on its contact pads. Additionally, the flip-chip attachment is underfilled with glass solder and cured at 780 °C. Due to the high process temperature and anisotropic Thermal Coefficient of Expansion (TCE) of the LGS crystal it will tend to expand. By allowing it to expand freely at one end, the potential thermal stresses developed in the package is reduced. In this paper, processes to develop high temperature stable flip-chip die attachment using stud bumps and glass solder underfill is presented. The free expansion of the LGS crystal at its free end is determined using Digital Image Correlation (DIC) technique for temperatures up to 500 °C. With the same construction, a Lithiumniobate (LN) crystal is also introduced for applications up to 300 °C. The thermal expansion behavior of the die attachment is characterized using DIC. Strength of the cantilever die attachment is measured using shear tests and results are presented.
{"title":"Flip-chip Die Attachment for High-temperature Pressure Sensor Packages up to 500 °C","authors":"N. Subbiah, Qingming Feng, K. Ramirez, N. Feil, J. Wilde, G. Bruckner","doi":"10.1109/ESTC.2018.8546394","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546394","url":null,"abstract":"Pressure sensors working at temperatures of about 500 °C impose new challenges in packaging due to thermal cross- sensitivity and temperature induced stresses on the package. One of the major issues is the identification of stress-tolerant sensor mounting technique with stable materials at high temperature. This research-based work will mainly focus on developing a flip-chip die attachment technique for pressure sensor assembly for applications up to 500 °C. A concept for this application was developed based on a deforming ceramic membrane. A micro- strain gauge is patterned onto a Langasite (LGS) crystal. It is attached to a ceramic substrate with a membrane (Al2O3) like a cantilever by flip-chip interconnection and glass. The deforming membrane induces a pressure dependent displacement at the free end of the cantilever. The strain produced on the cantilever is measured by the change of resistance of the microstrain gauge. This special design concept aims for the elimination of thermal stresses by having no constraints for thermal expansion at the free end of the cantilever. LGS is a well-established material for Surface Acoustic Wave (SAW) based applications. Later this resistive strain gauge could be replaced by a SAW delay line. In order to mount the sensing element like a cantilever, one side of the LGS strain gauge chip is fabricated with gold stud bumps on its contact pads. Additionally, the flip-chip attachment is underfilled with glass solder and cured at 780 °C. Due to the high process temperature and anisotropic Thermal Coefficient of Expansion (TCE) of the LGS crystal it will tend to expand. By allowing it to expand freely at one end, the potential thermal stresses developed in the package is reduced. In this paper, processes to develop high temperature stable flip-chip die attachment using stud bumps and glass solder underfill is presented. The free expansion of the LGS crystal at its free end is determined using Digital Image Correlation (DIC) technique for temperatures up to 500 °C. With the same construction, a Lithiumniobate (LN) crystal is also introduced for applications up to 300 °C. The thermal expansion behavior of the die attachment is characterized using DIC. Strength of the cantilever die attachment is measured using shear tests and results are presented.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116086096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546342
Madalin Moise, A. Mazare, P. Svasta
The paper presents an explicit and complete implementation of a platform which includes an embedded system and the software necessary to recognize hand gestures on the basis of which an environment is controlled. The platform is developed using an ATmega328P controller and it is based on active infrared (IR) proximity sensor. The proposed platform will be used to detect hand gesture and also approximate the distance with a higher accuracy. This deployment provides the beginner developer with a platform for understanding, testing and learning the concepts of an embedded system, human machine interface (HMI) and a closed loop controller that works in real time. The experimental results were obtained using four active infrared (IR) proximity sensor, a temperature sensor, a buzzer and a relay, all connected to the Atmega328P microcontroller. They are used to demonstrate the functionality of the platform. The main purpose is realization of a reliable gesture sensor which is easy to build and understand, also facilitating future improvements and capabilities.
{"title":"Implementation of 3D gesture control system for environmental control","authors":"Madalin Moise, A. Mazare, P. Svasta","doi":"10.1109/ESTC.2018.8546342","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546342","url":null,"abstract":"The paper presents an explicit and complete implementation of a platform which includes an embedded system and the software necessary to recognize hand gestures on the basis of which an environment is controlled. The platform is developed using an ATmega328P controller and it is based on active infrared (IR) proximity sensor. The proposed platform will be used to detect hand gesture and also approximate the distance with a higher accuracy. This deployment provides the beginner developer with a platform for understanding, testing and learning the concepts of an embedded system, human machine interface (HMI) and a closed loop controller that works in real time. The experimental results were obtained using four active infrared (IR) proximity sensor, a temperature sensor, a buzzer and a relay, all connected to the Atmega328P microcontroller. They are used to demonstrate the functionality of the platform. The main purpose is realization of a reliable gesture sensor which is easy to build and understand, also facilitating future improvements and capabilities.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125714382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546379
J. Sousa, Sabine Liebfahrt, B. Reitmaier, Maria Prutti, Bernd Schuscha, Q. Tao, J. Nicolics, M. Unger, P. Fulmek
This paper describes a heat capacitive PCB concept where phase change materials (PCMs) embedded in an epoxy resin matrix is used. A heat dissipating component is installed on the surface of the PCB containing phase change material filled cavities. During phase change, part of the dissipated heat is absorbed by the PCB with the effect of reducing the operational temperature for the component and expanding the time until the system has reached steady state maximum temperature.
{"title":"Heat Capacitive PCB","authors":"J. Sousa, Sabine Liebfahrt, B. Reitmaier, Maria Prutti, Bernd Schuscha, Q. Tao, J. Nicolics, M. Unger, P. Fulmek","doi":"10.1109/ESTC.2018.8546379","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546379","url":null,"abstract":"This paper describes a heat capacitive PCB concept where phase change materials (PCMs) embedded in an epoxy resin matrix is used. A heat dissipating component is installed on the surface of the PCB containing phase change material filled cavities. During phase change, part of the dissipated heat is absorbed by the PCB with the effect of reducing the operational temperature for the component and expanding the time until the system has reached steady state maximum temperature.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123607683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546365
A. Satheesh, Midhun Kattisseri, V. Vijayan
Selective soldering is ubiquitous in electronic manufacturing industry for the soldering of through-hole components on printed circuit boards. During the process the PCB and components are subjected to high temperatures and induced thermal strains. Accurate estimation and monitoring of these temperatures and strains is necessary since it can lead to failure of SMD components, ceramic chip capacitors in particular.Finite element analysis in industry uses a two-step methodology to predict the maximum strains during this process. A transient thermal analysis is carried out for the estimation of temperature profiles away from the nozzle region. Input for this analysis is the temperature load profile that is applied over an approximate area where the nozzle comes in contact with PCB. Temperature contours from this analysis is used as an input for static structural analysis for the determination of maximum strains induced in the PCB. These maximum strains are compared with the strain limits of the ceramic chip capacitors which are most susceptible to failure. One of the drawbacks in this approach is direct application of temperature loads in the pin region on the PCB leading to over-prediction of local thermal strains. In reality, the solder establishes contact with the PCB through capillary action and transfers heat circumferentially while it fills the annular cavity between pin and PCB.In this work, solder filling is modeled by element birth and death technique. Temperature dependent material properties are used to model the phase change of solder in the process. An uncoupled transient thermo-mechanical finite element analysis in ANSYS is carried out for the evaluation of transient temperature, strain and stress fields.
{"title":"Numerical estimation of localized transient temperature and strain fields in soldering process","authors":"A. Satheesh, Midhun Kattisseri, V. Vijayan","doi":"10.1109/ESTC.2018.8546365","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546365","url":null,"abstract":"Selective soldering is ubiquitous in electronic manufacturing industry for the soldering of through-hole components on printed circuit boards. During the process the PCB and components are subjected to high temperatures and induced thermal strains. Accurate estimation and monitoring of these temperatures and strains is necessary since it can lead to failure of SMD components, ceramic chip capacitors in particular.Finite element analysis in industry uses a two-step methodology to predict the maximum strains during this process. A transient thermal analysis is carried out for the estimation of temperature profiles away from the nozzle region. Input for this analysis is the temperature load profile that is applied over an approximate area where the nozzle comes in contact with PCB. Temperature contours from this analysis is used as an input for static structural analysis for the determination of maximum strains induced in the PCB. These maximum strains are compared with the strain limits of the ceramic chip capacitors which are most susceptible to failure. One of the drawbacks in this approach is direct application of temperature loads in the pin region on the PCB leading to over-prediction of local thermal strains. In reality, the solder establishes contact with the PCB through capillary action and transfers heat circumferentially while it fills the annular cavity between pin and PCB.In this work, solder filling is modeled by element birth and death technique. Temperature dependent material properties are used to model the phase change of solder in the process. An uncoupled transient thermo-mechanical finite element analysis in ANSYS is carried out for the evaluation of transient temperature, strain and stress fields.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122349896","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546401
S. Klengel, T. Stephan, Bolko Mühs-Portius, R. Klengel
This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.
{"title":"Corrosion mechanism in metallization systems for printed circuit boards","authors":"S. Klengel, T. Stephan, Bolko Mühs-Portius, R. Klengel","doi":"10.1109/ESTC.2018.8546401","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546401","url":null,"abstract":"This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124849887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546418
Jae Hak Lee, C. Lee, Y. J. Kim, S. Kim, J. Song
System in Foil (SiF) package could realize flexible, multi-functional and higher performance package using flexible substrate and ultra-thin heterogeneous chip integration. In this study, PEB(polymer elastic bump) bonding process is suggested newly, whichcould reduce stress concentration remarkably near bump and chip face by soft polymer bump material with electroconductive metal linepattern and usage of NCF(non-conductive adhesive film) and also lower bonding temperature during facedown interconnect process between flexible substrate and ultrathin chip. Compared to conventional bonding process by metal bumps, it improves flexibility of package because PEB is softer than metal bump and NCF adhesive film keeps mechanical contact between PEB and pad. Elastic deformation and restoration behavior of PEB bump during bonding process are investigated using FEM analysis to calculate bump-to-pad contact area related to electrical contact resistance. Through experiments PEB fabrication process is developed using thermal reflow process and spiraltype and spoke type PEB are developed in order to solve the Au cap metal line crack problem due to excessive deformation of PEB. We find optimal bonding conditions and effect of bonding parameters.
System in Foil (SiF)封装利用柔性衬底和超薄异质芯片集成实现了柔性、多功能和更高性能的封装。本研究提出了一种新的PEB(聚合物弹性凸点)键合工艺，采用具有导电金属线型的软质聚合物凸点材料和非导电胶膜，可以显著降低凸点和芯片表面附近的应力集中，并降低柔性衬底与超薄芯片面朝下互连过程中的键合温度。与传统的金属碰撞粘接工艺相比，由于PEB比金属碰撞更柔软，NCF胶膜使PEB与衬垫之间保持机械接触，从而提高了封装的灵活性。采用有限元分析方法计算了与接触电阻相关的碰触面积，研究了PEB碰触在粘接过程中的弹性变形和恢复行为。通过实验，开发了热回流法制备PEB的工艺，开发了螺旋型和辐条型PEB，解决了由于PEB变形过大导致的Au帽金属线裂纹问题。我们找到了最佳的键合条件和键合参数的影响。
{"title":"Development of PEB Face-Down Interconnect Process for Wearable Device","authors":"Jae Hak Lee, C. Lee, Y. J. Kim, S. Kim, J. Song","doi":"10.1109/ESTC.2018.8546418","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546418","url":null,"abstract":"System in Foil (SiF) package could realize flexible, multi-functional and higher performance package using flexible substrate and ultra-thin heterogeneous chip integration. In this study, PEB(polymer elastic bump) bonding process is suggested newly, whichcould reduce stress concentration remarkably near bump and chip face by soft polymer bump material with electroconductive metal linepattern and usage of NCF(non-conductive adhesive film) and also lower bonding temperature during facedown interconnect process between flexible substrate and ultrathin chip. Compared to conventional bonding process by metal bumps, it improves flexibility of package because PEB is softer than metal bump and NCF adhesive film keeps mechanical contact between PEB and pad. Elastic deformation and restoration behavior of PEB bump during bonding process are investigated using FEM analysis to calculate bump-to-pad contact area related to electrical contact resistance. Through experiments PEB fabrication process is developed using thermal reflow process and spiraltype and spoke type PEB are developed in order to solve the Au cap metal line crack problem due to excessive deformation of PEB. We find optimal bonding conditions and effect of bonding parameters.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124795614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546335
Arttu Huttunen, Timo Kurkela, Kaisa-Leena Väisänen, E. Juntunen
This work demonstrates the making of four-layer wiring design on a flexible plastic substrate by laminating together individualprinted sheets. Overmolding of the device into plastic is also experimented. In printed electronics, multilayer wiring is oftenavoided because of the technological difficulties in making several conductor layers. Yet many electrical designs require multiple layersand are therefore out of reach for printed and plastic electronics. In this work, multilayer wiring in the form of four-layer laminated structure was studied. Via filling in plastic foils was studied with different silver based pastes and it was found that most pastes fill vias well while simultaneously printing the wiring. Method for making multilayer boards by laminating polymer sheetstogether was explored by testing a range of plastic materials for their lamination adhesion and then producing a test structure on polyethylene terephthalate (PET) with wiring running through the substrate. Finally, this demo device with LED components was overmolded with thermoplastic polyurethane (TPU) to form a sealed structure with integrated lenses for LEDs. The final structure is sealed,flexible and transparent, which is desirable for example in display applications.
{"title":"Multilayer plastic substrate for electronics","authors":"Arttu Huttunen, Timo Kurkela, Kaisa-Leena Väisänen, E. Juntunen","doi":"10.1109/ESTC.2018.8546335","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546335","url":null,"abstract":"This work demonstrates the making of four-layer wiring design on a flexible plastic substrate by laminating together individualprinted sheets. Overmolding of the device into plastic is also experimented. In printed electronics, multilayer wiring is oftenavoided because of the technological difficulties in making several conductor layers. Yet many electrical designs require multiple layersand are therefore out of reach for printed and plastic electronics. In this work, multilayer wiring in the form of four-layer laminated structure was studied. Via filling in plastic foils was studied with different silver based pastes and it was found that most pastes fill vias well while simultaneously printing the wiring. Method for making multilayer boards by laminating polymer sheetstogether was explored by testing a range of plastic materials for their lamination adhesion and then producing a test structure on polyethylene terephthalate (PET) with wiring running through the substrate. Finally, this demo device with LED components was overmolded with thermoplastic polyurethane (TPU) to form a sealed structure with integrated lenses for LEDs. The final structure is sealed,flexible and transparent, which is desirable for example in display applications.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125033545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-01DOI: 10.1109/ESTC.2018.8546489
Fabian Huber, H. Etschmaier, A. Wolfberger, A. Singulani, P. Hadley
Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).
{"title":"Characterization of Moisture Uptake in Microelectronics Packaging Materials","authors":"Fabian Huber, H. Etschmaier, A. Wolfberger, A. Singulani, P. Hadley","doi":"10.1109/ESTC.2018.8546489","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546489","url":null,"abstract":"Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129710379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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