Pub Date : 2007-04-23DOI: 10.1109/nems.2007.352160
Si-Hyung Lim, J. Jaworski, S. Satyanarayana, F. Wang, D. Raorane, Seung-Wuk Lee, A. Majumdar
For gas phase chemical sensing, we have developed a selective, sensitive and portable sensing platform, which integrates bio receptors, chemo-mechanical sensor array, and electrical readout circuits. The biggest challenge in chemical sensors is selectivity of a receptor to its respective target molecule against a background of various interfering agents. For target specific receptors, sequence-specific recognition motifs have been identified through directed evolution methods, called phage display. We have demonstrated and updated a parylene micromembrane surface stress sensor array which uses capacitive signal readout. For a fully integrated sensor platform, a portable chemical sensing board has been built.
{"title":"Nanomechanical Chemical Sensor Platform","authors":"Si-Hyung Lim, J. Jaworski, S. Satyanarayana, F. Wang, D. Raorane, Seung-Wuk Lee, A. Majumdar","doi":"10.1109/nems.2007.352160","DOIUrl":"https://doi.org/10.1109/nems.2007.352160","url":null,"abstract":"For gas phase chemical sensing, we have developed a selective, sensitive and portable sensing platform, which integrates bio receptors, chemo-mechanical sensor array, and electrical readout circuits. The biggest challenge in chemical sensors is selectivity of a receptor to its respective target molecule against a background of various interfering agents. For target specific receptors, sequence-specific recognition motifs have been identified through directed evolution methods, called phage display. We have demonstrated and updated a parylene micromembrane surface stress sensor array which uses capacitive signal readout. For a fully integrated sensor platform, a portable chemical sensing board has been built.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128134323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352093
Weiping Chen, J. Ding, Xiaowei Liu, Chao Wang
A system-level model of a bulk micromachined dual axis accelerometer is presented. The accelerometer has only one inertial mass, symmetrically suspended by four pairs of folded elastic beams. The size of the fabricated accelerometer is 5.4times5.4 mm2. The displacement change of the inertial mass is converted to the change of differential capacitance between active combs and fixed combs. Generally, the input acceleration is mixed with the x-axis and the y-axis. In order to separate and pick off the mixed signal, the frequency-division method is adopted in the interface circuit. The paper details the Simulink model, which is used to evaluate the feasibility of the detective method. The simulation results validate the feasibility that the interface circuit can detect dual-axis acceleration separately and synchronously.
{"title":"Design and system-level simulation of a capacitive dual axis accelerometer","authors":"Weiping Chen, J. Ding, Xiaowei Liu, Chao Wang","doi":"10.1109/NEMS.2007.352093","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352093","url":null,"abstract":"A system-level model of a bulk micromachined dual axis accelerometer is presented. The accelerometer has only one inertial mass, symmetrically suspended by four pairs of folded elastic beams. The size of the fabricated accelerometer is 5.4times5.4 mm2. The displacement change of the inertial mass is converted to the change of differential capacitance between active combs and fixed combs. Generally, the input acceleration is mixed with the x-axis and the y-axis. In order to separate and pick off the mixed signal, the frequency-division method is adopted in the interface circuit. The paper details the Simulink model, which is used to evaluate the feasibility of the detective method. The simulation results validate the feasibility that the interface circuit can detect dual-axis acceleration separately and synchronously.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132600583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352112
W. Lou, X. Yu
MEMS package technology is playing an increasingly important part today. As one of important part of MEMS package technology, flip-chip technology is widely used in the assembly of high-performance that requires good functionality on substrate space. It has many advantages such as smaller size, increased functionality and lower cost. So it has been widely used in MEMS package. The thermal stress of flip-chip is analyzed by using the finite element analysis software in this paper. It simulates the thermal stress distributing of the flip-chip structure, which is caused by the high temperature during the underfill process. And by modifying all kinds of geometry parameters and material attributes, it analyses that how underfill CTE, solidifying temperature and bump size affect the thermal stress of the micro-structure. The results from this work would be very useful to optimize the technological parameter and improve the package properties.
{"title":"Flip-Chip Micro-Thermal Stress Simulation in Underfill Process","authors":"W. Lou, X. Yu","doi":"10.1109/NEMS.2007.352112","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352112","url":null,"abstract":"MEMS package technology is playing an increasingly important part today. As one of important part of MEMS package technology, flip-chip technology is widely used in the assembly of high-performance that requires good functionality on substrate space. It has many advantages such as smaller size, increased functionality and lower cost. So it has been widely used in MEMS package. The thermal stress of flip-chip is analyzed by using the finite element analysis software in this paper. It simulates the thermal stress distributing of the flip-chip structure, which is caused by the high temperature during the underfill process. And by modifying all kinds of geometry parameters and material attributes, it analyses that how underfill CTE, solidifying temperature and bump size affect the thermal stress of the micro-structure. The results from this work would be very useful to optimize the technological parameter and improve the package properties.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133632048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352209
Chi-Chang Lin, Jr-Tzai Chen, Yan-Fu Chen, T. Chang, Hsien-Chang Chang
An unique, sensitive, and highly specific immunoassay system using gold nanoparticles and surface-enhanced Raman spectroscopy (SERS) is described. To demonstrate the analytical capabilities of the new technique, Raman reporter (mercaptobenzoic, MBA) that is coimmobilized with biospeciflc anti-protein A on gold nanoparticles (AuNP). Anti-protein A-AuNP-MBA, which combing both electromagnetic field and chemical enhancement, was used to exploits the SERS-derived signal. A dynamic range of 2-3 orders of magnitude and 1-10 pg/mL of detection limitation of protein A were achieved. The results indicated this new technique could be used in clinical diagnostic applications with fast, high sensitivity and high-throughput screening of antibodies.
{"title":"Immunogold Nanoparticle Combing Surface-Enhanced Raman Scattering Method for Protein A Detection","authors":"Chi-Chang Lin, Jr-Tzai Chen, Yan-Fu Chen, T. Chang, Hsien-Chang Chang","doi":"10.1109/NEMS.2007.352209","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352209","url":null,"abstract":"An unique, sensitive, and highly specific immunoassay system using gold nanoparticles and surface-enhanced Raman spectroscopy (SERS) is described. To demonstrate the analytical capabilities of the new technique, Raman reporter (mercaptobenzoic, MBA) that is coimmobilized with biospeciflc anti-protein A on gold nanoparticles (AuNP). Anti-protein A-AuNP-MBA, which combing both electromagnetic field and chemical enhancement, was used to exploits the SERS-derived signal. A dynamic range of 2-3 orders of magnitude and 1-10 pg/mL of detection limitation of protein A were achieved. The results indicated this new technique could be used in clinical diagnostic applications with fast, high sensitivity and high-throughput screening of antibodies.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124908635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352104
H.T. Chen, C.W. Liu, S.G. Liu, C.S. Yang, C. Gau
Fabrication of a temperature sensor array and a heater in a complicated heat transfer microchannel system, on a glass substrate, is presented. In addition to the glass substrate, low thermal conductivity materials such as SU-8, PMMA plate are selected to form the micro channel wall to provide good thermal insulation. Both the titanium and the platinum are deposited sequentially on a glass plate and made into heater and sensors, respectively. Lift-off method is used to obtain the desired pattern for heater and sensors. The fabrication process is much simpler than those reported in literature. Design consideration and fabrication techniques involved in this processes is discussed. Finally, validation of the heaters and sensors fabricated and a measurement of the heat transfer coefficient distributions inside the micro channel is presented.
{"title":"Fabrication of a Complicated Heat Transfer Microchannel System for CPU Cooling Study","authors":"H.T. Chen, C.W. Liu, S.G. Liu, C.S. Yang, C. Gau","doi":"10.1109/NEMS.2007.352104","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352104","url":null,"abstract":"Fabrication of a temperature sensor array and a heater in a complicated heat transfer microchannel system, on a glass substrate, is presented. In addition to the glass substrate, low thermal conductivity materials such as SU-8, PMMA plate are selected to form the micro channel wall to provide good thermal insulation. Both the titanium and the platinum are deposited sequentially on a glass plate and made into heater and sensors, respectively. Lift-off method is used to obtain the desired pattern for heater and sensors. The fabrication process is much simpler than those reported in literature. Design consideration and fabrication techniques involved in this processes is discussed. Finally, validation of the heaters and sensors fabricated and a measurement of the heat transfer coefficient distributions inside the micro channel is presented.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131741647","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352240
U. Lee, Hyukjin Oh, S. You
Fundamental natural frequencies of armchair single-walled carbon nanotubes (SWCNTs) are evaluated in this paper. As there is no universal agreement on the exact wall thickness of a SWCNT, some different wall thicknesses have been assumed by most of researchers to report a wide range of different elastic constants for a SWCNT. Thus, to compute the effective structural properties of SWCNTs needed for the evaluation of their fundamental natural frequencies, without needing to assume the controversial wall thickness, we adopt a new continuum modeling method developed in our previous study based on the energy equivalence principle.
{"title":"Natural Frequencies of Single-Walled Carbon Nanotubes","authors":"U. Lee, Hyukjin Oh, S. You","doi":"10.1109/NEMS.2007.352240","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352240","url":null,"abstract":"Fundamental natural frequencies of armchair single-walled carbon nanotubes (SWCNTs) are evaluated in this paper. As there is no universal agreement on the exact wall thickness of a SWCNT, some different wall thicknesses have been assumed by most of researchers to report a wide range of different elastic constants for a SWCNT. Thus, to compute the effective structural properties of SWCNTs needed for the evaluation of their fundamental natural frequencies, without needing to assume the controversial wall thickness, we adopt a new continuum modeling method developed in our previous study based on the energy equivalence principle.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131542458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352053
Chi-Yuan Lee, Shuo-Jen Lee, C. Hsieh
The fuel cell has the potential to become an indispensable source of electric power. However, some problems have not yet been resolved. Measuring the temperature and humidity inside the fuel cells is currently difficult. Accordingly, in this study, array micro sensors are fabricated within the fuel cell, in which the temperature and humidity distributions are measured. The substrate of the bipolar plate of the fuel cell was made of stainless steel (SS-304) and the wet etching was employed to fabricate the channel on the stainless steel substrate. Then microelectromechanical systems (MEMS) technology was used to fabricate the array micro temperature sensors and the micro humidity sensors on the rib of channel of stainless steel. The advantages of array micro temperature sensors are their small volume, their high accuracy, their short response time, the simplicity of their fabrication, their mass production and their ability to measure the temperature at a precise location more effectively than the traditional thermocouple. The micro humidity sensors are made from gold and titanium as down and up electrodes in the channel. The performance curves of the single cell operating at 41.54 degC and gas flow rates of H2/O2 at 200/200ml/min. The max power density of the bipolar without micro sensor is 142 mW/cm2 and the current density is 463 mA/cm2. The max power density of the bipolar with micro sensor is 56 mW/cm2.
{"title":"Application of Micro Sensors on Diagnosis of Micro Fuel Cells","authors":"Chi-Yuan Lee, Shuo-Jen Lee, C. Hsieh","doi":"10.1109/NEMS.2007.352053","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352053","url":null,"abstract":"The fuel cell has the potential to become an indispensable source of electric power. However, some problems have not yet been resolved. Measuring the temperature and humidity inside the fuel cells is currently difficult. Accordingly, in this study, array micro sensors are fabricated within the fuel cell, in which the temperature and humidity distributions are measured. The substrate of the bipolar plate of the fuel cell was made of stainless steel (SS-304) and the wet etching was employed to fabricate the channel on the stainless steel substrate. Then microelectromechanical systems (MEMS) technology was used to fabricate the array micro temperature sensors and the micro humidity sensors on the rib of channel of stainless steel. The advantages of array micro temperature sensors are their small volume, their high accuracy, their short response time, the simplicity of their fabrication, their mass production and their ability to measure the temperature at a precise location more effectively than the traditional thermocouple. The micro humidity sensors are made from gold and titanium as down and up electrodes in the channel. The performance curves of the single cell operating at 41.54 degC and gas flow rates of H2/O2 at 200/200ml/min. The max power density of the bipolar without micro sensor is 142 mW/cm2 and the current density is 463 mA/cm2. The max power density of the bipolar with micro sensor is 56 mW/cm2.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134183245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352081
H. Ko, C.W. Liu, C. Gau
In the current fabrication of pressure sensor, both the sensor cavity and the sensor diaphragm were made of SU-8 which can be readily spun coat on the substrate at desired thickness and patterned by lithography. The thickness of the diaphragm, and the height of the sensor cavities, allowing deformation of diaphragm, can be readily varied from few to hundreds of microns by spin coat different thickness of SU-8 layer. This allows fabrication of cavity with much greater heights and measurement of pressure with much wider range. However, the sensor material used for the pressure sensor is the polysilicon doped with a high concentration of boron, which can readily sense the deformation of a diaphragm. This has precluded the possibility of fabricating the cavities and diaphragm first - which is a low temperature process, and then depositing the polysilicon sensor on the above - which is a high temperature process. Fabrication strategy has to be reversed, i.e., starts with the high temperature process of depositing the doped polysilicon layer and then the low temperature process.
{"title":"A Novel Fabrication for Pressure Sensor with Polymer Material and Its Characteristic Testing","authors":"H. Ko, C.W. Liu, C. Gau","doi":"10.1109/NEMS.2007.352081","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352081","url":null,"abstract":"In the current fabrication of pressure sensor, both the sensor cavity and the sensor diaphragm were made of SU-8 which can be readily spun coat on the substrate at desired thickness and patterned by lithography. The thickness of the diaphragm, and the height of the sensor cavities, allowing deformation of diaphragm, can be readily varied from few to hundreds of microns by spin coat different thickness of SU-8 layer. This allows fabrication of cavity with much greater heights and measurement of pressure with much wider range. However, the sensor material used for the pressure sensor is the polysilicon doped with a high concentration of boron, which can readily sense the deformation of a diaphragm. This has precluded the possibility of fabricating the cavities and diaphragm first - which is a low temperature process, and then depositing the polysilicon sensor on the above - which is a high temperature process. Fabrication strategy has to be reversed, i.e., starts with the high temperature process of depositing the doped polysilicon layer and then the low temperature process.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134330728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352255
D. Yao, Chun-Yi Lin, Fang-Gang Tseng
Superparamagnetic nanoparticles have been fabricated successfully, which are composed of Fe3O4 by using wet chemical co-precipitate method. The nanoparticles were functionalized on the surface by conjugated with the abti-Rabbit IgG. In the recently research, we try to use this system to approach the work which is to increase the reaction efficiency between antibodies and antigens by applying magnetic fields to alternate the binding samples in solution. The applied magnetic fields are produced by electro-magnets with AC or DC input. In the preliminary experiment, the antibodies were reacted with the carboxyl group Thiol SAMs that were modified on the glass chip with gold film. The surface plasma resonance (SPR) was used to detect the binding number of antibodies on the chip. The binding efficiency could be further calculated. The results showed the binding efficiency could be improved by using superparamagnetic nanoparticles with applying magnetic fields.
{"title":"The application of Iron Oxide magnetic nanoparticles to improve the binding efficiency of the IgG and Thiol SAMs","authors":"D. Yao, Chun-Yi Lin, Fang-Gang Tseng","doi":"10.1109/NEMS.2007.352255","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352255","url":null,"abstract":"Superparamagnetic nanoparticles have been fabricated successfully, which are composed of Fe3O4 by using wet chemical co-precipitate method. The nanoparticles were functionalized on the surface by conjugated with the abti-Rabbit IgG. In the recently research, we try to use this system to approach the work which is to increase the reaction efficiency between antibodies and antigens by applying magnetic fields to alternate the binding samples in solution. The applied magnetic fields are produced by electro-magnets with AC or DC input. In the preliminary experiment, the antibodies were reacted with the carboxyl group Thiol SAMs that were modified on the glass chip with gold film. The surface plasma resonance (SPR) was used to detect the binding number of antibodies on the chip. The binding efficiency could be further calculated. The results showed the binding efficiency could be improved by using superparamagnetic nanoparticles with applying magnetic fields.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133677580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-04-23DOI: 10.1109/NEMS.2007.352057
M. Tsai, T. Leu
This paper investigates on micro pumping system, flow field generated by an traveling wave boundary layer, which model is developed for flexural plate wave (FPW) device numerically. In the study, the steady state solution of a FPW pump is most concerned. The velocity profiles and net flow rate for different parameters including frequency, channel height, and wave length are investigated. In this device, it is found that flow field remains periodic. The time averaged velocity profiles over one period become a parabolic velocity profile when the channel height is less than 100 mum. When a channel height is higher than 200jim, the time averaged velocity profiles deviate from parabolic velocity profile to a wall-jet type velocity profile. This finding is different from previous study. The acoustic pressure can influence as high as 100 Jim channel height. The pressure wave confinement effect in a microchannel with height less than 100 Jim is noticed. This research also finds that the flow rate of FPW pump can be controlled by the frequency.
{"title":"The Study of Flexible Plate Wave Device for Micro Pumping System","authors":"M. Tsai, T. Leu","doi":"10.1109/NEMS.2007.352057","DOIUrl":"https://doi.org/10.1109/NEMS.2007.352057","url":null,"abstract":"This paper investigates on micro pumping system, flow field generated by an traveling wave boundary layer, which model is developed for flexural plate wave (FPW) device numerically. In the study, the steady state solution of a FPW pump is most concerned. The velocity profiles and net flow rate for different parameters including frequency, channel height, and wave length are investigated. In this device, it is found that flow field remains periodic. The time averaged velocity profiles over one period become a parabolic velocity profile when the channel height is less than 100 mum. When a channel height is higher than 200jim, the time averaged velocity profiles deviate from parabolic velocity profile to a wall-jet type velocity profile. This finding is different from previous study. The acoustic pressure can influence as high as 100 Jim channel height. The pressure wave confinement effect in a microchannel with height less than 100 Jim is noticed. This research also finds that the flow rate of FPW pump can be controlled by the frequency.","PeriodicalId":364039,"journal":{"name":"2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133459049","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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