Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583958
Mukunda Madhava Nath, G. Gupta
Mechanical reliability is the one of the critical aspect of flexible or foldable electronic devices. As new flexible components emerge, new paradigms for mechanical testing and simulations will be required. Standardized characterization test methods such as the 3-point bend test only account for small displacements and large radius of curvature and might not be applicable to foldable device as is. In this paper we propose a 3-point rolling test setup that can be used to achieve a range of radius of curvature. Additioanlly we evaluate the strain response of the device using an equivalent simulation model. We further evaluate the effect of different design parameters like layer thickness and modulus on the reliability of the device using a Taguchi design of experiments.
{"title":"Characterization of a Flexible Device using a 3-Point Rolling Test","authors":"Mukunda Madhava Nath, G. Gupta","doi":"10.1109/IFETC.2018.8583958","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583958","url":null,"abstract":"Mechanical reliability is the one of the critical aspect of flexible or foldable electronic devices. As new flexible components emerge, new paradigms for mechanical testing and simulations will be required. Standardized characterization test methods such as the 3-point bend test only account for small displacements and large radius of curvature and might not be applicable to foldable device as is. In this paper we propose a 3-point rolling test setup that can be used to achieve a range of radius of curvature. Additioanlly we evaluate the strain response of the device using an equivalent simulation model. We further evaluate the effect of different design parameters like layer thickness and modulus on the reliability of the device using a Taguchi design of experiments.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"8 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90848793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583973
G. Xiao, D. Makeiff, Y. Tao, Jianping Lu, Zhiyi Zhang
Silver nanowires, carbon nanotubes and graphenes have found applications for flexible electronics. The adhesion and the patterning of those materials on polymer substrates have been a challenge. This paper reports a novel approach for the improvement of the adhesion between silver nanowires and polyethylene terephthalate (PET) film by using a thermally crosslinkable polymer. The technique was found very efficient in improving the adhesion between silver nanowires and PET substrates.
{"title":"Improving The Adhesion Between Silver Nanowire Transparent Electrode and PET Film Using a Crosslinkable Polymer","authors":"G. Xiao, D. Makeiff, Y. Tao, Jianping Lu, Zhiyi Zhang","doi":"10.1109/IFETC.2018.8583973","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583973","url":null,"abstract":"Silver nanowires, carbon nanotubes and graphenes have found applications for flexible electronics. The adhesion and the patterning of those materials on polymer substrates have been a challenge. This paper reports a novel approach for the improvement of the adhesion between silver nanowires and polyethylene terephthalate (PET) film by using a thermally crosslinkable polymer. The technique was found very efficient in improving the adhesion between silver nanowires and PET substrates.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"18 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90921078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583971
K. Sakuma, Huan Hu, S. Bedell, B. Webb, S. Wright, K. Latzko, M. Agno, J. Knickerbocker
In this research study, we present comprehensive characterizations of flexible silicon sensors fabricated using controlled spalling which uses fracture to produce thin films of single-crystal silicon directly from a bulk substrate. We characterized the property of the thin silicon film for sensing strain and temperature. The flexible sensor exhibits high sensitivity with a temperature coefficient of resistance of −0.16/°C, which is desirable for targeted health monitoring applications.
{"title":"Flexible Piezoresistive Sensors Fabricated by Spalling Technique","authors":"K. Sakuma, Huan Hu, S. Bedell, B. Webb, S. Wright, K. Latzko, M. Agno, J. Knickerbocker","doi":"10.1109/IFETC.2018.8583971","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583971","url":null,"abstract":"In this research study, we present comprehensive characterizations of flexible silicon sensors fabricated using controlled spalling which uses fracture to produce thin films of single-crystal silicon directly from a bulk substrate. We characterized the property of the thin silicon film for sensing strain and temperature. The flexible sensor exhibits high sensitivity with a temperature coefficient of resistance of −0.16/°C, which is desirable for targeted health monitoring applications.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"1 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89848578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8584019
Audrey Laventure, Cayley R. Harding, G. Welch
Organic photovoltaics stands as one of the most promising clean energy technologies. However, its commercial availability is a challenge that has not yet been overcome. To improve the cost effectiveness of the organic solar cell active layer, our group has recently developed a series of N-annulated perylene diimide (PDI) derivatives acting as electron acceptors, one of these is today commercially available. [1] These resulting fullerene-free photovoltaic devices present a high power conversion efficiency, making them a viable alternative to the more traditional fullerene-containing solar cells. [2,3] Considering that these molecules can be mass-produced, they are excellent candidates for the coating of large area solar cells. Herein, we present the structure-property relationship of these materials, along with their utility as electron acceptors in bulk heterojunction organic photovoltaic. We also discuss the preliminary upscaling results of our efforts towards coating large-scale organic solar cells.
{"title":"Exploring Slot-Die Coating for Large Area Fullerene-Free Organic Photovoltaics","authors":"Audrey Laventure, Cayley R. Harding, G. Welch","doi":"10.1109/IFETC.2018.8584019","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8584019","url":null,"abstract":"Organic photovoltaics stands as one of the most promising clean energy technologies. However, its commercial availability is a challenge that has not yet been overcome. To improve the cost effectiveness of the organic solar cell active layer, our group has recently developed a series of N-annulated perylene diimide (PDI) derivatives acting as electron acceptors, one of these is today commercially available. [1] These resulting fullerene-free photovoltaic devices present a high power conversion efficiency, making them a viable alternative to the more traditional fullerene-containing solar cells. [2,3] Considering that these molecules can be mass-produced, they are excellent candidates for the coating of large area solar cells. Herein, we present the structure-property relationship of these materials, along with their utility as electron acceptors in bulk heterojunction organic photovoltaic. We also discuss the preliminary upscaling results of our efforts towards coating large-scale organic solar cells.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"AES-20 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84582233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583947
Yuliang Zhang, R. Izquierdo, Shuyong Xiao
Although organic solar cells have achieved the power conversion efficiency of 13% in laboratory, the commercialization of organic solar cells is still encountering many big challenges. This work aims to reduce the technical barriers on the way to the commercialization of organic solar cells, and centers on applying industrial compatible methods to produce flexible, large-area organic photovoltaic cells. Photoactive ink, green solvent, hole transport ink, and top Ag electrodes have been investigated. The key factors and rules for printing of efficient organic photovoltaic cells are analyzed and summarized. The fabricated flexible, large-area (~8 cm2) organic photovoltaic cells achieved an efficiency of ~1%. Further optimization of photoactive layers and the improvement of charge transport and charge collection are key factors to depress the recombination, enhance photocurrent, and improve the overall photovoltaic performance. This work could be easily transferred to the industry production of organic solar cells, provide directions as well and push one step forward to the commercialization of organic solar cells.
{"title":"Printing of Flexible, Large-Area Organic Photovoltaic Cells","authors":"Yuliang Zhang, R. Izquierdo, Shuyong Xiao","doi":"10.1109/IFETC.2018.8583947","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583947","url":null,"abstract":"Although organic solar cells have achieved the power conversion efficiency of 13% in laboratory, the commercialization of organic solar cells is still encountering many big challenges. This work aims to reduce the technical barriers on the way to the commercialization of organic solar cells, and centers on applying industrial compatible methods to produce flexible, large-area organic photovoltaic cells. Photoactive ink, green solvent, hole transport ink, and top Ag electrodes have been investigated. The key factors and rules for printing of efficient organic photovoltaic cells are analyzed and summarized. The fabricated flexible, large-area (~8 cm2) organic photovoltaic cells achieved an efficiency of ~1%. Further optimization of photoactive layers and the improvement of charge transport and charge collection are key factors to depress the recombination, enhance photocurrent, and improve the overall photovoltaic performance. This work could be easily transferred to the industry production of organic solar cells, provide directions as well and push one step forward to the commercialization of organic solar cells.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"14 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85804311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583889
Denis Shleifman, R. Griffin, A. Dadvand, T. Chu
Parameter extraction for organic thin film transistors (OTFTs) is often performed using the MOSFET square-law to model current-voltage (IV) characteristics. Usually the IV characteristics at a single drain voltage bias is used for fitting the mobility and extrapolating the threshold voltage. Described herein is a method of parameter extraction which fits a family of curves to any given model, and is not limited only to the square-law. Using LTspice, a freely available circuit simulation tool, coupled with MATLAB, a routine has been prepared which performs parameter extraction for OTFT measurement results across a family of curves via optimisation. The use of a circuit simulator allows a wide array of models to be used, and modified, to achieve more accurate circuit simulation performance and possibly provide insight into device behaviour.
{"title":"Generic Parameter Extraction of Inkjet-Printed OTFTs via Optimisation Using LTspice and MATLAB","authors":"Denis Shleifman, R. Griffin, A. Dadvand, T. Chu","doi":"10.1109/IFETC.2018.8583889","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583889","url":null,"abstract":"Parameter extraction for organic thin film transistors (OTFTs) is often performed using the MOSFET square-law to model current-voltage (IV) characteristics. Usually the IV characteristics at a single drain voltage bias is used for fitting the mobility and extrapolating the threshold voltage. Described herein is a method of parameter extraction which fits a family of curves to any given model, and is not limited only to the square-law. Using LTspice, a freely available circuit simulation tool, coupled with MATLAB, a routine has been prepared which performs parameter extraction for OTFT measurement results across a family of curves via optimisation. The use of a circuit simulator allows a wide array of models to be used, and modified, to achieve more accurate circuit simulation performance and possibly provide insight into device behaviour.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"29 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84980080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8584001
N. Qaiser, S. Khan, M. Hussain
Spiral-island is commonly used configuration for highly stretchable and flexible electronics. Here we show the elongations and stress behaviors of spiral-island system. We use the numerical modeling to reveal the stress states along the arms of spirals, especially when the spirals connect in series and as well as triangular configurations between islands. We stretched out the spirals up to 1000 μm and compared the behaviors for single, two and four spirals connected in series. Numerical calculations show that during stretching, the stress is higher near the region of arm’s start i.e. end that is connected to inner circle.. Our result also show that final elongation of spiral and arm’s stresses depend on the angular position and the no. of spirals connected in series. We use the 3D printer to manufacture the spiral-island for triangular configuration and compare the elongation of spirals, which confirm our numerical results.
{"title":"Understanding the Stretching Mechanism of Spiral-Island Configurations for Highly Stretchable Elecronics","authors":"N. Qaiser, S. Khan, M. Hussain","doi":"10.1109/IFETC.2018.8584001","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8584001","url":null,"abstract":"Spiral-island is commonly used configuration for highly stretchable and flexible electronics. Here we show the elongations and stress behaviors of spiral-island system. We use the numerical modeling to reveal the stress states along the arms of spirals, especially when the spirals connect in series and as well as triangular configurations between islands. We stretched out the spirals up to 1000 μm and compared the behaviors for single, two and four spirals connected in series. Numerical calculations show that during stretching, the stress is higher near the region of arm’s start i.e. end that is connected to inner circle.. Our result also show that final elongation of spiral and arm’s stresses depend on the angular position and the no. of spirals connected in series. We use the 3D printer to manufacture the spiral-island for triangular configuration and compare the elongation of spirals, which confirm our numerical results.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"8 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83391052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583964
S. Kong, Heetaek Lim, A. Hoessinger, E. Guichard
The mechanical stress in a thin-film transistor on flexible substrate is the most important problem in display industry. It causes to change electrical performance when bending, stretching, and other possible mechanical deformation stress are applied to film stack, or when repeated deformation is performed to thin film device on flexible substrate. There are few literatures to describe the mechanical stress calculation based on analytic calculation when bending moment is quite small and substrate is larger than film thickness, but this approach has a limitation to extend mechanically large deformed device on a flexible substrate. This motivates us to develop a comprehensive numerical stress model for simulating thin film transistor device on flexible substrate.
{"title":"Mechanical Stress Simulation of Thin Film Transistor on Flexible Substrate","authors":"S. Kong, Heetaek Lim, A. Hoessinger, E. Guichard","doi":"10.1109/IFETC.2018.8583964","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583964","url":null,"abstract":"The mechanical stress in a thin-film transistor on flexible substrate is the most important problem in display industry. It causes to change electrical performance when bending, stretching, and other possible mechanical deformation stress are applied to film stack, or when repeated deformation is performed to thin film device on flexible substrate. There are few literatures to describe the mechanical stress calculation based on analytic calculation when bending moment is quite small and substrate is larger than film thickness, but this approach has a limitation to extend mechanically large deformed device on a flexible substrate. This motivates us to develop a comprehensive numerical stress model for simulating thin film transistor device on flexible substrate.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"9 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89500230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583944
A. Shamim, M. Vaseem, An Sizhe, M. Farooqui
Emerging applications such as Internet of things (IoT) and wearable sensors require new kind of electronics that can be bent, stretched, worn, washed, etc. These electronics must be extremely low cost, to the extent that they become disposable. The flexibility and low-cost aspects can be addressed by using additive manufacturing techniques, such as inkjet and screen printing on light-weight and flexible substrates like paper or plastics. However, the best solution for wearable electronics is to print them directly on textiles. Though, the driving electronics are still predominantly realized in standard CMOS platforms but all the remaining parts of these systems, such as sensors, antennas, interconnects, etc, that are large and expensive to realize on CMOS, can be printed. These could be integrated with CMOS chips to demonstrate system level wearable examples. This paper will show some examples of such flexible and stretchable components and systems that have been realized through additive manufacturing. Performance issues under flexed and stretched conditions are discussed. The promising results of these designs indicate that the day when electronics can be printed like newspapers and magazines through roll-to-roll and reel-to-reel printing is not far away.
{"title":"Additively Manufactured Flexible and Stretchable Antenna Systems for Wearable Applications","authors":"A. Shamim, M. Vaseem, An Sizhe, M. Farooqui","doi":"10.1109/IFETC.2018.8583944","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583944","url":null,"abstract":"Emerging applications such as Internet of things (IoT) and wearable sensors require new kind of electronics that can be bent, stretched, worn, washed, etc. These electronics must be extremely low cost, to the extent that they become disposable. The flexibility and low-cost aspects can be addressed by using additive manufacturing techniques, such as inkjet and screen printing on light-weight and flexible substrates like paper or plastics. However, the best solution for wearable electronics is to print them directly on textiles. Though, the driving electronics are still predominantly realized in standard CMOS platforms but all the remaining parts of these systems, such as sensors, antennas, interconnects, etc, that are large and expensive to realize on CMOS, can be printed. These could be integrated with CMOS chips to demonstrate system level wearable examples. This paper will show some examples of such flexible and stretchable components and systems that have been realized through additive manufacturing. Performance issues under flexed and stretched conditions are discussed. The promising results of these designs indicate that the day when electronics can be printed like newspapers and magazines through roll-to-roll and reel-to-reel printing is not far away.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"11 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87180526","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/IFETC.2018.8583915
Ranran Wang, Yin Cheng, Jing Sun
The fragility of traditional metallic or semi-conductive materials hinders their application in flexible electronics. Low dimensional materials including carbon nanotubes, graphene and metal nanowires own outstanding flexibility and have been wildly used to fabricate flexible devices. Bendable/stretchable substrate is another key component of flexible electronics. Various thin polymer films made of polyethylene terephthalate, polyimide, polydimethylsiloxane et. al. were adopted. However, the air impermeability of these substrates will cause discomfort of humanbeing if applied in wearable electronics. Fiber is an ideal substrate for flexible and wearable electronics due to its excellent flexibility/stretchability, superior breathability, abundant microstructure and low cost. Herein, a series of conductive elastomers and strain sensors were fabricated by combining the low dimensional conductive materials with fiber substrates and regulating the microstructure on the interface. With the help of “twining spring” hierarchical architecture, silver nanowire-double covered yarn (Ag NW-DCY) composite fibers with ultrahigh stretchability were obtained. The conductivity of the composite fibers reached up to 104 S/cm and remained 90% at 2000% tensile strain. Commercial electronic components (LED arrays) were integrated onto a transparent, foldable and stretchable substrate using the composite fibers as stretchable electric wiring, demonstrating the potential application in large-area stretchable electronics. When AgNWs were replaced with graphene, strain sensing fiber with high sensitivity and large working range (100% strain) were fabricated, which enabled the detection of multiple deformation forms, including tensile strain, bending, and torsion. We employ the fibers as wearable sensors, realizing the monitoring of full-range human activities and intricate movement combinations of a robot. Besides, these fibers exhibits fast response, low hysteresis and excellent cycling stability. Another advantage needs to be noted is that these fiber are fabricated by a facial dip coating method, which can be scaled up easily. These smart fibers are of great meaning to the development of flexible and wearable electronics.
{"title":"Smart Fibers Based on Low Dimensional Conductive Materials","authors":"Ranran Wang, Yin Cheng, Jing Sun","doi":"10.1109/IFETC.2018.8583915","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583915","url":null,"abstract":"The fragility of traditional metallic or semi-conductive materials hinders their application in flexible electronics. Low dimensional materials including carbon nanotubes, graphene and metal nanowires own outstanding flexibility and have been wildly used to fabricate flexible devices. Bendable/stretchable substrate is another key component of flexible electronics. Various thin polymer films made of polyethylene terephthalate, polyimide, polydimethylsiloxane et. al. were adopted. However, the air impermeability of these substrates will cause discomfort of humanbeing if applied in wearable electronics. Fiber is an ideal substrate for flexible and wearable electronics due to its excellent flexibility/stretchability, superior breathability, abundant microstructure and low cost. Herein, a series of conductive elastomers and strain sensors were fabricated by combining the low dimensional conductive materials with fiber substrates and regulating the microstructure on the interface. With the help of “twining spring” hierarchical architecture, silver nanowire-double covered yarn (Ag NW-DCY) composite fibers with ultrahigh stretchability were obtained. The conductivity of the composite fibers reached up to 104 S/cm and remained 90% at 2000% tensile strain. Commercial electronic components (LED arrays) were integrated onto a transparent, foldable and stretchable substrate using the composite fibers as stretchable electric wiring, demonstrating the potential application in large-area stretchable electronics. When AgNWs were replaced with graphene, strain sensing fiber with high sensitivity and large working range (100% strain) were fabricated, which enabled the detection of multiple deformation forms, including tensile strain, bending, and torsion. We employ the fibers as wearable sensors, realizing the monitoring of full-range human activities and intricate movement combinations of a robot. Besides, these fibers exhibits fast response, low hysteresis and excellent cycling stability. Another advantage needs to be noted is that these fiber are fabricated by a facial dip coating method, which can be scaled up easily. These smart fibers are of great meaning to the development of flexible and wearable electronics.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"3 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75116597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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