Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644070
P. Rodgers, V. Eveloy, E. Rahim, D. Morgan
This paper presents a survey of the thermal performance of a range of TIMs (adhesives, greases, phase change materials (PCMs) and thermal pads) from different vendors. Previously published studies on TIM thermal performance characterization and reliability assessment for electronics packaging are reviewed. The potential limitations of ASTM D 5470 standard, and TIM industry thermal impedance characterization practices utilizing this standard are discussed, as well as alternative characterization approaches. From this analysis, guidelines are derived on TIM selection from thermal performance and reliability perspectives
本文介绍了来自不同供应商的一系列TIMs(粘合剂、润滑脂、相变材料和热垫)的热性能调查。综述了电子封装用TIM热性能表征和可靠性评估方面的研究成果。讨论了ASTM D 5470标准的潜在局限性，以及利用该标准的TIM工业热阻抗表征实践，以及替代表征方法。根据这一分析，从热性能和可靠性的角度得出了TIM选择的指导方针
{"title":"Thermal Performance and Reliability of Thermal Interface Materials: A Review","authors":"P. Rodgers, V. Eveloy, E. Rahim, D. Morgan","doi":"10.1109/ESIME.2006.1644070","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644070","url":null,"abstract":"This paper presents a survey of the thermal performance of a range of TIMs (adhesives, greases, phase change materials (PCMs) and thermal pads) from different vendors. Previously published studies on TIM thermal performance characterization and reliability assessment for electronics packaging are reviewed. The potential limitations of ASTM D 5470 standard, and TIM industry thermal impedance characterization practices utilizing this standard are discussed, as well as alternative characterization approaches. From this analysis, guidelines are derived on TIM selection from thermal performance and reliability perspectives","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84858430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644071
Tara Dalton, Marc Scott Hodes, Cormac Eason, P. Kolodner, Ryan Enright, T. Krupenkin
Advances in silicon processing and micro-machining now allow the consistent manufacture of micro- and nanoscale features necessary for the production of controlled roughness superhydrophobic surfaces. Superhydrophobic surfaces combine roughness features with low surface energy to create materials with substantially decreased wettability and, subsequently, reduced hydrodynamic drag. Thus, they represent a promising technology for reducing microchannel flow resistance; a major technical issue in microfluidic systems. In there, however, limits to the pressure a superhydrophobic surface can support before irreversible wetting transition occurs, leading to a loss of the drag-reducing effect. Of greater importance are preliminary observations that, even before a superhydrophobic surface wets irreversibly, the drag reduction over a superhydrophobic surface may be compromised by subtle changes in the three-phase contact line position. The positive impact of micro-geometries on heat transfer is well known. Coupling this phenomenon with superhydrophobic surfaces to reduce flow resistance, could represent a significant step forward in areas such as electronics cooling. However, theoretical models of superhydrophobic surfaces are complex due to the requirement for high resolution on multiple scales. This paper aims to present current results and discuss issues in implementing superhydrophobic surfaces, specifically nano-structured posts, in a microchannel
{"title":"Challenges in using nano-textured surfaces to reduce pressure drop through microchannels","authors":"Tara Dalton, Marc Scott Hodes, Cormac Eason, P. Kolodner, Ryan Enright, T. Krupenkin","doi":"10.1109/ESIME.2006.1644071","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644071","url":null,"abstract":"Advances in silicon processing and micro-machining now allow the consistent manufacture of micro- and nanoscale features necessary for the production of controlled roughness superhydrophobic surfaces. Superhydrophobic surfaces combine roughness features with low surface energy to create materials with substantially decreased wettability and, subsequently, reduced hydrodynamic drag. Thus, they represent a promising technology for reducing microchannel flow resistance; a major technical issue in microfluidic systems. In there, however, limits to the pressure a superhydrophobic surface can support before irreversible wetting transition occurs, leading to a loss of the drag-reducing effect. Of greater importance are preliminary observations that, even before a superhydrophobic surface wets irreversibly, the drag reduction over a superhydrophobic surface may be compromised by subtle changes in the three-phase contact line position. The positive impact of micro-geometries on heat transfer is well known. Coupling this phenomenon with superhydrophobic surfaces to reduce flow resistance, could represent a significant step forward in areas such as electronics cooling. However, theoretical models of superhydrophobic surfaces are complex due to the requirement for high resolution on multiple scales. This paper aims to present current results and discuss issues in implementing superhydrophobic surfaces, specifically nano-structured posts, in a microchannel","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77143354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644033
H. Fan, C. Wong, M. Yuen
Epoxy is widely used in electronic packaging and its performance is very important to the reliability of electronic packages. It is necessary to understand the mechanical properties of epoxy materials at a fundamental level as a guide in the experimental design of epoxy resin for high reliability. Molecular modeling is widespread in its usage and has been used to investigate the mechanical properties of polymer at the molecular level, including the investigation of the Tg. The present study is focused on the material properties of the cured epoxy resin. MD model of the epoxy was built using the amorphous module. MD simulations were carried out starting at 225degC under a pressure of 0.1Mpa using the ensembles of the constant number of particles, constant-pressure and constant temperature (NPT). Temperature was lowered to room temperature at a rate of 10 degC/200ps. Each subsequent simulation was started from the final configuration obtained at the preceding temperature. Non-bond interactions cut-off distance of 1.5 nm with a smooth switching function was used in all simulations. The simulation in each case study was performed with an interval of 1 femto second (fs) in each MD simulation step. Density of the epoxy at each temperature was calculated from the average specific volume. Tg was estimated based on the discontinuity in the slope of the density-temperature plot. The volumetric thermal expansion coefficient was obtained from the relation of the variation of the volume and temperature. The corresponding linear thermal expansion coefficient of the epoxy can be calculated. Young's modulus and Poisson's ratio of the epoxy can also be obtained from MD simulations. The predicted values of these mechanical properties are close to the experimental values
{"title":"Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation","authors":"H. Fan, C. Wong, M. Yuen","doi":"10.1109/ESIME.2006.1644033","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644033","url":null,"abstract":"Epoxy is widely used in electronic packaging and its performance is very important to the reliability of electronic packages. It is necessary to understand the mechanical properties of epoxy materials at a fundamental level as a guide in the experimental design of epoxy resin for high reliability. Molecular modeling is widespread in its usage and has been used to investigate the mechanical properties of polymer at the molecular level, including the investigation of the Tg. The present study is focused on the material properties of the cured epoxy resin. MD model of the epoxy was built using the amorphous module. MD simulations were carried out starting at 225degC under a pressure of 0.1Mpa using the ensembles of the constant number of particles, constant-pressure and constant temperature (NPT). Temperature was lowered to room temperature at a rate of 10 degC/200ps. Each subsequent simulation was started from the final configuration obtained at the preceding temperature. Non-bond interactions cut-off distance of 1.5 nm with a smooth switching function was used in all simulations. The simulation in each case study was performed with an interval of 1 femto second (fs) in each MD simulation step. Density of the epoxy at each temperature was calculated from the average specific volume. Tg was estimated based on the discontinuity in the slope of the density-temperature plot. The volumetric thermal expansion coefficient was obtained from the relation of the variation of the volume and temperature. The corresponding linear thermal expansion coefficient of the epoxy can be calculated. Young's modulus and Poisson's ratio of the epoxy can also be obtained from MD simulations. The predicted values of these mechanical properties are close to the experimental values","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80691772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1643946
Maryna Lishchynska, C. O’Mahony, O. Slattery, O. Wittier
Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved
{"title":"Modelling effects of packaging on pull-in behaviour of doubly-anchored beams","authors":"Maryna Lishchynska, C. O’Mahony, O. Slattery, O. Wittier","doi":"10.1109/ESIME.2006.1643946","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1643946","url":null,"abstract":"Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79600536","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644005
A. T. Valota, A. Losavioa, L. Renarc, A. Vicenzo
The changeover to lead-free solder and components metallization in conjunction with the market transition to portable products is expected to have a strong impact on the reliability of lead-free electronics. For handheld electronic products, particular concern has raised over solder joint fracture induced by drop impact. Existing test methods used to evaluate solder ball attachment, shear and pull test, thus far have not been considered suitable for the evaluation of shock reliability, due to their inability to simulate the high strain rate deformation, which characterizes impact loading. Recently, pull test equipment enabling high speed testing has become commercially available, thus calling for further study to assess its applicability for the measurement of joint strength under dynamic load conditions. In this paper, board level drop test and component level pull test results are reported and compared for different BGA assembly alloys and reflow cycle. Pull testing is performed at different test speed on BGA lead-free solder joints after reflow and after thermal ageing in order to investigate the correlation between failure analysis results and lead-free joints micro structural evolution. High-speed pull testing of solder joints is shown to be a promising test methodology for the evaluation of solder joints brittle fracture resistance. Moreover, high speed pull test results are shown to qualitatively correlate with drop test performance if the failure mode is taken as criterion
{"title":"High Speed Pull Test Characterization of BGA solder joints","authors":"A. T. Valota, A. Losavioa, L. Renarc, A. Vicenzo","doi":"10.1109/ESIME.2006.1644005","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644005","url":null,"abstract":"The changeover to lead-free solder and components metallization in conjunction with the market transition to portable products is expected to have a strong impact on the reliability of lead-free electronics. For handheld electronic products, particular concern has raised over solder joint fracture induced by drop impact. Existing test methods used to evaluate solder ball attachment, shear and pull test, thus far have not been considered suitable for the evaluation of shock reliability, due to their inability to simulate the high strain rate deformation, which characterizes impact loading. Recently, pull test equipment enabling high speed testing has become commercially available, thus calling for further study to assess its applicability for the measurement of joint strength under dynamic load conditions. In this paper, board level drop test and component level pull test results are reported and compared for different BGA assembly alloys and reflow cycle. Pull testing is performed at different test speed on BGA lead-free solder joints after reflow and after thermal ageing in order to investigate the correlation between failure analysis results and lead-free joints micro structural evolution. High-speed pull testing of solder joints is shown to be a promising test methodology for the evaluation of solder joints brittle fracture resistance. Moreover, high speed pull test results are shown to qualitatively correlate with drop test performance if the failure mode is taken as criterion","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79636744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644018
M. Vellvehí, X. Jordà, P. Godignon, J. Millán
This paper presents a methodology for simulating the electro-thermal behaviour of a DC/DC converter. This technique is based on the coupling of computational fluid dynamics software (FLOTHERM) with an electrical circuit simulator (VHDL-AMS). This work is mainly focused in the description of the thermal component with special emphasis in the modelling of the active power devices (MOSFET and Schottky diode) included in the converter. Once these devices have been fully modelled, they are included in the DC/DC converter modelled as a double sided PCB including also some passive components. The simulations have been experimentally verified with the aid of infrared measurements
{"title":"Electro-thermal Simulation of a DC/DC Converter using a Relaxation Method","authors":"M. Vellvehí, X. Jordà, P. Godignon, J. Millán","doi":"10.1109/ESIME.2006.1644018","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644018","url":null,"abstract":"This paper presents a methodology for simulating the electro-thermal behaviour of a DC/DC converter. This technique is based on the coupling of computational fluid dynamics software (FLOTHERM) with an electrical circuit simulator (VHDL-AMS). This work is mainly focused in the description of the thermal component with special emphasis in the modelling of the active power devices (MOSFET and Schottky diode) included in the converter. Once these devices have been fully modelled, they are included in the DC/DC converter modelled as a double sided PCB including also some passive components. The simulations have been experimentally verified with the aid of infrared measurements","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83366511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644049
J. Valtanen, P. Heino
In this work, thermo-mechanical reliability of solder joints of stacked thinned bare dice system-in-package is studied with the finite element method using three-dimensional models. The studied package consists of one to five layers. In every layer two 5 mm times 5 mm silicon chips have been joined with flip chip method onto an 8 mm times 14 mm aramid-epoxy or FR-4 interposer. The package has been simulated varying the number of layers, the thicknesses of interposers and silicon chips, interposer material. Moreover, the package with three layers is studied for component placement optimization. Different sized components are used to find optimal layer structure depending on their size. The results show that every studied aspect has effect on the reliability of stacked system-in-package and with good design it is possible to increase the life time of the package
{"title":"Reliability Optimization of Stacked System-in-Package Using FEA","authors":"J. Valtanen, P. Heino","doi":"10.1109/ESIME.2006.1644049","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644049","url":null,"abstract":"In this work, thermo-mechanical reliability of solder joints of stacked thinned bare dice system-in-package is studied with the finite element method using three-dimensional models. The studied package consists of one to five layers. In every layer two 5 mm times 5 mm silicon chips have been joined with flip chip method onto an 8 mm times 14 mm aramid-epoxy or FR-4 interposer. The package has been simulated varying the number of layers, the thicknesses of interposers and silicon chips, interposer material. Moreover, the package with three layers is studied for component placement optimization. Different sized components are used to find optimal layer structure depending on their size. The results show that every studied aspect has effect on the reliability of stacked system-in-package and with good design it is possible to increase the life time of the package","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89396963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1643951
Chang-Lin Yen, Y. Lai
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We investigate numerically in this paper the effect of yield stress variations of solder alloy on transient structural responses of a single package-level solder joint subjected to ball impact test. This study focuses on the characteristics of the ascending part of the impact force profile. According to the piecewise linear stress-strain curve obtained for the Sn-4Ag-0.5Cu solder alloy, parametric studies are performed by varying either segmental moduli or characteristic stresses of the curve at fixed ratios, in regard to the lack of available rate-dependent material properties of solder alloys
{"title":"Impact Force Characteristics of Package-level Solder Joints Under Ball Impact Test","authors":"Chang-Lin Yen, Y. Lai","doi":"10.1109/ESIME.2006.1643951","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1643951","url":null,"abstract":"The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We investigate numerically in this paper the effect of yield stress variations of solder alloy on transient structural responses of a single package-level solder joint subjected to ball impact test. This study focuses on the characteristics of the ascending part of the impact force profile. According to the piecewise linear stress-strain curve obtained for the Sn-4Ag-0.5Cu solder alloy, parametric studies are performed by varying either segmental moduli or characteristic stresses of the curve at fixed ratios, in regard to the lack of available rate-dependent material properties of solder alloys","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89459550","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1644063
J. Qu
In this paper, we provide a summary of our recent work on the interfacial adhesion and interfacial fracture of polymer-metal interfaces. A general framework outline first. Results are then presented in several areas including measurement of thermodynamics work of adhesion, chemical bonding, adhesion enhancement due to surface roughness, and effect of moisture
{"title":"Adhesion and Fracture of Polymer-Metal Interfaces","authors":"J. Qu","doi":"10.1109/ESIME.2006.1644063","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644063","url":null,"abstract":"In this paper, we provide a summary of our recent work on the interfacial adhesion and interfacial fracture of polymer-metal interfaces. A general framework outline first. Results are then presented in several areas including measurement of thermodynamics work of adhesion, chemical bonding, adhesion enhancement due to surface roughness, and effect of moisture","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81871719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-04-24DOI: 10.1109/ESIME.2006.1643953
Yan Lai, N. Cordero
High brightness white light emitting diodes (LEDs) have shown to be very promising for many illumination applications such as outdoor illumination, task and decorative lighting as well as aircraft and automobile illumination, including automotive headlights. The objective of this paper is to investigate the cooling solutions of such LEDs in automotive applications. In this research, a thermal design from device to board to system level has been carried out, and optimisation work has been done to find the optimum thermal performance. Both natural and forced convection have been explored and conclusions are drawn for each case in this specific application
{"title":"Thermal Management of Bright LEDs for Automotive Applications","authors":"Yan Lai, N. Cordero","doi":"10.1109/ESIME.2006.1643953","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1643953","url":null,"abstract":"High brightness white light emitting diodes (LEDs) have shown to be very promising for many illumination applications such as outdoor illumination, task and decorative lighting as well as aircraft and automobile illumination, including automotive headlights. The objective of this paper is to investigate the cooling solutions of such LEDs in automotive applications. In this research, a thermal design from device to board to system level has been carried out, and optimisation work has been done to find the optimum thermal performance. Both natural and forced convection have been explored and conclusions are drawn for each case in this specific application","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75799273","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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