Pub Date : 2024-09-11DOI: 10.1109/OJSSCS.2024.3458900
Joo-Hyung Chae
Currently, we are living in a data-centric era as the need for large amounts of data has dramatically increased due to the widespread adoption of artificial intelligence (AI) in a variety of technology domains. In the current computing architecture, the memory input and output (I/O) bandwidth is becoming a bottleneck for improving computing performance; therefore, high-bandwidth memory interfaces are essential. In addition, the high power consumption of data centers to edge AI devices will lead to power shortages and climate crises in the near future; therefore, energy-efficient techniques for memory interfaces are also important. This article presents contemporary approaches to improve I/O bandwidth, such as increasing the I/O pin count and data rate/pin, and to save energy in memory interfaces. However, there are still some design challenges that require further improvements. Therefore, various design challenges and problems to be solved are discussed, and future perspectives, including chiplet and die-to-die interfaces, are presented. Based on various research and development efforts to overcome the current limitations, the technological paradigm shift and related industries are expected to advance to the next level.
{"title":"High-Bandwidth and Energy-Efficient Memory Interfaces for the Data-Centric Era: Recent Advances, Design Challenges, and Future Prospects","authors":"Joo-Hyung Chae","doi":"10.1109/OJSSCS.2024.3458900","DOIUrl":"https://doi.org/10.1109/OJSSCS.2024.3458900","url":null,"abstract":"Currently, we are living in a data-centric era as the need for large amounts of data has dramatically increased due to the widespread adoption of artificial intelligence (AI) in a variety of technology domains. In the current computing architecture, the memory input and output (I/O) bandwidth is becoming a bottleneck for improving computing performance; therefore, high-bandwidth memory interfaces are essential. In addition, the high power consumption of data centers to edge AI devices will lead to power shortages and climate crises in the near future; therefore, energy-efficient techniques for memory interfaces are also important. This article presents contemporary approaches to improve I/O bandwidth, such as increasing the I/O pin count and data rate/pin, and to save energy in memory interfaces. However, there are still some design challenges that require further improvements. Therefore, various design challenges and problems to be solved are discussed, and future perspectives, including chiplet and die-to-die interfaces, are presented. Based on various research and development efforts to overcome the current limitations, the technological paradigm shift and related industries are expected to advance to the next level.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"4 ","pages":"252-264"},"PeriodicalIF":0.0,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10677348","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142844211","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-06DOI: 10.1109/OJSSCS.2024.3455269
Pingda Guan;Haikun Jia;Wei Deng;Teerachot Siriburanon;Robert Bogdan Staszewski;Zhihua Wang;Baoyong Chi
The rapidly advancing field of millimeter-wave (mm-wave) radio-frequency integrated circuit (RFIC) design has ushered in an era of remarkable innovation, particularly in the realm of on-chip passive devices. Among them, 8-shaped inductors have emerged as a novel and promising variant, attracting significant research interest thanks to their unique geometry and electromagnetic (EM) properties. The distinctive feature of 8-shaped inductors lies in their antiparallel magnetic fields due to the opposing current flows within the two turns, enabling manifold applications. In this article, we comprehensively explore the 8-shaped inductors with a focus on their diverse utilizations, including EM interference (EMI) reduction, compactness of RF layout, provision for a magnetic feedforward/feedback arrangement, and oscillation mode manipulation, thereby demonstrating that the 8-shaped inductor can be an essential addition to RFIC designers’ toolbox.
{"title":"8-Shaped Inductors: An Essential Addition to RFIC Designers’ Toolbox","authors":"Pingda Guan;Haikun Jia;Wei Deng;Teerachot Siriburanon;Robert Bogdan Staszewski;Zhihua Wang;Baoyong Chi","doi":"10.1109/OJSSCS.2024.3455269","DOIUrl":"https://doi.org/10.1109/OJSSCS.2024.3455269","url":null,"abstract":"The rapidly advancing field of millimeter-wave (mm-wave) radio-frequency integrated circuit (RFIC) design has ushered in an era of remarkable innovation, particularly in the realm of on-chip passive devices. Among them, 8-shaped inductors have emerged as a novel and promising variant, attracting significant research interest thanks to their unique geometry and electromagnetic (EM) properties. The distinctive feature of 8-shaped inductors lies in their antiparallel magnetic fields due to the opposing current flows within the two turns, enabling manifold applications. In this article, we comprehensively explore the 8-shaped inductors with a focus on their diverse utilizations, including EM interference (EMI) reduction, compactness of RF layout, provision for a magnetic feedforward/feedback arrangement, and oscillation mode manipulation, thereby demonstrating that the 8-shaped inductor can be an essential addition to RFIC designers’ toolbox.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"4 ","pages":"131-146"},"PeriodicalIF":0.0,"publicationDate":"2024-09-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10668829","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142323057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-02DOI: 10.1109/OJSSCS.2024.3453777
Sungwon Kwon;Minjae Jung;Byung-Wook Min
In this article, we introduce an ultra-wideband 4-bit distributed phase shifter using a lattice network. To achieve wider bandwidth, the proposed phase shifter employed an all-pass lattice network instead of the traditional low-pass ladder network. Seven cascaded 22.5° lattice phase shifters and one switched line 180° phase shifter were used to achieve 360° phase shift range. Based on our theoretical analysis, we designed the lattice network as a constant-phase shifter rather than a delay line. Implementations in the K/Ka- and E/W-bands validate the suitability of the lattice network for constant-phase shifting. Fabricated using 28-nm bulk CMOS technology, the K/Ka-band phase shifter had a size of 0.45 mm2 excluding pads. Within the frequency range of 20.5–35.5 GHz, the root-mean-square (RMS) phase error ranged from 1.6 to 5°, the RMS gain error ranged from 0.3 to 0.6 dB, and the return loss remained above 10 dB. At 28 GHz, the insertion loss was $11.6pm 0$