2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529938
A. Singulani, H. Ceric, L. Filipovic, E. Langer
The through Silicon Via (TSV) is a lead topic in interconnects and 3D integration research, mainly due to numerous anticipated advantages. However, several challenges must still be overcome if large scale production is to be achieved. In this work, we have studied the effects of Bosch scallops concerning mechanical reliability for a specific TSV technology. The presence of scallops on the TSV wall modifies the stress distribution along the via. By means of Finite Element Method (FEM) simulations, we assess this change in order to better understand the process. The achieved results support experiments and give further insight into the influence of scallops on the stress in an open TSV.
{"title":"Impact of bosch scallops dimensions on stress of an open through Silicon Via technology","authors":"A. Singulani, H. Ceric, L. Filipovic, E. Langer","doi":"10.1109/EUROSIME.2013.6529938","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529938","url":null,"abstract":"The through Silicon Via (TSV) is a lead topic in interconnects and 3D integration research, mainly due to numerous anticipated advantages. However, several challenges must still be overcome if large scale production is to be achieved. In this work, we have studied the effects of Bosch scallops concerning mechanical reliability for a specific TSV technology. The presence of scallops on the TSV wall modifies the stress distribution along the via. By means of Finite Element Method (FEM) simulations, we assess this change in order to better understand the process. The achieved results support experiments and give further insight into the influence of scallops on the stress in an open TSV.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127551897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529934
M. Roellig, R. Metasch, A. Schingale, A. Schiessl, K. Meier, N. Meyendorf
The paper presents an approach to bring numerical simulation and electronic design engineering closer together. In focus is the development of a design support tool, based on Finite Element Analysis as an automated running system behind an engineer adapted Graphical User Interface platform. The Quick Predict tool will have the capability to fast calculated mechanical stresses on PCB and electronic components, which are loaded by vibration. Vibration loading usually occurs in mobile transportation systems or mechanical motion systems. The paper presents the solution of the easy and quick input of geometry variations, material variation and different vibration scenarios reflected on the example of an Electronic Control Unit (ECU). The automated generation of the virtual model is based on the available general design parameter. A set of material data was determined experimentally. A suitable way to insert material data variations for PCB with low effort on measurements was developed and integrated. The engineers target to achieve, with the approach, is to improve vibration resistivity of electronic components or to design new configurations of PCB with vibration critical components with very low time consumption.
{"title":"Novel quick predict approach for identification of critical loadings in electronic components on PCB under vibration realized as design support tool","authors":"M. Roellig, R. Metasch, A. Schingale, A. Schiessl, K. Meier, N. Meyendorf","doi":"10.1109/EUROSIME.2013.6529934","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529934","url":null,"abstract":"The paper presents an approach to bring numerical simulation and electronic design engineering closer together. In focus is the development of a design support tool, based on Finite Element Analysis as an automated running system behind an engineer adapted Graphical User Interface platform. The Quick Predict tool will have the capability to fast calculated mechanical stresses on PCB and electronic components, which are loaded by vibration. Vibration loading usually occurs in mobile transportation systems or mechanical motion systems. The paper presents the solution of the easy and quick input of geometry variations, material variation and different vibration scenarios reflected on the example of an Electronic Control Unit (ECU). The automated generation of the virtual model is based on the available general design parameter. A set of material data was determined experimentally. A suitable way to insert material data variations for PCB with low effort on measurements was developed and integrated. The engineers target to achieve, with the approach, is to improve vibration resistivity of electronic components or to design new configurations of PCB with vibration critical components with very low time consumption.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131975594","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529973
M. Bedier, X. Rottenberg, V. Rochus, R. Abdelrassoul, H. Tilmans
Passive elements such as tunable capacitors are highly needed in wireless communication applications such as Voltage Controlled Oscillators (VCO) and switchable or tunable filters. In this paper, the design and modeling of a triangular shaped RF-MEMS switched air-gap capacitor using imec's SiGe-MEMS technology is presented. Low actuation voltage (<; 3 Volts), a capacitance ratio of around 7, an up-state capacitance of 20 fF and a high electrical quality factor (> 100) were achieved. A serpentine suspension was employed to build a low stiffness (less than 0.07 N/m) structure capable of achieving the low actuation voltage.
{"title":"Triangular-shaped RF MEMS switched air gap capacitor in imec's SiGe-MEMS platform","authors":"M. Bedier, X. Rottenberg, V. Rochus, R. Abdelrassoul, H. Tilmans","doi":"10.1109/EUROSIME.2013.6529973","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529973","url":null,"abstract":"Passive elements such as tunable capacitors are highly needed in wireless communication applications such as Voltage Controlled Oscillators (VCO) and switchable or tunable filters. In this paper, the design and modeling of a triangular shaped RF-MEMS switched air-gap capacitor using imec's SiGe-MEMS technology is presented. Low actuation voltage (<; 3 Volts), a capacitance ratio of around 7, an up-state capacitance of 20 fF and a high electrical quality factor (> 100) were achieved. A serpentine suspension was employed to build a low stiffness (less than 0.07 N/m) structure capable of achieving the low actuation voltage.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134222069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529889
B. Ozturk, P. Gromala, C. Silber, K. Jansen, L. Ernst
Highly filled epoxy-based adhesives are used as thermal and electrical interfaces in automotive electronics. The successful design for reliability of electronic packages depends on understanding and modeling the fatigue behavior of these materials. Both mechanical and thermal loadings are varying in a cyclic manner in test or field conditions. To establish an adequate constitutive model describing the thermo-mechanical behavior under cyclic mechanical and thermal loading, material testing is required on a dedicated test specimen. Current specimen geometries which are used to describe fatigue behavior of highly filled epoxy-based materials fail to describe the mechanical behavior. They contain stress concentrations near the clamping area, which leads to the failure within these areas and not in the reduced section of the beam. In this paper, a new test sample with dogbone geometry is designed by utilizing finite element analysis (FEA). A design space (DoE) is used to analyze the effect of important parameters (e.g. thickness, length and radius) that influence the stress distribution. The optimum design point is selected by FEA of stresses in the reduced section of the beam and near the clamping. In order to validate the simulations, experiments are done with samples, which are produced with the help of PTFE coated steel molds. This approach is shown to improve the existing dogbone designs and validity of the low cycle fatigue testing.
{"title":"Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications","authors":"B. Ozturk, P. Gromala, C. Silber, K. Jansen, L. Ernst","doi":"10.1109/EUROSIME.2013.6529889","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529889","url":null,"abstract":"Highly filled epoxy-based adhesives are used as thermal and electrical interfaces in automotive electronics. The successful design for reliability of electronic packages depends on understanding and modeling the fatigue behavior of these materials. Both mechanical and thermal loadings are varying in a cyclic manner in test or field conditions. To establish an adequate constitutive model describing the thermo-mechanical behavior under cyclic mechanical and thermal loading, material testing is required on a dedicated test specimen. Current specimen geometries which are used to describe fatigue behavior of highly filled epoxy-based materials fail to describe the mechanical behavior. They contain stress concentrations near the clamping area, which leads to the failure within these areas and not in the reduced section of the beam. In this paper, a new test sample with dogbone geometry is designed by utilizing finite element analysis (FEA). A design space (DoE) is used to analyze the effect of important parameters (e.g. thickness, length and radius) that influence the stress distribution. The optimum design point is selected by FEA of stresses in the reduced section of the beam and near the clamping. In order to validate the simulations, experiments are done with samples, which are produced with the help of PTFE coated steel molds. This approach is shown to improve the existing dogbone designs and validity of the low cycle fatigue testing.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134222649","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529904
F. Roqueta, K. Tahri
The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.
{"title":"Protection Power device performance investigation using TCAD simulations","authors":"F. Roqueta, K. Tahri","doi":"10.1109/EUROSIME.2013.6529904","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529904","url":null,"abstract":"The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"123 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134601485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529910
M. Lederer, B. Czerny, B. Nagl, A. Trnka, G. Khatibi, M. Thoben
Fatigue failure of wire-bonds is one of the key factors limiting the lifetime of power electronic devices. In IGBT (insulated gate bipolar transistor) modules, wire-bonds are exposed to repeated temperature changes leading to thermo-mechanical stresses in the constituent materials. Due to the geometry, stress concentrations arise at the interfaces of aluminum wires and silicon chips. In the framework of classical continuum mechanics, these stress concentrations show the characteristics of stress singularities. Nevertheless, IGBT modules reach lifetimes of about 30 years under service conditions. Therefore, it seems that classical continuum mechanics exaggerates the stress concentrations occurring at the material transitions. Hence, it is the subject of the present investigation to calculate more realistic stress distributions using a novel strain gradient theory.
{"title":"Simulation of stress concentrations in wire-bonds using a novel strain gradient theory","authors":"M. Lederer, B. Czerny, B. Nagl, A. Trnka, G. Khatibi, M. Thoben","doi":"10.1109/EUROSIME.2013.6529910","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529910","url":null,"abstract":"Fatigue failure of wire-bonds is one of the key factors limiting the lifetime of power electronic devices. In IGBT (insulated gate bipolar transistor) modules, wire-bonds are exposed to repeated temperature changes leading to thermo-mechanical stresses in the constituent materials. Due to the geometry, stress concentrations arise at the interfaces of aluminum wires and silicon chips. In the framework of classical continuum mechanics, these stress concentrations show the characteristics of stress singularities. Nevertheless, IGBT modules reach lifetimes of about 30 years under service conditions. Therefore, it seems that classical continuum mechanics exaggerates the stress concentrations occurring at the material transitions. Hence, it is the subject of the present investigation to calculate more realistic stress distributions using a novel strain gradient theory.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133978996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529900
C. Durand, M. Klingler, D. Coutellier, H. Naceur
A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a copper clip soldered on the top side of the chip. The successful design for increased reliability of this electronic package depends on better understanding and modeling its fatigue behavior and its failure mechanisms. During Active Power Cycling tests, the chip acts as a heat source and temperature gradients develop in the package causing expansion of the different materials. To assess the reliability of those devices under thermal power cycling loads, both experiments and simulations have to be performed. Some failures were already observed after Active Power Cycling tests, but they do not correspond to failures usually observed in standard MOSFET packages, and thus are not thoroughly understood. For instance, the formation of a wave in the aluminum metallization layer, on top of the chip, caused by a high deformation grade, was never described. High operating life of more than 1 million cycles can be achieved by optimizing clip geometry and thicknesses of metal layers. Such packages are then clearly more robust compared to those using wire bond technology. In this paper, failures observed via testing are confronted with thermal and mechanical stresses distribution computed by Finite Element Analysis in order to improve the understanding of failure formation mechanisms. A 2D Finite Element model of MOSFET packages is used to analyze mechanical stresses induced by thermal loads. Simulations help in determining critical areas and then in improving the design of modules.
{"title":"Confrontation of failure mechanisms observed during Active Power Cycling tests with finite element analyze performed on a MOSFET power module","authors":"C. Durand, M. Klingler, D. Coutellier, H. Naceur","doi":"10.1109/EUROSIME.2013.6529900","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529900","url":null,"abstract":"A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a copper clip soldered on the top side of the chip. The successful design for increased reliability of this electronic package depends on better understanding and modeling its fatigue behavior and its failure mechanisms. During Active Power Cycling tests, the chip acts as a heat source and temperature gradients develop in the package causing expansion of the different materials. To assess the reliability of those devices under thermal power cycling loads, both experiments and simulations have to be performed. Some failures were already observed after Active Power Cycling tests, but they do not correspond to failures usually observed in standard MOSFET packages, and thus are not thoroughly understood. For instance, the formation of a wave in the aluminum metallization layer, on top of the chip, caused by a high deformation grade, was never described. High operating life of more than 1 million cycles can be achieved by optimizing clip geometry and thicknesses of metal layers. Such packages are then clearly more robust compared to those using wire bond technology. In this paper, failures observed via testing are confronted with thermal and mechanical stresses distribution computed by Finite Element Analysis in order to improve the understanding of failure formation mechanisms. A 2D Finite Element model of MOSFET packages is used to analyze mechanical stresses induced by thermal loads. Simulations help in determining critical areas and then in improving the design of modules.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"53 57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117171644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529939
F. Sayed, T. Aftab, M. Eker, D. Hohlfeld, T. Bechtold, J. Korvink
This paper proposes a novel modeling methodology for MEMS-based piezoelectric vibration energy harvesting systems. The approach is based on coupling of the reduced order model and the power circuitry. A numerically accurate reduced order model of the harvester was connected to a synchronized switch harvesting on inductor scheme and optimized subsequently. The harvester output voltage was increased by 17% under open circuit condition.
{"title":"Reduced order modeling enables system level simulation of a MEMS piezoelectric energy harvester with a self-supplied SSHI-scheme","authors":"F. Sayed, T. Aftab, M. Eker, D. Hohlfeld, T. Bechtold, J. Korvink","doi":"10.1109/EUROSIME.2013.6529939","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529939","url":null,"abstract":"This paper proposes a novel modeling methodology for MEMS-based piezoelectric vibration energy harvesting systems. The approach is based on coupling of the reduced order model and the power circuitry. A numerically accurate reduced order model of the harvester was connected to a synchronized switch harvesting on inductor scheme and optimized subsequently. The harvester output voltage was increased by 17% under open circuit condition.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"278 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123714943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529899
J. Li, J. Makkonen, M. Broas, J. Hokka, T. Mattila, M. Paulasto-Krockel, J. Meng, A. Dasgupta
In this paper the shock impact reliability of a MEMS microphone is studied through experiments and finite element simulations. The maximum acceleration tolerance of the device is studied and the effect of shock impact orientation is also investigated. Finite element method is employed to determine the potential failure locations of the MEMS structure. Several challenges of the modeling process, such as the large differences in dimension, the complexity of the structures, and the material properties of the materials in the MEMS devices, are investigated and solutions are presented. The shock impact response simulations are used to determine the mechanical response of the MEMS structures. The contact between the backplate and diaphragm is also included in the simulation investigations. The deformations of these membranes are related to the vibration modes excited by the shock impact and the stress concentration regions are regarded as potential failure sites. The predicted failure sites are in good agreement with the experimental findings. The modeling results are used to explain the failure mechanisms related to the observed failure modes. Furthermore, it is found that both the acceleration limits and the fatigue life characterization are dependent strongly on the impact orientation. This work gives insights into the reliability of MEMS microphones under shock impact loading. Different failure modes are distinguished through shock impact tests with different acceleration levels. The simulation approach deepens the understanding of deformation and stress states in the MEMS structures.
{"title":"Reliability assessment of a MEMS microphone under shock impact loading","authors":"J. Li, J. Makkonen, M. Broas, J. Hokka, T. Mattila, M. Paulasto-Krockel, J. Meng, A. Dasgupta","doi":"10.1109/EUROSIME.2013.6529899","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529899","url":null,"abstract":"In this paper the shock impact reliability of a MEMS microphone is studied through experiments and finite element simulations. The maximum acceleration tolerance of the device is studied and the effect of shock impact orientation is also investigated. Finite element method is employed to determine the potential failure locations of the MEMS structure. Several challenges of the modeling process, such as the large differences in dimension, the complexity of the structures, and the material properties of the materials in the MEMS devices, are investigated and solutions are presented. The shock impact response simulations are used to determine the mechanical response of the MEMS structures. The contact between the backplate and diaphragm is also included in the simulation investigations. The deformations of these membranes are related to the vibration modes excited by the shock impact and the stress concentration regions are regarded as potential failure sites. The predicted failure sites are in good agreement with the experimental findings. The modeling results are used to explain the failure mechanisms related to the observed failure modes. Furthermore, it is found that both the acceleration limits and the fatigue life characterization are dependent strongly on the impact orientation. This work gives insights into the reliability of MEMS microphones under shock impact loading. Different failure modes are distinguished through shock impact tests with different acceleration levels. The simulation approach deepens the understanding of deformation and stress states in the MEMS structures.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123965336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529988
R. O'Keeffe, N. Jackson, F. Waldron, M. O'Niell, K. McCarthy, A. Mathewson
A COMSOL MultiphysicsR model was created which provides accurate information on the resonant frequency, stress and power output of an ALN piezoelectric device. The maximum error in the resonant frequency was found to be 4%. The models accurately predicted the trend of the output power for external impedances as well as the matched impedance for maximum energy harvesting. The expected voltage and current output for 1g acceleration was also be modeled.
{"title":"Investigation into modelling power output for MEMS energy harvesting devices using COMSOL MultiphysicsR","authors":"R. O'Keeffe, N. Jackson, F. Waldron, M. O'Niell, K. McCarthy, A. Mathewson","doi":"10.1109/EUROSIME.2013.6529988","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529988","url":null,"abstract":"A COMSOL MultiphysicsR model was created which provides accurate information on the resonant frequency, stress and power output of an ALN piezoelectric device. The maximum error in the resonant frequency was found to be 4%. The models accurately predicted the trend of the output power for external impedances as well as the matched impedance for maximum energy harvesting. The expected voltage and current output for 1g acceleration was also be modeled.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125949498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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