首页 > 最新文献

IEEE Microwave and Wireless Components Letters最新文献

英文 中文
A Low Running Complexity Model for Digital Predistortion of RF Power Amplifiers 射频功率放大器数字预失真的低运行复杂度模型
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3181204
Renlong Han, W. Qiao, Chengye Jiang, Lei Su, Guichen Yang, Jing-tao Tan, Falin Liu
In this letter, two basis function multiplexing-based behavioral modeling methods for digital predistortion (DPD) of RF power amplifiers (PAs) are proposed to reduce the running complexity of DPD. The proposed full basis-propagating selection (FBPS) model and reduced-complexity FBPS (RC-FBPS) model give two reasonable ways to multiplex even-order basis functions, extending the basis-propagating selection (BAPS) model which only uses basis function delay and odd-order basis functions. The experimental results confirm that both the proposed FBPS and RC-FBPS models can achieve a good tradeoff between running complexity and performance.
本文提出了两种基于基函数复用的射频功率放大器数字预失真行为建模方法,以降低数字预失真的运行复杂度。所提出的全基传播选择(FBPS)模型和降复杂度FBPS(RC-FBPS)给出了两种合理的偶阶基函数复用方法,扩展了只使用基函数延迟和奇阶基函数的基传播选择模型。实验结果证实,所提出的FBPS和RC-FBPS模型都可以在运行复杂性和性能之间实现良好的折衷。
{"title":"A Low Running Complexity Model for Digital Predistortion of RF Power Amplifiers","authors":"Renlong Han, W. Qiao, Chengye Jiang, Lei Su, Guichen Yang, Jing-tao Tan, Falin Liu","doi":"10.1109/LMWC.2022.3181204","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3181204","url":null,"abstract":"In this letter, two basis function multiplexing-based behavioral modeling methods for digital predistortion (DPD) of RF power amplifiers (PAs) are proposed to reduce the running complexity of DPD. The proposed full basis-propagating selection (FBPS) model and reduced-complexity FBPS (RC-FBPS) model give two reasonable ways to multiplex even-order basis functions, extending the basis-propagating selection (BAPS) model which only uses basis function delay and odd-order basis functions. The experimental results confirm that both the proposed FBPS and RC-FBPS models can achieve a good tradeoff between running complexity and performance.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42534532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A 120–140-GHz LNA in 250-nm InP HBT 250nm InP HBT中的120 - 140 ghz LNA
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3189607
Vikas Chauhan, N. Collaert, P. Wambacq
This letter presents a $D$ -band low-noise amplifier (LNA) in 250-nm InP HBT technology for the next-generation wireless applications. The LNA has a measured peak gain of 13 dB, a 3-dB bandwidth greater than 20 GHz (120–140 GHz), and a measured noise figure (NF) of less than 6 dB in the band. A reduction in the 3-dB bandwidth from simulation was observed during the measurements which was attributed to the substrate waves using full chip electromagnetic (EM) simulation. EM simulations show that a partial or complete removal of the back side metallization of the InP substrate, holes in metal-1 ground plane, or a strategic placement of through-substrate vias suppress these substrate waves. To the authors’ knowledge, this is the first 120–140-GHz LNA in the InP 250-nm HBT technology.
本文介绍了一种用于下一代无线应用的250纳米InP HBT技术的D波段低噪声放大器(LNA)。LNA的实测峰值增益为13db, 3db带宽大于20ghz (120 ~ 140ghz),该频段的实测噪声系数小于6db。在使用全芯片电磁(EM)模拟的测量过程中,观察到模拟中3db带宽的减少,这归因于衬底波。EM模拟表明,部分或完全去除InP衬底的背面金属化,金属-1接平面上的孔,或策略性地放置穿过衬底的通孔,都可以抑制这些衬底波。据作者所知,这是InP 250nm HBT技术中的第一个120 - 140 ghz LNA。
{"title":"A 120–140-GHz LNA in 250-nm InP HBT","authors":"Vikas Chauhan, N. Collaert, P. Wambacq","doi":"10.1109/LMWC.2022.3189607","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3189607","url":null,"abstract":"This letter presents a $D$ -band low-noise amplifier (LNA) in 250-nm InP HBT technology for the next-generation wireless applications. The LNA has a measured peak gain of 13 dB, a 3-dB bandwidth greater than 20 GHz (120–140 GHz), and a measured noise figure (NF) of less than 6 dB in the band. A reduction in the 3-dB bandwidth from simulation was observed during the measurements which was attributed to the substrate waves using full chip electromagnetic (EM) simulation. EM simulations show that a partial or complete removal of the back side metallization of the InP substrate, holes in metal-1 ground plane, or a strategic placement of through-substrate vias suppress these substrate waves. To the authors’ knowledge, this is the first 120–140-GHz LNA in the InP 250-nm HBT technology.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42561492","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A Cryo-CMOS Low-Noise Amplifier With 2.3-to-8.5-K Noise Temperature at 20 K for Highly Integrated Radio-Astronomy Receivers 一个低温cmos低噪声放大器2.3至8.5 K噪声温度在20 K高集成射电天文接收机
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3178579
A. Sheldon, L. Belostotski
This letter presents a 0.9–1.8-GHz cryo-CMOS low-noise amplifier (LNA) built-in standard 65-nm CMOS for highly integrated radio astronomy receivers. The measured cryogenic noise parameters confirm noise matching in the band and demonstrate that the LNA nears its minimum noise temperature at the desired frequency range. The proposed LNA operates at 20 K, consumes 115 mW of power, and provides a 37.2 ± 2.4 dB gain ( $S_{21}$ ) with a noise temperature (figure) of 2.3 to 8.5 K (0.03 to 0.13 dB) and $| S_{11}| < -10$ dB.
这封信介绍了一种0.9–1.8-GHz低温CMOS低噪声放大器(LNA),内置标准65 nm CMOS,用于高度集成的射电天文接收器。测量的低温噪声参数证实了频带中的噪声匹配,并证明LNA在期望的频率范围接近其最小噪声温度。所提出的LNA在20K下工作,消耗115mW的功率,并提供37.2±2.4dB的增益($S_{21}$),噪声温度(图)为2.3至8.5K(0.03至0.13dB),$|S_{11}|<-10$dB。
{"title":"A Cryo-CMOS Low-Noise Amplifier With 2.3-to-8.5-K Noise Temperature at 20 K for Highly Integrated Radio-Astronomy Receivers","authors":"A. Sheldon, L. Belostotski","doi":"10.1109/LMWC.2022.3178579","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3178579","url":null,"abstract":"This letter presents a 0.9–1.8-GHz cryo-CMOS low-noise amplifier (LNA) built-in standard 65-nm CMOS for highly integrated radio astronomy receivers. The measured cryogenic noise parameters confirm noise matching in the band and demonstrate that the LNA nears its minimum noise temperature at the desired frequency range. The proposed LNA operates at 20 K, consumes 115 mW of power, and provides a 37.2 ± 2.4 dB gain (<inline-formula> <tex-math notation=\"LaTeX\">$S_{21}$ </tex-math></inline-formula>) with a noise temperature (figure) of 2.3 to 8.5 K (0.03 to 0.13 dB) and <inline-formula> <tex-math notation=\"LaTeX\">$| S_{11}| < -10$ </tex-math></inline-formula> dB.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42646818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Behavioral Model With Multiple States Based on Deep Neural Network for Power Amplifiers 基于深度神经网络的功率放大器多状态行为模型
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3186062
Xin Hu, Shubin Xie, Xin Ji, Xuming Chang, Yi Qiu, Bo Li, Zhijun Liu, Weidong Wang
Digital predistortion is widely used to compensate the nonlinear distortion of power amplifiers (PAs). Among the digital predistortion methods, the polynomial or deep neural networks (DNNs) models are only adopted with one specific state. When the operating conditions of PAs change, it is necessary to retrain and update the coefficients of the PA model. The generalization ability of the DNN models cannot be presented. To address this issue, this letter proposes one new modeling method that can build one generalized PA model with multiple states based on DNN. This method embeds a set of coding vectors representing corresponding states to build the generalized model. Compared with the traditional DNN model, experimental results show that the proposed method can construct the PA model containing multiple states while ensuring good modeling performance.
数字预失真被广泛用于补偿功率放大器的非线性失真。在数字预失真方法中,多项式或深度神经网络(DNN)模型只适用于一种特定状态。当PA的运行条件发生变化时,有必要重新训练和更新PA模型的系数。DNN模型的泛化能力无法呈现。为了解决这个问题,本文提出了一种新的建模方法,可以基于DNN建立一个具有多个状态的广义PA模型。该方法嵌入一组表示相应状态的编码向量来建立广义模型。与传统的DNN模型相比,实验结果表明,该方法可以在保证良好建模性能的同时,构建包含多个状态的PA模型。
{"title":"Behavioral Model With Multiple States Based on Deep Neural Network for Power Amplifiers","authors":"Xin Hu, Shubin Xie, Xin Ji, Xuming Chang, Yi Qiu, Bo Li, Zhijun Liu, Weidong Wang","doi":"10.1109/LMWC.2022.3186062","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3186062","url":null,"abstract":"Digital predistortion is widely used to compensate the nonlinear distortion of power amplifiers (PAs). Among the digital predistortion methods, the polynomial or deep neural networks (DNNs) models are only adopted with one specific state. When the operating conditions of PAs change, it is necessary to retrain and update the coefficients of the PA model. The generalization ability of the DNN models cannot be presented. To address this issue, this letter proposes one new modeling method that can build one generalized PA model with multiple states based on DNN. This method embeds a set of coding vectors representing corresponding states to build the generalized model. Compared with the traditional DNN model, experimental results show that the proposed method can construct the PA model containing multiple states while ensuring good modeling performance.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48827000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Contactless Air-Filled Mode Selective Transmission Line 非接触充气式选择性输电线路
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3179872
Xiao-he Cheng, Tingting Xie, Yuan Yao, Yaohui Yang, Ting Zhang, Junsheng Yu, Xiao-dong Chen
An air-filled mode selective transmission line (AF-MSTL) consisting of an opened groove gap waveguide (GWG) and an inverted coplanar waveguide (CPW) is proposed in this letter. By using the electromagnetic band gap (EBG) structure, the electrical contacts of AF-MSTL are not required during the assembly process. To verify the design, the AF-MSTL prototype, connected to two designed grounded-CPW (GCPW) to AF-MSTL transitions to build a back-to-back structure, has been fabricated and measured. A measured insertion loss of 0.2857 dB/mm at 110 GHz is achieved, which is lower than the dielectric filled (DF) MSTL of 0.5012 dB/mm at 110 GHz.
本文提出了一种由开口槽隙波导(GWG)和倒置共面波导(CPW)组成的充气模式选择传输线(AF-MSTL)。通过使用电磁带隙(EBG)结构,在组装过程中不需要AF-MSTL的电接触。为了验证设计,已经制造并测量了AF-MSTL原型,该原型连接到两个设计的接地CPW(GCPW)到AF-MSTL的过渡,以构建背靠背结构。在110 GHz时,测得的插入损耗为0.2857 dB/mm,低于110 GHz时0.5012 dB/mm的介质填充(DF)MSTL。
{"title":"Contactless Air-Filled Mode Selective Transmission Line","authors":"Xiao-he Cheng, Tingting Xie, Yuan Yao, Yaohui Yang, Ting Zhang, Junsheng Yu, Xiao-dong Chen","doi":"10.1109/LMWC.2022.3179872","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3179872","url":null,"abstract":"An air-filled mode selective transmission line (AF-MSTL) consisting of an opened groove gap waveguide (GWG) and an inverted coplanar waveguide (CPW) is proposed in this letter. By using the electromagnetic band gap (EBG) structure, the electrical contacts of AF-MSTL are not required during the assembly process. To verify the design, the AF-MSTL prototype, connected to two designed grounded-CPW (GCPW) to AF-MSTL transitions to build a back-to-back structure, has been fabricated and measured. A measured insertion loss of 0.2857 dB/mm at 110 GHz is achieved, which is lower than the dielectric filled (DF) MSTL of 0.5012 dB/mm at 110 GHz.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43069402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
220–320-GHz J-Band 4-Way Power Amplifier in Advanced 130-nm BiCMOS Technology 基于先进130纳米BiCMOS技术的220 - 320 ghz j波段4路功率放大器
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3181407
Eissa Mohamed, G. Fischer, Thomas Mausolf, H. Rücker, A. Malignaggi, G. Kahmen
A power combined wideband power amplifier (PA) covering the $J$ -band (220–320 GHz) is presented in 130-nm BiCMOS technology. The input power is split by two cascaded 1-to-2 power splitters with amplification stages in-between. The four split signals drive four output stages, which have their outputs combined within a 4-way zero-degree combiner. The splitting and combining networks also incorporate impedance matching. After de-embedding the I/O pads and baluns of 2 dB loss at each side, the PA achieves a gain of 20 dB at the middle of the band and a minimum gain of 17 dB at 320 GHz with I/O return losses below −5 dB. The PA records a saturated output power ranging from 9.5 to 14.5 dBm across the $J$ -band. It consumes 710 mW from a 3 V supply which corresponds to a drain efficiency ( $eta _{d}$ ) of 3.15% at 270 GHz. The presented PA achieves twice better bandwidth with 1.5 times better $eta _{d}$ than the state-of-the-art silicon-based amplifiers above 200 GHz. To the authors’ knowledge, this is the first PA covering the whole $J$ -band in silicon technologies.
提出了一种基于130纳米BiCMOS技术的J波段(220 ~ 320 GHz)功率组合宽带功率放大器(PA)。输入功率由两个级联的1对2功率分配器分割,中间有放大级。四个分裂信号驱动四个输出级,它们的输出组合在一个4路零度组合器内。拆分和合并网络还包含阻抗匹配。在去嵌入每侧损耗为2db的I/O垫和平衡后,PA在频带中部获得20db增益,在320ghz时获得最小17db增益,I/O回波损耗低于- 5db。PA记录的饱和输出功率范围为9.5至14.5 dBm,横跨J波段。它从3v电源消耗710 mW,对应于270 GHz的漏极效率($eta _{d}$)为3.15%。与目前最先进的200 GHz以上的硅基放大器相比,该放大器实现了两倍的带宽和1.5倍的性能。据作者所知,这是第一个涵盖硅技术整个J$ $波段的PA。
{"title":"220–320-GHz J-Band 4-Way Power Amplifier in Advanced 130-nm BiCMOS Technology","authors":"Eissa Mohamed, G. Fischer, Thomas Mausolf, H. Rücker, A. Malignaggi, G. Kahmen","doi":"10.1109/LMWC.2022.3181407","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3181407","url":null,"abstract":"A power combined wideband power amplifier (PA) covering the <inline-formula> <tex-math notation=\"LaTeX\">$J$ </tex-math></inline-formula>-band (220–320 GHz) is presented in 130-nm BiCMOS technology. The input power is split by two cascaded 1-to-2 power splitters with amplification stages in-between. The four split signals drive four output stages, which have their outputs combined within a 4-way zero-degree combiner. The splitting and combining networks also incorporate impedance matching. After de-embedding the I/O pads and baluns of 2 dB loss at each side, the PA achieves a gain of 20 dB at the middle of the band and a minimum gain of 17 dB at 320 GHz with I/O return losses below −5 dB. The PA records a saturated output power ranging from 9.5 to 14.5 dBm across the <inline-formula> <tex-math notation=\"LaTeX\">$J$ </tex-math></inline-formula>-band. It consumes 710 mW from a 3 V supply which corresponds to a drain efficiency (<inline-formula> <tex-math notation=\"LaTeX\">$eta _{d}$ </tex-math></inline-formula>) of 3.15% at 270 GHz. The presented PA achieves twice better bandwidth with 1.5 times better <inline-formula> <tex-math notation=\"LaTeX\">$eta _{d}$ </tex-math></inline-formula> than the state-of-the-art silicon-based amplifiers above 200 GHz. To the authors’ knowledge, this is the first PA covering the whole <inline-formula> <tex-math notation=\"LaTeX\">$J$ </tex-math></inline-formula>-band in silicon technologies.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45840837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Efficient and Compact Tri-Band Rectifier With Large Frequency Ratio for WPT 用于WPT的高效紧凑的大频率比三频整流器
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3182059
Zhen Yue, Xin Xu, Shun Li, Yu Zhu, X. Lin
In this letter, an efficient and compact tri-band rectifier with large frequency ratio is proposed, which adopts a novel low-cost direct current (dc)-pass filter structure in the design. Three large frequency ratio rectifiers are combined together by using diode arrays with a frequency-selective topology without additional impedance matching networks. The dc-pass filter is composed of microstrip line structures cascaded low-cost lumped components, which can effectively suppress the high-order harmonics at high- and low-frequency points while reducing the circuit size and costs of large frequency ratio. For validation, the proposed rectifier working at 0.915, 2.45, and 5.8 GHz is fabricated with the dimensions of 29.5 mm $times21.3$ mm. The measured results show that the RF-dc power conversion efficiency (PCE) reaches 72.6%, 71.8%, and 73.5% at 0.915, 2.45, and 5.8 GHz, respectively, when the input power is 19 dBm. Compared with traditional multiband rectifiers, the proposed topology exhibits merits of compact size, high efficiency, and large frequency ratio.
本文提出了一种高效紧凑的大频率比三带整流器,该整流器在设计中采用了一种新颖的低成本直流通滤波器结构。三个大频率比整流器通过使用具有频率选择拓扑的二极管阵列组合在一起,而不需要额外的阻抗匹配网络。该直流通滤波器由微带线结构级联低成本集总元件组成,可以有效抑制高、低频点的高次谐波,同时减小了大频率比的电路尺寸和成本。为验证所提出的整流器工作频率为0.915、2.45和5.8 GHz,尺寸为29.5 mm × 21.3 mm。测量结果表明,当输入功率为19 dBm时,在0.915、2.45和5.8 GHz时,RF-dc功率转换效率(PCE)分别达到72.6%、71.8%和73.5%。与传统的多带整流器相比,该拓扑结构具有体积小、效率高、频率比大等优点。
{"title":"Efficient and Compact Tri-Band Rectifier With Large Frequency Ratio for WPT","authors":"Zhen Yue, Xin Xu, Shun Li, Yu Zhu, X. Lin","doi":"10.1109/LMWC.2022.3182059","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3182059","url":null,"abstract":"In this letter, an efficient and compact tri-band rectifier with large frequency ratio is proposed, which adopts a novel low-cost direct current (dc)-pass filter structure in the design. Three large frequency ratio rectifiers are combined together by using diode arrays with a frequency-selective topology without additional impedance matching networks. The dc-pass filter is composed of microstrip line structures cascaded low-cost lumped components, which can effectively suppress the high-order harmonics at high- and low-frequency points while reducing the circuit size and costs of large frequency ratio. For validation, the proposed rectifier working at 0.915, 2.45, and 5.8 GHz is fabricated with the dimensions of 29.5 mm $times21.3$ mm. The measured results show that the RF-dc power conversion efficiency (PCE) reaches 72.6%, 71.8%, and 73.5% at 0.915, 2.45, and 5.8 GHz, respectively, when the input power is 19 dBm. Compared with traditional multiband rectifiers, the proposed topology exhibits merits of compact size, high efficiency, and large frequency ratio.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48662311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A 19.1–25.5-GHz Compact Dual-Mode Rotary Traveling-Wave Oscillator With 195.4-dBc/Hz FoM 19.1 - 25.5 ghz紧凑型双模旋转行波振荡器,195.4 dbc /Hz FoM
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3183446
Hongkun Li, Yiyang Shu, Changting Pi, Xun Luo
In this letter, a dual-mode rotary traveling-wave oscillator (RTWO) is proposed to achieve wide operation bandwidth and multiple phases. Two twisted differential transmission lines are coupled together to form the dual-mode traveling-wave resonator. Sixteen pairs of back-to-back inverters and capacitors are connected to the resonators to introduce the multicore multi-phase operation. The mode switches are used to control the coupling direction and select the desired mode without degrading the quality factor. Verified in a 40-nm CMOS process, the proposed dual-mode RTWO exhibits a dual-mode frequency range from 19.1 to 25.5 GHz with the core size of 0.08 mm $^{textbf {2}}$ . The measured 10-MHz phase noise at 25.30 and 22.12 GHz is −129.6 and −131.5 dBc/Hz, respectively. The best FoM and FoMT are 186.2 and 195.4 dBc/Hz, respectively.
在这封信中,提出了一种双模旋转行波振荡器(RTWO),以实现宽工作带宽和多相。将双绞线差分传输线耦合在一起,形成双模行波谐振器。16对背靠背逆变器和电容器连接到谐振器上,以引入多核多相操作。模式开关用于控制耦合方向和选择所需的模式,而不降低质量因子。经40纳米CMOS工艺验证,所提出的双模RTWO具有19.1 ~ 25.5 GHz的双模频率范围,核心尺寸为0.08 mm。在25.30 GHz和22.12 GHz频段测得的10 mhz相位噪声分别为- 129.6和- 131.5 dBc/Hz。最佳FoM和FoM分别为186.2和195.4 dBc/Hz。
{"title":"A 19.1–25.5-GHz Compact Dual-Mode Rotary Traveling-Wave Oscillator With 195.4-dBc/Hz FoM","authors":"Hongkun Li, Yiyang Shu, Changting Pi, Xun Luo","doi":"10.1109/LMWC.2022.3183446","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3183446","url":null,"abstract":"In this letter, a dual-mode rotary traveling-wave oscillator (RTWO) is proposed to achieve wide operation bandwidth and multiple phases. Two twisted differential transmission lines are coupled together to form the dual-mode traveling-wave resonator. Sixteen pairs of back-to-back inverters and capacitors are connected to the resonators to introduce the multicore multi-phase operation. The mode switches are used to control the coupling direction and select the desired mode without degrading the quality factor. Verified in a 40-nm CMOS process, the proposed dual-mode RTWO exhibits a dual-mode frequency range from 19.1 to 25.5 GHz with the core size of 0.08 mm $^{textbf {2}}$ . The measured 10-MHz phase noise at 25.30 and 22.12 GHz is −129.6 and −131.5 dBc/Hz, respectively. The best FoM and FoMT are 186.2 and 195.4 dBc/Hz, respectively.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43289221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging 基于等效电路的电子封装中双键带互连变化的耦合建模
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3181058
Jun Tian, Yucheng Teng, Ruining Li, Yijiang Zhou, Daxing Zhang, S. Liu, Song Xue, Kabin Lin, Meng Wang, G. Leng, Congsi Wang
A method for modeling the interconnection and signal transmission performance of double bond ribbons with configuration variation has been proposed. Arc interval function parameterization has been used to define the geometry of bond ribbons. The coupling model was created using the equivalent circuit approach, taking into account the mutual coupling between two ribbons. The average relative error of return loss is 9.21%, and the average relative error of insertion loss is 0.23%. The accuracy of the model has been verified, and the envelope interval of the signal transmission performance considering the variation of the interconnection configuration has been calculated.
提出了一种在组态变化的情况下模拟双键带互连和信号传输性能的方法。弧间隔函数参数化已用于定义粘结带的几何结构。耦合模型是使用等效电路方法创建的,考虑了两条带之间的相互耦合。回波损耗的平均相对误差为9.21%,插入损耗的平均相关误差为0.23%。验证了模型的准确性,并计算了考虑互连配置变化的信号传输性能的包络区间。
{"title":"Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging","authors":"Jun Tian, Yucheng Teng, Ruining Li, Yijiang Zhou, Daxing Zhang, S. Liu, Song Xue, Kabin Lin, Meng Wang, G. Leng, Congsi Wang","doi":"10.1109/LMWC.2022.3181058","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3181058","url":null,"abstract":"A method for modeling the interconnection and signal transmission performance of double bond ribbons with configuration variation has been proposed. Arc interval function parameterization has been used to define the geometry of bond ribbons. The coupling model was created using the equivalent circuit approach, taking into account the mutual coupling between two ribbons. The average relative error of return loss is 9.21%, and the average relative error of insertion loss is 0.23%. The accuracy of the model has been verified, and the envelope interval of the signal transmission performance considering the variation of the interconnection configuration has been calculated.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45311360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A -Band Power Amplifier With Four-Way Combining in 0.13-μm SiGe 0.13-μm硅锗四路组合的A波段功率放大器
IF 3 2区 工程技术 Q2 Engineering Pub Date : 2022-11-01 DOI: 10.1109/LMWC.2022.3178933
Ibrahim Kagan Aksoyak, Matthias Möck, M. Kaynak, A. Ulusoy
This letter presents a four-way power combined $D$ -band power amplifier (PA) in 0.13- $mu text{m}$ SiGe technology. The conventional cascode topology is modified by adding an additional interstage network between the common-emitter (CE) and common-base (CB) devices. Further techniques, such as power combining and adaptive bias circuits, are implemented to boost the power generation and the efficiency of the amplifier. The realized PA exhibits a saturated output power of 19.6 dBm with a maximum power-added-efficiency (PAE) of 9.5% at 130 GHz, which is a leading-edge performance among the reported silicon (Si) $D$ -band PAs in similar technologies. The small-signal gain peaks at 16 dB and the PA has a 3-dB bandwidth of 18 GHz.
本文介绍了一种采用0.13- $mu text{m}$ SiGe技术的四路功率组合$D$波段功率放大器(PA)。通过在共发射极(CE)和共基极(CB)器件之间增加一个额外的级间网络,改进了传统的级联编码拓扑结构。进一步的技术,如功率组合和自适应偏置电路,被实现以提高功率产生和放大器的效率。所实现的放大器在130 GHz时的饱和输出功率为19.6 dBm,最大功率增加效率(PAE)为9.5%,在同类技术中已报道的硅(Si) D波段放大器中具有领先的性能。小信号增益峰值为16db,扩音器的3db带宽为18ghz。
{"title":"A -Band Power Amplifier With Four-Way Combining in 0.13-μm SiGe","authors":"Ibrahim Kagan Aksoyak, Matthias Möck, M. Kaynak, A. Ulusoy","doi":"10.1109/LMWC.2022.3178933","DOIUrl":"https://doi.org/10.1109/LMWC.2022.3178933","url":null,"abstract":"This letter presents a four-way power combined <inline-formula> <tex-math notation=\"LaTeX\">$D$ </tex-math></inline-formula>-band power amplifier (PA) in 0.13-<inline-formula> <tex-math notation=\"LaTeX\">$mu text{m}$ </tex-math></inline-formula> SiGe technology. The conventional cascode topology is modified by adding an additional interstage network between the common-emitter (CE) and common-base (CB) devices. Further techniques, such as power combining and adaptive bias circuits, are implemented to boost the power generation and the efficiency of the amplifier. The realized PA exhibits a saturated output power of 19.6 dBm with a maximum power-added-efficiency (PAE) of 9.5% at 130 GHz, which is a leading-edge performance among the reported silicon (Si) <inline-formula> <tex-math notation=\"LaTeX\">$D$ </tex-math></inline-formula>-band PAs in similar technologies. The small-signal gain peaks at 16 dB and the PA has a 3-dB bandwidth of 18 GHz.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":null,"pages":null},"PeriodicalIF":3.0,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46827480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
IEEE Microwave and Wireless Components Letters
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1