Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795574
K. Lee, K. Oi, S. Lim, Yvonne Yeo, K. Sweatman, T. Ono, K. Murayama, S. Martell, H. Shimamoto, M. Tsuriya
The presence of voids in first-level interconnects (FLI) is an unknown reliability concern. This paper presents the study of void formation in the interconnects, the inspection capability of void detection and the reliability impact of the voids in electromigration, thermal cycle and thermal shock tests. The first phase of this work has made it possible to define process recipes that can consistently build test packages with and without solder voids. X-ray inspection has been used to determine the level of voiding in the test packages. The second phase of this work has focused on subjecting the test packages to the said reliability tests. A comparison has been made between test packages with solder voids and test packages without solder voids. A conclusion that can be derived from the test data is that test packages with solder voids performed worse in solder joint reliability compared to test packages without solder voids.
{"title":"Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability","authors":"K. Lee, K. Oi, S. Lim, Yvonne Yeo, K. Sweatman, T. Ono, K. Murayama, S. Martell, H. Shimamoto, M. Tsuriya","doi":"10.23919/ICEP55381.2022.9795574","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795574","url":null,"abstract":"The presence of voids in first-level interconnects (FLI) is an unknown reliability concern. This paper presents the study of void formation in the interconnects, the inspection capability of void detection and the reliability impact of the voids in electromigration, thermal cycle and thermal shock tests. The first phase of this work has made it possible to define process recipes that can consistently build test packages with and without solder voids. X-ray inspection has been used to determine the level of voiding in the test packages. The second phase of this work has focused on subjecting the test packages to the said reliability tests. A comparison has been made between test packages with solder voids and test packages without solder voids. A conclusion that can be derived from the test data is that test packages with solder voids performed worse in solder joint reliability compared to test packages without solder voids.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"344 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127571411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795488
T. Konishi, R. Kibushi, T. Hatakeyama, S. Nakagawa, M. Ishizuka
This paper describes the evaluation of amount of heat from the semiconductor die, which is a boundary condition for Electro-Thermal Analysis to evaluate the micro scale hot spots in power SiC MOSFET. Electro-Thermal Analysis is a method for identifying the nano or micro scale hot spots of semiconductor devices. In our previous study, the adiabatic boundary condition between the semiconductor die and the mold resin was employed in the Electro-Thermal Analysis. However, it is necessary to discuss whether heat dissipation from the semiconductor die to the mold resin should be considered. In this study, we discuss the validity of the adiabatic boundary condition between the semiconductor die and the mold resin using CFD analysis.
{"title":"Evaluation of Amount of Heat Through Each Component of SiC Package Using CFD Analysis","authors":"T. Konishi, R. Kibushi, T. Hatakeyama, S. Nakagawa, M. Ishizuka","doi":"10.23919/ICEP55381.2022.9795488","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795488","url":null,"abstract":"This paper describes the evaluation of amount of heat from the semiconductor die, which is a boundary condition for Electro-Thermal Analysis to evaluate the micro scale hot spots in power SiC MOSFET. Electro-Thermal Analysis is a method for identifying the nano or micro scale hot spots of semiconductor devices. In our previous study, the adiabatic boundary condition between the semiconductor die and the mold resin was employed in the Electro-Thermal Analysis. However, it is necessary to discuss whether heat dissipation from the semiconductor die to the mold resin should be considered. In this study, we discuss the validity of the adiabatic boundary condition between the semiconductor die and the mold resin using CFD analysis.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134103654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795555
Rodolfo Saccon, A. Benin, Sri Krishna Bhogaraju, G. Elger
Copper sintering materials easily oxidize at high temperature. Therefore, functional binders capable of reducing copper oxides in-situ, have low boiling point, leave no unwanted residues and help realizing stable paste formulation are desired. Among all binders investigated in the study, a high boiling point, glycol based binder, provided the best reducing capability and highest shear strength followed by lower boiling point alcohol based binders. α-terpineol gave the best printability, however provided no protection against oxidation during sintering. Short chain alcohols reveal to have a better reducing effect and the sintering is improved for low temperature sintering, but they are too volatile to be reliable.
{"title":"Effect of binders on the performance of copper sintering pastes","authors":"Rodolfo Saccon, A. Benin, Sri Krishna Bhogaraju, G. Elger","doi":"10.23919/ICEP55381.2022.9795555","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795555","url":null,"abstract":"Copper sintering materials easily oxidize at high temperature. Therefore, functional binders capable of reducing copper oxides in-situ, have low boiling point, leave no unwanted residues and help realizing stable paste formulation are desired. Among all binders investigated in the study, a high boiling point, glycol based binder, provided the best reducing capability and highest shear strength followed by lower boiling point alcohol based binders. α-terpineol gave the best printability, however provided no protection against oxidation during sintering. Short chain alcohols reveal to have a better reducing effect and the sintering is improved for low temperature sintering, but they are too volatile to be reliable.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116543794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795406
Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita
While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.
{"title":"Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder","authors":"Qichao Hao, X. Tan, S. McDonald, K. Sweatman, T. Nishimura, T. Nishimura, K. Nogita","doi":"10.23919/ICEP55381.2022.9795406","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795406","url":null,"abstract":"While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123725348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795457
J. A. Goundar, Ken Suzuki, H. Miura
The ribbon width dependency of graphene nanoribbons (GNR) on the electronic properties showed promising applications in the development of advanced photonic devices, such as multi-bandgap photovoltaic devices. However, large periodic oscillations due to the change in the number of carbon atoms is a major limitation. To effectively control the electronic band properties of the fabricated GNR-based device, in this study, application of strain to the GNR’s is proposed. This study experimentally validates the theoretical concept on an 80-nm ribbon width dumbbell-shaped-GNR structure. The device showed about clear change in the electronic properties under 3 different strain conditions with an observed gauge factor of about 1500. Under an irradiation of a focused laser beam, the device showed an improvement of about 4.5 times under applied strain when compared to an unstrained sample.
{"title":"Strain-Induced Change in the Photonic Properties of Dumbbell-Shaped Graphene Nanoribbon Structures","authors":"J. A. Goundar, Ken Suzuki, H. Miura","doi":"10.23919/ICEP55381.2022.9795457","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795457","url":null,"abstract":"The ribbon width dependency of graphene nanoribbons (GNR) on the electronic properties showed promising applications in the development of advanced photonic devices, such as multi-bandgap photovoltaic devices. However, large periodic oscillations due to the change in the number of carbon atoms is a major limitation. To effectively control the electronic band properties of the fabricated GNR-based device, in this study, application of strain to the GNR’s is proposed. This study experimentally validates the theoretical concept on an 80-nm ribbon width dumbbell-shaped-GNR structure. The device showed about clear change in the electronic properties under 3 different strain conditions with an observed gauge factor of about 1500. Under an irradiation of a focused laser beam, the device showed an improvement of about 4.5 times under applied strain when compared to an unstrained sample.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"124 14","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113945270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795379
Yuri Yamada, F. Koshiji, Y. Yasuda, T. Uchida, Katsumi Yamada
In this study, the sheet resistance reduction of Indium Tin Oxide (ITO) transparent conductive films, which are utilized as the radiating elements, by annealing treatment was investigated to improve the radiation efficiency of monopole antennas using transparent conductive films. As a result, it was confirmed that the sheet resistance was significantly reduced and the radiation efficiency was improved to 72.23 % by increasing the film thickness and annealing
{"title":"Reduction of Sheet Resistance and Improvement of Radiation Efficiency by Annealing Treatment of ITO Transparent Antenna","authors":"Yuri Yamada, F. Koshiji, Y. Yasuda, T. Uchida, Katsumi Yamada","doi":"10.23919/ICEP55381.2022.9795379","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795379","url":null,"abstract":"In this study, the sheet resistance reduction of Indium Tin Oxide (ITO) transparent conductive films, which are utilized as the radiating elements, by annealing treatment was investigated to improve the radiation efficiency of monopole antennas using transparent conductive films. As a result, it was confirmed that the sheet resistance was significantly reduced and the radiation efficiency was improved to 72.23 % by increasing the film thickness and annealing","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125177869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795618
M. Honda, T. Hatakeyama, S. Nakagawa, R. Kibushi, M. Ishizuka
As the heat generation density of electronic devices increases, thermal vias are inserted in the printed circuit board (PCB) to dissipate the heat efficiently. Although the effective thermal conductivity of the PCB is important for the thermal management of electronics, measuring the effective thermal conductivity is time-consuming. Therefore, to save time, we focused on the thermal network method and examined the effect of the contraction heat flow around the thermal via on the numerically analyzed effective thermal conductivity of the PCB. The results showed that the contraction heat flow caused by the thermal via affects the range of 7 mm, and the range should be taken care of to express the contraction heat flow appropriately.
{"title":"A Thermal Network Model of a Printed Circuit Board Considering the Thermal Contraction Flow Caused by Thermal Vias","authors":"M. Honda, T. Hatakeyama, S. Nakagawa, R. Kibushi, M. Ishizuka","doi":"10.23919/ICEP55381.2022.9795618","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795618","url":null,"abstract":"As the heat generation density of electronic devices increases, thermal vias are inserted in the printed circuit board (PCB) to dissipate the heat efficiently. Although the effective thermal conductivity of the PCB is important for the thermal management of electronics, measuring the effective thermal conductivity is time-consuming. Therefore, to save time, we focused on the thermal network method and examined the effect of the contraction heat flow around the thermal via on the numerically analyzed effective thermal conductivity of the PCB. The results showed that the contraction heat flow caused by the thermal via affects the range of 7 mm, and the range should be taken care of to express the contraction heat flow appropriately.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128073361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795586
Kyung-Yeol Kim, Eun-Sung Ha, Tae-Ho Noh, Seung-Boo Jung
Recently, high-temperature endurance bonding has been required for the increasing demands of SiC die attachment for SiC power modules. The TLPS process is one of the promising high-heat endurance bonding methods. The general TLPS process needs a long bonding time about 60 min. To decrease the bonding time, we applied ultrasonic vibration during the soldering process. The cavitation effect induced by ultrasonic vibration can accelerate the intermetallics formation reaction. Also, we conducted the die shear test to evaluate the mechanical property after the environmental reliability test. The ultrasonic-assisted soldered joints showed superior mechanical reliability after a high-temperature storage test.
{"title":"The transient liquid phase bonding by ultrasonic-assisted soldering of Cu contained Sn-58Bi solder paste for high-temperature packaging applications","authors":"Kyung-Yeol Kim, Eun-Sung Ha, Tae-Ho Noh, Seung-Boo Jung","doi":"10.23919/ICEP55381.2022.9795586","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795586","url":null,"abstract":"Recently, high-temperature endurance bonding has been required for the increasing demands of SiC die attachment for SiC power modules. The TLPS process is one of the promising high-heat endurance bonding methods. The general TLPS process needs a long bonding time about 60 min. To decrease the bonding time, we applied ultrasonic vibration during the soldering process. The cavitation effect induced by ultrasonic vibration can accelerate the intermetallics formation reaction. Also, we conducted the die shear test to evaluate the mechanical property after the environmental reliability test. The ultrasonic-assisted soldered joints showed superior mechanical reliability after a high-temperature storage test.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130534174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795636
Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin
Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.
在这里，我们报告样品制备和电气测试的失效分析。对2 μm / 2 μm细线和空间的扇出封装进行失效分析，利用三维x射线识别亚微米缺陷。FIB结果证实了缺陷小于1μm, 3D x射线能力在2 μm细线封装上是有用的。
{"title":"3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages","authors":"Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin","doi":"10.23919/ICEP55381.2022.9795636","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795636","url":null,"abstract":"Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"26 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130754419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795521
Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh
This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.
{"title":"Study on Wiring and Mounting Structures for Smart Suits with Actuators","authors":"Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh","doi":"10.23919/ICEP55381.2022.9795521","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795521","url":null,"abstract":"This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122466089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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