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2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)最新文献

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Future of Power Electronics from TCAD Perspective 从TCAD的角度看电力电子的未来
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241652
T. Ma
Power electronics are an integral part of our daily life. The applications of power electronics are widespread, supporting multiple industries such as automotive, telecommunication, transportation, utility systems, aerospace, etc. According to a new market research report including the analysis of the COVID-19 impact [1], the global power electronics market is expected to grow at a Compounded Annual Growth Rate (CAGR) of 4.7% from $35.1 billion in 2020 to $44.2 billion by 2025. As depicted in Figure 1, the key drivers of growth are 1) increasing integration of power electronics, and 2) increasing use of wide bandgap (WBG) materials. In terms of regional growth, Asia Pacific (APAC) including China, Japan, South Korea, and India is expected to grow the fastest compared to North America, Europe, and Rest of the World (Figure 2).
电力电子设备是我们日常生活中不可或缺的一部分。电力电子的应用非常广泛,支持汽车、电信、交通、公用事业系统、航空航天等多个行业。根据一份新的市场研究报告,包括对COVID-19影响的分析[1],全球电力电子市场预计将以4.7%的复合年增长率(CAGR)增长,从2020年的351亿美元增长到2025年的442亿美元。如图1所示,增长的主要驱动因素是1)电力电子器件的集成度不断提高,以及2)宽带隙(WBG)材料的使用不断增加。就区域增长而言,与北美、欧洲和世界其他地区相比,包括中国、日本、韩国和印度在内的亚太地区(APAC)预计将增长最快(图2)。
{"title":"Future of Power Electronics from TCAD Perspective","authors":"T. Ma","doi":"10.23919/SISPAD49475.2020.9241652","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241652","url":null,"abstract":"Power electronics are an integral part of our daily life. The applications of power electronics are widespread, supporting multiple industries such as automotive, telecommunication, transportation, utility systems, aerospace, etc. According to a new market research report including the analysis of the COVID-19 impact [1], the global power electronics market is expected to grow at a Compounded Annual Growth Rate (CAGR) of 4.7% from $35.1 billion in 2020 to $44.2 billion by 2025. As depicted in Figure 1, the key drivers of growth are 1) increasing integration of power electronics, and 2) increasing use of wide bandgap (WBG) materials. In terms of regional growth, Asia Pacific (APAC) including China, Japan, South Korea, and India is expected to grow the fastest compared to North America, Europe, and Rest of the World (Figure 2).","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117324440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SISPAD 2020 Cover Page SISPAD 2020封面
Pub Date : 2020-09-23 DOI: 10.23919/sispad49475.2020.9241597
{"title":"SISPAD 2020 Cover Page","authors":"","doi":"10.23919/sispad49475.2020.9241597","DOIUrl":"https://doi.org/10.23919/sispad49475.2020.9241597","url":null,"abstract":"","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131008273","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TCAD-Assisted MultiPhysics Modeling & Simulation for Accelerating Silicon Quantum Dot Qubit Design 加速硅量子点量子比特设计的tcad辅助多物理场建模与仿真
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241612
F. Mohiyaddin, G. Simion, N. D. Stuyck, R. Li, A. Elsayed, M. Shehata, S. Kubicek, C. Godfrin, B. Chan, J. Jussot, F. C. ubotaru, S. Brebels, F. M. Bufler, G. Eneman, P. Weckx, P. Matagne, A. Spessot, B. Govoreanu, I. Radu
We summarize the design parameters and modeling techniques for silicon quantum dot qubit devices. A general overview on the operation of the devices - including various methods of qubit readout, control, and interaction - is provided with relevant parameters. With these blocks forming the backbone of silicon quantum computation, the paper provides a guideline to aid and accelerate the design and optimization of silicon qubit devices.
总结了硅量子点量子比特器件的设计参数和建模技术。设备操作的总体概述-包括量子位读出,控制和交互的各种方法-提供了相关参数。这些模块构成了硅量子计算的主干,本文为帮助和加速硅量子比特器件的设计和优化提供了指导。
{"title":"TCAD-Assisted MultiPhysics Modeling & Simulation for Accelerating Silicon Quantum Dot Qubit Design","authors":"F. Mohiyaddin, G. Simion, N. D. Stuyck, R. Li, A. Elsayed, M. Shehata, S. Kubicek, C. Godfrin, B. Chan, J. Jussot, F. C. ubotaru, S. Brebels, F. M. Bufler, G. Eneman, P. Weckx, P. Matagne, A. Spessot, B. Govoreanu, I. Radu","doi":"10.23919/SISPAD49475.2020.9241612","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241612","url":null,"abstract":"We summarize the design parameters and modeling techniques for silicon quantum dot qubit devices. A general overview on the operation of the devices - including various methods of qubit readout, control, and interaction - is provided with relevant parameters. With these blocks forming the backbone of silicon quantum computation, the paper provides a guideline to aid and accelerate the design and optimization of silicon qubit devices.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"52 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124616984","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Enhanced Capabilities of the Nano-Electronic Simulation Software (NESS) 纳米电子仿真软件(NESS)的增强功能
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241594
C. Medina-Bailón, O. Badami, H. Carrillo-Nuñez, T. Dutta, D. Nagy, F. Adamu-Lema, V. Georgiev, A. Asenov
The aim of this paper is to present a flexible TCAD platform called Nano-Electronic Simulation Software (NESS) which enables the modelling of contemporary future electronic devices combining different simulation paradigms (with different degrees of complexity) in a unified simulation domain. NESS considers confinement-aware band structures, generates the main sources of variability, and can study their impact using different transport models. In particular, this work focuses on the new modules implemented: Kubo-Greenwood solver, Kinetic Monte Carlo solver, Gate Leakage calculation, and a full-band quantum transport solver in the presence of hole-phonon interactions using a mode-space $k cdot p$ approach in combination with the existing NEGF module.
本文的目的是提出一个灵活的TCAD平台,称为纳米电子仿真软件(NESS),它可以在统一的仿真领域中结合不同的仿真范式(具有不同程度的复杂性)对当代未来电子设备进行建模。NESS考虑了空间感知波段结构,产生了变率的主要来源,并可以使用不同的输运模型研究它们的影响。特别是,这项工作侧重于实现的新模块:Kubo-Greenwood求解器,动力学蒙特卡罗求解器,门泄漏计算,以及使用模式空间$k cdot p$方法与现有的NEGF模块相结合的空穴-声子相互作用存在的全频带量子输运求解器。
{"title":"Enhanced Capabilities of the Nano-Electronic Simulation Software (NESS)","authors":"C. Medina-Bailón, O. Badami, H. Carrillo-Nuñez, T. Dutta, D. Nagy, F. Adamu-Lema, V. Georgiev, A. Asenov","doi":"10.23919/SISPAD49475.2020.9241594","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241594","url":null,"abstract":"The aim of this paper is to present a flexible TCAD platform called Nano-Electronic Simulation Software (NESS) which enables the modelling of contemporary future electronic devices combining different simulation paradigms (with different degrees of complexity) in a unified simulation domain. NESS considers confinement-aware band structures, generates the main sources of variability, and can study their impact using different transport models. In particular, this work focuses on the new modules implemented: Kubo-Greenwood solver, Kinetic Monte Carlo solver, Gate Leakage calculation, and a full-band quantum transport solver in the presence of hole-phonon interactions using a mode-space $k cdot p$ approach in combination with the existing NEGF module.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116014164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Multiband Phase Space Operator for Narrow Bandgap Semiconductor Devices 窄带隙半导体器件的多频带相空间算子
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241595
L. Schulz, D. Schulz
The analysis of the charge carrier transport within modern device concepts of nanoelectronics and nanophotonics as well as THz technology requires the inclusion of multiband Hamiltonians. These can then be used to consider not only intraband transitions but also interband transitions as well as effects based on the existence and interaction of light and heavy holes. For this purpose appropriate multiband Hamiltonians must be applied for a suitable numerical analysis. On the basis of the quantum Liouville equation, a formalism is derived how multiband Hamiltonians can be integrated into advanced and recently developed Wigner transport based algorithms utilizing a phase space operator and which multiband models are appropriate. The presented formalism is demonstrated by its application onto resonant tunnel diodes that take advantage of interband effects within narrow band gap semiconductor devices.
在纳米电子学和纳米光子学以及太赫兹技术的现代器件概念中,电荷载流子输运的分析需要包含多波段哈密顿量。然后,这些不仅可以用于考虑带内跃迁,还可以用于考虑带间跃迁以及基于轻、重空穴存在和相互作用的效应。为此,必须采用适当的多波段哈密顿量进行适当的数值分析。在量子Liouville方程的基础上,推导了如何利用相空间算子将多波段哈密顿量集成到先进的和最近开发的基于Wigner输运的算法中,以及哪些多波段模型是合适的。通过在利用窄带隙半导体器件带间效应的谐振隧道二极管上的应用,证明了所提出的形式。
{"title":"Multiband Phase Space Operator for Narrow Bandgap Semiconductor Devices","authors":"L. Schulz, D. Schulz","doi":"10.23919/SISPAD49475.2020.9241595","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241595","url":null,"abstract":"The analysis of the charge carrier transport within modern device concepts of nanoelectronics and nanophotonics as well as THz technology requires the inclusion of multiband Hamiltonians. These can then be used to consider not only intraband transitions but also interband transitions as well as effects based on the existence and interaction of light and heavy holes. For this purpose appropriate multiband Hamiltonians must be applied for a suitable numerical analysis. On the basis of the quantum Liouville equation, a formalism is derived how multiband Hamiltonians can be integrated into advanced and recently developed Wigner transport based algorithms utilizing a phase space operator and which multiband models are appropriate. The presented formalism is demonstrated by its application onto resonant tunnel diodes that take advantage of interband effects within narrow band gap semiconductor devices.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127705291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Combined First Principles and Kinetic Monte Carlo study of Polyoxometalate based Molecular Memory Devices 基于多金属氧酸盐的分子记忆器件的第一性原理与动力学蒙特卡罗相结合研究
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241606
P. Lapham, O. Badami, C. Medina-Bailón, F. Adamu-Lema, T. Dutta, D. Nagy, V. Georgiev, A. Asenov
In this paper, we combine Density Functional Theory with Kinetic Monte Carlo methodology to study the fundamental transport properties of a type of polyoxometalate (POM) and its behaviour in a potential flash memory device. DFT simulations on POM molecular junctions helps us demonstrate the link between underlying electronic structure of the molecule and its transport properties. Furthermore, we show how various electrode-molecule contact configurations determine the electron transport through the POM. Also, our work reveals that the orientation of the molecule to the electrodes plays a key role in the transport properties of the junction. With Kinetic Monte Carlo we extend this investigation by simulating the retention time of a POM-based flash memory device. Our results show that a POM based flash memory could potentially show multi-bit storage and retain charge for up to 10 years.
本文将密度泛函理论与动力学蒙特卡罗方法相结合,研究了一类多金属氧酸盐(POM)的基本输运性质及其在潜在闪存器件中的行为。聚甲醛分子结的DFT模拟有助于我们证明分子的潜在电子结构与其输运性质之间的联系。此外,我们展示了不同的电极-分子接触构型如何决定电子通过POM的传递。此外,我们的工作揭示了分子在电极上的取向在结的传输特性中起着关键作用。利用动力学蒙特卡罗,我们通过模拟基于pom的闪存设备的保留时间来扩展这一研究。我们的研究结果表明,基于POM的闪存有可能显示多比特存储,并保持电荷长达10年。
{"title":"A Combined First Principles and Kinetic Monte Carlo study of Polyoxometalate based Molecular Memory Devices","authors":"P. Lapham, O. Badami, C. Medina-Bailón, F. Adamu-Lema, T. Dutta, D. Nagy, V. Georgiev, A. Asenov","doi":"10.23919/SISPAD49475.2020.9241606","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241606","url":null,"abstract":"In this paper, we combine Density Functional Theory with Kinetic Monte Carlo methodology to study the fundamental transport properties of a type of polyoxometalate (POM) and its behaviour in a potential flash memory device. DFT simulations on POM molecular junctions helps us demonstrate the link between underlying electronic structure of the molecule and its transport properties. Furthermore, we show how various electrode-molecule contact configurations determine the electron transport through the POM. Also, our work reveals that the orientation of the molecule to the electrodes plays a key role in the transport properties of the junction. With Kinetic Monte Carlo we extend this investigation by simulating the retention time of a POM-based flash memory device. Our results show that a POM based flash memory could potentially show multi-bit storage and retain charge for up to 10 years.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128980323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
TCAD simulation for transition metal dichalcogenide channel Tunnel FETs consistent with ab-initio based NEGF calculation 过渡金属二硫化物通道隧道场效应管的TCAD模拟与基于abinitio的NEGF计算一致
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241637
H. Asai, T. Kuroda, K. Fukuda, J. Hattori, T. Ikegami, N. Mori
We perform TCAD simulation for TMDC channel TFETs with the material parameters considering ab initio band structure. By using the WKB-based nonlocal band-to-band tunneling (BTBT) model with the above parameters, we find that the current voltage characteristics of the TFETs are in good agreement with those obtained by microscopic NEGF calculation. Based on this approach, we also investigate the dependence of tunnel leakage current on the gate length. Our simulation method paves the way for reliable macroscopic device simulations for TMDC channel TFET.
我们对材料参数考虑从头算带结构的TMDC沟道tfet进行了TCAD仿真。利用基于wkb的非局域带到带隧穿(BTBT)模型计算上述参数,我们发现tfet的电流电压特性与微观NEGF计算结果吻合较好。在此基础上,我们还研究了隧道漏电流与栅极长度的关系。我们的仿真方法为可靠的TMDC通道TFET宏观器件仿真奠定了基础。
{"title":"TCAD simulation for transition metal dichalcogenide channel Tunnel FETs consistent with ab-initio based NEGF calculation","authors":"H. Asai, T. Kuroda, K. Fukuda, J. Hattori, T. Ikegami, N. Mori","doi":"10.23919/SISPAD49475.2020.9241637","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241637","url":null,"abstract":"We perform TCAD simulation for TMDC channel TFETs with the material parameters considering ab initio band structure. By using the WKB-based nonlocal band-to-band tunneling (BTBT) model with the above parameters, we find that the current voltage characteristics of the TFETs are in good agreement with those obtained by microscopic NEGF calculation. Based on this approach, we also investigate the dependence of tunnel leakage current on the gate length. Our simulation method paves the way for reliable macroscopic device simulations for TMDC channel TFET.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129700937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Calibrated Si Mobility and Incomplete Ionization Models with Field Dependent Ionization Energy for Cryogenic Simulations 校准硅迁移率和不完全电离模型与场依赖电离能的低温模拟
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241599
H. Wong
Cryogenic silicon CMOS operating between 77K and 4.2K is becoming more popular in high-speed server applications and the periphery of quantum computers. In the cryogenic regime, dopant incomplete ionization and field enhanced ionization become dominating physical phenomena. Therefore, it is important to use accurate and well-calibrated mobility and incomplete ionization models in cryogenic TCAD simulations. In this paper, we present a Philips Unified Mobility Model (PhuMob) and Altermatt’s incomplete ionization model calibrated between 300K and 20K for boron and arsenic dopants in silicon across 5 orders of magnitude in doping concentration. A novel method is proposed to include field-dependent ionization energy in Altermatt’s model, which results in good convergence even in 3D TCAD simulations at 4K.
工作在77K和4.2K之间的低温硅CMOS在高速服务器应用和量子计算机外围越来越受欢迎。在低温条件下,掺杂不完全电离和场增强电离成为主要的物理现象。因此,在低温TCAD模拟中使用精确且校准良好的迁移率和不完全电离模型是很重要的。在本文中,我们提出了Philips统一迁移模型(PhuMob)和Altermatt的不完全电离模型,该模型在300K和20K之间校准,用于硅中硼和砷掺杂剂的掺杂浓度跨越5个数量级。提出了一种将场相关电离能纳入Altermatt模型的新方法,即使在4K的3D TCAD模拟中也能取得良好的收敛性。
{"title":"Calibrated Si Mobility and Incomplete Ionization Models with Field Dependent Ionization Energy for Cryogenic Simulations","authors":"H. Wong","doi":"10.23919/SISPAD49475.2020.9241599","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241599","url":null,"abstract":"Cryogenic silicon CMOS operating between 77K and 4.2K is becoming more popular in high-speed server applications and the periphery of quantum computers. In the cryogenic regime, dopant incomplete ionization and field enhanced ionization become dominating physical phenomena. Therefore, it is important to use accurate and well-calibrated mobility and incomplete ionization models in cryogenic TCAD simulations. In this paper, we present a Philips Unified Mobility Model (PhuMob) and Altermatt’s incomplete ionization model calibrated between 300K and 20K for boron and arsenic dopants in silicon across 5 orders of magnitude in doping concentration. A novel method is proposed to include field-dependent ionization energy in Altermatt’s model, which results in good convergence even in 3D TCAD simulations at 4K.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130843354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
SISPAD 2020 TOC
Pub Date : 2020-09-23 DOI: 10.23919/sispad49475.2020.9241589
{"title":"SISPAD 2020 TOC","authors":"","doi":"10.23919/sispad49475.2020.9241589","DOIUrl":"https://doi.org/10.23919/sispad49475.2020.9241589","url":null,"abstract":"","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126417599","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TCAD Incorporation of Physical Framework to Model N and P BTI in MOSFETs 利用物理框架建模mosfet中的N和P BTI
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241687
R. Tiwari, N. Choudhury, Tarun Samadder, S. Mukhopadhyay, N. Parihar, S. Mahapatra
Negative and Positive Bias Temperature Instabilities (NBTI, PBTI) respectively in P and N channel High-K Metal Gate (HKMG) MOSFETs are modeled by trap generation (TG) and charge trapping (CT) and validated against measured data. The mechanism of TG (interface) is incorporated into TCAD and is separately validated using independent experiments. BTI kinetics is modeled at different stress bias (VG) and temperature (T). Impacts of Nitrogen (N%) and Equivalent Oxide Thickness (EOT) scaling on the magnitude of BTI and its time, VG and T dependencies are modeled.
利用陷阱生成(TG)和电荷捕获(CT)对P沟道和N沟道高钾金属栅极(HKMG) mosfet的负偏置温度不稳定性(NBTI)和正偏置温度不稳定性(PBTI)进行了建模,并根据实测数据进行了验证。将TG(界面)的作用机理纳入TCAD,并分别通过独立实验进行验证。模拟了不同应力偏置(VG)和温度(T)下的BTI动力学。模拟了氮(N%)和等效氧化物厚度(EOT)对BTI大小及其时间、VG和T依赖性的影响。
{"title":"TCAD Incorporation of Physical Framework to Model N and P BTI in MOSFETs","authors":"R. Tiwari, N. Choudhury, Tarun Samadder, S. Mukhopadhyay, N. Parihar, S. Mahapatra","doi":"10.23919/SISPAD49475.2020.9241687","DOIUrl":"https://doi.org/10.23919/SISPAD49475.2020.9241687","url":null,"abstract":"Negative and Positive Bias Temperature Instabilities (NBTI, PBTI) respectively in P and N channel High-K Metal Gate (HKMG) MOSFETs are modeled by trap generation (TG) and charge trapping (CT) and validated against measured data. The mechanism of TG (interface) is incorporated into TCAD and is separately validated using independent experiments. BTI kinetics is modeled at different stress bias (VG) and temperature (T). Impacts of Nitrogen (N%) and Equivalent Oxide Thickness (EOT) scaling on the magnitude of BTI and its time, VG and T dependencies are modeled.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129262923","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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