Pub Date : 2024-04-11DOI: 10.1088/1361-6641/ad3a92
Zhenxing Lv, Zhefu Liao, Shengjun Zhou
Increasing the reflection of p-side is an effective way to improve the optoelectronic performance of flip-chip light-emitting diodes (FCLEDs). Here, we propose a full-coverage Al reflector (FAR) and a highly reflective Ni/Rh p-electrode to enhance the performance of deep ultraviolet (DUV) FCLEDs. The physical mechanism for the impact of the FAR and Ni/Rh electrode on the light extraction efficiency (LEE) is discussed theoretically. Simulations demonstrate that the combination of the FAR and Ni/Rh electrode improves the LEEs of transverse electric- and transverse magnetic-polarized light by 13.62% and 27.08%, respectively. At an injection current of 100 mA, the fabricated DUV FCLEDs with FAR and Ni/Rh electrode exhibits an external quantum efficiency of 4.01% and a wall plugging efficiency of 2.92%, which are 16.85% and 13.18% higher than those of conventional DUV FCLEDs, respectively. These results support the promise of the FAR and Ni/Rh electrode for high-power DUV LED applications.
提高 p 面的反射率是改善倒装芯片发光二极管(FCLED)光电性能的有效方法。在此,我们提出了一种全覆盖铝反射器(FAR)和一种高反射镍/铑对电极,以提高深紫外(DUV)FCLED 的性能。理论上讨论了 FAR 和 Ni/Rh 电极对光萃取效率(LEE)影响的物理机制。模拟结果表明,结合使用 FAR 和 Ni/Rh 电极,横向电偏振光和横向磁偏振光的萃取效率分别提高了 13.62% 和 27.08%。在注入电流为 100 mA 时,使用 FAR 和 Ni/Rh 电极制造的 DUV FCLED 的外部量子效率为 4.01%,堵壁效率为 2.92%,分别比传统 DUV FCLED 高出 16.85% 和 13.18%。这些结果支持了 FAR 和 Ni/Rh 电极在高功率 DUV LED 应用中的前景。
{"title":"Enhanced efficiency of deep ultraviolet light-emitting diodes utilizing full-coverage Al reflector and highly reflective Ni/Rh p-electrode","authors":"Zhenxing Lv, Zhefu Liao, Shengjun Zhou","doi":"10.1088/1361-6641/ad3a92","DOIUrl":"https://doi.org/10.1088/1361-6641/ad3a92","url":null,"abstract":"Increasing the reflection of p-side is an effective way to improve the optoelectronic performance of flip-chip light-emitting diodes (FCLEDs). Here, we propose a full-coverage Al reflector (FAR) and a highly reflective Ni/Rh p-electrode to enhance the performance of deep ultraviolet (DUV) FCLEDs. The physical mechanism for the impact of the FAR and Ni/Rh electrode on the light extraction efficiency (LEE) is discussed theoretically. Simulations demonstrate that the combination of the FAR and Ni/Rh electrode improves the LEEs of transverse electric- and transverse magnetic-polarized light by 13.62% and 27.08%, respectively. At an injection current of 100 mA, the fabricated DUV FCLEDs with FAR and Ni/Rh electrode exhibits an external quantum efficiency of 4.01% and a wall plugging efficiency of 2.92%, which are 16.85% and 13.18% higher than those of conventional DUV FCLEDs, respectively. These results support the promise of the FAR and Ni/Rh electrode for high-power DUV LED applications.","PeriodicalId":21585,"journal":{"name":"Semiconductor Science and Technology","volume":"78 1","pages":""},"PeriodicalIF":1.9,"publicationDate":"2024-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140608629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this work, p-n junction vertical gate (JVG) and polarization junction vertical gate (PVG) structures are for the first time proposed to improve the performance of GaN-based enhancement-mode (E-mode) high electron mobility transistor (HEMT) devices. Compared with the control group featuring the vertical gate structure, a highly improved threshold voltage (V