Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627790
K. Naka, S. Konishi
This paper proposes a breakthrough in application of pyrolyzed polymer in MEMS field. It is one of drawbacks of pyrolyzed polymer that high temperature pyrolysis promoting further carbonization is difficult to be combined with MEMS process. Available temperature used to be restricted below 1000 ° C. Our key strategy is to use a conductive pyrolyzed polymer structure prepared at low temperature as a heater for finishing pyrolysis at high temperature. The local heating of pyrolyzed polymer heaters allows further carbonization at higher temperature. The obtained material by our strategy shows similar feature to commercialized glassy carbon prepared beyond above restriction.
{"title":"Local Heating of Pyrolyzed Polymer Heaters for Further Carbonization at Higher Temperature","authors":"K. Naka, S. Konishi","doi":"10.1109/MEMSYS.2006.1627790","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627790","url":null,"abstract":"This paper proposes a breakthrough in application of pyrolyzed polymer in MEMS field. It is one of drawbacks of pyrolyzed polymer that high temperature pyrolysis promoting further carbonization is difficult to be combined with MEMS process. Available temperature used to be restricted below 1000 ° C. Our key strategy is to use a conductive pyrolyzed polymer structure prepared at low temperature as a heater for finishing pyrolysis at high temperature. The local heating of pyrolyzed polymer heaters allows further carbonization at higher temperature. The obtained material by our strategy shows similar feature to commercialized glassy carbon prepared beyond above restriction.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128849421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627939
Y. Yoshida, Y. Koga, A. Yamashita, K. Nishizawa, Y. Yokoyama, Y. Fujii, T. Hamaguchi, T. Nishino, M. Taguchi, M. Takeda
This paper presents a silicon-micromachined microstrip antenna in which both feeding power and ground interconnection are performed along the vertical direction of the substrate at the wafer level. The antenna has a stacked structure consisting of a patch antenna substrate and a feed substrate. The structure possesses the following novel points: (i) it satisfies both optimum design and ease of wafer handling in the fabrication process; (ii) the ground plane intervened in the microstrip antenna is interconnected by through-wafer vias. The measured radiation patterns of the developed antenna at an 80-GHz band showed good agreement with the designed patterns. This newly developed technology can be utilized for wafer-level stacking to achieve a compact array antenna in the millimeterwave range.
{"title":"A Millimeterwave Microstrip Antenna with Micromachined Wafer-Level Stacking Structure","authors":"Y. Yoshida, Y. Koga, A. Yamashita, K. Nishizawa, Y. Yokoyama, Y. Fujii, T. Hamaguchi, T. Nishino, M. Taguchi, M. Takeda","doi":"10.1109/MEMSYS.2006.1627939","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627939","url":null,"abstract":"This paper presents a silicon-micromachined microstrip antenna in which both feeding power and ground interconnection are performed along the vertical direction of the substrate at the wafer level. The antenna has a stacked structure consisting of a patch antenna substrate and a feed substrate. The structure possesses the following novel points: (i) it satisfies both optimum design and ease of wafer handling in the fabrication process; (ii) the ground plane intervened in the microstrip antenna is interconnected by through-wafer vias. The measured radiation patterns of the developed antenna at an 80-GHz band showed good agreement with the designed patterns. This newly developed technology can be utilized for wafer-level stacking to achieve a compact array antenna in the millimeterwave range.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131688127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627821
Chang‐Hwan Choi, S. Hagvall, J. Dunn, B. Wu, C. Kim
We report on various aspects of cell adhesion of fibrolasts over densely-populated sharp-tip nano-post structures, which we term “ NanoTurf”. The ability to control the size, shape, and aspect ratio of the nanostructures enabled the study on the effect of surface three-dimensionality of the cell-matrix adhesion in detail. To our best knowledge, this is the first systematic investigation of the nanometric three-dimensional surface topography effect on cell adhesions.
{"title":"Cell Adhesions on Nanoturf Surfaces","authors":"Chang‐Hwan Choi, S. Hagvall, J. Dunn, B. Wu, C. Kim","doi":"10.1109/MEMSYS.2006.1627821","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627821","url":null,"abstract":"We report on various aspects of cell adhesion of fibrolasts over densely-populated sharp-tip nano-post structures, which we term “ NanoTurf”. The ability to control the size, shape, and aspect ratio of the nanostructures enabled the study on the effect of surface three-dimensionality of the cell-matrix adhesion in detail. To our best knowledge, this is the first systematic investigation of the nanometric three-dimensional surface topography effect on cell adhesions.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133821561","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627873
C. Son, B. Ziaie
Wireless ionizing radiation sensors have a wide range of applications in areas such as radiation therapy, environmental monitoring, and homeland security. It is preferable to manufacture such sensors using passive elements since ionizing radiation can damage active electronic components. This paper reports the development of a first micromachined totally passive electret based wireless ionizing radiation dosimeter for high dose radiation therapy applications. Wireless Ionizing radiation measurement is performed by monitoring the resonance frequency change with a phase-dip technique. Device test results show that 60,000R gamma-ray ionizing radiation exposure produces a 687kHz resonance frequency shift resulting in a sensitivity of 11.45kHz/kR.
{"title":"Electret Based Wireless Micro Ionizing Radiation Dosimeter","authors":"C. Son, B. Ziaie","doi":"10.1109/MEMSYS.2006.1627873","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627873","url":null,"abstract":"Wireless ionizing radiation sensors have a wide range of applications in areas such as radiation therapy, environmental monitoring, and homeland security. It is preferable to manufacture such sensors using passive elements since ionizing radiation can damage active electronic components. This paper reports the development of a first micromachined totally passive electret based wireless ionizing radiation dosimeter for high dose radiation therapy applications. Wireless Ionizing radiation measurement is performed by monitoring the resonance frequency change with a phase-dip technique. Device test results show that 60,000R gamma-ray ionizing radiation exposure produces a 687kHz resonance frequency shift resulting in a sensitivity of 11.45kHz/kR.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"225 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115475722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627784
K. Yamazaki, H. Namatsu
We have devised a new resist-coating technique for three-dimensional (3D) substrates. The technique uses a quasi-static ambient of very fine mist and enables us to coat a resist film on a 3D substrate such as a cube. We found good conditions for obtaining a resist film with a uniform thickness and smooth surface and succeeded in coating polymethyl-methacrylate on a SiO2/Si cube. Moreover, electron-beam (EB) lithography on the cube resulted in similar patterns on each face of the top and side faces. This technique promises to enable 3D nanofabrication of various materials such as silicon with the resolution of EB lithography.
{"title":"New Resist-Coating Technique Using Fine Mist for Three-Dimensional Nanotechnology","authors":"K. Yamazaki, H. Namatsu","doi":"10.1109/MEMSYS.2006.1627784","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627784","url":null,"abstract":"We have devised a new resist-coating technique for three-dimensional (3D) substrates. The technique uses a quasi-static ambient of very fine mist and enables us to coat a resist film on a 3D substrate such as a cube. We found good conditions for obtaining a resist film with a uniform thickness and smooth surface and succeeded in coating polymethyl-methacrylate on a SiO2/Si cube. Moreover, electron-beam (EB) lithography on the cube resulted in similar patterns on each face of the top and side faces. This technique promises to enable 3D nanofabrication of various materials such as silicon with the resolution of EB lithography.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115925257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, we present the design and fabrication of innovative phononic crystals integrated with two sets of interdigital (IDT) electrodes for frequency band selection of surface acoustic waves (SAW). The potential applications of this device include performance improvement of SAW micro-sensors, front-end components in RF circuitries, and directional receptions of high frequency acoustic waves. Analogous to the band-gap generated by photonic crystals, the phononic crystals, two dimensional repetitive structures composed of two different elastic materials, can prohibit the propagation of elastic waves with either specific incident angles or certain bandwidth. In this paper, the prohibited bandwidth has been verified by fabricating the phononic crystals between a micromachined SAW resonator and a receiver. Both the resonator and receiver are composed of IDT electrodes deposited and patterned on a thin piezoelectric layer. To confine the prohibited bandwidth on the order of hundred MHz, the diameter of the circular pores in phononic crystals is designed to be 6 micron and the aspect ratio of each pore is 3:1. To maximize the power transduction from IDT electrodes to SAW, the spacing between two inter-digits is one-fourth the wavelength of SAW. Specifically, the spacing ranges from 3.4 microns to 9.0 microns, depending on the central frequency. Both surface and bulk micromachining are employed and integrated to fabricate the crystals as well as SAW resonator and receiver altogether. Firstly, a 1.5-micron zinc oxide, which provides well-defined central frequency, is sputtered and patterned onto silicon substrate.
{"title":"Design and Fabrication of 2D Phononic Crystals in Surface Acoustic wave Micro Devices","authors":"K. Gu, C. Chang, J. Shieh, W. Shih","doi":"10.1115/IMECE2005-82692","DOIUrl":"https://doi.org/10.1115/IMECE2005-82692","url":null,"abstract":"In this paper, we present the design and fabrication of innovative phononic crystals integrated with two sets of interdigital (IDT) electrodes for frequency band selection of surface acoustic waves (SAW). The potential applications of this device include performance improvement of SAW micro-sensors, front-end components in RF circuitries, and directional receptions of high frequency acoustic waves. Analogous to the band-gap generated by photonic crystals, the phononic crystals, two dimensional repetitive structures composed of two different elastic materials, can prohibit the propagation of elastic waves with either specific incident angles or certain bandwidth. In this paper, the prohibited bandwidth has been verified by fabricating the phononic crystals between a micromachined SAW resonator and a receiver. Both the resonator and receiver are composed of IDT electrodes deposited and patterned on a thin piezoelectric layer. To confine the prohibited bandwidth on the order of hundred MHz, the diameter of the circular pores in phononic crystals is designed to be 6 micron and the aspect ratio of each pore is 3:1. To maximize the power transduction from IDT electrodes to SAW, the spacing between two inter-digits is one-fourth the wavelength of SAW. Specifically, the spacing ranges from 3.4 microns to 9.0 microns, depending on the central frequency. Both surface and bulk micromachining are employed and integrated to fabricate the crystals as well as SAW resonator and receiver altogether. Firstly, a 1.5-micron zinc oxide, which provides well-defined central frequency, is sputtered and patterned onto silicon substrate.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114705542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627799
M. T. Richardson, Y. Gianchandani, D. Skala
This paper reports a detailed evaluation of batch mode micro-electro-discharge machining (μEDM) of 316L stainless steel. Lithographically fabricated copper tools with parallel line features of 5-50 μm width and 5-75 μm spacing were used to quantify trends in machining tolerance and the impact of debris accumulation. As tool feature density increased, debris accumulation effects began to dominate, eventually destroying both tool and workpiece. A two-step hydrodynamic debris removal technique yielded significant improvements in surface and edge finish, machining time, and tool wear over past work using standard vertical dither flushing.
{"title":"A Parametric Study of Dimensional Tolerance and Hydrodynamic Debris Removal in Micro-Electro-Discharge Machining","authors":"M. T. Richardson, Y. Gianchandani, D. Skala","doi":"10.1109/MEMSYS.2006.1627799","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627799","url":null,"abstract":"This paper reports a detailed evaluation of batch mode micro-electro-discharge machining (μEDM) of 316L stainless steel. Lithographically fabricated copper tools with parallel line features of 5-50 μm width and 5-75 μm spacing were used to quantify trends in machining tolerance and the impact of debris accumulation. As tool feature density increased, debris accumulation effects began to dominate, eventually destroying both tool and workpiece. A two-step hydrodynamic debris removal technique yielded significant improvements in surface and edge finish, machining time, and tool wear over past work using standard vertical dither flushing.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115079040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627724
Tao Li, R. Gianchandani, Y. Gianchandani
This paper describes a piezoelectric sensor integrated into a cavity at the tip of a biopsy needle intended for fine needle aspiration (FNA) of thyroid nodules. Located on a steel diaphragm of 300 µ m radius and 23 µ m average thickness, it is intended to aid in tissue differentiation, providing information that is complementary to any imaging method that may be used concurrently. The sensor is fabricated from bulk lead zirconate titanate (PZT) using a customized process. Micro electro-discharge machining is used to form a steel tool that is subsequently used for batch-mode ultrasonic machining of bulk PZT ceramic. The resulting sensor is 50 µ m thick and 200 µ m in diameter. Devices were tested in materials that mimic the texture of human tissue in the training of physicians, and were separately tested with porcine fat and muscle tissue. The magnitude and frequency of a resonant peak shows tissue-specific characteristics as the needle is inserted into tissue. For example, in the porcine tissue sample, the magnitude and peak frequency respectively change from ≈2118 Ω and ≈163 MHz to ≈562 Ω and ≈150 MHz as the needle moves from fat to muscle tissue.
{"title":"A Bulk PZT Microsensor for In-Situ Tissue Contrast Detection During Fine Needle Aspiration Biopsy of Thyroid Nodules","authors":"Tao Li, R. Gianchandani, Y. Gianchandani","doi":"10.1109/MEMSYS.2006.1627724","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627724","url":null,"abstract":"This paper describes a piezoelectric sensor integrated into a cavity at the tip of a biopsy needle intended for fine needle aspiration (FNA) of thyroid nodules. Located on a steel diaphragm of 300 µ m radius and 23 µ m average thickness, it is intended to aid in tissue differentiation, providing information that is complementary to any imaging method that may be used concurrently. The sensor is fabricated from bulk lead zirconate titanate (PZT) using a customized process. Micro electro-discharge machining is used to form a steel tool that is subsequently used for batch-mode ultrasonic machining of bulk PZT ceramic. The resulting sensor is 50 µ m thick and 200 µ m in diameter. Devices were tested in materials that mimic the texture of human tissue in the training of physicians, and were separately tested with porcine fat and muscle tissue. The magnitude and frequency of a resonant peak shows tissue-specific characteristics as the needle is inserted into tissue. For example, in the porcine tissue sample, the magnitude and peak frequency respectively change from ≈2118 Ω and ≈163 MHz to ≈562 Ω and ≈150 MHz as the needle moves from fat to muscle tissue.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115117541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627800
D. Cheng, M. Gosálvez, M. Shikida, K. Sato
We propose a new explanation for the difference between the etching properties of potassium-hydroxide (KOH) and tetramethyl-ammonium-hydroxide (TMAH) by focusing on the volume fraction occupied by the corresponding cations, K+for KOH and TMA+(with molecular structure N(CH3)4+) for TMAH. We have found experimentally that the differences in the surface morphology of Si(111) after etching can be explained by considering the cation volume fraction and that this parameter can also be used to explain the changes in the etch rates between different etchants, or between different concentrations of the same etchant, suggesting a universal behavior for any etching system. This finding simplifies the understanding of the mechanism of silicon anisotropic etching.
{"title":"A Universal Parameter for Silicon Anisotropic Etching Inalkaline Solutions","authors":"D. Cheng, M. Gosálvez, M. Shikida, K. Sato","doi":"10.1109/MEMSYS.2006.1627800","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627800","url":null,"abstract":"We propose a new explanation for the difference between the etching properties of potassium-hydroxide (KOH) and tetramethyl-ammonium-hydroxide (TMAH) by focusing on the volume fraction occupied by the corresponding cations, K+for KOH and TMA+(with molecular structure N(CH3)4+) for TMAH. We have found experimentally that the differences in the surface morphology of Si(111) after etching can be explained by considering the cation volume fraction and that this parameter can also be used to explain the changes in the etch rates between different etchants, or between different concentrations of the same etchant, suggesting a universal behavior for any etching system. This finding simplifies the understanding of the mechanism of silicon anisotropic etching.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116931802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/MEMSYS.2006.1627765
Ting Chen, Y. Chuang, F. Tseng
A novel surface wettability switchable device was successfully demonstrated by changing the surface morphology to induce contact angle change. The surface morphology transformation carried out from the deflection of thin PDMS membrane, driven by electrostatic force, can dynamically change the surface contact angle from 131 ° to 152 ° based on the contact area variation. The electrostatic energy can be throughout shielded out from droplets thanks to ground shielding effect. Since there is no direct physical or chemical (thermal, electrical, UV light etc.) interference from this actuation mean to biological solutions, the proposed method has great potential on microscale droplet transportation and is suitable to many applications especially digital fluidic systems.
{"title":"A Wettability Switchable Surface Driven by Electrostatic Induced Surface Morphology Change Without Energy Interference On Reagents in Droplets","authors":"Ting Chen, Y. Chuang, F. Tseng","doi":"10.1109/MEMSYS.2006.1627765","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627765","url":null,"abstract":"A novel surface wettability switchable device was successfully demonstrated by changing the surface morphology to induce contact angle change. The surface morphology transformation carried out from the deflection of thin PDMS membrane, driven by electrostatic force, can dynamically change the surface contact angle from 131 ° to 152 ° based on the contact area variation. The electrostatic energy can be throughout shielded out from droplets thanks to ground shielding effect. Since there is no direct physical or chemical (thermal, electrical, UV light etc.) interference from this actuation mean to biological solutions, the proposed method has great potential on microscale droplet transportation and is suitable to many applications especially digital fluidic systems.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117134150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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