The particle-free silver conductive ink and the PET film were used as the reactive ink and the substrate respectively. During the printing process, a layer of ink drops would be printed. After that, the printed liquid drops were sintered in an oven to obtain a compact silver layer. Repeat the “printing and sintering” process to form a silver film by a layer-by-layer way. Silver film with several layers was characterized by SEM observation, EDS composition analysis and XRD phase analysis. The result showed that sintered compact of silver film was composed of homogeneously distributed nano-silver particles. The film resistivity was measured by the four-point probe method. The effects of the printed layer number on the film property and the resistivity of the silver sintered compact were studied. The results showed that the film property and the resistivity varied with the number of printed layers. When the number was up to 14, the electric conductivity reached its optimum value 4.8μΩ·cm, and the sintered compact of nano-silver covered 94.5% area of the PET substrate. In the final part of this work, a circuit including LED and printed wires were set up to demonstrate the conductivity of the printed flexible electronics under various conditions.
{"title":"Conductive property of inkjet printed film by reactive silver inks on PET flexible substrate","authors":"Xingming Tang, Hongbo Xu, Ximing Liu, Hongyun Zhao","doi":"10.1109/ICEPT.2016.7583360","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583360","url":null,"abstract":"The particle-free silver conductive ink and the PET film were used as the reactive ink and the substrate respectively. During the printing process, a layer of ink drops would be printed. After that, the printed liquid drops were sintered in an oven to obtain a compact silver layer. Repeat the “printing and sintering” process to form a silver film by a layer-by-layer way. Silver film with several layers was characterized by SEM observation, EDS composition analysis and XRD phase analysis. The result showed that sintered compact of silver film was composed of homogeneously distributed nano-silver particles. The film resistivity was measured by the four-point probe method. The effects of the printed layer number on the film property and the resistivity of the silver sintered compact were studied. The results showed that the film property and the resistivity varied with the number of printed layers. When the number was up to 14, the electric conductivity reached its optimum value 4.8μΩ·cm, and the sintered compact of nano-silver covered 94.5% area of the PET substrate. In the final part of this work, a circuit including LED and printed wires were set up to demonstrate the conductivity of the printed flexible electronics under various conditions.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"69 1","pages":"1293-1296"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86158930","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance of the paste on 6061Al increases, and the tensile strength and shear strength of 6061Al/SAC0307/6061Al solder joints increase observably, which is due to the fact that the activity of the aluminum solder paste increases with the increase of heating rate in reflow process. However, the effects of peak soldering temperature on the solderability of the aluminum solder paste and the reliability of the soldered joints may be negligible. There is no intermetallic compound or transition layer formed at the interface. In addition, the shear strength of the joints increases with the increase of joint thickness because of the less voids formed in the solder matrix.
{"title":"Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures","authors":"Yuan-Jiang Lin, Min-bo Zhou, X. Ma, Xin-Ping Zhang","doi":"10.1109/ICEPT.2016.7583302","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583302","url":null,"abstract":"Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance of the paste on 6061Al increases, and the tensile strength and shear strength of 6061Al/SAC0307/6061Al solder joints increase observably, which is due to the fact that the activity of the aluminum solder paste increases with the increase of heating rate in reflow process. However, the effects of peak soldering temperature on the solderability of the aluminum solder paste and the reliability of the soldered joints may be negligible. There is no intermetallic compound or transition layer formed at the interface. In addition, the shear strength of the joints increases with the increase of joint thickness because of the less voids formed in the solder matrix.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"71 1","pages":"1028-1032"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86943280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583141
Penghao Gu, Jing Han, F. Guo
The research on lead-free solders has become the focus in electronic industry, conventional lead-free solder technology may not meet the increasingly severe service environment, so an attractive and potentially method to enhance the performance of a lead-free solder is to introduce reinforcements into a conventional alloy. This study employed polyhedral oligomeric silsesquioxanes (POSS) nano-particles as reinforcements for Sn3.5Ag0.5Cu (SAC) solder matrix. It was aimed at investigating the effect of POSS on the microstructure evolution and recrystallization behavior of ball grid array (BGA) solder joints under thermal fatigue. 3wt% POSS were incorporated into Sn3.5Ag0.5Cu (SAC) solder matrix by mechanical ball milling followed by reflow process, and found to be homogeneously dispersed into the solder matrix by EDX analysis. Then, two kinds of different components BGA assemblies were subjected to thermal cycling, and the surface morphology change and orientation evolution of solder joints before and after the thermal shock was respectively characterized by using SEM and EBSD. Experimental results revealed that the microstructure of solder matrix could be markedly refined with the addition of POSS, because of the reinforcements retarded the element diffusion and intermetallic compound aggregation. Vickers hardness has obviously improved, composite solder joint shows a better mechanical properties. After the thermal fatigue test of 928 cycles, at the interfaces extrusion deformation produced, the recrystallization accompanied with initiation and propagation of cracks in the BGA of SAC305 solder joint. But after the addition of nanoparticles, composite solder resulted in less grain boundaries in the same time, and it can prevent the appearance of recrystallization in solder.
{"title":"Effects of nano-structured reinforcements on the recrystallizationand damage mode of of Sn-3.0Ag-0.5Cu solder joints","authors":"Penghao Gu, Jing Han, F. Guo","doi":"10.1109/ICEPT.2016.7583141","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583141","url":null,"abstract":"The research on lead-free solders has become the focus in electronic industry, conventional lead-free solder technology may not meet the increasingly severe service environment, so an attractive and potentially method to enhance the performance of a lead-free solder is to introduce reinforcements into a conventional alloy. This study employed polyhedral oligomeric silsesquioxanes (POSS) nano-particles as reinforcements for Sn3.5Ag0.5Cu (SAC) solder matrix. It was aimed at investigating the effect of POSS on the microstructure evolution and recrystallization behavior of ball grid array (BGA) solder joints under thermal fatigue. 3wt% POSS were incorporated into Sn3.5Ag0.5Cu (SAC) solder matrix by mechanical ball milling followed by reflow process, and found to be homogeneously dispersed into the solder matrix by EDX analysis. Then, two kinds of different components BGA assemblies were subjected to thermal cycling, and the surface morphology change and orientation evolution of solder joints before and after the thermal shock was respectively characterized by using SEM and EBSD. Experimental results revealed that the microstructure of solder matrix could be markedly refined with the addition of POSS, because of the reinforcements retarded the element diffusion and intermetallic compound aggregation. Vickers hardness has obviously improved, composite solder joint shows a better mechanical properties. After the thermal fatigue test of 928 cycles, at the interfaces extrusion deformation produced, the recrystallization accompanied with initiation and propagation of cracks in the BGA of SAC305 solder joint. But after the addition of nanoparticles, composite solder resulted in less grain boundaries in the same time, and it can prevent the appearance of recrystallization in solder.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"55 1","pages":"304-309"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87256978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583192
M. Fan, M. Huang, N. Zhao
Synchrotron radiation real-time imaging technology was performed to in situ study the effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn-3.0Ag-0.5Cu/Ni micro interconnects at 221°C. For Cu/Sn-3.0Ag-0.5Cu interconnect, the scalloped IMC remained its shape grew slightly larger with prolonged reaction time. However, with Ni substrate added on the opposite interface, the scallop grains were split into smaller grains. Besides the opinion that Ni can improve the nucleation rate of Cu6Sn5 on Cu interface and inhibit grain coarsening, the liquid solder/Cu6Sn5 interfacial energy change and the grooving effect by the addition of Ni played an important role on the growth behavior of Cu6Sn5.
{"title":"Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects","authors":"M. Fan, M. Huang, N. Zhao","doi":"10.1109/ICEPT.2016.7583192","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583192","url":null,"abstract":"Synchrotron radiation real-time imaging technology was performed to in situ study the effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn-3.0Ag-0.5Cu/Ni micro interconnects at 221°C. For Cu/Sn-3.0Ag-0.5Cu interconnect, the scalloped IMC remained its shape grew slightly larger with prolonged reaction time. However, with Ni substrate added on the opposite interface, the scallop grains were split into smaller grains. Besides the opinion that Ni can improve the nucleation rate of Cu6Sn5 on Cu interface and inhibit grain coarsening, the liquid solder/Cu6Sn5 interfacial energy change and the grooving effect by the addition of Ni played an important role on the growth behavior of Cu6Sn5.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"23 1","pages":"542-545"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87292443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583084
X. Long, Bingjie Chen, Yao Yao
Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations are preferred compared with experimental studies. In the present study, a thermo-visco-plastic constitutive model is proposed for both lead-containing and lead-free solders under monotonic and cyclic loading conditions. Due to a simple formulation form and only a few parameters, the proposed thermo-visco-plastic constitutive model can be implemented into finite element software at minor effort and the determination of parameters can be achieved conveniently by regression to experimental data. The validations against experimental data show that the proposed model is capable of well simulating the tensile behavior of various solder materials at different strain rates and working temperatures. In addition, the required parameters in the proposed model are proved to be well defined as good changing patterns are achieved by revealing the intrinsic characteristic properties of solder material under various conditions.
{"title":"Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings","authors":"X. Long, Bingjie Chen, Yao Yao","doi":"10.1109/ICEPT.2016.7583084","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583084","url":null,"abstract":"Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations are preferred compared with experimental studies. In the present study, a thermo-visco-plastic constitutive model is proposed for both lead-containing and lead-free solders under monotonic and cyclic loading conditions. Due to a simple formulation form and only a few parameters, the proposed thermo-visco-plastic constitutive model can be implemented into finite element software at minor effort and the determination of parameters can be achieved conveniently by regression to experimental data. The validations against experimental data show that the proposed model is capable of well simulating the tensile behavior of various solder materials at different strain rates and working temperatures. In addition, the required parameters in the proposed model are proved to be well defined as good changing patterns are achieved by revealing the intrinsic characteristic properties of solder material under various conditions.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"39 1","pages":"31-36"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85627097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583282
Baotan Zhang, Pengli Zhu, Gang Li, R. Sun, C. Wong
The novel underfill material with low coefficient of thermal expansion was prepared by cyanate, epoxy, polyimide and silica filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, FTIR, TMA and DMA, respectively. The results showed that the modification of cyanate resin and its copolymer with silica filler has high fluidity for capillary underfill application. With an increase in silica fillers loading, the coefficient of thermal expansion reduces from 68.2 to 19.5 ppm/°C at 70 wt% silica fillers at room temperature, while the glass transition temperature of cured material is greater than 230 °C. This indicates that the novel underfill material has good dimensional stability and thermal stability, which can be used for high density flip chip interconnection assembly.
{"title":"Novel underfill material with low coefficient of thermal expansione","authors":"Baotan Zhang, Pengli Zhu, Gang Li, R. Sun, C. Wong","doi":"10.1109/ICEPT.2016.7583282","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583282","url":null,"abstract":"The novel underfill material with low coefficient of thermal expansion was prepared by cyanate, epoxy, polyimide and silica filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, FTIR, TMA and DMA, respectively. The results showed that the modification of cyanate resin and its copolymer with silica filler has high fluidity for capillary underfill application. With an increase in silica fillers loading, the coefficient of thermal expansion reduces from 68.2 to 19.5 ppm/°C at 70 wt% silica fillers at room temperature, while the glass transition temperature of cured material is greater than 230 °C. This indicates that the novel underfill material has good dimensional stability and thermal stability, which can be used for high density flip chip interconnection assembly.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"28 1","pages":"933-937"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85678219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583318
L. Huaicheng, An Tong, Bie Xiaorui, S. Ge, Q. Fei
Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify the failure mechanism and locations of solder joints. Finite element analysis with quarter model was implemented to obtain the strain and stress of solder joints. Furthermore, viscoplastic Anand's model was used to describe the constitutive equation of Sn63Pb37 solder. The life prediction model was established based on Engelmaier's model at last.
{"title":"Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints","authors":"L. Huaicheng, An Tong, Bie Xiaorui, S. Ge, Q. Fei","doi":"10.1109/ICEPT.2016.7583318","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583318","url":null,"abstract":"Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify the failure mechanism and locations of solder joints. Finite element analysis with quarter model was implemented to obtain the strain and stress of solder joints. Furthermore, viscoplastic Anand's model was used to describe the constitutive equation of Sn63Pb37 solder. The life prediction model was established based on Engelmaier's model at last.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"40 1","pages":"1104-1107"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85954571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583167
Wang Jian, Yanbin Shen, S. Luo, Wenhu Yang, Shuhui Yu, R. Sun, C. Wong
The nonlinear I-V behavior of the three-phase SiC/CNTs/epoxy composites for high voltage field grading application was investigated, and a composite bulk hopping mechanism was proposed. It is hypothesized that nearest-neighbor electronic hopping occurs through thin epoxy layers between CNTs and SiC particles, and an asymmetric rectangular potential barrier structure is the mechanism governing the nonlinear electric response of the three-phase SiC/CNTs/epoxy composites. Compared with CNTs/epoxy, the I-V behavior of the three-phase SiC/CNTs/epoxy composites exhibited much better reproducibility.
{"title":"The nonlinear voltage-current characteristics of three-phase SiC/CNTs/epoxy composite","authors":"Wang Jian, Yanbin Shen, S. Luo, Wenhu Yang, Shuhui Yu, R. Sun, C. Wong","doi":"10.1109/ICEPT.2016.7583167","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583167","url":null,"abstract":"The nonlinear I-V behavior of the three-phase SiC/CNTs/epoxy composites for high voltage field grading application was investigated, and a composite bulk hopping mechanism was proposed. It is hypothesized that nearest-neighbor electronic hopping occurs through thin epoxy layers between CNTs and SiC particles, and an asymmetric rectangular potential barrier structure is the mechanism governing the nonlinear electric response of the three-phase SiC/CNTs/epoxy composites. Compared with CNTs/epoxy, the I-V behavior of the three-phase SiC/CNTs/epoxy composites exhibited much better reproducibility.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"26 1","pages":"421-424"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91190545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, the root cause and solution of bump deformation failure of memory product in FC(Flip chip) process were studied through experimental and simulation method. After analysis, MUF (Mold under fill) unbalanced flow was proposed to be the real root cause for this type of failure. In order to verificate it, the simulation method was proposed to explain what level of stress did the bump suffer during the mold process. What' more, It was found that all the kinds of products with bump deformation have a larger size of die than those products without bump deformation. So the simulation method was proposed to simulate the MUF flow by different size of die. In order to solve the bump deformation problem, the mold process was optimized. The key parameter which effects the bump deformation was found by DOE. Then the profile was optimized and the result showed that it avoided the bump deformation failure a lot.
{"title":"Analysis and solution of bump deformation failure in Flip chip process","authors":"N. Wang, Xiaoqing Li, Liqun Gu, Ying Li, Jianwei Zhou, Jonghyun Chae","doi":"10.1109/ICEPT.2016.7583330","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583330","url":null,"abstract":"In this paper, the root cause and solution of bump deformation failure of memory product in FC(Flip chip) process were studied through experimental and simulation method. After analysis, MUF (Mold under fill) unbalanced flow was proposed to be the real root cause for this type of failure. In order to verificate it, the simulation method was proposed to explain what level of stress did the bump suffer during the mold process. What' more, It was found that all the kinds of products with bump deformation have a larger size of die than those products without bump deformation. So the simulation method was proposed to simulate the MUF flow by different size of die. In order to solve the bump deformation problem, the mold process was optimized. The key parameter which effects the bump deformation was found by DOE. Then the profile was optimized and the result showed that it avoided the bump deformation failure a lot.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"8 1","pages":"1159-1162"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81803369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-08-01DOI: 10.1109/ICEPT.2016.7583093
Ying Yang
This paper presents a failure analysis for delamination. White spots were found on four-layer PCBs. Cross-sectioning showed that there was delamination/blistering within prepreg. Thermal analysis was performed, and it turned out that delamination/blistering is related to poor heat resistance of base substrate.
{"title":"Failure analysis for laminate delamination","authors":"Ying Yang","doi":"10.1109/ICEPT.2016.7583093","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583093","url":null,"abstract":"This paper presents a failure analysis for delamination. White spots were found on four-layer PCBs. Cross-sectioning showed that there was delamination/blistering within prepreg. Thermal analysis was performed, and it turned out that delamination/blistering is related to poor heat resistance of base substrate.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"27 1","pages":"73-75"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90993664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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