3D Printing and Additive Manufacturing最新文献

The finite element (FE) method is used to characterize the thermal gradient, solidification rate, and molten pool sizes of Ti-6Al-4V plates in the process of selective laser melting (SLM). The results are verified by using the computational fluid dynamics (CFD) simulation. The proposed FE model contains a series of toolpath information that is directly converted from a G-code file, including hatch spacing, laser power, layer thickness, dwell time, and scanning speed generated by using Slic3r software from a CAD file. A proposed multi-layer, multi-track FE model is used to investigate the influence of the laser power, scanning speed, and scanning path on the microstructure in the Ti-6Al-4V plate built via SLM. The processing window is also determined based on the proposed FE model. The FE results indicate that, with a decrease in the laser power and an increase in the scanning speed, the morphology of the crystal grains, showing fully columnar crystals, gradually deviates from the fully equiaxed region. The formed grains are dependent on the laser power, scanning speed, and deposition position, but they are not sensitive to the scanning path, and with the deposition from the bottom layer to the top layer, the size of the formed grains is gradually increasing, which shows a good agreement with the experimental results.

Fused filament fabrication is one of the most desired thermal plastic additive manufacturing processes because of its ability to fabricate complex objects with high accessibility. However, due to the extrusion track-based direct write process mechanism, parts built using this method exhibit anisotropic mechanical properties. In this work, an in-process laser heating method is introduced to heal interface adhesion between adjacent deposited tracks by increasing the interface temperature to promote polymer reptation and enhance bonding strength of the interface of adjacent tracks. With the use of laser heating induced interface healing, the measured flexural strength between adjacent tracks in the same layer increased and exceeded that of the control sample tested along the track direction. The effect of laser on interface healing was also verified by investigating the load-displacement curve and morphology analysis of the fractured surface.

The challenges in reliably removing the sacrificial material from fully enclosed microfluidic channels hinder the use of three-dimensional (3D) printing to create microfluidic devices with intricate geometries. With advances in printer resolution, the etching of sacrificial materials from increasingly smaller channels is poised to be a bottleneck using the existing techniques. In this study, we introduce a microfabrication approach that utilizes centrifugation to effortlessly and efficiently remove the sacrificial materials from 3D-printed microfluidic devices with densely packed microfeatures. We characterize the process by measuring the etch rate under different centrifugal forces and developed a theoretical model to estimate process parameters for a given geometry. The effect of the device layout on the centrifugal etching process is also investigated. We demonstrate the applicability of our approach on devices fabricated using inkjet 3D printing and stereolithography. Finally, the advantages of the introduced approach over commonly used injection-based etching of sacrificial material are experimentally demonstrated in direct comparisons. A robust method to postprocess additively manufactured geometries composed of intricate microfluidic channels can help utilize both the large printing volume and high spatial resolution afforded by 3D printing in creating a variety of devices ranging from scaffolds to large-scale microfluidic assays.

Advances in selective laser melting (SLM) of metals in the past two decades have made metals additive manufacturing more accessible for industrial adoption. Despite printing process improvements, post-processing of SLM components has not improved much, resulting in considerable costs, delay, and design limitations. Building upon recent advances in sensitization-based self-terminating etching processes, this work details a new set iodine-based sensitization and etching chemistries that simplify the post-processing of copper (Cu) alloy components fabricated using SLM. This work demonstrates that iodine can be used to "sensitize" the surface of copper alloy components to form soluble copper iodide salt that can be then dissolved in common solvents, such as acetonitrile. This process removes a predefined amount of material from all interior and exterior surfaces in a self-terminating manner, enabling facile removal of internal and external supports, removal of any trapped powder, and the smoothing of interior and exterior surfaces. We demonstrate this process on GRCop (Cu-chromium-niobium) alloys due to their widespread use by the rocket propulsion industry along with a demonstration in copper (110) for applications in heat exchangers and electromagnetic transmitters/receivers. Our results provide the first systematic study on the effect of iodization temperature and duration on the thickness of the iodide region in GRCop-84 components. Additionally, the surface roughness before and after each iodization-dissolution was also quantified for GRCop-84 and showed 70% reduction in R_a roughness from a high of 10 μm as-printed to a low of 3 μm after four iodization-dissolution cycles.

Direct Ink Writing (DIW) opens new possibilities in three-dimensional (3D) printing of carbon-based polymeric ink. This is due to its ability in design flexibility, structural complexity, and environmental sustainability. This area requires exhaustive study because of its wide application in different manufacturing sectors. The present article is related to the variant emerging 3D printing techniques and DIW of carbonaceous materials. Carbon-based materials, extensively used for various applications in 3D printing, possess impressive chemical stability, strength, and flexible nanostructure. Fine printable inks consist predominantly of uniform solutions of carbon materials, such as graphene, graphene oxide (GO), carbon fibers (CFs), carbon nanotubes (CNTs), and solvents. It also contains compatible polymers and suitable additives. This review article elaborately discusses the fundamental requirements of DIW in structuring carbon-doped polymeric inks viz. ink formulation, required ink rheology, extrusion parameters, print fidelity prediction, layer bonding examination, substrate selection, and curing method to achieve fine functional composites. A detailed description of its application in the fields of electronics, medical, and mechanical segments have also been focused in this study.

The current available selective laser sintering (SLS) materials are often high in cost and limited in variety; the mechanical properties of wood-composite SLS parts are low quality, which restricts the development of SLS technology. This article aims to optimize the SLS processing parameters to enhance the mechanical properties of the Prosopis chilensis powder (PCP)/polyethersulfone (PES) composite (PCPC) part fabricated via SLS. The PCP and PES powder were proposed as the feedstock of the PCPC powder bed for SLS. First, the thermal decomposition and glass transition temperatures (Tg) of PCP and PES powder were estimated to reduce the produced PCPC parts from warping and deformation during SLS. An orthogonal experimental methodology with five factors and four levels was used to optimize the SLS parameters for the PCPC SLS test. The scanning speed, preheating temperature, and laser power are selected as the main affecting factors on this study. The influence of these factors on dimension accuracies, bending and tensile strengths, and surface roughness quality of the produced PCPC parts was studied. The PCPC particle distribution and microstructure were inspected via scanning electron microscopy. Furthermore, the synthesis weighted scoring methods were utilized to determine the optimal SLS processing parameters of the produced PCPC parts. The combined results of tests showed that the optimal SLS parameters were as follows: the scanning speed is 1.8 m/s, preheating temperature is 80°C, and the laser power is 12 W. Thus, the quality of PCPC SLS parts was significantly enhanced when the optimal parameters were utilized in the SLS process. This article provided the main reference values of SLS parameters of the PCPC. To further enhance the surface roughness quality and mechanical strengths, the postprocessing infiltration with wax was introduced; after wax infiltration, the surface roughness and mechanical strengths were significantly improved.

Laser powder bed fusion (LPBF) provides a rapid and versatile approach for producing parts with complex geometries. However, many parts with intricate geometries have overhang structures, which are not easily fabricated by using LPBF and are often downgraded by staircase effects, warpage, cracks, and dross formation. Thus, the present study proposes a combined numerical and experimental approach for determining the optimal settings of the laser power and scanning speed that minimize the surface roughness and maximize the density of Inconel 718 LPBF overhang structures. In the proposed approach, the heat transfer simulations are employed to determine the melt pool depth, the melt pool length, and the solid cooling rate within the feasible input space of laser power and scanning speed combinations. Notably, the simulations take account of both the difference in the material properties of the solid and powder materials, respectively, and the variation of the laser absorptivity in the depth direction of the powder layer. The simulation results are then used to train artificial neural networks for predicting the melt pool depth for 3600 combinations of the laser power and scanning speed within the input space. The resulting processing maps are screened in accordance with three quality criteria (namely the melt pool depth, the melt pool length, and the solid cooling rate) to determine the optimal processing region, which improves the surface roughness. The feasibility of the proposed approach is demonstrated by fabricating 10 × 10 and 20 × 20 mm² horizontal overhang structures using parameter settings chosen from the optimal processing map. It shows that the optimal processing conditions result in a low surface roughness and a maximum density of 99.78%.

A highly sensitive low-cost strain sensor was fabricated in this research study based on microdispensing direct write (MDDW) technique. MDDW is an additive manufacturing approach that involves direct deposition of functional material to the substrate. The devices were printed directly onto a polymeric substrate by optimizing the fabrication parameters. A composite of silver and carbon was used as active sensor material where both materials in the composite have opposite resistance temperature coefficients. The ratio of materials in the composite was selected so that the effect of temperature on the resistance of overall composite was canceled out. This resulted in achieving temperature compensation or inherent independence of the strain sensor resistance on temperature without requiring any additional sensors and components. The sensor was further encapsulated by electrospray deposition, which is also an additive manufacturing approach, to eliminate the effect of humidity as well. Electrical and morphological characterizations were performed to investigate the output response of the sensors and their physical and structural properties. An analog signal conditioning circuit was developed for seamless interfacing of the sensor with any electronic system. The sensor had an excellent gauge factor of 45 and a strain sensitivity of 45 Ω/μɛ that is higher than most of the conventional strain sensors. The sensor's response showed excellent temperature and humidity compensation reducing the relative effect of temperature on the resistance by ∼99.5% and humidity by ∼99.8%.

Three-dimensional (3D) printing of Cu items is a new way to build up the structured Cu materials, but 3D printing of Cu items is usually a challenge because of the high melting point, high thermal conductivity, and high light reflection rate of Cu material. In this study, the composite of Cu microspheres powder and Cu nanoparticles (micro/nano Cu powder) is used to realize the 3D printing of Cu items with the selective laser melting technology. The sintering temperature and the thermal conductivity of micro/nano Cu powder are evidently decreased due to Cu nanoparticles' addition in the micron Cu powder. The results reveal that the 3D printing of 50%/50% micro/nano Cu powder needs laser power range of 100-240 W, which is in contrast to 200-340 W for 3D printing of 100% Cu microspheres powder. Furthermore, the conductivity, mechanical strength, and density of 3D-printed Cu items are improved with the addition of Cu nanoparticles into the micron Cu powder. The increasement of 34% on electrical conductivity and 17% on tensile strength are reached by the addition of 50% Cu nanoparticles with the laser power of 240 W.

Direct ink writing (DIW) belongs to extrusion-based three-dimensional (3D) printing techniques. The success of DIW process depends on well-printable ink and optimized process parameters. After ink preparation, DIW process parameters considerably affect the parts' dimensional accuracy, and process parameters optimization for dimensional accuracy of printed layers is necessary for quality control of parts in DIW. In this study, DIW process parameters were identified and divided into two categories as the parameters for printing a line and the parameter from lines to a layer. Then, a two-step method was proposed for optimizing process parameters. Step 1 was to optimize process parameters for printing a line. In Step 1, continuity and uniformity of extruded filaments and printed rectangular objects were observed in screening experiments to determine printability windows for each process parameter. Then, interaction effect tests were conducted and degree of freedom for experiments was calculated followed by orthogonal array selection for the Taguchi design. Next, main experiments of line printing based on the Taguchi method were conducted. Signal-to-noise ratio calculations and analysis of variance were performed to find the optimal combination and evaluate the significance, respectively. Step 2 was to optimize the parameter from lines to a layer. In Step 2, the average width of the printed line under optimal condition was first measured. Then, single-factor tests of rectangular object printing were conducted to find the optimal parameter from lines to a layer. After these two steps, confirmation results were conducted to verify the reliability of the proposed method and the method robustness on other shapes and other materials; parameter adaptability in 3D parts printing from printed layers' analyses for the proposed method; and parameter adaptability in constructs fabricated as 100% infill or with porosities.