Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117184
N. B. P. Aguilera, J. Mollinger, J. Bastemeijer, J. Zhou, P. French, A. Bossche
Rechargeable shapeable Lithium batteries have been in research and development by Philips in the last years resulting in an option to optimize the size of a System-in-Package. In a previous work, it was shown that gluing can replace ultrasonic welding in low power applications, nevertheless, the glued contacts require of a material to protect them from humidity in order to avoid corrosion. In this work, the reliability of the glued and welded contacts is studied, when protected by a glob top material. The contact resistance of the bonds is measured before and after a high humidity and temperature aging process. If the contacts present a change of resistance of less than 20% after the reliability test, the test is considered a pass. The welded contacts presented a change in resistance of less that 20% and the glued contacts of at least 50%. The welded contacts protected with a high purity UV curable material are the most reliable.
{"title":"Limitations of gluing as a replacement of ultrasonic welding: Attaching Lithium battery contacts to PCBs","authors":"N. B. P. Aguilera, J. Mollinger, J. Bastemeijer, J. Zhou, P. French, A. Bossche","doi":"10.1109/IMPACT.2011.6117184","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117184","url":null,"abstract":"Rechargeable shapeable Lithium batteries have been in research and development by Philips in the last years resulting in an option to optimize the size of a System-in-Package. In a previous work, it was shown that gluing can replace ultrasonic welding in low power applications, nevertheless, the glued contacts require of a material to protect them from humidity in order to avoid corrosion. In this work, the reliability of the glued and welded contacts is studied, when protected by a glob top material. The contact resistance of the bonds is measured before and after a high humidity and temperature aging process. If the contacts present a change of resistance of less than 20% after the reliability test, the test is considered a pass. The welded contacts presented a change in resistance of less that 20% and the glued contacts of at least 50%. The welded contacts protected with a high purity UV curable material are the most reliable.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"3 1","pages":"230-233"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73283260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117213
Chung-Yen Ni, Ren-Tzung Tan, Hsien Chung, K. Tseng, B. Lwo
The MOSFET (Metal-Oxide-Semiconductor Field-Effective-Transistor) has the potential to be a suitable chip stress monitoring tool for microelectronic packaging because the measurements are nondestructive, in-situ, real-time, and the sensor is relatively small. To this end, this paper studies the stress behaviors of both types of the MOSFET micro stress sensors. In this work, a self-developed four-point bending (4PB) measurement methodology is employed and the stress coefficient calibrations on the MOSFET sensors were next performed. After measurements, stress coefficients for both types of the MOSFET were successfully extracted with discussions. After comparing with the previous extracted temperature coefficients on the same devices, it is also concluded that the temperature effect is extremely important for the MOSFET sensor applications.
{"title":"Stress coefficient extractions on MOSFET micro-sensors","authors":"Chung-Yen Ni, Ren-Tzung Tan, Hsien Chung, K. Tseng, B. Lwo","doi":"10.1109/IMPACT.2011.6117213","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117213","url":null,"abstract":"The MOSFET (Metal-Oxide-Semiconductor Field-Effective-Transistor) has the potential to be a suitable chip stress monitoring tool for microelectronic packaging because the measurements are nondestructive, in-situ, real-time, and the sensor is relatively small. To this end, this paper studies the stress behaviors of both types of the MOSFET micro stress sensors. In this work, a self-developed four-point bending (4PB) measurement methodology is employed and the stress coefficient calibrations on the MOSFET sensors were next performed. After measurements, stress coefficients for both types of the MOSFET were successfully extracted with discussions. After comparing with the previous extracted temperature coefficients on the same devices, it is also concluded that the temperature effect is extremely important for the MOSFET sensor applications.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"41 1","pages":"323-326"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76240565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117214
Chang-Chun Lee, Y. Shih, C. Wu, Chia‐Hao Tsai, Shu-Tang Yeh, Kuang-Jung Chen
Mechanical model of multi-layer under bending loadings and related stress simulations, based on finite element method (FEM), are proposed. The models are used to analyze the stress/strain characteristic of flexible packaging with organic light-emitting diode (OLED) devices. Under various geometrical combinations of stacked thin films and plastic substrate, the position of neural axis (N.A.) which is regarded as a key design parameter to minimize stress impact for the concerned OLED devices, is acquired by the present methodology. Through the performance of sensitivity analysis, both the thickness and mechanical properties of cover plate are shown to have an obvious effect in the determination of N.A. location. Movement of N.A to the region of indium tin oxide (ITO) film is achievable because the corresponding scale smaller than 5 μm in thickness or 40 GPa in Young's modulus for a cover plate is derived. In addition, several radii of curvature are selected to examine the reliable mechanical tolerance and to provide insight into the estimated reliability of foldable displays.
{"title":"Mechanical reliability enhancement of flexible packaging with OLED display under bending loading conditions","authors":"Chang-Chun Lee, Y. Shih, C. Wu, Chia‐Hao Tsai, Shu-Tang Yeh, Kuang-Jung Chen","doi":"10.1109/IMPACT.2011.6117214","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117214","url":null,"abstract":"Mechanical model of multi-layer under bending loadings and related stress simulations, based on finite element method (FEM), are proposed. The models are used to analyze the stress/strain characteristic of flexible packaging with organic light-emitting diode (OLED) devices. Under various geometrical combinations of stacked thin films and plastic substrate, the position of neural axis (N.A.) which is regarded as a key design parameter to minimize stress impact for the concerned OLED devices, is acquired by the present methodology. Through the performance of sensitivity analysis, both the thickness and mechanical properties of cover plate are shown to have an obvious effect in the determination of N.A. location. Movement of N.A to the region of indium tin oxide (ITO) film is achievable because the corresponding scale smaller than 5 μm in thickness or 40 GPa in Young's modulus for a cover plate is derived. In addition, several radii of curvature are selected to examine the reliable mechanical tolerance and to provide insight into the estimated reliability of foldable displays.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"57 1","pages":"87-90"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84879367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117236
Chien-Chang Huang
In this paper, the complete models and measured results are presented for the probe pad in the CMOS on-wafer transmission line measurements using L-2L deembedding method. The transmission line parameters including characteristic impedance and propagation constant are acquired for broadband operation. The π-/T-network instead of the conventional shunt/series configuration for the probe pad are proposed with detail expressions for parameter extractions. Due to the under-determined condition for the parameter extraction, the iteration procedure is utilized. The measured results for the thin-film microstrip lines built by the 0.18 μm 1P6M process are shown from 0.2 GHz to 50 GHz.
{"title":"CMOS interconnect transmission line measurements with new probe pad models","authors":"Chien-Chang Huang","doi":"10.1109/IMPACT.2011.6117236","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117236","url":null,"abstract":"In this paper, the complete models and measured results are presented for the probe pad in the CMOS on-wafer transmission line measurements using L-2L deembedding method. The transmission line parameters including characteristic impedance and propagation constant are acquired for broadband operation. The π-/T-network instead of the conventional shunt/series configuration for the probe pad are proposed with detail expressions for parameter extractions. Due to the under-determined condition for the parameter extraction, the iteration procedure is utilized. The measured results for the thin-film microstrip lines built by the 0.18 μm 1P6M process are shown from 0.2 GHz to 50 GHz.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"28 1","pages":"107-110"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73507848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117225
Cliff Chen, Michk Huang, T. Lewis
The approaching deadline for the RoHS Server exemption expiration provides incentive to the server manufacturing industry to accelerate the Pb-free transition for complex manufacturing processes. The Pb-free soldering process requires a higher reflow temperature than standard eutectic SnPb solder to achieve proper solder joint formation, but introduces more thermal stress to thermally/temperature sensitive components (TSC), especially for the pin through hole (PTH) components attached by surface mount soldering/intrusive soldering or legacy wave soldering processes. Hand soldering and solder fountain (solder pot or selective wave) are two methods used as replacements for legacy wave-soldering to avoid thermal damage to TSC's. There are some challenges with hand soldering that include achieving the 50% hole fill requirements and consistently performing a manual operation during high volume mass production. Solder fountain has become the most reliable method for thermal sensitive PTH components to ensure temperature limitations. In one application that it was required to use solder fountain was the soldering of a Liquid Crystal Display (LCD) PTH component. This particular LCD component had very severe temperature limitations restricting its exposure to 90∼100°C. The method presented in this publication is to reduce the thermal exposure of this specific TSC PTH component, a process utilizing a solder fountain with some additional tools to reduce the heat transfer. In order to further control heat transfer via conduction, convection, or radiation, the idea of applying a controllable air flow between the component body and heated pins was conceived. The air flow between the heat source and component body formed an air wall thermally isolating the component without causing a disturbance with the soldering process. A design of experiments (DOE) using manufacturing parameters that influence component body temperature was completed and provided optimized settings for the “air wall's” effect. This paper documents the experiment varying contact cycles, contact time and air flow that generated an effective air wall process and discusses how the air wall successfully reduces heat transfer to the component body. It will compare the thermal impact on the LCD component body of hand soldering, solder fountain, and solder fountain with the “air wall” mechanism.
{"title":"Novel method for PTH soldering driven by the thermal restrictions of a PTH LCD device","authors":"Cliff Chen, Michk Huang, T. Lewis","doi":"10.1109/IMPACT.2011.6117225","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117225","url":null,"abstract":"The approaching deadline for the RoHS Server exemption expiration provides incentive to the server manufacturing industry to accelerate the Pb-free transition for complex manufacturing processes. The Pb-free soldering process requires a higher reflow temperature than standard eutectic SnPb solder to achieve proper solder joint formation, but introduces more thermal stress to thermally/temperature sensitive components (TSC), especially for the pin through hole (PTH) components attached by surface mount soldering/intrusive soldering or legacy wave soldering processes. Hand soldering and solder fountain (solder pot or selective wave) are two methods used as replacements for legacy wave-soldering to avoid thermal damage to TSC's. There are some challenges with hand soldering that include achieving the 50% hole fill requirements and consistently performing a manual operation during high volume mass production. Solder fountain has become the most reliable method for thermal sensitive PTH components to ensure temperature limitations. In one application that it was required to use solder fountain was the soldering of a Liquid Crystal Display (LCD) PTH component. This particular LCD component had very severe temperature limitations restricting its exposure to 90∼100°C. The method presented in this publication is to reduce the thermal exposure of this specific TSC PTH component, a process utilizing a solder fountain with some additional tools to reduce the heat transfer. In order to further control heat transfer via conduction, convection, or radiation, the idea of applying a controllable air flow between the component body and heated pins was conceived. The air flow between the heat source and component body formed an air wall thermally isolating the component without causing a disturbance with the soldering process. A design of experiments (DOE) using manufacturing parameters that influence component body temperature was completed and provided optimized settings for the “air wall's” effect. This paper documents the experiment varying contact cycles, contact time and air flow that generated an effective air wall process and discusses how the air wall successfully reduces heat transfer to the component body. It will compare the thermal impact on the LCD component body of hand soldering, solder fountain, and solder fountain with the “air wall” mechanism.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"21 1","pages":"222-229"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75353819","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117248
Tien-Tsorng Shih, Binghua Chen, Win-Der Lee, Mu-Chun Wang
To seek and implement the high-speed circuit products, the high-pin count package is necessary to be considered well. Adopting polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost and reliability consideration is a practical selection. After the reflow process, the outward appearance for polymer solder ball shows the better quality, especially in oxidation effect. The uniformity of stand-off height performance for polymer solder ball without flux assistance is better than that for solid solder ball. After shearing test, the adhesion capability for polymer core solder ball on carrier substrate still represents the good performance, compared with solid solder ball.
{"title":"Reflow influence for Sn96.7-Ag3.7 polymer core solder ball in BGA package","authors":"Tien-Tsorng Shih, Binghua Chen, Win-Der Lee, Mu-Chun Wang","doi":"10.1109/IMPACT.2011.6117248","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117248","url":null,"abstract":"To seek and implement the high-speed circuit products, the high-pin count package is necessary to be considered well. Adopting polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost and reliability consideration is a practical selection. After the reflow process, the outward appearance for polymer solder ball shows the better quality, especially in oxidation effect. The uniformity of stand-off height performance for polymer solder ball without flux assistance is better than that for solid solder ball. After shearing test, the adhesion capability for polymer core solder ball on carrier substrate still represents the good performance, compared with solid solder ball.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"29 1","pages":"431-434"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75850868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117288
Jhih-Jyun Yan, Liang-chun Chang, Chun-Wei Lu, W. Dow, A. Liu, David W. Wang
Through-holes (TH) filling of printed circuit board (PCB) by copper electroplating using single organic additive was carried out. The inhibition of the organic additive was sensitive to acid. We chose different kind of organic acids with different concentrations as supporting electrolytes to achieve TH copper filling, which was called butterfly technology (BFT). To reduce plating time, high current density was necessary but it had to combine with raising the concentration of chloride ions and force convection. These combinations can significantly improve the filling performance of the copper plating solution. All of the results of electroplating were observed by optical microscope (OM).
{"title":"The effect of acid on fast through-hole filling by Cu electroplating","authors":"Jhih-Jyun Yan, Liang-chun Chang, Chun-Wei Lu, W. Dow, A. Liu, David W. Wang","doi":"10.1109/IMPACT.2011.6117288","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117288","url":null,"abstract":"Through-holes (TH) filling of printed circuit board (PCB) by copper electroplating using single organic additive was carried out. The inhibition of the organic additive was sensitive to acid. We chose different kind of organic acids with different concentrations as supporting electrolytes to achieve TH copper filling, which was called butterfly technology (BFT). To reduce plating time, high current density was necessary but it had to combine with raising the concentration of chloride ions and force convection. These combinations can significantly improve the filling performance of the copper plating solution. All of the results of electroplating were observed by optical microscope (OM).","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"7 1","pages":"485-487"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74346466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117271
Jin‐Cherng Shyu, Jhih-Zong Syu
This study examines the influence of positions and arrangements of a piezofan having 12-mm wide and 70-mm-long Mylar blade on the thermal performance of two different types of vertical heat sinks. Heat sinks having 11 plate-fins and 100 square pin-fins are tested. The heat transfer coefficient is measured with either a vertical fan and a horizontal fan located at five different locations with distance of 16 mm over fin tip. It is found that the tip amplitude of the Mylar blade is about 7.2 mm. Besides, it is shown that heat transfer coefficient of present heat sinks induced by piezofan show 1.1–2.3 times higher than that under natural convection depending on the fan arrangements and positions. The maximum heat transfer enhancement usually occurs at x/L = 0.5 with either fan arrangement. The heat transfer coefficient is more enhanced with a vertical fan than that with a horizontal fan for either heat sink.
{"title":"Investigation of heat transfer enhancement of vertical heat sinks by piezoelectric fan","authors":"Jin‐Cherng Shyu, Jhih-Zong Syu","doi":"10.1109/IMPACT.2011.6117271","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117271","url":null,"abstract":"This study examines the influence of positions and arrangements of a piezofan having 12-mm wide and 70-mm-long Mylar blade on the thermal performance of two different types of vertical heat sinks. Heat sinks having 11 plate-fins and 100 square pin-fins are tested. The heat transfer coefficient is measured with either a vertical fan and a horizontal fan located at five different locations with distance of 16 mm over fin tip. It is found that the tip amplitude of the Mylar blade is about 7.2 mm. Besides, it is shown that heat transfer coefficient of present heat sinks induced by piezofan show 1.1–2.3 times higher than that under natural convection depending on the fan arrangements and positions. The maximum heat transfer enhancement usually occurs at x/L = 0.5 with either fan arrangement. The heat transfer coefficient is more enhanced with a vertical fan than that with a horizontal fan for either heat sink.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"3 1","pages":"466-469"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84192942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117246
Tien-Tsorng Shih, Binghua Chen, Win-Der Lee, Mu-Chun Wang
Since the high-pin count package is strongly desired from the high performance of commercial electronic products, the ball-grid-array (BGA) assembly is indeed suitable to fit this need. Using the polymer core solder ball in lead-free BGA package instead of solid solder ball is a promising choice due to the lighter weight benefiting the self-alignment in solder adhesion reducing the shift ball issue and the good elasticity protecting the clamping substrates, avoiding the leakage or open phenomenon in circuit operation. Comparing the constitution and the IMC thickness among the solid solder ball and polymer core ball groups, the polymer core solder ball demonstrates not only the similar structure, but the better stability in adhesion. By the way, adopting the polymer core solder ball as a bump replacing the conventional SnPb solder bump is also a feasible method in flip-chip package requiring the adhesion metal medium with a lower melting point.
{"title":"IMC integrity for Sn96.7-Ag3.7 polymer core solder ball in BGA package","authors":"Tien-Tsorng Shih, Binghua Chen, Win-Der Lee, Mu-Chun Wang","doi":"10.1109/IMPACT.2011.6117246","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117246","url":null,"abstract":"Since the high-pin count package is strongly desired from the high performance of commercial electronic products, the ball-grid-array (BGA) assembly is indeed suitable to fit this need. Using the polymer core solder ball in lead-free BGA package instead of solid solder ball is a promising choice due to the lighter weight benefiting the self-alignment in solder adhesion reducing the shift ball issue and the good elasticity protecting the clamping substrates, avoiding the leakage or open phenomenon in circuit operation. Comparing the constitution and the IMC thickness among the solid solder ball and polymer core ball groups, the polymer core solder ball demonstrates not only the similar structure, but the better stability in adhesion. By the way, adopting the polymer core solder ball as a bump replacing the conventional SnPb solder bump is also a feasible method in flip-chip package requiring the adhesion metal medium with a lower melting point.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"32 1","pages":"427-430"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84237578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-29DOI: 10.1109/IMPACT.2011.6117162
Xiaofei Yu, Wei‐dong He, S. Wang, Guoyun Zhou, Meng Zhu
Plasma has a special advantage in cleaning micro blind holes due to simple process, easily operate and non-pollution. In this paper, different etching rates of materials include epoxy, polyimide(PI) and acrylic aid were obtained by cleaning blind holes with plasma in the same condition. The relationship between plasma parameters and etching depths of PI were discussed through orthogonal experimental design (OED). The effects of etching blind holes were investigated through metallographic cross section. Blind holes in a double-side flexible printed circuit(FPC) with PI materials were successfully obtained by plasma etching process.
{"title":"Research on etching blind holes and desmear with plasma","authors":"Xiaofei Yu, Wei‐dong He, S. Wang, Guoyun Zhou, Meng Zhu","doi":"10.1109/IMPACT.2011.6117162","DOIUrl":"https://doi.org/10.1109/IMPACT.2011.6117162","url":null,"abstract":"Plasma has a special advantage in cleaning micro blind holes due to simple process, easily operate and non-pollution. In this paper, different etching rates of materials include epoxy, polyimide(PI) and acrylic aid were obtained by cleaning blind holes with plasma in the same condition. The relationship between plasma parameters and etching depths of PI were discussed through orthogonal experimental design (OED). The effects of etching blind holes were investigated through metallographic cross section. Blind holes in a double-side flexible printed circuit(FPC) with PI materials were successfully obtained by plasma etching process.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"69 1","pages":"304-306"},"PeriodicalIF":0.0,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85883423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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