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2008 European Microwave Integrated Circuit Conference最新文献

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The Impact of Technology Node Scaling on nMOS SPDT RF Switches 技术节点缩放对nMOS SPDT射频开关的影响
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772307
T. Thrivikraman, W. Kuo, J. Comeau, J. Cressler
This work presents a comparison of three single-pole double-throw (SPDT) nMOS RF switches implemented in commercially available Si-based 180, 130, and 90 nm technologies. In addition, a new series-shunt switch is presented that offers a means to improve switch isolation. Measured results of these RF switches demonstrates how technology node scaling impacts RF switch design and provides insight into the complicated trade-offs between insertion loss, isolation, and linearity.
本研究比较了三种单极双掷(SPDT) nMOS射频开关在商用的基于硅的180、130和90纳米技术中实现的情况。此外,还提出了一种新型串联并联开关,为提高开关的隔离性提供了一种手段。这些RF开关的测量结果展示了技术节点缩放如何影响RF开关设计,并提供了对插入损耗、隔离和线性之间复杂权衡的见解。
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引用次数: 10
A 20 Watt Micro-strip X-Band AlGaN/GaN HPA MMIC for Advanced Radar Applications 用于先进雷达应用的20瓦微带x波段AlGaN/GaN HPA MMIC
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772355
C. Costrini, M. Calori, A. Cetronio, C. Lanzieri, S. Lavanga, M. Peroni, E. Limiti, A. Serino, G. Ghione, G. Melone
In this paper a first iteration design, fabrication and test of a two-stage X-Band MMIC HPA in micro-strip AlGaN/GaN technology is reported. With 20 V drain voltage operating bias point, at 3 dB compression point, the HPA delivers a pulsed output power ranging from 21 to 28.5 W, an associated gain from 12.9 to 16.5 dB and an associated PAE from circa 30% to 40%, over the 8-10.5 GHz frequency bandwidth. In the best performance frequency points (8.5 and 9 GHz) the HPA exhibits a saturated output power of 30 W with an associated PAE of 40%.
本文报道了一种基于微带AlGaN/GaN技术的两级x波段MMIC HPA的首次迭代设计、制造和测试。在20 V漏极电压工作偏置点下,在3db压缩点下,HPA在8-10.5 GHz带宽范围内提供21 - 28.5 W的脉冲输出功率,12.9 - 16.5 dB的相关增益和约30% - 40%的相关PAE。在性能最佳的频率点(8.5 GHz和9 GHz), HPA的饱和输出功率为30 W,相关PAE为40%。
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引用次数: 21
A Survey on 60 GHz Broadband Communication: Capability, Applications and System Design 60 GHz宽带通信综述:性能、应用与系统设计
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772213
M. Peter, W. Keusgen, Jian Luo
This paper gives a review of important aspects and current developments in 60 GHz broadband communication. We present channel measurement results for a conference room and analyze the channel capacity. The results clearly demonstrate the capability of the 60 GHz approach. Finally, we outline a concept for a wireless 60 GHz in-flight entertainment system.
本文综述了60ghz宽带通信的重要方面和发展现状。给出了一个会议室的信道测量结果,并对信道容量进行了分析。结果清楚地证明了60ghz方法的能力。最后,我们概述了无线60ghz机上娱乐系统的概念。
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引用次数: 23
Industrial MHEMT Technologies for 80 - 220 GHz Applications 80 - 220 GHz应用的工业MHEMT技术
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772267
D. Smith, G. Dambrine, J. Orlhac
This paper describes the industrial development methodology of a family of MHEMT technologies with gate lengths from 130 down to 50 nm. State of the art MMIC LNA performance for the commercial 70 nm technology at 90 and 150 GHz is presented.
本文介绍了栅极长度从130纳米到50纳米的一系列MHEMT技术的工业开发方法。介绍了90 GHz和150 GHz商用70 nm技术的最先进MMIC LNA性能。
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引用次数: 15
5.5 GHz Low Voltage and High Linearity RF CMOS Mixer Design 5.5 GHz低电压高线性RF CMOS混频器设计
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772256
Senhg-Feng Lu, Jyh-Chyurn Guo
A CMOS mixer was design with a new circuit scheme to realize low voltage and high linearity simultaneously. A double balanced Gilbert cell was adopted as the basic topology and TSMC 0.18 mum 1P6M CMOS process was employed for the on-chip RF circuit fabrication. The proposed new circuit scheme consists of LC-tanks as a capacitively coupled resonator for low voltage and multi-stage parallel RC networks for linearity improvement. Furthermore, multi-gated structure is applied at the RF input as a transconductance amplifier to enhance conversion gain and linearity. The new circuit scheme enables a successful low voltage operation at 1-V for 0.18 mum technology, The measured circuit performance demonstrates superior linearity with IIP3 of 11 dBm and P1dB of 2.2 dBm. The conversion gain can be maintained at 8.1 dB in a wide frequencies of 5 GHz to 6.8 GHz.
采用新的电路方案设计了一种CMOS混频器,同时实现了低电压和高线性度。采用双平衡Gilbert单元作为基本拓扑结构,采用TSMC 0.18 mum 1P6M CMOS工艺制作片上射频电路。提出的新电路方案由lc -tank作为电容耦合谐振器,用于低压和多级并联RC网络,以提高线性度。此外,在射频输入端采用多门控结构作为跨导放大器,以提高转换增益和线性度。新的电路方案使0.18 mum技术在1 v下成功地实现了低电压工作,测量电路性能显示出良好的线性度,IIP3为11 dBm, P1dB为2.2 dBm。在5 GHz至6.8 GHz的宽频率范围内,转换增益可保持在8.1 dB。
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引用次数: 5
Robust Packaged Diode Modelling with a Table-Based Approach 基于表的稳健封装二极管建模方法
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772246
A. Rodríguez-Testera, O. Mojón, M. Fernández-Barciela, E. Sánchez
A table-based nonlinear approach was used to predict the performance of a commercially packaged Schottky diode. Excellent results have been obtained which improve those of the analytical model provided by the manufacturer. Both models were extensively validated under DC, small and large-signal one-tone and two-tone excitations. Measurements for table-based model extraction and models validation were obtained by using a multi-tone nonlinear measurement system based on a LSNA. Time domain waveforms have once more been demonstrated as a key tool to compare large-signal models.
采用基于表的非线性方法预测了商用肖特基二极管的性能。得到了较好的结果,改进了厂家提供的分析模型。两种模型在直流、小信号和大信号单音和双音激励下进行了广泛的验证。采用基于LSNA的多音调非线性测量系统,对基于表的模型提取和模型验证进行了测量。时域波形再次被证明是比较大信号模型的关键工具。
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引用次数: 3
Advanced Modeling of MISHFET Devices and their Performance in Current-Mode Class-D Power Amplifiers 电流模式d类功率放大器中MISHFET器件的高级建模及其性能
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772258
J. Cumana, C. Lautensack, M. Eickelkamp, J. Goliasch, A. Noculak, A. Vescan, R. Jansen
GaN HFETs and MISHFETs are promising power devices for RF and microwave power applications. However, the performance of devices can be compromised under some operating conditions. From the device development point of view, device optimization is necessary to obtain the best possible performance. For device modeling and design purposes, the device needs to be characterized and modeled accurately in order to foresee how the device will behave under realistic operating conditions. In this paper, an improved EEHEMT1-based model for GaN MISHFETs, will be introduced. This model is capable of describing the knee region of the device's output characteristics, dispersion effects as well as gate diode behavior accurately. The models will be incorporated in a switched-mode amplifier topology and evaluations will be made to determine the suitability of MISHFETs in these amplifiers.
GaN hfet和mishfet是射频和微波功率应用中很有前途的功率器件。但是,在某些操作条件下,设备的性能可能会受到影响。从器件开发的角度来看,器件优化是获得最佳性能的必要条件。为了设备建模和设计的目的,需要对设备进行准确的表征和建模,以便预见设备在实际操作条件下的行为。本文将介绍一种改进的基于eehemt1的GaN mishfet模型。该模型能够准确地描述器件输出特性、色散效应以及栅极二极管行为的膝区。这些模型将被整合到一个开关模式放大器拓扑结构中,并将进行评估,以确定mishfet在这些放大器中的适用性。
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引用次数: 0
A Fully Integrated 60 GHz SiGe BiCMOS Mixer 一个完全集成的60 GHz SiGe BiCMOS混频器
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772316
Sang-Heung Lee, Ja-yol Lee, Hae-cheon Kim
In this paper, a 60 GHz MMIC down-conversion mixer for 60 GHz WPAN is designed and fabricated on chip using 0.25 mum SiGe:C BiCMOS process technology. This 60 GHz mixer is fully integrated on chip, including active input balun and output balun circuits. The results of the fabricated mixer measured at RF 60 GHz show conversion gain of 10.7 dB, LO to IF isolation and RF to IF isolation of above 30 dB, and input P1dB of -17 dBm. Also, the results of the fabricated mixer measured between RF 57 and 63 GHz show conversion gain of 12.0 ~ 10.7 dB, LO to IF isolation and RF to IF isolation of above 28 dB, and input P1dB of -17 ~ -18 dBm. The chip size of the manufactured mixer is 1.3 mm times 0.8 mm.
本文采用0.25 μ m SiGe:C BiCMOS工艺技术,设计并制作了用于60 GHz无线广域网的60 GHz MMIC下变频混频器。这款60 GHz混频器完全集成在芯片上,包括有源输入平衡和输出平衡电路。在射频60 GHz下的测试结果表明,该混频器的转换增益为10.7 dB,本端到中频隔离和射频到中频隔离均在30 dB以上,输入P1dB为-17 dBm。在RF 57 ~ 63 GHz范围内的测试结果表明,该混频器的转换增益为12.0 ~ 10.7 dB,本端到中频隔离度和射频到中频隔离度均在28 dB以上,输入P1dB为-17 ~ -18 dBm。所制混合器的芯片尺寸为1.3 mm × 0.8 mm。
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引用次数: 2
24 GHz LTCC I/Q Mixer Using Packaged HEMTs 采用封装hemt的24ghz LTCC I/Q混频器
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772327
V. Napijalo, V. Cojocaru
An I/Q active mixer in LTCC technology using packaged HEMTs as mixing devices is described. A mixer is designed for use in the 24 GHz automotive radar application. An on-tile buffer amplifier was added to compensate for the limited power available from the system oscillator. Careful choice of the type or topology for each of the passive circuits implemented resulted in an optimal mixer layout, so a very small size for a ceramic tile of 15times15times0.8 mm3 was achieved. The measured conversion gain of the mixer for a 0 dBm LO level was -6.7 dB for I and -5.2 dB for Q. The amplitude imbalance between I and Q signals resulting from the aggressive miniaturization of the quadrature coupler could be compensated in the DSP stages of the system at no additional cost. The measured I-Q phase imbalance was around 3 degrees. The measured return losses at mixer ports and LO-RF isolations are also very good.
介绍了一种采用封装hemt作为混合器件的LTCC技术中的I/Q有源混频器。混频器设计用于24 GHz汽车雷达应用。增加了一个片上缓冲放大器来补偿系统振荡器提供的有限功率。为实现的每个无源电路精心选择类型或拓扑结构,从而实现最佳混频器布局,因此实现了瓷砖的15 × 15 × 0.8 mm3的非常小的尺寸。对于0 dBm的LO电平,混频器的测量转换增益为-6.7 dB (I)和-5.2 dB (Q)。由于正交耦合器的积极小型化而导致的I和Q信号之间的幅度不平衡可以在系统的DSP级中进行补偿,而无需额外成本。测得的I-Q相不平衡约为3度。在混频器端口和LO-RF隔离处测量的回波损耗也非常好。
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引用次数: 2
Regenerative Frequency Divider SiGe-RFIC with Octave Bandwidth and Low Phase Noise 具有倍频宽和低相位噪声的可再生分频器SiGe-RFIC
Pub Date : 2008-10-01 DOI: 10.1109/EMICC.2008.4772294
T. Wallin, J. Hellén, H. Berg, S.-E. Elfgren
Using traditional RFIC design architecture a broadband regenerative frequency divider is designed. By integrating the frequency divider in a single IC the size is reduced and the bandwidth is increased without compromising the phase noise performance. A one octave bandwidth, 3.2-6.4 GHz, is achieved with a phase noise floor below -157 dBc/Hz. For a narrower frequency band, 4.0-5.6 GHz, a phase noise floor below -167 dBc/Hz is measured. This is directly comparable to regenerative frequency dividers designed using conventional discrete components or commercially available dividers. At the same time the bandwidth is exceeded only by digital dividers, they however have a typical phase noise floor of -150 dBc/Hz at these frequencies. Both f0/2 and 3f0/2 are available at the output while the input frequency, f0, is suppressed to at least -20 dBc. The IC is manufactured by austriamicrosystems in their 0.35 mum SiGe-BiCMOS process with an fT of 70 GHz and is packaged in a 5times5 mm QFN plastic package.
采用传统的RFIC设计架构,设计了宽带再生分频器。通过将分频器集成在单个IC中,可以减小尺寸并增加带宽,而不会影响相位噪声性能。在相位本底噪声低于-157 dBc/Hz的情况下,实现了一个倍频程带宽3.2-6.4 GHz。对于较窄的频段(4.0-5.6 GHz),测量到的相位本底噪声低于-167 dBc/Hz。这直接可与使用传统分立元件或市售分压器设计的再生分频器相媲美。与此同时,只有数字分频器超过了带宽,但是在这些频率下,它们的典型相位本底噪声为-150 dBc/Hz。f0/2和3f0/2在输出端都可用,而输入频率f0被抑制到至少-20 dBc。该IC由奥地利微系统公司采用0.35 μ m SiGe-BiCMOS工艺制造,fT为70 GHz,封装在5倍5毫米QFN塑料封装中。
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引用次数: 2
期刊
2008 European Microwave Integrated Circuit Conference
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