2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463388
J. Lan, Mei-Ling Wu
This paper provides micro-bump fracture analysis in the context of a 2.5D IC package under reflow process. With the increasing demands for product functionality, the pitch size and diameter of micro-bumps have become smaller, as a means of achieving higher input/output counts in microelectronic packages. However, by decreasing micro-bump diameter, integrity of the microelectronic package is becoming compromised. The majority of research on the system in package (SiP) has focused on the Coefficient of Thermal Expansion (CTE) mismatch and heat junctions. The primary problems arising due to CTE mismatch and heat dissipation are failures or fatigues in 2.5D IC package, which can escalate to critical reliability issues. However, thermo-mechanical stress induced by temperature loading has a significant effect on material strength, causing, for example, interfacial cracking or micro-bump failure. Thus, 2.5D IC package modeling needs to be developed in order to identify factors that can mitigate micro-bump failure under reflow process. In this paper, we discuss the different insights pertaining to physics of thermo-mechanical loading for 2.5D IC package.
{"title":"Simulation of micro-bump interconnections failure analysis for 2.5D IC packaging","authors":"J. Lan, Mei-Ling Wu","doi":"10.1109/EUROSIME.2016.7463388","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463388","url":null,"abstract":"This paper provides micro-bump fracture analysis in the context of a 2.5D IC package under reflow process. With the increasing demands for product functionality, the pitch size and diameter of micro-bumps have become smaller, as a means of achieving higher input/output counts in microelectronic packages. However, by decreasing micro-bump diameter, integrity of the microelectronic package is becoming compromised. The majority of research on the system in package (SiP) has focused on the Coefficient of Thermal Expansion (CTE) mismatch and heat junctions. The primary problems arising due to CTE mismatch and heat dissipation are failures or fatigues in 2.5D IC package, which can escalate to critical reliability issues. However, thermo-mechanical stress induced by temperature loading has a significant effect on material strength, causing, for example, interfacial cracking or micro-bump failure. Thus, 2.5D IC package modeling needs to be developed in order to identify factors that can mitigate micro-bump failure under reflow process. In this paper, we discuss the different insights pertaining to physics of thermo-mechanical loading for 2.5D IC package.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126526112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463341
G. Acciani, Filomena Di Modugno, E. Mininno, P. Montegiglio
The growing research interest coming from the wide diffusion of wireless micro sensors and small electronic devices has given input on several studies towards Energy Harvesting (EH) as possible alternative to their powering in untraditional way. In the EH field the use of piezoelectric materials is developing rapidly. In this scenery, the aim of this paper is to evaluate the experimental and simulated behaviour and performances of an energy harvester, with the shape of a piezoelectric cantilever beam, subjected to wind induced-vibrations. The mathematical model is described by the Navier-Stokes equations and the constitutive equations of piezoelectric materials. The experimental setup is simulated using the software Comsol Multiphysics.
{"title":"Multi-physics simulation of a wind piezoelectric energy harvester validated by experimental results","authors":"G. Acciani, Filomena Di Modugno, E. Mininno, P. Montegiglio","doi":"10.1109/EUROSIME.2016.7463341","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463341","url":null,"abstract":"The growing research interest coming from the wide diffusion of wireless micro sensors and small electronic devices has given input on several studies towards Energy Harvesting (EH) as possible alternative to their powering in untraditional way. In the EH field the use of piezoelectric materials is developing rapidly. In this scenery, the aim of this paper is to evaluate the experimental and simulated behaviour and performances of an energy harvester, with the shape of a piezoelectric cantilever beam, subjected to wind induced-vibrations. The mathematical model is described by the Navier-Stokes equations and the constitutive equations of piezoelectric materials. The experimental setup is simulated using the software Comsol Multiphysics.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126541166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463322
Daniel Markus, M. Schmidt, Karin Lunz, U. Becker
This paper analyzes moisture diffusion methods regarding their applicability under varying boundary conditions and under consideration of non-linear material properties. It is shown that commonly utilized methods are not adequate for a physically consistent treatment of multimaterial setups with non-linear saturation concentrations. In order to overcome this limitation in moisture modeling, a new method, the so called Surface Humidity Potential approach is introduced, verified, and applied to a moisture simulation of a printed circuit board subjected to an environment encountered in automotive applications. Overall, a sound foundation for moisture analysis of plastic materials encountered in electronic components is established.
{"title":"A new method to model transient multi-material moisture transfer in automotive electronics applications","authors":"Daniel Markus, M. Schmidt, Karin Lunz, U. Becker","doi":"10.1109/EUROSIME.2016.7463322","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463322","url":null,"abstract":"This paper analyzes moisture diffusion methods regarding their applicability under varying boundary conditions and under consideration of non-linear material properties. It is shown that commonly utilized methods are not adequate for a physically consistent treatment of multimaterial setups with non-linear saturation concentrations. In order to overcome this limitation in moisture modeling, a new method, the so called Surface Humidity Potential approach is introduced, verified, and applied to a moisture simulation of a printed circuit board subjected to an environment encountered in automotive applications. Overall, a sound foundation for moisture analysis of plastic materials encountered in electronic components is established.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126574854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463401
B. Vandevelde, F. Vanhee, D. Pissoort, L. Degrendele, J. De Baets, B. Allaert, R. Lauwaert, R. Labie, G. Willems
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (PCB) through cyclic board bending. During the cycling, the temperature is kept constant, preferably at elevated temperature in order to fasten the creep deformation of the solder joint. This is done in a four-point bending setup which allows to apply an equal loading on all components lying between the inner bars. The scope of the paper is, firstly, to evaluate if the four point bending testing generates the same fatigue fracture as in thermal cycling; secondly, that the measured life times can be also predicted through finite element simulations; and thirdly if the technique can finally fasten the cycling frequency to gain testing time.
{"title":"Four-point bending cycling as alternative for thermal cycling solder fatigue testing","authors":"B. Vandevelde, F. Vanhee, D. Pissoort, L. Degrendele, J. De Baets, B. Allaert, R. Lauwaert, R. Labie, G. Willems","doi":"10.1109/EUROSIME.2016.7463401","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463401","url":null,"abstract":"This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (PCB) through cyclic board bending. During the cycling, the temperature is kept constant, preferably at elevated temperature in order to fasten the creep deformation of the solder joint. This is done in a four-point bending setup which allows to apply an equal loading on all components lying between the inner bars. The scope of the paper is, firstly, to evaluate if the four point bending testing generates the same fatigue fracture as in thermal cycling; secondly, that the measured life times can be also predicted through finite element simulations; and thirdly if the technique can finally fasten the cycling frequency to gain testing time.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129756571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463404
J. Albrecht, G. M. Reuther, J. Brueckner, J. Auersperg, S. Rzepka, R. Pufall
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal migration electrical failures may occur. Loading conditions comparable to the wire bonding process can be achieved using a nanoindenter. In this work a spherical tip has been used at first to determine material properties of the silicon nitride film and also to attain cracking of the film material. Based on the experimental results a finite element model using ABAQUS standardTM was established representing the experimentally observed load-displacement behavior. The introduction of the extended finite element method as well as the cohesive surface approach allow to describe different failure modes. The results of these investigations can be used to avoid failures like oxide layer cracking during wire bonding or during the wafer testing process.
{"title":"Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling","authors":"J. Albrecht, G. M. Reuther, J. Brueckner, J. Auersperg, S. Rzepka, R. Pufall","doi":"10.1109/EUROSIME.2016.7463404","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463404","url":null,"abstract":"Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal migration electrical failures may occur. Loading conditions comparable to the wire bonding process can be achieved using a nanoindenter. In this work a spherical tip has been used at first to determine material properties of the silicon nitride film and also to attain cracking of the film material. Based on the experimental results a finite element model using ABAQUS standardTM was established representing the experimentally observed load-displacement behavior. The introduction of the extended finite element method as well as the cohesive surface approach allow to describe different failure modes. The results of these investigations can be used to avoid failures like oxide layer cracking during wire bonding or during the wafer testing process.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123771845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463337
A. Chernyakov, A. Kartashova, N. Shmidt, E. Shabunina, N. A. Talnishnikh, A. L. Zakgeim
The results of the degradation study of commercial InGaN/GaN LEDs with the external quantum efficiency (EQE) ~ 40-50 % at 450-460 nm are presented. It has been clarified that one of the mechanisms responsible for EQE degradation and the unpredictable failure of LEDs is the multiphonon recombination of carriers. The distorted forward branch of I-V characteristics at U <; 2V and the appearance of the SI ~j4 section on the current spectral noise density dependences on current density in LEDs before or after 100 hours of aging test are the criteria identifying an unpredictable failure.
{"title":"Criteria of unpredictable failure for high-power InGaN LEDs","authors":"A. Chernyakov, A. Kartashova, N. Shmidt, E. Shabunina, N. A. Talnishnikh, A. L. Zakgeim","doi":"10.1109/EUROSIME.2016.7463337","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463337","url":null,"abstract":"The results of the degradation study of commercial InGaN/GaN LEDs with the external quantum efficiency (EQE) ~ 40-50 % at 450-460 nm are presented. It has been clarified that one of the mechanisms responsible for EQE degradation and the unpredictable failure of LEDs is the multiphonon recombination of carriers. The distorted forward branch of I-V characteristics at U <; 2V and the appearance of the SI ~j4 section on the current spectral noise density dependences on current density in LEDs before or after 100 hours of aging test are the criteria identifying an unpredictable failure.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125963891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463297
Hong-liang Ke, Qiang Sun, Jian Zhao, Hongxin Zhang, L. Jing, Yao Wang, Jian-cheng Hao
For estimating the junction temperature (Tj) of LED lamp, the Tj of LED module powering by rated current (135mA DC) and working in the thermal environment of LED lamp is measured with traditional forward voltage method in experiment 1. To calculate the Tj of LED lamp in actual working conditions (220V AC), a correction factor is introduced into the original model to process the deviation of output currents of LED driver electronics, as demonstrated in experiment 2. Compared with the surface temperature of LED obtained by infrared imaging method, the result in experiment 2 can effectively reflect the change in Tj of LED lamp under different ambient temperatures, which differs the surface temperature by 3~4°C. While due to a significant effect on the thermal environment of LED lamp introduced by LED driver electronics, the result in experiment 1 is approximately 9~10°C lower than that in experiment 2.
{"title":"Junction temperature estimation for LED lamp with forward voltage method","authors":"Hong-liang Ke, Qiang Sun, Jian Zhao, Hongxin Zhang, L. Jing, Yao Wang, Jian-cheng Hao","doi":"10.1109/EUROSIME.2016.7463297","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463297","url":null,"abstract":"For estimating the junction temperature (Tj) of LED lamp, the Tj of LED module powering by rated current (135mA DC) and working in the thermal environment of LED lamp is measured with traditional forward voltage method in experiment 1. To calculate the Tj of LED lamp in actual working conditions (220V AC), a correction factor is introduced into the original model to process the deviation of output currents of LED driver electronics, as demonstrated in experiment 2. Compared with the surface temperature of LED obtained by infrared imaging method, the result in experiment 2 can effectively reflect the change in Tj of LED lamp under different ambient temperatures, which differs the surface temperature by 3~4°C. While due to a significant effect on the thermal environment of LED lamp introduced by LED driver electronics, the result in experiment 1 is approximately 9~10°C lower than that in experiment 2.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125097950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463315
Alexander Mann, H. Lohmeyer, Yvonne Joseph
A novel approach for wafer-level test and monitoring of multilayer metal-stack integrity in integrated circuit process technology based on the low-cycle fatigue of power device metallization structure is described. Repetitive power pulsing at the limit of the electro-thermal safe-operating area of the devices reveals systematic changes in level and homogeneity of intrinsic thermomechanical robustness and is able to activate latent defects. Exemplarily for two smart-power process technologies the intrinsic low-cycle lifetime limit is explored as reference basis and transfer to test vehicles on product or process control module is validated in experimental case-study and supported by detailed electrothermal simulation of stress pulse events.
{"title":"Low-cycle fatigue of multilayer metal stack employed as fast wafer level monitor for backend integrity in smart power technologies","authors":"Alexander Mann, H. Lohmeyer, Yvonne Joseph","doi":"10.1109/EUROSIME.2016.7463315","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463315","url":null,"abstract":"A novel approach for wafer-level test and monitoring of multilayer metal-stack integrity in integrated circuit process technology based on the low-cycle fatigue of power device metallization structure is described. Repetitive power pulsing at the limit of the electro-thermal safe-operating area of the devices reveals systematic changes in level and homogeneity of intrinsic thermomechanical robustness and is able to activate latent defects. Exemplarily for two smart-power process technologies the intrinsic low-cycle lifetime limit is explored as reference basis and transfer to test vehicles on product or process control module is validated in experimental case-study and supported by detailed electrothermal simulation of stress pulse events.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"143 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124552081","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463365
S. Wiese, D. Bruch, M. Elasmi, F. Kraemer, J. Ahmar
This paper presents an approach to adequately design a test setup and specimen in order to perform tensile tests on PCB copper traces for board level packaging. The difficulty to conduct tensile tests on thin pcb copper traces is caused by the requirements of representative specimens. Most of the failure sites on copper interconnect structures in electronic assemblies are characterised by a high aspect ratio between the thickness and width. While the width is on the range of some hundred micrometres to a few millimetres, typical thicknesses are between 1 to 100 micrometres. Therefore specimens that adequately represent the properties of pcb copper are difficult to test in a standard mechanical test setup, which is usually made for compact specimens. The experimental design for determining the deformation behaviour of the PCB copper trace material encompasses two aspects: (1) experimental setup design and (2) specimen design. The two aspects contribute to the accuracy of the later material model for the use in FEM simulation. In order to conduct tests on thin copper film specimens, a test setup was designed, which is characterized by higher compliance of its frame. This way the test setup is able to compensate for misaligned angles of the sample to the load axis of the setup. An optical measurement is used in order provide accurate strain measurements on the sample. The role of specimen design of thin copper foil specimens is crucial for the accuracy of the test. FEM simulations of stress distributions have been carried out on classical dog bone specimens and on stripe specimens. The paper will discuss the inhomogeneous stress distributions of the gauge length of the stripe specimen compared to the dog bone specimen. Another aspect is the sample preparation. The paper will report the difficulties that exist, when the specimen is prepared by milling a copper sheet. The paper will discuss the connection between test setup design and specimen design with respect to the effects on the results of a tensile test on thin copper specimens.
{"title":"Experimental design for tensile tests on PCB copper traces for board level packaging","authors":"S. Wiese, D. Bruch, M. Elasmi, F. Kraemer, J. Ahmar","doi":"10.1109/EUROSIME.2016.7463365","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463365","url":null,"abstract":"This paper presents an approach to adequately design a test setup and specimen in order to perform tensile tests on PCB copper traces for board level packaging. The difficulty to conduct tensile tests on thin pcb copper traces is caused by the requirements of representative specimens. Most of the failure sites on copper interconnect structures in electronic assemblies are characterised by a high aspect ratio between the thickness and width. While the width is on the range of some hundred micrometres to a few millimetres, typical thicknesses are between 1 to 100 micrometres. Therefore specimens that adequately represent the properties of pcb copper are difficult to test in a standard mechanical test setup, which is usually made for compact specimens. The experimental design for determining the deformation behaviour of the PCB copper trace material encompasses two aspects: (1) experimental setup design and (2) specimen design. The two aspects contribute to the accuracy of the later material model for the use in FEM simulation. In order to conduct tests on thin copper film specimens, a test setup was designed, which is characterized by higher compliance of its frame. This way the test setup is able to compensate for misaligned angles of the sample to the load axis of the setup. An optical measurement is used in order provide accurate strain measurements on the sample. The role of specimen design of thin copper foil specimens is crucial for the accuracy of the test. FEM simulations of stress distributions have been carried out on classical dog bone specimens and on stripe specimens. The paper will discuss the inhomogeneous stress distributions of the gauge length of the stripe specimen compared to the dog bone specimen. Another aspect is the sample preparation. The paper will report the difficulties that exist, when the specimen is prepared by milling a copper sheet. The paper will discuss the connection between test setup design and specimen design with respect to the effects on the results of a tensile test on thin copper specimens.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130223394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463366
Zhibo Chen, Wei Huang, Xinfeng Zhang, M. Yuen
Elastomeric electric-contact pressure sensors in wearable devices for monitoring physiological signals have much broader potential. In order to design and develop better pressure sensors, the simulation of the electric contact - pressure response is very important. However, due to the large deformation of the patterned surface, it is difficult to model the specific contact surface by using the conventional electric-contact theory only. In the present study, a hybrid electromechanical-contact resistance model was developed to study the strain and stress distributions on the microstructured elastomeric electric-contact surface subjected to pressure. In our new model, the contact resistance in an epidermal pressure sensor can be modeled easily and accurately with a better result. Our model can be used to optimize the sensor design and evaluate the sensing performance of pressure sensors.
{"title":"Modeling and simulation of electromechanical-contact based elastomeric pressure sensor","authors":"Zhibo Chen, Wei Huang, Xinfeng Zhang, M. Yuen","doi":"10.1109/EUROSIME.2016.7463366","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463366","url":null,"abstract":"Elastomeric electric-contact pressure sensors in wearable devices for monitoring physiological signals have much broader potential. In order to design and develop better pressure sensors, the simulation of the electric contact - pressure response is very important. However, due to the large deformation of the patterned surface, it is difficult to model the specific contact surface by using the conventional electric-contact theory only. In the present study, a hybrid electromechanical-contact resistance model was developed to study the strain and stress distributions on the microstructured elastomeric electric-contact surface subjected to pressure. In our new model, the contact resistance in an epidermal pressure sensor can be modeled easily and accurately with a better result. Our model can be used to optimize the sensor design and evaluate the sensing performance of pressure sensors.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130072632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：