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2017 IEEE Radiation Effects Data Workshop (REDW)最新文献

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Single event effect and total ionizing dose assessment of commercial optical coherent DSP ASIC 商用光相干DSP专用集成电路的单事件效应和总电离剂量评估
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115466
Raichelle J. Aniceto, Slaven Moro, R. Milanowski, C. Isabelle, N. Hall, B. Vermeire, K. Cahoy
Experimental assessment of commercial 100/200 Gbps optical coherent DSP modem ASIC completed with 64 MeV and 480 MeV proton radiation test campaigns. Single event effect cross sections calculated and no performance degradation observed for proton fluence levels up to 1.27×1012 p/cm2 with equivalent total ionizing dose exposure to 170 krad(Si).
商用100/200 Gbps光相干DSP调制解调器ASIC的实验评估,完成64 MeV和480 MeV质子辐射测试活动。计算了单事件效应截面,在质子通量水平高达1.27×1012 p/cm2,总电离剂量暴露于170 krad(Si)时,未观察到性能下降。
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引用次数: 5
Experimental methods and results for the evaluation of triple modular redundancy SEU mitigation techniques with the Xilinx Kintex-7 FPGA 基于Xilinx Kintex-7 FPGA的三模冗余SEU缓解技术评估的实验方法和结果
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115451
K. Sielewicz, G. Rinella, M. Bonora, P. Giubilato, M. Lupi, M. Rossewij, J. Schambach, T. Vanat
This paper describes experimental methods and results for the evaluation of triple modular redundancy SEU mitigation techniques with the Xilinx Kintex-7 FPGA. Testing was performed both in proton irradiation and fault injection tests.
本文介绍了基于Xilinx Kintex-7 FPGA的三模冗余SEU缓解技术评估的实验方法和结果。在质子辐照和断层注入试验中进行了测试。
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引用次数: 15
Radiation evaluation of the CDCLVP111-SP low voltage 1:10 LVPECL clock distributor CDCLVP111-SP低压1:10 LVPECL时钟分配器的辐射评价
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115461
J. Cruz-Colon, V. Narayanan, W. Vonbergen, R. G. Roybal, R. Baumann
Single Events Effect (SEE) characterization results for LVPECL 1:10 Clock Distributor is summarized, showing very robust SEE performance up to LETeff=69.2 MeV-cm2/mg.
总结了LVPECL 1:10时钟分配器的单事件效应(SEE)表征结果,显示出非常稳健的SEE性能,高达LETeff=69.2 MeV-cm2/mg。
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引用次数: 0
Single event upset characterization of the Tegra K1 mobile processor using proton irradiation Tegra K1移动处理器的质子辐照单事件扰动表征
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115446
Haibin Wang, Qingyu Chen, Li Chen, D. Hiemstra, V. Kirischian
Vroton induced SEU cross-sections of Tegra K1 mobile processor are presented. Overall upset rates of Tegra K1 in the space radiation environment are estimated.
给出了Tegra K1移动处理器的Vroton诱导SEU截面。估算了Tegra K1在空间辐射环境中的总体扰动率。
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引用次数: 6
Radiation effects characterization of TI LMH5401-SP ultra-wideband fully differential amplifier (FDA) TI LMH5401-SP超宽带全差分放大器(FDA)辐射效应表征
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115459
S. Narayanan, V. Narayanan, C. Yots, J. Cruz-Colon
The SEE, TID, and SET effects of the LMH5401-SP, industry leading fully differential amplifier, are presented. No latch up events were observed up to an LET of 85 MeV.cm2/mg at 125 C.
介绍了业界领先的全差分放大器LMH5401-SP的SEE、TID和SET效应。在85 MeV的LET下未观察到闩锁事件。cm2/mg在125℃。
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引用次数: 0
SEE test results for the Snapdragon 820 骁龙820 SEE测试结果
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115452
S. Guertin, M. Cui
SEE test results are presented for proton, neutron, and heavy ion testing of the Qualcomm Snapdragon 820 and its support DDR4 device (in this case the SK Hynix 24 Gb LP DDR4 device H9HKNNNDGUMUBR-NMH). Processor crashes and DDR4 stuck bits are the primary SEE types for protons and neutrons. Test preparation difficulties and software limitations caused test efforts to be limited to processor crashes, SEFIs and SBU, and Stuck Bits in the DDR4 device. Interpretation of results is complicated by mixing of errors between devices.
给出了高通骁龙820及其支持的DDR4器件(本例中为SK海力士24 Gb LP DDR4器件H9HKNNNDGUMUBR-NMH)的质子、中子和重离子测试结果。处理器崩溃和DDR4卡位是质子和中子的主要SEE类型。测试准备困难和软件限制导致测试工作仅限于处理器崩溃,sefi和SBU,以及DDR4设备中的卡位。由于仪器之间的误差混合在一起,结果的解释变得复杂。
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引用次数: 7
Single event effect assessment of a 1-Mbit commercial magneto-resistive random access memory (MRAM) 1 mbit商用磁阻随机存取存储器(MRAM)的单事件效应评估
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115456
P. Adell, Slaven Moro, L. Gouyet, C. Chatry, B. Vermeire
Single event effect susceptibility of a 1-Mbit commercial MRAM was experimentally evaluated. The memory exhibited SEFIs when operated in a dynamic mode with an LET threshold of 2.29 MeV.cm2/mg and a saturated cross section of 2.2×10−4 cm2/device. The memory was not sensitive to SEL, SEU or MBUs.
实验评估了1 mbit商用MRAM的单事件效应磁化率。在LET阈值为2.29 MeV的动态模式下,存储器表现出sefi。Cm2 /mg和饱和截面2.2×10−4 Cm2 /装置。记忆对SEL、SEU和MBUs不敏感。
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引用次数: 7
Heavy-ion device cross-section response in magnetic tunnel junctions for a radiation hardened 16Mb magnetoresistive random access memory (MRAM) 辐射硬化16Mb磁阻随机存储器(MRAM)重离子器件在磁隧道结中的截面响应
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115455
R. Katti
Heavy-ion device effect cross-sections from irradiated MRAM Magnetic Tunnel Junctions are LET/atomic number, and not fluence, dominated, with distribution tails similar to thermally-accelerated resistance and magnetoresistance shifts that also depend physically on the tunnel barrier.
受辐照的MRAM磁隧道结的重离子器件效应截面以LET/原子序数为主,而不是以通量为主,其分布尾巴类似于热加速电阻和磁电阻位移,也依赖于物理上的隧道势垒。
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引用次数: 5
Heavy ion and proton induced radiation effects on differential bus transceiver microcircuits 重离子和质子诱导辐射对差分总线收发器微电路的影响
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115479
R. Koga, S. Davis, J. George
We present observations of heavy ion and proton induced radiation effects on selected COTS differential bus integrated microcircuits.
我们观察了重离子和质子诱导辐射对选定的COTS差动总线集成微电路的影响。
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引用次数: 1
1.8 MeV proton testing of thermally stabilized GaN HEMT RF power devices in three operational modes 三种工作模式下热稳定GaN HEMT射频功率器件的1.8 MeV质子测试
Pub Date : 2017-07-01 DOI: 10.1109/NSREC.2017.8115472
M. Mccurdy, peixiong zhao, D. Fleetwood, K. Bole, B. Poling
We report summary test results of commercially available GaN HEMT RF power devices from Cree and Qorvo, Inc., with 1.8 MeV protons in three operational modes. Tested parameters include threshold voltage, transconductance, and S-parameters representative of RF/power performance. Thermoelectric cooling was used to minimize thermally induced parametric shifts.
我们报告了来自Cree和Qorvo公司的市售GaN HEMT射频功率器件的总结测试结果,该器件在三种工作模式下具有1.8 MeV的质子。测试参数包括阈值电压、跨导和代表RF/功率性能的s参数。热电冷却被用来最小化热引起的参数位移。
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引用次数: 0
期刊
2017 IEEE Radiation Effects Data Workshop (REDW)
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