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2012 8th International Caribbean Conference on Devices, Circuits and Systems (ICCDCS)最新文献

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PTFTs with blends of P3HT:F8T2 P3HT:F8T2共混物的ptft
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188917
M. Avila, F. Ulloa, J. Sánchez, M. Estrada
In this paper, we characterize MIS structures and PTFTs made with blends of P3HT:F8T2 as active layer and PMMA as dielectric. The properties of the interface between the dielectric and the active layer are analyzed using CV curves and compared to those obtained for P3HT and F8T2 as active layer. Mobility and its dependence with gate voltage, the distribution of states DOS in the active layer of the PTFTs and other device parameters were obtained and analyzed. It was found that the characteristic temperature of the distribution of States, DOS in P3HT is the lowest, increasing slightly for the blend, but quite significant in F8T2 PTFTs, while the density of localized states is highest for the blend. Mobility resulted lower than for P3HT devices, but higher than for F8T2. The interface density of states also increases.
在本文中,我们表征了MIS结构和由P3HT:F8T2作为有源层和PMMA作为电介质的共混物制成的ptft。利用CV曲线分析了介电介质与有源层之间的界面特性,并与P3HT和F8T2作为有源层进行了比较。得到并分析了迁移率及其与栅极电压、PTFTs有源层DOS态分布及其他器件参数的关系。结果表明,共混物中DOS分布的特征温度在P3HT中最低,在共混物中略有增加,但在F8T2 ptft中显著增加,而共混物的局域态密度最高。迁移率低于P3HT器件,但高于F8T2器件。界面态密度也增加了。
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引用次数: 1
Symbolic DDD-based tool for the computation of noise in CMOS analog circuits 基于符号ddd的CMOS模拟电路噪声计算工具
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188912
S. Rodriguez-Chavez, E. Tlelo-Cuautle, A. A. Palma-Rodriguez, S. Tan
In this paper we present a tool based on determinant decision diagrams (DDDs) for the automatic generation of exact fully-symbolic noise expressions of analog integrated circuits containing MOSFETs. The formulation of the circuit equations is performed through modeling all MOSFETs with their nullor equivalents and by applying symbolic nodal analysis. The derived exact fully-symbolic noise expressions are evaluated from HSPICE™ simulations using the related noise equations for NLEV 0, 1 and 2. We show the good agreement between the derived symbolic-expressions and HSPICE™. Another advantage of our proposed DDD-based tool relies on its capability to compute the voltage noise generated at each circuit node, and in a simple post-processing step it can compute the current noise at each circuit branch.
本文提出了一种基于行列式决策图(DDDs)的工具,用于自动生成包含mosfet的模拟集成电路的精确全符号噪声表达式。电路方程的公式是通过对所有mosfet进行零值等效建模并应用符号节点分析来实现的。使用NLEV 0、1和2的相关噪声方程,从HSPICE™模拟中评估了推导出的精确的全符号噪声表达式。我们证明了衍生的符号表达式与HSPICE™之间的良好一致性。我们提出的基于ddd的工具的另一个优点在于它能够计算每个电路节点产生的电压噪声,并且在一个简单的后处理步骤中,它可以计算每个电路支路的电流噪声。
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引用次数: 6
Uniaxial mechanical stress influence on the low frequency noise in FD SOI nMOSFETs operating in saturation 单轴机械应力对饱和状态下FD SOI nmosfet低频噪声的影响
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188929
M. A. S. de Saouza, R. T. Doria, M. Pavanello, C. Claeys, E. Simoen
This work presents a study of the influence of mechanical stress on the low frequency noise in planar SOI transistors operating in saturation. Several channel lengths were measured, and the results show a reduction of the low frequency noise for strained devices independent of the channel length, and this reduction is more effective for smaller channel lengths.
本文研究了饱和状态下机械应力对平面SOI晶体管低频噪声的影响。对几个通道长度进行了测量,结果表明,对于与通道长度无关的应变器件,低频噪声的降低是有效的,并且这种降低对于较小的通道长度更有效。
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引用次数: 0
BGA MPI socket analysis and validation BGA MPI套接字分析和验证
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188927
F. Aldana, A. Zenteno, D. R. Mendavil, G. Regalado
The design of a ball grid array metalized particle interconnect (BGA MPI) socket is presented. A novel design using static force system using less force and components instead of a dynamic one is shown. The performance of MPI socket has been characterized mechanically as deformation value and electrically as S parameters for different compression force. The MPI has been validated at laboratory using continuity, resistance and validation test. All of tests successfully passed which probed the socket design.
介绍了一种球栅阵列金属化粒子互连(BGA MPI)插座的设计。提出了一种新的静力系统设计方案,采用较小的力和元件来代替动态系统。在不同的压缩力作用下,MPI插座的力学性能表现为变形值,电气性能表现为S参数。MPI已在实验室通过连续性、阻力和验证试验进行验证。对套接字设计的所有测试均成功通过。
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引用次数: 2
Analytical calculation of the equivalent inductance for signal vias in parallel planes with arbitrary P/G via distribution 任意P/G通孔分布平行平面上信号通孔等效电感的解析计算
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188933
G. Hernández‐Sosa, A. Sánchez
This paper introduces an analytical method for calculating the equivalent inductance associated to signal vias in parallel planes with arbitrary power/ground (P/G) via distribution. The proposal is corroborated by comparing the equivalent inductances predicted by a commercial electromagnetic solver (HFSS) and those predicted by the analytical method. Excellent results are obtained demonstrating the accuracy and validity of the proposal.
本文介绍了一种计算任意功率/地(P/G)分布的平行平面上信号过孔等效电感的解析方法。通过比较商用电磁求解器(HFSS)预测的等效电感和解析方法预测的等效电感,证实了上述建议。实验结果证明了该方法的准确性和有效性。
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引用次数: 6
Contact technology schemes for advanced Ge and III-V CMOS technologies 先进Ge和III-V CMOS技术的接触技术方案
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188889
C. Claeys, A. Firrincieli, K. Martens, J. Kittl, E. Simoen
For sub 22 nm technologies the use of both Ge and III-V based devices is extensively investigated because of their promising electrical performances. However, for both types of devices it is of utmost importance to achieve ohmic contacts with a low specific contact resistivity in the order of 1×10-8 Ωcm2 or below. This paper reviews some basic aspects and recent insights in contact technology schemes for both Ge and III-V based technologies.
对于22纳米以下的技术,Ge和III-V基器件的使用被广泛研究,因为它们具有良好的电气性能。然而,对于这两种类型的设备来说,最重要的是实现具有1×10-8 Ωcm2或以下顺序的低比接触电阻率的欧姆接触。本文回顾了Ge和III-V基技术的接触技术方案的一些基本方面和最新见解。
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引用次数: 1
Temperature influence on UTBOX 1T-DRAM using GIDL for writing operation 温度对使用GIDL进行写入操作的utbox1t - dram的影响
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188903
K. Sasaki, L. Almeida, J. Martino, M. Aoulaiche, E. Simoen, C. Claeys
This paper investigates the temperature influence on Ultra Thin Buried Oxide (UTBOX) FDSOI devices used as a 1T-DRAM (single transistor dynamic random access memory cell) using GIDL (Gate Induced Drain Leakage) for writing operation through numerical simulations. At higher temperatures, it is observed that the memory window varies and the retention time is degraded, when using a standard read. To solve this issue, we suggest the ZTC read, which fixes the state-0 current independently of the temperature. Moreover, considering I0 current as a reference current for the memory cell operation results in improved retention time.
本文通过数值模拟研究了温度对超薄埋藏氧化物(UTBOX) FDSOI器件使用GIDL(栅极感应漏极)进行写入操作的1T-DRAM(单晶体管动态随机存取存储器单元)的影响。在较高的温度下,可以观察到,当使用标准读取时,内存窗口会发生变化,并且保留时间会降低。为了解决这个问题,我们建议ZTC读取,它独立于温度固定状态0电流。此外,考虑I0电流作为存储单元操作的参考电流可改善保持时间。
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引用次数: 11
A 2.4GHz transceiver for wireless sensor network 2.4GHz无线传感器网络收发器
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188923
W. A. Amaral, F. Castro, S. T. Coelho, M. Goes, C. O. Hamanaka, I. C. S. Junior, J. L. E. Júnior, W. B. Moraes, M. D. Pereira, R. L. O. Pinto, A. F. Ponchet, E. A. C. Sanchez, J. C. Silva, L. H. Spiller, A. Ximenes, S. D. Yamamoto, R. Lima, V. L. Sobral
A transceiver design will be presented in the following items. The circuit will be used in a wireless sensor network for precision irrigation in agriculture. The transceiver was designed to operate in the license - free ISM band of 2.4GHz. A complete top-down methodology was used, improving the coverage of the system functional verification. The design was made using XFAB 0.18um CMOS technology.
收发器的设计将在以下项目中提出。该电路将用于农业精准灌溉的无线传感器网络。该收发器被设计为在2.4GHz的免许可证ISM频段工作。采用了完整的自顶向下的方法,提高了系统功能验证的覆盖率。设计采用XFAB 0.18um CMOS技术。
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引用次数: 0
DC and low-frequency noise optimization of four-gate transistors 四栅极晶体管的直流和低频噪声优化
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188916
J. Tejada, A. L. Rodriguez, A. Godoy, S. Rodríguez-Bolívar, J. Villanueva, O. Marinov, M. Deen
The effects of different parameters on the DC and low-frequency noise performance of four gate field effect transistors (G4-FET) are studied. Experimental data of the drain current and the current noise power spectral density (PSD) are compared with simulation results. The comparisons show that the drain current and its associated noise are very sensitive to the doping profile of the pn junctions that constitute the lateral gates of the device. The presence of recombination centers also modifies the performance of the device. These centers can degrade the excellent subthreshold slope that the G4-FET transistor exhibits. At the same time, the generation-recombination (g-r) noise produced by deep traps in the depletion regions of the device can be reduced by the presence of these recombination centers. In this work, we propose a procedure to determine an optimal dopant profile of the lateral pn junctions of the device that minimizes the subthreshold slope and the low frequency noise and maximizes the transconductance.
研究了不同参数对四栅极场效应晶体管(G4-FET)直流和低频噪声性能的影响。将漏极电流和电流噪声功率谱密度(PSD)的实验数据与仿真结果进行了比较。比较表明,漏极电流及其相关噪声对构成器件侧栅的pn结的掺杂谱非常敏感。重组中心的存在也改变了器件的性能。这些中心可以降低G4-FET晶体管所表现出的良好的亚阈值斜率。同时,由于这些复合中心的存在,器件耗尽区深阱产生的产生复合(g-r)噪声可以降低。在这项工作中,我们提出了一种方法来确定器件侧pn结的最佳掺杂轮廓,以最小化亚阈值斜率和低频噪声,并最大化跨导。
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引用次数: 0
Mobility models for ZnO TFTs ZnO tft的迁移率模型
Pub Date : 2012-03-14 DOI: 10.1109/ICCDCS.2012.6188880
M. Cheralathan, Sungjae Chang, M. Bawedin, Burhan Bayraktaroglu, J.-H. Lee, Benjamin Iñiguez, S. Cristoloveanu
ZnO device technology provides numerous possible TFT applications. This paper investigates the transport properties in thin nanocrystalline ZnO films. Since these devices are bottom-gate controlled, their characteristics reveal the properties of the back channel located at the interface. Guided by systematic experimental results, we focus on analytical models matching the mobility behavior in ZnO TFTs. The gate leakage and subthreshold leakage currents are much lower than the drain current in inversion, where the mobility model holds. We present appropriate parameter extraction methods for two particular mobility models. A good agreement is obtained between the low temperature measurements and the models proposed.
ZnO器件技术提供了许多可能的TFT应用。研究了ZnO纳米晶薄膜的输运特性。由于这些器件是底栅控制的,它们的特性揭示了位于接口处的后通道的特性。在系统实验结果的指导下,我们重点研究了ZnO tft中迁移行为的分析模型。栅极泄漏电流和亚阈值泄漏电流远低于倒转时的漏极电流,此时迁移率模型成立。针对两种特殊的迁移率模型,提出了相应的参数提取方法。低温测量结果与所提出的模型吻合较好。
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引用次数: 1
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2012 8th International Caribbean Conference on Devices, Circuits and Systems (ICCDCS)
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