Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300544
A. Ramkumar, X. Chen, D. Paduch, P.N. Schlegel, A. Lai
We report on a microfabricated silicon probe integrated with an ultrasonic actuator and polysilicon strain gauges for Microdissection TEsticular Sperm Extraction (TESE) surgery. Insertion experiment was performed on rat testis tissue and by sensing the strain we were able to ascertain the size of the sperm-carrying microtubules in the sample. This information is important in Microdissection TESE to distinguish tubules with and without fertile sperm, eliminating large incision currently required for optical spermatazoa localization. Experimental data on tissue rigidity measurements indicate that the micromechanical assay can also be used for minimally-invasive testicular cancer detection.
{"title":"Micro-Dissecting Dual-Probe Testicular Tubule Assay","authors":"A. Ramkumar, X. Chen, D. Paduch, P.N. Schlegel, A. Lai","doi":"10.1109/SENSOR.2007.4300544","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300544","url":null,"abstract":"We report on a microfabricated silicon probe integrated with an ultrasonic actuator and polysilicon strain gauges for Microdissection TEsticular Sperm Extraction (TESE) surgery. Insertion experiment was performed on rat testis tissue and by sensing the strain we were able to ascertain the size of the sperm-carrying microtubules in the sample. This information is important in Microdissection TESE to distinguish tubules with and without fertile sperm, eliminating large incision currently required for optical spermatazoa localization. Experimental data on tissue rigidity measurements indicate that the micromechanical assay can also be used for minimally-invasive testicular cancer detection.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"5 1","pages":"1959-1962"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85166672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300360
A. Hess, J. Dunning, D. Tyler, C. Zorman
This paper reports the development of a mechanically-flexible microfabricated flat interface nerve electrode using polynorbornene (PNB) as the structural material. The device consists of two electrode arrays each fabricated on a photolithographically-defined PNB base with thin film Pt electrodes and a photolithographically patterned PNB capping layer. The two arrays are inserted into a silicone housing designed to create a flat interface between the electrodes and the nerve bundle. Electrical tests showed that the resistance of the Pt electrode interconnect traces are unaffected by flexing around a 1.8 mm radius. Electrical testing in phosphate-buffered saline (PBS) shows that resistance of the traces is about 3 kOmega. A 10 day leakage current test in PBS did not produce a detectable change in leakage current. These and other tests indicate that a PNB multilayer system may be viable for microfabricated electrodes.
{"title":"A Polynorbornene-Based Microelectrode Array for Neural Interfacing","authors":"A. Hess, J. Dunning, D. Tyler, C. Zorman","doi":"10.1109/SENSOR.2007.4300360","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300360","url":null,"abstract":"This paper reports the development of a mechanically-flexible microfabricated flat interface nerve electrode using polynorbornene (PNB) as the structural material. The device consists of two electrode arrays each fabricated on a photolithographically-defined PNB base with thin film Pt electrodes and a photolithographically patterned PNB capping layer. The two arrays are inserted into a silicone housing designed to create a flat interface between the electrodes and the nerve bundle. Electrical tests showed that the resistance of the Pt electrode interconnect traces are unaffected by flexing around a 1.8 mm radius. Electrical testing in phosphate-buffered saline (PBS) shows that resistance of the traces is about 3 kOmega. A 10 day leakage current test in PBS did not produce a detectable change in leakage current. These and other tests indicate that a PNB multilayer system may be viable for microfabricated electrodes.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"28 1","pages":"1235-1238"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83615160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300573
Jiangang Du, C. Zorman
A low temperature (450degC) amorphous, hydrogenated silicon carbide (a-SiC:H) thin film transfer technology by way of a-SiC:H/Si direct bonding is described. Compared to traditional thin film bonding and transfer processes, the proposed approach does not rely on IC-incompatible substances or high process temperatures to form the bond. Due to the ultra-smooth a-SiC surfaces, a CMP step normally used in traditional direct bonding is not required. Using this approach, prototype structures, such as nanogap channels and vacuum-sealed, micron-deep reservoirs with a-SiC films as capping layers have been successful fabricated.
{"title":"Low Temperature A-SiC/Si Direct Bonding Technology for MEMS/NEMS","authors":"Jiangang Du, C. Zorman","doi":"10.1109/SENSOR.2007.4300573","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300573","url":null,"abstract":"A low temperature (450degC) amorphous, hydrogenated silicon carbide (a-SiC:H) thin film transfer technology by way of a-SiC:H/Si direct bonding is described. Compared to traditional thin film bonding and transfer processes, the proposed approach does not rely on IC-incompatible substances or high process temperatures to form the bond. Due to the ultra-smooth a-SiC surfaces, a CMP step normally used in traditional direct bonding is not required. Using this approach, prototype structures, such as nanogap channels and vacuum-sealed, micron-deep reservoirs with a-SiC films as capping layers have been successful fabricated.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"40 1","pages":"2075-2078"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89243904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300435
A. Werber, H. Zappe
We present a novel, high stroke tip-tilt-piston micro-mirror actuated by thermo-pneumatic forces. A circular silicon mirror plate is mounted on top of three balloons, made of a 50 mum thick elastomer membrane. The balloons are inflated under thermo-pneumatic pressure, thus driving the mirror plate into tip-tilt and piston motion. Very large stroke values of 385 mum as well as tip-tilt angles of 5deg were measured. The triangular arrangement of the balloon actuator yields a high flexibility in mirror motion, including tip-tilt in any direction.
{"title":"A Thermo-Pneumatically Actuated Tip-Tilt-Piston Mirror","authors":"A. Werber, H. Zappe","doi":"10.1109/SENSOR.2007.4300435","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300435","url":null,"abstract":"We present a novel, high stroke tip-tilt-piston micro-mirror actuated by thermo-pneumatic forces. A circular silicon mirror plate is mounted on top of three balloons, made of a 50 mum thick elastomer membrane. The balloons are inflated under thermo-pneumatic pressure, thus driving the mirror plate into tip-tilt and piston motion. Very large stroke values of 385 mum as well as tip-tilt angles of 5deg were measured. The triangular arrangement of the balloon actuator yields a high flexibility in mirror motion, including tip-tilt in any direction.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"62 1","pages":"1525-1528"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90998293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300363
M. Spira, D. Kamber, A. Dormann, A. Cohen, C. Bartic, G. Borghs, J. Langedijk, S. Yitzchaik, K. Shabthai, J. Shappir
One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the transistor gate surface. The micronails were functionalized by phagocytosis facilitating peptides. Cultured neurons readily engulf the functionalized micronails forming tight physical contact between the cells and the surface of the device.
{"title":"Improved Neuronal Adhesion to the Surface of Electronic Device by Engulfment of Protruding Micro-Nails Fabricated on the Chip Surface","authors":"M. Spira, D. Kamber, A. Dormann, A. Cohen, C. Bartic, G. Borghs, J. Langedijk, S. Yitzchaik, K. Shabthai, J. Shappir","doi":"10.1109/SENSOR.2007.4300363","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300363","url":null,"abstract":"One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the transistor gate surface. The micronails were functionalized by phagocytosis facilitating peptides. Cultured neurons readily engulf the functionalized micronails forming tight physical contact between the cells and the surface of the device.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"72 1","pages":"1247-1250"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91025653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300600
S. Tanaka, O. Ichihashi, K. Sugano, T. Tsuchiya, O. Tabata
An improved equivalent circuit model for effective calculation of a valveless piezoelectric micropump performance which is operated by a dependency of flow resistance on flow rate was proposed. The validity of the proposed model was evaluated by comparing the dynamic flow behavior calculated by the equivalent circuit model with mu-PIV measurement. From the good agreements between the analysis and the experimental results, it was concluded that a dynamic flow characteristic with microsecond scale of the micropump was able to be analyzed precisely by the developed equivalent circuit model.
{"title":"Analysis of Valveless Piezoelectric Micropump using Electrical Equivalent Circuit Model","authors":"S. Tanaka, O. Ichihashi, K. Sugano, T. Tsuchiya, O. Tabata","doi":"10.1109/SENSOR.2007.4300600","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300600","url":null,"abstract":"An improved equivalent circuit model for effective calculation of a valveless piezoelectric micropump performance which is operated by a dependency of flow resistance on flow rate was proposed. The validity of the proposed model was evaluated by comparing the dynamic flow behavior calculated by the equivalent circuit model with mu-PIV measurement. From the good agreements between the analysis and the experimental results, it was concluded that a dynamic flow characteristic with microsecond scale of the micropump was able to be analyzed precisely by the developed equivalent circuit model.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"70 1","pages":"2183-2186"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91207775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300074
P. Pursula, J. Marjonen, H. Ronkainen, K. Jaakkola
A transponder for UHF RFID with sensor interface for external capacitive sensors is described. The sensor interface consists of a capacitive voltage divider and a 10 bit successive approximation analog to digital converter. The power consumption is about 30 muWDC and the transponder is wirelessly powered with RF waves from the reader device. Wireless measurement of capacitance is demonstrated at a distance of 30 cm with 0.5 W erp transmission power. Low operation distance is mostly due to low efficiency of the rectifying Schottky-diodes in the particular BiCMOS process.
{"title":"Wirelessly Powered Sensor Transponder for UHF RFID","authors":"P. Pursula, J. Marjonen, H. Ronkainen, K. Jaakkola","doi":"10.1109/SENSOR.2007.4300074","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300074","url":null,"abstract":"A transponder for UHF RFID with sensor interface for external capacitive sensors is described. The sensor interface consists of a capacitive voltage divider and a 10 bit successive approximation analog to digital converter. The power consumption is about 30 muWDC and the transponder is wirelessly powered with RF waves from the reader device. Wireless measurement of capacitance is demonstrated at a distance of 30 cm with 0.5 W erp transmission power. Low operation distance is mostly due to low efficiency of the rectifying Schottky-diodes in the particular BiCMOS process.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"54 1","pages":"73-76"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89453723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300654
D. Briand, L. Guillot, S. Raible, J. Kappler, N. D. de Rooij
This communication presents the miniaturization and the wafer level packaging (WLP) of micromachined metal-oxide (MOX) gas sensors. A combination of deep reactive ion etching of silicon(DRIE) combined with a drop coating of the gas sensitive material allows the direct WLP of the MOX sensors on silicon. Compared to the standard micromachined MOX gas sensors where the gas sensitive films are integrated on top of the dielectric membranes, here we propose the integration of the MOX films underneath the dielectric membrane in the cavity micromachined in the silicon wafer. Using this process, the gas sensors can be easily packaged at the wafer level by sealing the metal-oxide drops in the silicon cavities with a gas permeable membrane. This concept allows liquid-tight sealing of gas sensor devices, protecting them during wafer dicing and later in the application, while still allowing the target gases to reach the sensing layer. Miniaturized WLP low-power MOX gas sensors with a sensing area reduced to 100 times 100 mum2 and power consumption to less than 20 mW at 300degC were realized.
{"title":"Highly Integrated Wafer Level Packaged MOX Gas Sensors","authors":"D. Briand, L. Guillot, S. Raible, J. Kappler, N. D. de Rooij","doi":"10.1109/SENSOR.2007.4300654","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300654","url":null,"abstract":"This communication presents the miniaturization and the wafer level packaging (WLP) of micromachined metal-oxide (MOX) gas sensors. A combination of deep reactive ion etching of silicon(DRIE) combined with a drop coating of the gas sensitive material allows the direct WLP of the MOX sensors on silicon. Compared to the standard micromachined MOX gas sensors where the gas sensitive films are integrated on top of the dielectric membranes, here we propose the integration of the MOX films underneath the dielectric membrane in the cavity micromachined in the silicon wafer. Using this process, the gas sensors can be easily packaged at the wafer level by sealing the metal-oxide drops in the silicon cavities with a gas permeable membrane. This concept allows liquid-tight sealing of gas sensor devices, protecting them during wafer dicing and later in the application, while still allowing the target gases to reach the sensing layer. Miniaturized WLP low-power MOX gas sensors with a sensing area reduced to 100 times 100 mum2 and power consumption to less than 20 mW at 300degC were realized.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"1 1","pages":"2401-2404"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89852446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300324
Hyouk Kwon, Y. Yee, C. Jeong, H. Nam, Ki-Won Park, Gun-Woo Lee, J. Bu
This paper reports a microlens array (MLA) film with full fill factor and presents its application to organic light emitting diode (OLED) for improving outcoupling efficiency. Gapless MLA film having high sag ratio is proposed and fabricated by simple micromachining process including trench formation and conformal vapor phase deposition of polymer. As applying MLA film to OLED panel, the outcoupling efficiency increased by maximum 48%. High-sag MLA optical film with full fill factor is expected to give remarkable optical efficiency to various display or lighting applications of the flat panel light sources including OLED.
{"title":"Microlens Array Film with Full Fill Factor for Enhancing Outcoupling Efficiency from OLED Lighting","authors":"Hyouk Kwon, Y. Yee, C. Jeong, H. Nam, Ki-Won Park, Gun-Woo Lee, J. Bu","doi":"10.1109/SENSOR.2007.4300324","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300324","url":null,"abstract":"This paper reports a microlens array (MLA) film with full fill factor and presents its application to organic light emitting diode (OLED) for improving outcoupling efficiency. Gapless MLA film having high sag ratio is proposed and fabricated by simple micromachining process including trench formation and conformal vapor phase deposition of polymer. As applying MLA film to OLED panel, the outcoupling efficiency increased by maximum 48%. High-sag MLA optical film with full fill factor is expected to give remarkable optical efficiency to various display or lighting applications of the flat panel light sources including OLED.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"7 1","pages":"1091-1094"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89862025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-06-10DOI: 10.1109/SENSOR.2007.4300446
S. Chung, W. Park, Hyunsung Park, Kyoungsik Yu, N. Park, Sunghoon Kwon
We propose and demonstrate an optofluidic maskless lithography technique to fabricate various polymer microparticles and microwires in microfluidic channels. Combining maskless lithography and microfluidic systems, we demonstrate temporal and spatial control of polymeric micro structure generation in microfluidic channels.
{"title":"Optofluidic Maskless Lithography System","authors":"S. Chung, W. Park, Hyunsung Park, Kyoungsik Yu, N. Park, Sunghoon Kwon","doi":"10.1109/SENSOR.2007.4300446","DOIUrl":"https://doi.org/10.1109/SENSOR.2007.4300446","url":null,"abstract":"We propose and demonstrate an optofluidic maskless lithography technique to fabricate various polymer microparticles and microwires in microfluidic channels. Combining maskless lithography and microfluidic systems, we demonstrate temporal and spatial control of polymeric micro structure generation in microfluidic channels.","PeriodicalId":23295,"journal":{"name":"TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"49 1","pages":"1569-1572"},"PeriodicalIF":0.0,"publicationDate":"2007-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90825355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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