Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906508
K. Hosokawa, R. Maeda
In this paper, a novel optical method for monitoring of local pressure in a microfluidic device using a deformable diffraction grating is presented. A test device was fabricated with transparent silicone elastomer-polydimethylsiloxane (PDMS)-using the replica molding technique. A diffraction grating of 2 mm/spl times/2 mm area and a microchannel of 200 /spl mu/m width and 20 /spl mu/m depth are defined by the conformal contact between a PDMS chip and a glass plate. The grating consists of 5 /spl mu/m wide, 2 /spl mu/m deep rectangular grooves arrayed with period of 10 /spl mu/m, and it is connected to access ports with the microchannel. Optical response of the device to internal pressure ranging from 0 to -80 kPa is presented and compared with theoretical prediction. It is also demonstrated that the test device can be used for measurement of air flow rate ranging form 0 to 0.3 cc/min. The major advantages of this method are simple fabrication and flexible design. This method is not only desirable for flow characterization of microfluidic devices, but also opens up the possibility of new types of fiber-optic pressure sensors and pressure-driven optical modulators.
{"title":"In-line pressure monitoring for microfluidic devices using a deformable diffraction grating","authors":"K. Hosokawa, R. Maeda","doi":"10.1109/MEMSYS.2001.906508","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906508","url":null,"abstract":"In this paper, a novel optical method for monitoring of local pressure in a microfluidic device using a deformable diffraction grating is presented. A test device was fabricated with transparent silicone elastomer-polydimethylsiloxane (PDMS)-using the replica molding technique. A diffraction grating of 2 mm/spl times/2 mm area and a microchannel of 200 /spl mu/m width and 20 /spl mu/m depth are defined by the conformal contact between a PDMS chip and a glass plate. The grating consists of 5 /spl mu/m wide, 2 /spl mu/m deep rectangular grooves arrayed with period of 10 /spl mu/m, and it is connected to access ports with the microchannel. Optical response of the device to internal pressure ranging from 0 to -80 kPa is presented and compared with theoretical prediction. It is also demonstrated that the test device can be used for measurement of air flow rate ranging form 0 to 0.3 cc/min. The major advantages of this method are simple fabrication and flexible design. This method is not only desirable for flow characterization of microfluidic devices, but also opens up the possibility of new types of fiber-optic pressure sensors and pressure-driven optical modulators.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122966861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906517
D.P. O'Brien, T. Nichols, M. Allen
Flexible microelectrode arrays (FMAs) allow interfacing to delicate living tissues such as neural tissue with a minimum of physical disruption of that tissue during and after insertion. This physical disruption is minimized since the compliant FMAs can deform along with the tissue. However, a problem with these arrays is the insertion and subsequent precise positioning of the arrays in the tissue. Previous FMAs required hand assembly of the flexible array with another rigid structure. This may not be feasible if the dimensions of the flexible array are too small. In this work, FMAs with integrated rigid insertion devices were designed, fabricated, and assessed. Thin-film technology and electrodeposition were used to create flexible arrays with attached rigid insertion devices in a single sequence of fabrication steps. These arrays can be designed in two different configurations. The first type allows for flexible electrodes to be sewn through a nerve. The second allows for insertion into a surface such as the cerebral cortex or the spinal cord. After insertion, the rigid portion of the FMA is removed from the tissue with the flexible portion remaining behind. These two implantation schemes were tested on tissue models and found to be straightforward and reliable. In addition, comparisons of the potential to cause tissue damage between flexible and rigid arrays of similar dimensions were made under three different conditions of mechanical perturbation. In all cases, FMAs caused no damage to the tissue model above that caused by the original electrode insertion track while rigid arrays caused significant tearing. Finally, FMAs were shown to successfully stimulate neural tissue in an experimental setting.
{"title":"Flexible microelectrode arrays with integrated insertion devices","authors":"D.P. O'Brien, T. Nichols, M. Allen","doi":"10.1109/MEMSYS.2001.906517","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906517","url":null,"abstract":"Flexible microelectrode arrays (FMAs) allow interfacing to delicate living tissues such as neural tissue with a minimum of physical disruption of that tissue during and after insertion. This physical disruption is minimized since the compliant FMAs can deform along with the tissue. However, a problem with these arrays is the insertion and subsequent precise positioning of the arrays in the tissue. Previous FMAs required hand assembly of the flexible array with another rigid structure. This may not be feasible if the dimensions of the flexible array are too small. In this work, FMAs with integrated rigid insertion devices were designed, fabricated, and assessed. Thin-film technology and electrodeposition were used to create flexible arrays with attached rigid insertion devices in a single sequence of fabrication steps. These arrays can be designed in two different configurations. The first type allows for flexible electrodes to be sewn through a nerve. The second allows for insertion into a surface such as the cerebral cortex or the spinal cord. After insertion, the rigid portion of the FMA is removed from the tissue with the flexible portion remaining behind. These two implantation schemes were tested on tissue models and found to be straightforward and reliable. In addition, comparisons of the potential to cause tissue damage between flexible and rigid arrays of similar dimensions were made under three different conditions of mechanical perturbation. In all cases, FMAs caused no damage to the tissue model above that caused by the original electrode insertion track while rigid arrays caused significant tearing. Finally, FMAs were shown to successfully stimulate neural tissue in an experimental setting.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126638421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906597
P. Dubois, B. Guldimann, M. Gretillat, N. D. de Rooij
An electrostatically actuated gas microvalve has been designed, fabricated and characterized. This valve is composed of a vertically moving, double-clamped Ta-Si-N membrane, located over a small (10 /spl mu/m), round orifice machined by deep reactive ion etching (DRIE) through the silicon substrate. The valve can be actuated as an on/off switch, or using pulse width modulation (PWM) to achieve a controlled flow rate. To our knowledge, previously reported, electrostatically actuated microvalves have had much larger orifices, which limited the operating pressures to less than 200 mbar, an order of magnitude lower than the valve presented. Furthermore, a controlled flow rate using PWM has never been demonstrated experimentally. The valve reported here thus represents the first working MEMS device integrating a sputtered Ta-Si-N layer, for use at differential pressures greater than 2 bar and capable of achieving controlled flow rates.
{"title":"Electrostatically actuated gas microvalve based on a Ta-Si-N membrane","authors":"P. Dubois, B. Guldimann, M. Gretillat, N. D. de Rooij","doi":"10.1109/MEMSYS.2001.906597","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906597","url":null,"abstract":"An electrostatically actuated gas microvalve has been designed, fabricated and characterized. This valve is composed of a vertically moving, double-clamped Ta-Si-N membrane, located over a small (10 /spl mu/m), round orifice machined by deep reactive ion etching (DRIE) through the silicon substrate. The valve can be actuated as an on/off switch, or using pulse width modulation (PWM) to achieve a controlled flow rate. To our knowledge, previously reported, electrostatically actuated microvalves have had much larger orifices, which limited the operating pressures to less than 200 mbar, an order of magnitude lower than the valve presented. Furthermore, a controlled flow rate using PWM has never been demonstrated experimentally. The valve reported here thus represents the first working MEMS device integrating a sputtered Ta-Si-N layer, for use at differential pressures greater than 2 bar and capable of achieving controlled flow rates.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116794237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906576
K. Ikuta, A. Takahashi, S. Maruo
World's first "In-chip cell-free protein synthesis from DNA" in the biochemical IC chips was demonstrated. A luminous protein of firefly "Luciferase" was synthesized from DNA and monitored in real time manner. This micro chemical laboratory was constructed by prefabricated biochemical IC chips proposed and developed by the authors. Each chip was three dimensionally fabricated by using "Hybrid micro stereolithography". Our successful results provide new and strong method demanded from post-genome research to find the relationship between gene and protein. User assemble versatile biochemical IC chips provide us to reduces experimental through put time, the cost of expensive biochemical reagent and apparatus for various kinds of protein. DNA originated cell-free protein synthesis is one of the biggest key technology for not only life science but also medicine and drug discovery.
{"title":"In-chip cell-free protein synthesis from DNA by using biochemical IC chips","authors":"K. Ikuta, A. Takahashi, S. Maruo","doi":"10.1109/MEMSYS.2001.906576","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906576","url":null,"abstract":"World's first \"In-chip cell-free protein synthesis from DNA\" in the biochemical IC chips was demonstrated. A luminous protein of firefly \"Luciferase\" was synthesized from DNA and monitored in real time manner. This micro chemical laboratory was constructed by prefabricated biochemical IC chips proposed and developed by the authors. Each chip was three dimensionally fabricated by using \"Hybrid micro stereolithography\". Our successful results provide new and strong method demanded from post-genome research to find the relationship between gene and protein. User assemble versatile biochemical IC chips provide us to reduces experimental through put time, the cost of expensive biochemical reagent and apparatus for various kinds of protein. DNA originated cell-free protein synthesis is one of the biggest key technology for not only life science but also medicine and drug discovery.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116536652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906580
K. Yoshida, M. Kikuchi, Jung-Ho Park, S. Yokota
As an advanced control component for practical micromachines using fluid power in millimeter size, the authors have proposed a micro ER valve using homogeneous ER fluids and verified the validity through basic experiments using several micro ER valves fabricated by conventional machining. In this paper, to control micro grippers mounted on micromachines, further miniaturized ER valves are realized by using micromachining. Firstly, to investigate an ER effect in micro size, several 2-port micro ER valves with different electrode gap lengths are fabricated and investigated. It is ascertained that the viscosity change rate is 4.5 constant with miniaturization. Secondly, a 3-port micro ER valve is fabricated and basic characteristics are experimentally investigated. It is ascertained that the controllable pressure change rate is 60% of supply pressure and the rise time is 0.2 s. Finally, the validity of the micro ER valve is confirmed by applying to position control of a bellows microactuator.
{"title":"A micro ER valve fabricated by micromachining","authors":"K. Yoshida, M. Kikuchi, Jung-Ho Park, S. Yokota","doi":"10.1109/MEMSYS.2001.906580","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906580","url":null,"abstract":"As an advanced control component for practical micromachines using fluid power in millimeter size, the authors have proposed a micro ER valve using homogeneous ER fluids and verified the validity through basic experiments using several micro ER valves fabricated by conventional machining. In this paper, to control micro grippers mounted on micromachines, further miniaturized ER valves are realized by using micromachining. Firstly, to investigate an ER effect in micro size, several 2-port micro ER valves with different electrode gap lengths are fabricated and investigated. It is ascertained that the viscosity change rate is 4.5 constant with miniaturization. Secondly, a 3-port micro ER valve is fabricated and basic characteristics are experimentally investigated. It is ascertained that the controllable pressure change rate is 60% of supply pressure and the rise time is 0.2 s. Finally, the validity of the micro ER valve is confirmed by applying to position control of a bellows microactuator.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"20 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126942161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906514
Dongwan Lee, T. Ono, T. Abe, M. Esashi
A novel fabrication method of a micro-thermal probe and its array for nanometric thermal imaging and a technological approach for probe-based data storage are presented. A small metal wire for a nano-heater is fabricated at the apex of a pyramidal SiO/sub 2/ tip, which is formed by low temperature oxidation of a silicon etch-pit at 950/spl deg/C, consecutive metal deposition (Pt/Cr or Au/Cr) to fill the metal into the etch-pit, and etching of the SiO/sub 2/ in buffered HF solution. Another metal (Ni) is deposited on the small wire to form a metal-to-metal junction that enables to measure the temperature at the tip end. Metal feed-through are formed on a glass substrate that is bonded with the probe array, which enables to transmit a high-speed signal to a processing-circuit and increase the probe array density. Using the thermal probe, temperature distribution on a sample surface is measured. The heating capability of nano-heater is confirmed by the resistivity change and thermophoton emission from the nano-heater when flowing a small current into the nano-heater. By using a micro-probe, preliminary experiment for data writing and erasing is performed on phase change medium.
{"title":"Fabrication of microprobe array with sub-100 nm nano-heater for nanometric thermal imaging and data storage","authors":"Dongwan Lee, T. Ono, T. Abe, M. Esashi","doi":"10.1109/MEMSYS.2001.906514","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906514","url":null,"abstract":"A novel fabrication method of a micro-thermal probe and its array for nanometric thermal imaging and a technological approach for probe-based data storage are presented. A small metal wire for a nano-heater is fabricated at the apex of a pyramidal SiO/sub 2/ tip, which is formed by low temperature oxidation of a silicon etch-pit at 950/spl deg/C, consecutive metal deposition (Pt/Cr or Au/Cr) to fill the metal into the etch-pit, and etching of the SiO/sub 2/ in buffered HF solution. Another metal (Ni) is deposited on the small wire to form a metal-to-metal junction that enables to measure the temperature at the tip end. Metal feed-through are formed on a glass substrate that is bonded with the probe array, which enables to transmit a high-speed signal to a processing-circuit and increase the probe array density. Using the thermal probe, temperature distribution on a sample surface is measured. The heating capability of nano-heater is confirmed by the resistivity change and thermophoton emission from the nano-heater when flowing a small current into the nano-heater. By using a micro-probe, preliminary experiment for data writing and erasing is performed on phase change medium.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125085971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906488
Xiaghua Li, T. Abe, Yongxun Liu, M. Esashi
This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 /spl mu/m in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfur hexafluoride (SF/sub 6/) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.
本文报道了一种采用细间距电馈通法制备耐热玻璃的新工艺。在六氟化硫(SF/sub 6/)等离子体中，采用深度反应离子刻蚀技术，在Pyrex玻璃板上制备了直径为40 ~ 60 μ l μ m的小通孔。通过在通孔中填充电镀金属，使热玻璃板的细间距电馈通成为一项可行的技术。耐热玻璃可以与硅阳极结合。因此，我们的技术将广泛应用于高密度电馈通到板的背面。该技术在高密度数据存储和封装器件微探针阵列中的应用前景十分广阔。
{"title":"High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass","authors":"Xiaghua Li, T. Abe, Yongxun Liu, M. Esashi","doi":"10.1109/MEMSYS.2001.906488","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906488","url":null,"abstract":"This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 /spl mu/m in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfur hexafluoride (SF/sub 6/) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"351 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133875999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906535
Luc G. Fréchette, Steve Nagle, R. Ghodssi, S. Umans, Martin A. Schmidt, Jeffrey H. Lang
This paper reports the first successful fabrication and demonstration of an electrostatic induction micromotor supported on gas-lubricated bearings for electrical-to-mechanical energy conversion. The device consists of a stack of five (5) deep reactive ion etched (DRIE) fusion bonded silicon wafers, with an enclosed 4.2 mm diameter rotor driven by a high-voltage, high-frequency thin-film stator. Testing has demonstrated a torque of 0.3 /spl mu/Nm at a rotation rate of 15,000 revolutions per minute, corresponding to a shaft power of 0.5 mW. This development effort serves to support the creation of a wide array of power MEMS devices such as micro-scale pumps, compressors, generators, and coolers.
{"title":"An electrostatic induction micromotor supported on gas-lubricated bearings","authors":"Luc G. Fréchette, Steve Nagle, R. Ghodssi, S. Umans, Martin A. Schmidt, Jeffrey H. Lang","doi":"10.1109/MEMSYS.2001.906535","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906535","url":null,"abstract":"This paper reports the first successful fabrication and demonstration of an electrostatic induction micromotor supported on gas-lubricated bearings for electrical-to-mechanical energy conversion. The device consists of a stack of five (5) deep reactive ion etched (DRIE) fusion bonded silicon wafers, with an enclosed 4.2 mm diameter rotor driven by a high-voltage, high-frequency thin-film stator. Testing has demonstrated a torque of 0.3 /spl mu/Nm at a rotation rate of 15,000 revolutions per minute, corresponding to a shaft power of 0.5 mW. This development effort serves to support the creation of a wide array of power MEMS devices such as micro-scale pumps, compressors, generators, and coolers.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134200864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906527
T. Ikehara, M. Tanaki, S. Shimada, H. Matsuda
The authors propose a new optically driven actuator which utilizes photo-induced phase-transition (PIPT) material. This actuator is expected to be useful for micromechanical systems, since it provides a wireless energy supply by light. In these PIPT materials the material phase is changed by irradiation of light, as well as by temperature or external fields. In this report, a kind of polydiacetylene (PDA) substituted with alkyl-urethane is investigated. This material is known to exhibit reversible PIPT around 125/spl deg/C between the 'blue' phase and 'red' phase. The authors measured the induced macroscopic elongation of PDA crystal using a displacement meter. The induced strains due to thermal phase transition were measured to be 2%, 0.03%, and 0.9% at 125/spl deg/C for the a-, b-, and c-axes, respectively. These values are larger than that of the piezoelectric or thermal-expansion materials conventionally used for microactuators. Material deformation due to light-pulse irradiation was demonstrated for the first time. The observed bending was explained by bimorph formation induced by phase transition at the irradiated surface.
{"title":"Optically-driven actuator using photo-induced phase-transition material","authors":"T. Ikehara, M. Tanaki, S. Shimada, H. Matsuda","doi":"10.1109/MEMSYS.2001.906527","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906527","url":null,"abstract":"The authors propose a new optically driven actuator which utilizes photo-induced phase-transition (PIPT) material. This actuator is expected to be useful for micromechanical systems, since it provides a wireless energy supply by light. In these PIPT materials the material phase is changed by irradiation of light, as well as by temperature or external fields. In this report, a kind of polydiacetylene (PDA) substituted with alkyl-urethane is investigated. This material is known to exhibit reversible PIPT around 125/spl deg/C between the 'blue' phase and 'red' phase. The authors measured the induced macroscopic elongation of PDA crystal using a displacement meter. The induced strains due to thermal phase transition were measured to be 2%, 0.03%, and 0.9% at 125/spl deg/C for the a-, b-, and c-axes, respectively. These values are larger than that of the piezoelectric or thermal-expansion materials conventionally used for microactuators. Material deformation due to light-pulse irradiation was demonstrated for the first time. The observed bending was explained by bimorph formation induced by phase transition at the irradiated surface.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"11 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131521640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906476
Yu-Chuan Su, Liwei Lin
Localized plastic bonding schemes for plastics-to-silicon, plastics-to-glass, and plastics-to-plastics assembly, packaging and liquid encapsulation have been successfully demonstrated. Aluminum thin films are deposited and patterned as resistive heaters for the purpose of localized heating and bonding. In the experiments, plastic thin films are successfully bonded on silicon, glass, and plastic substrates in 0.25 seconds under a contact pressure of 0.4 MPa. Local temperature at the bonding interface can reach more than 140/spl deg/C for bonding and the global substrate remains at room temperature. The approach of localized heating for bonding of plastic materials while maintaining low temperature globally enables direct sealing of polymer based MEMS processing without using additional adhesive and without damaging pre-existing, temperature-sensitive substances on the bonding substrate. Water encapsulation by plastics-to-plastics bonding is performed to demonstrate the capability of low temperature processing. As such, this technique can be applied broadly in plastic assembly, packaging and liquid encapsulation for microsystems, including microfluidic devices.
{"title":"Localized plastic bonding for micro assembly, packaging and liquid encapsulation","authors":"Yu-Chuan Su, Liwei Lin","doi":"10.1109/MEMSYS.2001.906476","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906476","url":null,"abstract":"Localized plastic bonding schemes for plastics-to-silicon, plastics-to-glass, and plastics-to-plastics assembly, packaging and liquid encapsulation have been successfully demonstrated. Aluminum thin films are deposited and patterned as resistive heaters for the purpose of localized heating and bonding. In the experiments, plastic thin films are successfully bonded on silicon, glass, and plastic substrates in 0.25 seconds under a contact pressure of 0.4 MPa. Local temperature at the bonding interface can reach more than 140/spl deg/C for bonding and the global substrate remains at room temperature. The approach of localized heating for bonding of plastic materials while maintaining low temperature globally enables direct sealing of polymer based MEMS processing without using additional adhesive and without damaging pre-existing, temperature-sensitive substances on the bonding substrate. Water encapsulation by plastics-to-plastics bonding is performed to demonstrate the capability of low temperature processing. As such, this technique can be applied broadly in plastic assembly, packaging and liquid encapsulation for microsystems, including microfluidic devices.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130831117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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