Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906514
Dongwan Lee, T. Ono, T. Abe, M. Esashi
A novel fabrication method of a micro-thermal probe and its array for nanometric thermal imaging and a technological approach for probe-based data storage are presented. A small metal wire for a nano-heater is fabricated at the apex of a pyramidal SiO/sub 2/ tip, which is formed by low temperature oxidation of a silicon etch-pit at 950/spl deg/C, consecutive metal deposition (Pt/Cr or Au/Cr) to fill the metal into the etch-pit, and etching of the SiO/sub 2/ in buffered HF solution. Another metal (Ni) is deposited on the small wire to form a metal-to-metal junction that enables to measure the temperature at the tip end. Metal feed-through are formed on a glass substrate that is bonded with the probe array, which enables to transmit a high-speed signal to a processing-circuit and increase the probe array density. Using the thermal probe, temperature distribution on a sample surface is measured. The heating capability of nano-heater is confirmed by the resistivity change and thermophoton emission from the nano-heater when flowing a small current into the nano-heater. By using a micro-probe, preliminary experiment for data writing and erasing is performed on phase change medium.
{"title":"Fabrication of microprobe array with sub-100 nm nano-heater for nanometric thermal imaging and data storage","authors":"Dongwan Lee, T. Ono, T. Abe, M. Esashi","doi":"10.1109/MEMSYS.2001.906514","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906514","url":null,"abstract":"A novel fabrication method of a micro-thermal probe and its array for nanometric thermal imaging and a technological approach for probe-based data storage are presented. A small metal wire for a nano-heater is fabricated at the apex of a pyramidal SiO/sub 2/ tip, which is formed by low temperature oxidation of a silicon etch-pit at 950/spl deg/C, consecutive metal deposition (Pt/Cr or Au/Cr) to fill the metal into the etch-pit, and etching of the SiO/sub 2/ in buffered HF solution. Another metal (Ni) is deposited on the small wire to form a metal-to-metal junction that enables to measure the temperature at the tip end. Metal feed-through are formed on a glass substrate that is bonded with the probe array, which enables to transmit a high-speed signal to a processing-circuit and increase the probe array density. Using the thermal probe, temperature distribution on a sample surface is measured. The heating capability of nano-heater is confirmed by the resistivity change and thermophoton emission from the nano-heater when flowing a small current into the nano-heater. By using a micro-probe, preliminary experiment for data writing and erasing is performed on phase change medium.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125085971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906597
P. Dubois, B. Guldimann, M. Gretillat, N. D. de Rooij
An electrostatically actuated gas microvalve has been designed, fabricated and characterized. This valve is composed of a vertically moving, double-clamped Ta-Si-N membrane, located over a small (10 /spl mu/m), round orifice machined by deep reactive ion etching (DRIE) through the silicon substrate. The valve can be actuated as an on/off switch, or using pulse width modulation (PWM) to achieve a controlled flow rate. To our knowledge, previously reported, electrostatically actuated microvalves have had much larger orifices, which limited the operating pressures to less than 200 mbar, an order of magnitude lower than the valve presented. Furthermore, a controlled flow rate using PWM has never been demonstrated experimentally. The valve reported here thus represents the first working MEMS device integrating a sputtered Ta-Si-N layer, for use at differential pressures greater than 2 bar and capable of achieving controlled flow rates.
{"title":"Electrostatically actuated gas microvalve based on a Ta-Si-N membrane","authors":"P. Dubois, B. Guldimann, M. Gretillat, N. D. de Rooij","doi":"10.1109/MEMSYS.2001.906597","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906597","url":null,"abstract":"An electrostatically actuated gas microvalve has been designed, fabricated and characterized. This valve is composed of a vertically moving, double-clamped Ta-Si-N membrane, located over a small (10 /spl mu/m), round orifice machined by deep reactive ion etching (DRIE) through the silicon substrate. The valve can be actuated as an on/off switch, or using pulse width modulation (PWM) to achieve a controlled flow rate. To our knowledge, previously reported, electrostatically actuated microvalves have had much larger orifices, which limited the operating pressures to less than 200 mbar, an order of magnitude lower than the valve presented. Furthermore, a controlled flow rate using PWM has never been demonstrated experimentally. The valve reported here thus represents the first working MEMS device integrating a sputtered Ta-Si-N layer, for use at differential pressures greater than 2 bar and capable of achieving controlled flow rates.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116794237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906509
N. Hedenstierna, S. Habibi, S. Nilsen, T. Kvisterøy, G. U. Jensen
The principle of the butterfly-gyro was first demonstrated with a large anisotropically etched structure in bulk silicon. Now the same principle has been used to develop a much smaller structure (9.6 mm/sup 2/). The new sensor chip is ICP-etched in bulk silicon and anodically bonded to form a triple stack (glass/Si/glass) structure. Together with an ASIC the sensor typically shows a noise level of 0.3 /sup o///sub s/ over 50 Hz bandwidth and a zero-rate offset (ZRO) less than 50 /sup o///sub s/.
{"title":"Bulk micromachined angular rate sensor based on the 'butterfly'-gyro structure","authors":"N. Hedenstierna, S. Habibi, S. Nilsen, T. Kvisterøy, G. U. Jensen","doi":"10.1109/MEMSYS.2001.906509","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906509","url":null,"abstract":"The principle of the butterfly-gyro was first demonstrated with a large anisotropically etched structure in bulk silicon. Now the same principle has been used to develop a much smaller structure (9.6 mm/sup 2/). The new sensor chip is ICP-etched in bulk silicon and anodically bonded to form a triple stack (glass/Si/glass) structure. Together with an ASIC the sensor typically shows a noise level of 0.3 /sup o///sub s/ over 50 Hz bandwidth and a zero-rate offset (ZRO) less than 50 /sup o///sub s/.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124086991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906554
Y. Yang, M. Kamon, V. Rabinovich, Chahid K. Ghaddar, M. Deshpande, K. Greiner, J. Gilbert
In this paper, we present an efficient macromodel extraction technique for gas damping and spring effects for arbitrarily shaped MEMS devices. The technique applies an Arnoldi-based model-order-reduction algorithm to generate low-order models from an FEM approximation of the linearized Reynolds equation. We demonstrate that this approach for generating the frequency-dependent gas-damping model is more than 100 times faster than previous approaches, which solve the linearized Reynolds equation using a transient FEM solver. The low-order gas-damping model can be easily inserted into a system-level modeling package for transient and frequency analysis. The simulated results are in good agreement with experimental results for four different devices.
{"title":"Modeling gas damping and spring phenomena in MEMS with frequency dependent macro-models","authors":"Y. Yang, M. Kamon, V. Rabinovich, Chahid K. Ghaddar, M. Deshpande, K. Greiner, J. Gilbert","doi":"10.1109/MEMSYS.2001.906554","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906554","url":null,"abstract":"In this paper, we present an efficient macromodel extraction technique for gas damping and spring effects for arbitrarily shaped MEMS devices. The technique applies an Arnoldi-based model-order-reduction algorithm to generate low-order models from an FEM approximation of the linearized Reynolds equation. We demonstrate that this approach for generating the frequency-dependent gas-damping model is more than 100 times faster than previous approaches, which solve the linearized Reynolds equation using a transient FEM solver. The low-order gas-damping model can be easily inserted into a system-level modeling package for transient and frequency analysis. The simulated results are in good agreement with experimental results for four different devices.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127652467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906487
O. Tabata, N. Matsuzuka, T. Yamaji, Hui You, J. Minakuchi, K. Yamamoto
Two methods, "Forward Approach" and "Inverse Approach", to fabricate complicated 3-dimensional microstructures by deep X-ray lithography have been developed. In the "Forward Approach", exposure energy distribution on a PMMA substrate was calculated using X-ray mask pattern and mask moving trajectories. Two different micro-nozzle patterns were fabricated to demonstrate the feasibility of this approach. From the comparison between prediction and experiment, a new phenomenon related to the long lifetime radicals was observed. As the "Inverse Approach", a method to determine the optimum mask moving trajectory using Fourier transformation was developed.
{"title":"Fabrication of 3-dimensional microstructures using moving mask deep X-ray lithography (M/sup 2/DXL)","authors":"O. Tabata, N. Matsuzuka, T. Yamaji, Hui You, J. Minakuchi, K. Yamamoto","doi":"10.1109/MEMSYS.2001.906487","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906487","url":null,"abstract":"Two methods, \"Forward Approach\" and \"Inverse Approach\", to fabricate complicated 3-dimensional microstructures by deep X-ray lithography have been developed. In the \"Forward Approach\", exposure energy distribution on a PMMA substrate was calculated using X-ray mask pattern and mask moving trajectories. Two different micro-nozzle patterns were fabricated to demonstrate the feasibility of this approach. From the comparison between prediction and experiment, a new phenomenon related to the long lifetime radicals was observed. As the \"Inverse Approach\", a method to determine the optimum mask moving trajectory using Fourier transformation was developed.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114743651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906580
K. Yoshida, M. Kikuchi, Jung-Ho Park, S. Yokota
As an advanced control component for practical micromachines using fluid power in millimeter size, the authors have proposed a micro ER valve using homogeneous ER fluids and verified the validity through basic experiments using several micro ER valves fabricated by conventional machining. In this paper, to control micro grippers mounted on micromachines, further miniaturized ER valves are realized by using micromachining. Firstly, to investigate an ER effect in micro size, several 2-port micro ER valves with different electrode gap lengths are fabricated and investigated. It is ascertained that the viscosity change rate is 4.5 constant with miniaturization. Secondly, a 3-port micro ER valve is fabricated and basic characteristics are experimentally investigated. It is ascertained that the controllable pressure change rate is 60% of supply pressure and the rise time is 0.2 s. Finally, the validity of the micro ER valve is confirmed by applying to position control of a bellows microactuator.
{"title":"A micro ER valve fabricated by micromachining","authors":"K. Yoshida, M. Kikuchi, Jung-Ho Park, S. Yokota","doi":"10.1109/MEMSYS.2001.906580","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906580","url":null,"abstract":"As an advanced control component for practical micromachines using fluid power in millimeter size, the authors have proposed a micro ER valve using homogeneous ER fluids and verified the validity through basic experiments using several micro ER valves fabricated by conventional machining. In this paper, to control micro grippers mounted on micromachines, further miniaturized ER valves are realized by using micromachining. Firstly, to investigate an ER effect in micro size, several 2-port micro ER valves with different electrode gap lengths are fabricated and investigated. It is ascertained that the viscosity change rate is 4.5 constant with miniaturization. Secondly, a 3-port micro ER valve is fabricated and basic characteristics are experimentally investigated. It is ascertained that the controllable pressure change rate is 60% of supply pressure and the rise time is 0.2 s. Finally, the validity of the micro ER valve is confirmed by applying to position control of a bellows microactuator.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"20 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126942161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906527
T. Ikehara, M. Tanaki, S. Shimada, H. Matsuda
The authors propose a new optically driven actuator which utilizes photo-induced phase-transition (PIPT) material. This actuator is expected to be useful for micromechanical systems, since it provides a wireless energy supply by light. In these PIPT materials the material phase is changed by irradiation of light, as well as by temperature or external fields. In this report, a kind of polydiacetylene (PDA) substituted with alkyl-urethane is investigated. This material is known to exhibit reversible PIPT around 125/spl deg/C between the 'blue' phase and 'red' phase. The authors measured the induced macroscopic elongation of PDA crystal using a displacement meter. The induced strains due to thermal phase transition were measured to be 2%, 0.03%, and 0.9% at 125/spl deg/C for the a-, b-, and c-axes, respectively. These values are larger than that of the piezoelectric or thermal-expansion materials conventionally used for microactuators. Material deformation due to light-pulse irradiation was demonstrated for the first time. The observed bending was explained by bimorph formation induced by phase transition at the irradiated surface.
{"title":"Optically-driven actuator using photo-induced phase-transition material","authors":"T. Ikehara, M. Tanaki, S. Shimada, H. Matsuda","doi":"10.1109/MEMSYS.2001.906527","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906527","url":null,"abstract":"The authors propose a new optically driven actuator which utilizes photo-induced phase-transition (PIPT) material. This actuator is expected to be useful for micromechanical systems, since it provides a wireless energy supply by light. In these PIPT materials the material phase is changed by irradiation of light, as well as by temperature or external fields. In this report, a kind of polydiacetylene (PDA) substituted with alkyl-urethane is investigated. This material is known to exhibit reversible PIPT around 125/spl deg/C between the 'blue' phase and 'red' phase. The authors measured the induced macroscopic elongation of PDA crystal using a displacement meter. The induced strains due to thermal phase transition were measured to be 2%, 0.03%, and 0.9% at 125/spl deg/C for the a-, b-, and c-axes, respectively. These values are larger than that of the piezoelectric or thermal-expansion materials conventionally used for microactuators. Material deformation due to light-pulse irradiation was demonstrated for the first time. The observed bending was explained by bimorph formation induced by phase transition at the irradiated surface.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"11 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131521640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906612
P. Kladitis, R. Linderman, V. Bright
This work presents the first micro-sized axial flow fan driven by a scratch drive actuator rotary motor. The eight fan blades are mass assembled using the surface tension of molten 4 mil diameter 63 Sn/37 Pb manufactured solder spheres. A sample size of 27 blade angles was measured with a mean assembly angle of 107.24/spl deg/. The actual mean of the manufactured solder sphere diameters was measured at 4.89 mils, yielding a, model predicted, mean blade assembly angle of 107.71/spl deg/. At resonance, the SDA motor can be driven at 50 RPM forward with a 2 kHz AC voltage of 30 V/sub 0.P/, and at 100 RPM reverse with a 3 kHz signal. For non-resonant frequencies, the SDA motor can be driven in a forward direction with linear speed control up to 180 RPM using driving signals from 75-150 V/sub 0.P/. Fluid movement by the fan was also experimentally demonstrated.
{"title":"Solder self-assembled micro axial flow fan driven by a scratch drive actuator rotary motor","authors":"P. Kladitis, R. Linderman, V. Bright","doi":"10.1109/MEMSYS.2001.906612","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906612","url":null,"abstract":"This work presents the first micro-sized axial flow fan driven by a scratch drive actuator rotary motor. The eight fan blades are mass assembled using the surface tension of molten 4 mil diameter 63 Sn/37 Pb manufactured solder spheres. A sample size of 27 blade angles was measured with a mean assembly angle of 107.24/spl deg/. The actual mean of the manufactured solder sphere diameters was measured at 4.89 mils, yielding a, model predicted, mean blade assembly angle of 107.71/spl deg/. At resonance, the SDA motor can be driven at 50 RPM forward with a 2 kHz AC voltage of 30 V/sub 0.P/, and at 100 RPM reverse with a 3 kHz signal. For non-resonant frequencies, the SDA motor can be driven in a forward direction with linear speed control up to 180 RPM using driving signals from 75-150 V/sub 0.P/. Fluid movement by the fan was also experimentally demonstrated.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"13 9","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131751578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906488
Xiaghua Li, T. Abe, Yongxun Liu, M. Esashi
This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 /spl mu/m in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfur hexafluoride (SF/sub 6/) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.
本文报道了一种采用细间距电馈通法制备耐热玻璃的新工艺。在六氟化硫(SF/sub 6/)等离子体中，采用深度反应离子刻蚀技术，在Pyrex玻璃板上制备了直径为40 ~ 60 μ l μ m的小通孔。通过在通孔中填充电镀金属，使热玻璃板的细间距电馈通成为一项可行的技术。耐热玻璃可以与硅阳极结合。因此，我们的技术将广泛应用于高密度电馈通到板的背面。该技术在高密度数据存储和封装器件微探针阵列中的应用前景十分广阔。
{"title":"High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass","authors":"Xiaghua Li, T. Abe, Yongxun Liu, M. Esashi","doi":"10.1109/MEMSYS.2001.906488","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906488","url":null,"abstract":"This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 /spl mu/m in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfur hexafluoride (SF/sub 6/) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"351 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133875999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906535
Luc G. Fréchette, Steve Nagle, R. Ghodssi, S. Umans, Martin A. Schmidt, Jeffrey H. Lang
This paper reports the first successful fabrication and demonstration of an electrostatic induction micromotor supported on gas-lubricated bearings for electrical-to-mechanical energy conversion. The device consists of a stack of five (5) deep reactive ion etched (DRIE) fusion bonded silicon wafers, with an enclosed 4.2 mm diameter rotor driven by a high-voltage, high-frequency thin-film stator. Testing has demonstrated a torque of 0.3 /spl mu/Nm at a rotation rate of 15,000 revolutions per minute, corresponding to a shaft power of 0.5 mW. This development effort serves to support the creation of a wide array of power MEMS devices such as micro-scale pumps, compressors, generators, and coolers.
{"title":"An electrostatic induction micromotor supported on gas-lubricated bearings","authors":"Luc G. Fréchette, Steve Nagle, R. Ghodssi, S. Umans, Martin A. Schmidt, Jeffrey H. Lang","doi":"10.1109/MEMSYS.2001.906535","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906535","url":null,"abstract":"This paper reports the first successful fabrication and demonstration of an electrostatic induction micromotor supported on gas-lubricated bearings for electrical-to-mechanical energy conversion. The device consists of a stack of five (5) deep reactive ion etched (DRIE) fusion bonded silicon wafers, with an enclosed 4.2 mm diameter rotor driven by a high-voltage, high-frequency thin-film stator. Testing has demonstrated a torque of 0.3 /spl mu/Nm at a rotation rate of 15,000 revolutions per minute, corresponding to a shaft power of 0.5 mW. This development effort serves to support the creation of a wide array of power MEMS devices such as micro-scale pumps, compressors, generators, and coolers.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134200864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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