Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology最新文献_第8页

Modeling and analysis of specific cutting energy for Ti6Al4V alloy using quasi-intermittent vibration assisted swing cutting 准间歇振动辅助摆动切削Ti6Al4V合金切削比能建模与分析

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-11-01 DOI: 10.1016/j.precisioneng.2025.11.004

Mingming Lu , Xinghan Wang , Jieqiong Lin , Yida Chen , Yongsheng Du

The quasi-intermittent vibration assisted swing cutting (QVASC) has demonstrated excellent performance in improving the machining ability of difficult to machine materials such as Ti6AL4V. This machining technique also offers the benefits of reversing friction, lowering cutting force, and enhancing surface quality as compared to elliptical vibration assisted turning (EVC). Additionally, the distinct quasi-intermittent deflection feature can successfully lower the surface residual height and enhance processing quality. At present, the modeling of cutting specific energy mainly focuses on the macroscopic scale of ordinary cutting methods and materials. There is limited research on modeling the cutting specific energy of QVASC titanium alloy at the micrometer scale. This article proposes a comprehensive specific cutting energy (SCE) model considering size effects, material elastic recovery, temperature evolution, and chip friction, based on the unique quasi-intermittent cutting characteristics of QVASC and the microstructure characteristics of Ti6AL4V. Through finite element simulation analysis and single factor comparative experiments, the effects of different cutting methods, undeformed cutting thickness, cutting speed, tool swing frequency and amplitude on cutting specific energy were studied. The change mechanism of SCE is analyzed. The results show that QVASC can reduce the equivalent plastic strain and the maximum principal stress, which is helpful to reduce the cutting specific energy. At small cutting thicknesses, most of the energy is wasted in extruding the material rather than in shear removal, which results in a higher SCE. The minimum SCE occurs during the transition of the cutting mechanism from ploughing to shearing. Furthermore, the fluctuating patterns of theoretical and experimental SCE under various cutting thicknesses, cutting speeds, tool swing frequencies and amplitudes are consistent with maximum errors of 9.3 %, 12.3 %, 9.1 %, and 9.2 % respectively. All are within the acceptable range, which proves the validity of the theoretical model. This study is helpful to understand the energy dissipation in the cutting process of QVASC.

准间歇振动辅助摆动切削（QVASC）在提高Ti6AL4V等难加工材料的加工能力方面表现出优异的性能。与椭圆振动辅助车削（EVC）相比，这种加工技术还具有扭转摩擦、降低切削力和提高表面质量的优点。此外，明显的准间歇偏转特征可以成功地降低表面残留高度，提高加工质量。目前，切削比能的建模主要集中在普通切削方法和材料的宏观尺度上。在微米尺度上对QVASC钛合金切削比能的建模研究有限。本文基于QVASC独特的准间歇切削特性和Ti6AL4V的微观结构特征，提出了考虑尺寸效应、材料弹性恢复、温度演变和切屑摩擦的综合比切削能（SCE）模型。通过有限元仿真分析和单因素对比实验，研究了不同切削方式、未变形切削厚度、切削速度、刀具摆动频率和振幅对切削比能的影响。分析了SCE的变化机理。结果表明：QVASC能降低等效塑性应变和最大主应力，有利于降低切削比能；在较小的切割厚度下，大部分能量浪费在挤压材料上，而不是剪切去除，这导致更高的SCE。最小的SCE发生在切削机制从犁耕到剪切的转变过程中。此外，理论和实验SCE在不同切削厚度、切削速度、刀具摆动频率和振幅下的波动规律与最大误差一致，分别为9.3%、12.3%、9.1%和9.2%。均在可接受范围内，证明了理论模型的有效性。该研究有助于了解QVASC切割过程中的能量耗散。

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引用次数: 0

Effects of the γ/α2 lamellar thickness and the phase boundary on the nano-scratch behavior of dual-phase TiAl alloys γ/α2片层厚度和相边界对双相TiAl合金纳米划伤行为的影响

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-11-01 DOI: 10.1016/j.precisioneng.2025.11.003

Hui Cao , Linghao Zeng , Chenyang Han , Ruicheng Feng , Wenshuai Niu , Haiyan Li , Baocheng Zhou , Tao Chen

Microstructure plays a critical role in governing the deformation behavior and mechanical properties of materials, with phase boundaries being particularly crucial for regulating the friction and wear performance of multiphase materials. In this study, the evolution of scratch behavior near phase boundaries was systematically investigated using nano-scratch experiments and crystal plasticity finite element method (CPFEM) simulations. The validity of the scratch model under the influence of phase boundaries was confirmed by comparing CPFEM simulation results with nano-scratch experimental data. The findings indicate that the γ/α₂ lamellar thickness exerts a significant effect on the scratch response of dual-phase TiAl alloys: as the γ/α₂ lamellar thickness decreases, the scratch force increases correspondingly. The scratch response near phase boundaries is primarily dominated by changes in pile-up morphology and subsurface shear strain distribution, and the interplay between these two factors gives rise to variations in the scratch response. Additionally, changes in indenter orientation alter the relative alignment between the material's lattice direction and the external loading direction, thereby influencing the material's plastic deformation behavior. These findings provide valuable insights for improving the wear resistance of dual-phase TiAl alloys and optimizing their microstructure.

微观结构在控制材料的变形行为和力学性能方面起着至关重要的作用，其中相边界对调节多相材料的摩擦磨损性能尤为重要。本研究采用纳米划伤实验和晶体塑性有限元法（CPFEM）模拟，系统地研究了相界附近划伤行为的演变。将CPFEM模拟结果与纳米划痕实验数据进行对比，验证了相界影响下划痕模型的有效性。结果表明：γ/α2片层厚度对双相TiAl合金的划痕响应有显著影响，随着γ/α2片层厚度的减小，划痕力相应增大；相界附近的划伤响应主要受堆积形态和地下剪切应变分布的影响，两者的相互作用导致了划伤响应的变化。此外，压头方向的改变会改变材料晶格方向与外部加载方向的相对对准，从而影响材料的塑性变形行为。这些发现为提高双相TiAl合金的耐磨性和优化其组织提供了有价值的见解。

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引用次数: 0

Modeling and analysis of forces in laser-assisted micro-milling Inconel 718 under softening effects and size effects 软化效应和尺寸效应下激光辅助微铣削Inconel 718的受力建模与分析

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-30 DOI: 10.1016/j.precisioneng.2025.10.024

Chen Cong , Xiaohong Lu , Ying Chen , Xiuqing Hao , Wentian Shi , Steven Y. Liang

Inconel 718 is a critical material in aerospace, energy, and power sectors for manufacturing micro-components because of its exceptional properties such as high-temperature strength, thermal stability, and resistance to thermal fatigue. It is also a typically difficult-to-machine material. Laser-assisted micro-milling (LAMM) is a potentially effective processing method for such materials. However, the elevated temperatures induced by the laser can alter the material properties within the cutting zone. Coupled with the size effects inherent to micro-milling, this gives rise to highly complex fluctuations in cutting forces that are difficult to characterize accurately. To this end, the traditional Johnson-Cook (JC) constitutive model is modified by comprehensively considering the thermal softening effects and size effects. A cutting force prediction model for LAMM is established based on the mechanical analysis of different deformation zones. Cutting experiments are conducted to verify the accuracy of the cutting force model. The model simulation shows that the maximum errors of the three-directional forces are 9.84 %, 7.12 %, and 11.2 % respectively. The proposed force prediction model provides robust theoretical support for subsequent tool wear monitoring and machining accuracy control in LAMM processes.

因科乃尔718具有优异的性能，如高温强度、热稳定性和抗热疲劳性能，是航空航天、能源和电力领域制造微型部件的关键材料。它也是一种典型的难以加工的材料。激光辅助微铣削（LAMM）是一种潜在的有效的加工方法。然而，激光引起的高温会改变切割区内的材料性能。再加上微铣削固有的尺寸效应，这导致了切削力高度复杂的波动，难以准确表征。为此，综合考虑热软化效应和尺寸效应，对传统的Johnson-Cook （JC）本构模型进行了修正。在对不同变形区进行力学分析的基础上，建立了LAMM的切削力预测模型。通过切削实验验证了切削力模型的准确性。模型仿真结果表明，三方向力的最大误差分别为9.84%、7.12%和11.2%。提出的力预测模型为后续的刀具磨损监测和加工精度控制提供了有力的理论支持。

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引用次数: 0

Deep learning-driven virtual phase shifting for enhanced interferometric surface profiling 深度学习驱动的虚拟相移增强干涉表面轮廓

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-28 DOI: 10.1016/j.precisioneng.2025.10.021

Jurim Jeon , Yangjin Kim , Naohiko Sugita

Accurate surface measurement of silicon wafers is essential for various high-precision applications, where even sub-nanometer deviations can lead to critical performance degradation. Phase-shifting interferometry (PSI) is widely used for this task owing to its high accuracy. Among PSI methods, the classical 4-step phase-shifting algorithm (PSA) with π/2 shifts offers an optimal balance between accuracy and simplicity, effectively compensating for second harmonic distortion. However, in real-world experiments, ideal phase shifts are difficult to realize because of environmental disturbances, which result in phase-shift errors and coupling effects with harmonic distortions. To address this limitation, we propose a deep learning-based virtual phase shifter (DLVPS) that generates three additional interferograms with accurate phase shifts, which accounts for second harmonic components, from a single experimental interferogram. The original input interferogram and the three generated interferograms comprise a synthetic interferogram sequence that enables accurate phase retrieval. Experimental validation on silicon wafer profiling confirmed that the DLVPS can produce more accurate phase shifts than the classical experimental method, demonstrating its robustness against environmental disturbances. The evaluation of the retrieved phase exhibited phase error of 0.0725 and standard deviation of 0.0368 rad, indicating that the proposed method achieved both high phase retrieval accuracy and robust repeatability. Our approach utilizes deep learning to reduce reliance on complex hardware-based phase shifting, achieving stable and precise phase retrieval in the presence of environmental disturbances. Furthermore, by combining this with analytic phase retrieval, the proposed method overcomes the practical limitations of PSI while preserving the strengths of the established 4-step PSA.

硅晶圆的精确表面测量对于各种高精度应用至关重要，即使是亚纳米偏差也可能导致关键性能下降。相移干涉法（PSI）因其精度高而被广泛应用于该任务。在PSI方法中，经典的π/2位移的4步相移算法（PSA）在精度和简单性之间取得了最佳平衡，有效地补偿了二次谐波失真。然而，在实际实验中，由于环境干扰，难以实现理想的相移，从而导致相移误差和谐波畸变耦合效应。为了解决这一限制，我们提出了一种基于深度学习的虚拟移相器（DLVPS），它可以从单个实验干涉图中生成三个具有精确相移的额外干涉图，这些干涉图占二次谐波分量。原始输入干涉图和生成的三个干涉图组成一个合成干涉图序列，可以实现精确的相位恢复。在硅片上进行的实验验证证实，DLVPS比传统的实验方法可以产生更精确的相移，证明了它对环境干扰的鲁棒性。相位评价的相位误差为0.0725，标准差为0.0368 rad，表明该方法具有较高的相位检索精度和鲁棒重复性。我们的方法利用深度学习来减少对复杂的基于硬件的相移的依赖，在存在环境干扰的情况下实现稳定和精确的相位检索。此外，通过将其与分析相位检索相结合，所提出的方法克服了PSI的实际局限性，同时保留了已建立的四步PSA的优势。

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引用次数: 0

Study on removal mechanism of sintered SiC ceramic in wheel type vibration magnetorheological compound polishing 轮式振动磁流变复合抛光烧结SiC陶瓷去除机理研究

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-28 DOI: 10.1016/j.precisioneng.2025.10.020

Bin Fu , Yan Gu , Jieqiong Lin , Guangze Du , Guoqing Li , Wenrui Wu , Zisu Xu , Huibo Zhao

Wheel type vibration magnetorheological compound polishing is capable of effectively enhancing the polishing efficiency of hard ceramic materials in the process of magnetorheological finishing. The abrasives start to move under the effect of periodically changing forces when non-resonant vibration is introduced. However, due to the random nature of the trajectory, it is challenging to conduct a quantitative analysis of the abrasive trajectory and accurately quantify the material removal amount of the abrasive. To quantify the impact of vibration on the material removal during the polishing of sintered silicon carbide ceramic, molecular dynamics simulation was used to reveal the influence of the change of the work mode of the force exerted by the magnetorheological polishing fluid to the abrasive on the length and removal amount of the abrasive. A quantitative method for measuring the scratch length of a single abrasive based on the principle of energy conversion was proposed. On the basis of this method, a material removal rate model was developed by combining rheological property analysis and abrasive wear theory. The average error between the theoretical and the actual value is 11.85 %. The validity is verified. This study provides a theoretical basis for exploring the internal mechanism of vibration in the polishing process.

轮式振动磁流变复合抛光能够有效地提高硬质陶瓷材料在磁流变抛光过程中的抛光效率。当引入非共振振动时，磨料在周期性变化的力的作用下开始运动。然而，由于轨迹的随机性，对磨料轨迹进行定量分析并准确量化磨料的材料去除率是一项挑战。为了量化振动对烧结碳化硅陶瓷抛光过程中材料去除的影响，采用分子动力学模拟的方法揭示了磁流变抛光液对磨料受力工作方式的改变对磨料长度和去除量的影响。提出了一种基于能量转换原理的单粒磨料划痕长度定量测量方法。在此基础上，结合流变特性分析和磨粒磨损理论建立了材料去除率模型。理论值与实际值的平均误差为11.85%。验证了有效性。该研究为探索抛光过程中振动的内在机理提供了理论依据。

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引用次数: 0

A regularized reconstruction and contact modelling method for asperities based on real machined surface topography 一种基于真实加工表面形貌的凸点正则化重建与接触建模方法

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-23 DOI: 10.1016/j.precisioneng.2025.10.019

Kaiqi Huang , Cheng Hong , Zhiliang Deng , Jingbo Shen , Jinyuan Tang , Yuqin Wen

The accuracy of contact analysis for rough surfaces is fundamentally determined by the asperity model, the computational precision of which primarily depends on the geometric characterization and mechanical deformation description of individual asperities. To achieve accurate asperity characterization and contact modeling of rough surfaces, this study proposes a method for segmenting surface asperities based on reference lines and peak-valley heights. According to the principle of area conservation, a regularization reconstruction approach is established for various asperity geometries, including parabolic, circular arc, sinusoidal, triangular, and ellipsoidal shapes. Using surface topography data from workpieces fabricated through different machining processes, the optimal asperity shape that best represents real surface topography is determined through a minimum error criterion. Subsequently, an analytical contact model for single asperity is developed. The results indicate: (1) the ellipsoidal asperity shape most closely matches the actual surface topography of machined workpieces; (2) contact models based on ellipsoidal asperity can enhance computational accuracy by more than 35 %. The proposed model enables effective regularization and contact analysis of asperities, offering a novel approach and valuable reference for improving the accuracy of rough surface contact simulations.

粗糙表面接触分析的精度从根本上取决于粗糙体模型，其计算精度主要取决于单个粗糙体的几何表征和力学变形描述。为了实现粗糙表面的精确凹凸度表征和接触建模，本研究提出了一种基于参考线和峰谷高度的表面凹凸度分割方法。根据面积守恒原理，对抛物线、圆弧、正弦波、三角形、椭球体等多种粗糙几何形状建立了正则化重构方法。利用不同加工工艺加工的工件表面形貌数据，通过最小误差准则确定最能代表真实表面形貌的最佳粗糙形状。在此基础上，建立了单个粗糙体的解析接触模型。结果表明：(1)椭球形的凹凸面形状与实际加工工件的表面形貌最接近；(2)基于椭球面粗糙度的接触模型计算精度可提高35%以上。该模型能够有效地对粗糙表面进行正则化和接触分析，为提高粗糙表面接触模拟的精度提供了一种新的方法和有价值的参考。

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引用次数: 0

Tooth profile piecewise modification method for cycloid gear of RV reducer based on meshing interval optimization 基于啮合区间优化的RV减速器摆线轮齿形分段修形方法

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-22 DOI: 10.1016/j.precisioneng.2025.10.018

Song Gao , Xuan Wang , Jiapeng Wang , Yiwan Li

Rotate vector (RV) reducer is a high-precision deceleration mechanism featuring advantages such as a large transmission ratio and load-bearing capacity. It is widely applied in fields of industrial robots. As a key component of RV reducer, the cycloid gear plays a decisive role in reducer's performance, and the cycloidal shape significantly affects the meshing performance. In this study, taking the RV-40E reducer as the object, a piecewise modification for the cycloidal gear based on meshing interval optimization was proposed. The working segment of cycloidal profile was modified by the rotated angular method, and the influence of meshing interval on transmission performance was analyzed. Then, taking the meshing-in and meshing-out phase angles as variables, the friction power loss and gluing coefficient as objectives, an optimization model for meshing interval was established. The single- and multi-objective optimizations were solved based on the genetic algorithm. The dedendum and addendum of cycloidal profiles were adopted spline curves. According to the continuity conditions at endpoints, the tooth profile equations of the non-working segments were obtained by spline interpolation method. The results demonstrated after optimization, the friction loss and gluing coefficient reduced by 6.30% and 10.50%, respectively, the reasonable radial clearances were maintained at the dedendum and addendum. Finally, the finite element simulation verification was carried out through ANSYS software. The proposed piecewise modification method not only ensures conjugate meshing in working segment, but also can flexibly control the gaps of non-working segments according to specific requirements, which provides the design ideas for gear tooth modification in engineering applications.

RV减速器是一种高精度的减速机构，具有传动比大、承载能力强等优点。广泛应用于工业机器人领域。摆线齿轮作为RV减速器的关键部件，对减速器的性能起着决定性的作用，摆线齿形对其啮合性能有显著影响。本文以RV-40E减速器为研究对象，提出了一种基于啮合区间优化的摆线齿轮分段修形方法。采用旋转角法对摆线轮廓的工作段进行了修正，分析了啮合间距对传动性能的影响。然后，以啮合相位角和啮合相位角为变量，以摩擦功率损失和粘接系数为目标，建立了啮合区间优化模型。采用遗传算法求解单目标和多目标优化问题。摆线轮廓的尾轴和尾轴采用样条曲线。根据末端连续条件，采用样条插值法得到了非工作齿段的齿形方程。结果表明，优化后的摩擦损失和粘接系数分别降低了6.30%和10.50%，齿根和齿根处保持了合理的径向间隙。最后通过ANSYS软件进行有限元仿真验证。提出的分段修形方法既保证了工作齿段的共轭啮合，又能根据具体要求灵活控制非工作齿段的间隙，为工程应用中的齿轮修形提供了设计思路。

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引用次数: 0

Modular system of additive manufacturing benchmarking artefacts for XCT inspection using a design-for-metrology approach 使用设计计量方法的增材制造基准工件XCT检查的模块化系统

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-21 DOI: 10.1016/j.precisioneng.2025.10.012

Darragh A. Broadbent , David M. Gorman , Wenhan Zeng , Shan Lou

Additive Manufacturing (AM) offers freedom in both design and materials selection. Safety critical industries, such as aerospace and healthcare, stand to benefit from the unique capabilities offered by AM. However, adoption of AM is hindered by the unique and complex inspection and quality assurance requirements that conventional line-of-sight techniques struggle to fulfil. X-ray computed tomography (XCT) is a non-destructive, non-line-of-sight, volumetric imaging technique, which has gained traction as a viable inspection method over the last two decades and shows promise as a next generation dimensional metrology tool for AM. This paper details the development of a system of modular artefacts which provide a reconfigurable toolkit to address a variety of AM metrology challenges. The toolkit consists of AM test, and XCT data validation modules. The test modules are engineered to assess the ability of an AM system to produce challenging geometries. Additionally, several XCT data validation modules are introduced, which are intended to reduce measurement uncertainty by providing a consistent repeatably measured ground truth in the form of features of known size and shape in each dataset. The AM test modules are parameterised based on AM process and XCT scanning parameters, enabling the modules to be adapted for specific requirements.

增材制造（AM）提供了设计和材料选择的自由。航空航天和医疗保健等安全关键行业将受益于AM提供的独特功能。然而，AM的采用受到传统视线技术难以满足的独特而复杂的检查和质量保证要求的阻碍。x射线计算机断层扫描（XCT）是一种非破坏性、非视距、体积成像技术，在过去二十年中作为一种可行的检测方法获得了广泛的关注，并有望成为增材制造的下一代尺寸测量工具。本文详细介绍了模块化工件系统的开发，该系统提供了一个可重新配置的工具包，以解决各种AM计量挑战。该工具包由AM测试和XCT数据验证模块组成。测试模块旨在评估增材制造系统产生具有挑战性几何形状的能力。此外，介绍了几个XCT数据验证模块，旨在通过在每个数据集中以已知大小和形状的特征形式提供一致的可重复测量的地面真值来减少测量不确定性。AM测试模块基于AM过程和XCT扫描参数进行参数化，使模块能够适应特定要求。

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引用次数: 0

Algebraic kinematic modeling and trajectory analysis for double-sided planetary grinding of silicon wafers in semiconductor manufacturing 半导体制造中硅片双面行星磨削的代数运动学建模与轨迹分析

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-19 DOI: 10.1016/j.precisioneng.2025.10.013

Chung-Yu Tsai , Chih-Chun Cheng , Wei-Jie Luo

Double-sided planetary grinding (DSPG) of semiconductor materials faces several critical challenges, including the lack of a unified quantitative kinematic framework, systematic methods for determining optimal grinding cycles, and sufficient understanding of the trajectory overlap mechanisms that affect surface uniformity. Furthermore, current approaches cannot quantify the directional randomness in the grinding paths, leading to inefficient empirical parameter selection. To address these limitations, this study develops a comprehensive algebraic kinematic modeling framework. Precise mathematical models are derived to describe the planetary gear motion relationships, and an optimal cycle determination methodology is introduced. A novel trajectory overlap analysis method is proposed for examining the abrasive grain behavior, and a Shannon entropy method is employed to quantify the grinding path directional randomness and support data-driven optimization. Case studies show that the relative rotational speed ratios significantly influence the surface uniformity, with moderate grinding cycles achieving nearly uniform directional distributions. Moreover, the framework accurately predicts trajectory repetition cycles and explains the variations in the surface quality. Overall, it provides semiconductor engineers with systematic process control tools, overcoming the limitations of empirical approaches and enabling consistent, high-quality wafer processing for hard materials such as silicon carbide (SiC) and gallium nitride (GaN).

半导体材料的双面行星磨削（DSPG）面临着几个关键的挑战，包括缺乏统一的定量运动学框架，确定最佳磨削周期的系统方法，以及对影响表面均匀性的轨迹重叠机制的充分理解。此外，现有方法无法量化磨削路径的方向随机性，导致经验参数选择效率低下。为了解决这些限制，本研究开发了一个全面的代数运动学建模框架。推导了描述行星齿轮运动关系的精确数学模型，并介绍了最优周期确定方法。提出了一种新的轨迹重叠分析方法来检测磨粒行为，并利用香农熵法量化磨削路径方向随机性，支持数据驱动优化。实例研究表明，相对转速比显著影响表面均匀性，适度的磨削循环可以获得接近均匀的方向分布。此外，该框架准确地预测了轨迹重复周期，并解释了表面质量的变化。总的来说，它为半导体工程师提供了系统的过程控制工具，克服了经验方法的局限性，并实现了硬质材料（如碳化硅（SiC）和氮化镓（GaN））的一致，高质量的晶圆加工。

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引用次数: 0

Enhanced single-crystal AlN global planarization process based on chemical mechanical polishing 基于化学机械抛光的增强单晶AlN全局平面化工艺

IF 3.7 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology

Pub Date : 2025-10-18 DOI: 10.1016/j.precisioneng.2025.10.014

Jie Wu , Jiafu Zhou , Yupeng Xiong , Cheng Huang , Yang Ou , Ganyu Chen , Yifan Dai

Single-crystal AlN substrates are highly hard and brittle, considerably hindering their ultra-precision machining. However, few studies have investigated effective methods for polishing single-crystal AlN substrates, despite their substantial potential. To address this issue, this study proposes a novel chemical mechanical polishing scheme for single-crystal AlN substrates, which incorporates three primary stages: grinding, rough polishing, and precision polishing. The optimum process parameters were derived by assessing the effects of polishing-disc speed and downward pressure on attained surface roughness. After precision polishing, a globally flattened ultra-smooth surface with an average surface roughness of 0.139 nm was achieved on a single-crystal AlN substrate, with a variation coefficient of 9.88 %. This study provides valuable guidelines for obtaining ultrasmooth, globally flattened surfaces of hard and brittle semiconductor materials such as AlN.

单晶AlN衬底具有高硬度和脆性，极大地阻碍了其超精密加工。然而，很少有研究研究抛光单晶AlN衬底的有效方法，尽管它们具有巨大的潜力。为了解决这一问题，本研究提出了一种新的单晶AlN衬底化学机械抛光方案，该方案包括三个主要阶段：研磨、粗抛光和精密抛光。通过分析抛光盘转速和下压对表面粗糙度的影响，得出了最佳工艺参数。经过精密抛光后，在单晶AlN衬底上获得了整体平坦的超光滑表面，平均表面粗糙度为0.139 nm，变异系数为9.88%。该研究为获得硬脆半导体材料（如AlN）的超光滑、全局扁平表面提供了有价值的指导。

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引用次数: 0