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15th Annual GaAs IC Symposium最新文献

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High gain V-band heterojunction FET MMIC power amplifiers 高增益v波段异质结FET MMIC功率放大器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394429
M. Funabashi, K. Hosoya, K. Ohata, K. Onda, N. Iwata, M. Kuzuhara
High gain V-band medium power MMIC amplifiers have been successfully demonstrated using 0.15 /spl mu/m T-shaped gate AlGaAs/InGaAs heterojunction FETs. Optimization of the FET achieved high f/sub max/ of 227 GHz with high gate breakdown voltage of -13 V. A single-stage 65 GHz-band amplifier has exhibited 8.7 dB small signal gain with the 1 dB-gain-down bandwidth of 2 GHz. A single-stage 60 GHz-band amplifier has achieved 8.4 dB gain with 3 GHz bandwidth and good input and output impedance matching. The output power of 37.2 mW with high power-added-efficiency of 25.6% at 61.2 GHz has been obtained at 3 V drain bias.<>
利用0.15 /spl mu/m的t形栅极AlGaAs/InGaAs异质结场效应管,成功地演示了高增益v波段中功率MMIC放大器。优化后的FET在-13 V的栅极击穿电压下达到了227 GHz的高f/sub max/。单级65 GHz频段放大器的小信号增益为8.7 dB,降增益带宽为2ghz。单级60ghz频带放大器在3ghz带宽下获得8.4 dB增益,输入输出阻抗匹配良好。在3v漏极偏压下,在61.2 GHz下获得了37.2 mW的输出功率和25.6%的高功率附加效率
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引用次数: 14
A 8-15 GHz, 1W HBT power MMIC with 16 dB gain and 48% peak power added efficiency 8-15 GHz, 1W HBT功率MMIC, 16 dB增益和48%峰值功率增加效率
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394433
F. Ali, M. Salib, A. Gupta, D. Dawson
A two-stage X-Ku band MMIC power amplifier has been designed and fabricated using common-emitter GaAs heterojunction bipolar transistors (HBTs). This monolithic amplifier has achieved 16 dB gain, 1.4 W (CW) peak output power and 48% peak power added efficiency (PAE) over 8-15 GHz. Input and output matching networks, as well as biasing circuits, are all contained within this HBT MMIC. To the authors' knowledge, this is the highest efficiency and the highest gain reported for any broadband monolithic power amplifier in the X-Ku band.<>
利用共发射极GaAs异质结双极晶体管(hbt),设计并制作了一种两级X-Ku波段MMIC功率放大器。该单片放大器在8-15 GHz范围内实现了16 dB增益,1.4 W (CW)峰值输出功率和48%的峰值功率附加效率(PAE)。输入输出匹配网络,以及偏置电路,都包含在这个HBT MMIC中。据作者所知,这是在X-Ku波段的任何宽带单片功率放大器中报道的最高效率和最高增益。
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引用次数: 12
Highly selective citric buffer etch-stop process for the manufacture of very uniform GaAs/AlGaAs FETs 用于制造非常均匀的GaAs/AlGaAs fet的高选择性柠檬酸缓冲蚀刻停止工艺
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394442
B. Schmukler, P. Brunemeier, W. Hitchens, B. Cantos, W. Strifler, D. Rosenblatt, R. Remba
A citric buffer etch has been developed and used to create an optimized etch-stop process for the manufacture of recessed gate GaAs/AlGaAs FETs. Selectives in excess of 1800 have been achieved for a 25 /spl Aring/, x=0.35 Al/sub x/Ga/sub 1-x/As stop layer with the advantage of no iron damage to the channel. Stop layer thicknesses from 15 /spl Aring/ to 100 /spl Aring/ and Al content from x=0.25 to x=0/5 were investigated for process robustness and FET performance. The high selectivity permits the use of a thin 25 /spl Aring/ stop layer of x=0.35 material that does not perturb FET performance, and still provides a robust process. Performance is verified with DC and RF tests, including small signal extrinsic transconductance, and FET noise figure, which are particularly sensitive to increased source resistance. With the etch-stop process, uniformity is greatly enhanced. The standard deviation for Idss was reduced from 20%-30% to less than 5%, and standard deviation for threshold voltage was reduced from 300 mV to less than 30 mV. This proces is applicable to a wide variety of heterostructure devices.<>
开发了一种柠檬酸缓冲蚀刻剂,并用于制造嵌入式栅极GaAs/AlGaAs fet的优化蚀刻停止工艺。对于25 /spl Aring/, x=0.35 Al/sub x/Ga/sub 1-x/As停止层,已经实现了超过1800的选择性,其优点是不会对通道造成铁损伤。停止层厚度从15 /spl Aring/到100 /spl Aring/, Al含量从x=0.25到x=0/5,研究了过程鲁棒性和FET性能。高选择性允许使用x=0.35材料的薄25 /spl的Aring/ stop层,这不会干扰FET的性能,并且仍然提供稳健的过程。通过直流和射频测试验证了性能,包括小信号外部跨导和FET噪声系数,它们对增加的源电阻特别敏感。采用蚀刻停止工艺,大大提高了均匀性。Idss的标准差从20% ~ 30%减小到5%以下,阈值电压的标准差从300 mV减小到30 mV以下。该工艺适用于各种异质结构器件。
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引用次数: 5
A miniaturized W-band monolithic dual-gate InAlAs/InGaAs HEMT mixer 小型化w波段单片双栅InAlAs/InGaAs HEMT混频器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394466
Y. Kwon, D. Pavlidis, P. Marsh, G. Ng, T. Brock, D. Streit
A miniaturized W-band dual-gate HEMT mixer has been demonstrated using InAlAs/InGaAs HEMT technology. The circuit provides on-chip RF/LO coupling and integrates the HEMT, RF/LO/IF matching circuits and bias lines on a 1 mm /spl times/ 1 mm chip. The dual-gate mixer showed a conversion loss of 3 dB with 5 dBm LO power and had an RF return loss better than 10 dB over a wide range of frequencies (87 GHz-100 GHz). The LO-to-RF isolation was better than 17 dB for W-band operation.<>
采用InAlAs/InGaAs HEMT技术,展示了一种小型化w波段双栅HEMT混频器。该电路提供片上RF/LO耦合,并将HEMT, RF/LO/IF匹配电路和偏置线集成在1mm /spl倍/ 1mm芯片上。双门混频器在5 dBm本端功率下的转换损耗为3 dB,在宽频率范围内(87 GHz-100 GHz)的射频回波损耗优于10 dB。w波段工作时,低电平对射频的隔离度优于17 dB。
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引用次数: 5
C-band 20 watt internally matched GaAs based pseudomorphic HEMT power amplifiers c波段20瓦内部匹配基于GaAs的伪晶HEMT功率放大器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394435
S. Fu, J. Komiak, L. Lester, K. Duh, P.M. Smith, P. Chao, T. Yu
The authors present preliminary results of the effort to develop C-band high power internally-matched GaAs-based pseudomorphic high electron mobility transistors (PHEMTs) power amplifiers. Previously developed 0.25 /spl mu/m/spl times/8 mm PHEMT chips had been selected as the building block of the power amplifiers. The single chip units are comprised of one 8 mm PHEMT chip and its input and output matching circuits. These parts are integrated into a small copper carrier. By combining four 8 mm chips with lumped elements and a distributed Wilkinson power divider/combiner, the units were assembled within the same type of carrier and delivered 20 W output power.<>
作者介绍了c波段高功率内匹配gaas基伪晶高电子迁移率晶体管(PHEMTs)功率放大器的初步研究成果。先前开发的0.25 /spl mu/m/spl times/ 8mm PHEMT芯片被选择作为功率放大器的构建模块。单片机单元由一个8mm PHEMT芯片及其输入输出匹配电路组成。这些部件被集成到一个小型铜载体中。通过将四个带有集总元件的8毫米芯片和一个分布式威尔金森功率分配器/合成器组合在一起,这些单元组装在同一类型的载波中,并提供20 W的输出功率
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引用次数: 10
A 3.5V, 1.3W GaAs power multichip IC for cellular phone 一种用于手机的3.5V, 1.3W GaAs电源多芯片IC
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394501
M. Maeda, M. Nishijima, H. Takehara, C. Adachi, H. Fujimoto, Y. Ota, O. Ishikawa
A GaAs power multichip IC (MCIC) operating at 3.5 V for cellular phone has been developed. The MCIC can deliver an output power over 1.3 W with a power-added efficiency of 60% from 890 to 950 MHz. It is comprised of two GaAs MESFETs, three GaAs passive matching chips and a printed board on which biasing networks are fabricated. These components are mounted on an aluminum nitride (AlN) package. The volume of the MCIC is only 0.4 cc, half that of conventional power hybrid ICs. This MCIC will contribute to realization of high performance and very compact cellular phones.<>
研制了一种工作电压为3.5 V的手机用GaAs电源多芯片IC (MCIC)。MCIC可以提供超过1.3 W的输出功率,功率增加效率为60%,从890到950 MHz。它由两个GaAs mesfet,三个GaAs无源匹配芯片和一个印制板组成,在印制板上制造偏置网络。这些组件安装在氮化铝(AlN)封装上。MCIC的体积只有0.4 cc,是传统动力混合ic的一半。该MCIC将有助于实现高性能和非常紧凑的移动电话。
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引用次数: 22
2 - 8 GHz Gilbert-cell mixer IC for 2.5 Gb/s coherent optical transmission 用于2.5 Gb/s相干光传输的2 - 8 GHz吉尔伯特单元混频器IC
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394448
M. Kasashima, K. Tanaka, H. Yamazaki, H. Nakamura
A Gilbert-cell mixer IC for a 2.5 Gb/s coherent optical fiber transmission system using 0.25 /spl mu/m gate GaAs MESFETs has been developed. The mixer IC operates 1-8.5 GHz RF 3 dB bandwidth and an ideal square-law characteristic was obtained around input level of -15 dBm to 0 dBm. The mixer IC was actually operated in a 2.5 Gb/s coherent optical transmission test system, and sensitivity of -41.3 dBm for 10/sup -11/ bit-error-rate was obtained.<>
研制了一种采用0.25 /spl μ m栅极GaAs mesfet用于2.5 Gb/s相干光纤传输系统的Gilbert-cell混频器IC。混频器IC工作于1-8.5 GHz RF 3db带宽,在-15 dBm至0 dBm的输入电平附近获得理想的平方律特性。该混频器集成电路在2.5 Gb/s相干光传输测试系统中实际运行,在10/sup -11/误码率下获得了-41.3 dBm的灵敏度。
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引用次数: 1
High-efficiency InP-based HEMT MMIC power amplifier 基于inp的高效率HEMT MMIC功率放大器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394430
A. Kurdoghlian, W. Lam, C. Chou, L. Jellian, A. Igawa, M. Matloubian, L. Larson, A. Brown, M. Thompson, C. Ngo
High-efficiency monolithic Q-band power amplifiers were developed using InP based HEMT MMIC technology. The amplifiers demonstrated state-of-the-art power performance including 33% power-added efficiency and 26 dBm of output power at 44 GHz. This is the highest output power reported with such a high efficiency for InP-based HEMT MMIC power amplifiers at Q-bands. The intended application is communication terminals.<>
采用基于InP的HEMT MMIC技术开发了高效单片q波段功率放大器。该放大器展示了最先进的功率性能,包括33%的功率附加效率和44 GHz的26 dBm输出功率。这是基于inp的HEMT MMIC功率放大器在q波段具有如此高效率的最高输出功率。预期的应用是通信终端
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引用次数: 8
A 25 k-gate BDCFL G/A with a differential push-pull ECL I/O 一个25 k门BDCFL G/A与差分推挽ECL I/O
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394483
Y. Kaneko, H. Shimizu, K. Nagata, M. Koyanagi, M. Okamoto, M. Suzuki, S. Yokokawa, S. Shimizu, T. Maejima, J. Wada, H. Kawada, S. Ueno, M. Minamizawa, I. Yaegashi
The authors develop a 25 k-gate array with 0.8-/spl mu/m buried p-layer MESFET, three-level gold-based interconnects, and Au bump technology. They use differential push-pull circuits for the ECL interface circuits to obtain a sufficient margin, a low-voltage (-1.6 V) power supply for the internal gates to reduce the power consumption, and -2.0 V for the I/O circuits. The basic cell array combines DCFL and ECL compatible buffered DCFL gates (BDCFL). The basic delay times are 45 ps for 0.75 mW DCFL and 60 ps for 1.2 mW BDCFL gates. The gate array chip size is 10.7/spl times/10/7 mm, and contains 24,320 three-input BDCFL internal gates. The authors also use 80 /spl mu/m TAB to reduce the package delay time and simultaneous switching output noise. They use the array in a vector parallel processor which has a peak performance of 355 GFLOPS.<>
作者开发了一种25 k栅极阵列,采用0.8-/spl mu/m埋p层MESFET,三能级金基互连和Au碰撞技术。他们为ECL接口电路使用差分推挽电路以获得足够的余量,为内部门提供低压(-1.6 V)电源以降低功耗,为I/O电路使用-2.0 V。基本单元阵列结合了DCFL和ECL兼容缓冲DCFL门(BDCFL)。0.75 mW DCFL栅极的基本延迟时间为45 ps, 1.2 mW BDCFL栅极的基本延迟时间为60 ps。门阵列芯片尺寸为10.7/spl倍/10/ 7mm,包含24,320个三输入BDCFL内部门。作者还使用80 /spl mu/m TAB来减少封装延迟时间和同时开关输出噪声。他们在矢量并行处理器中使用该阵列,其峰值性能为355 GFLOPS。
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引用次数: 1
Low current GaAs integrated down converter for portable communication applications 用于便携式通信应用的低电流GaAs集成下变频器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394504
V. Nair, R. Vaitkus, D. Scheitlin, J. Kline, H. Swanson
A low current GaAs MMIC amplifier/mixer was designed and characterized for portable communication applications in the 900 MHz band. This single chip integrated front-end IC (90 mil /spl times/ 110 mil) achieved - 118 dBM sensitivity at the cellular band. The extremely low power dissipation, high level of integration, and very good RF performance of this monolithic IC make it an ideal candidate for portable communication applications.<>
设计了一种适用于900 MHz频段便携式通信的低电流GaAs MMIC放大器/混频器。该单芯片集成前端IC (90 mil /spl倍/ 110 mil)在蜂窝频段实现了- 118 dBM的灵敏度。这种单片IC极低的功耗、高集成度和非常好的射频性能使其成为便携式通信应用的理想选择。
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引用次数: 19
期刊
15th Annual GaAs IC Symposium
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