In this paper, the method I is compared with the method II. The method I is developed in the 1st report to control surface orientation by using two measuring lines perpendicular to each other and the method II by two parallel measuring lines. The results are as follows . (1)The measuring length for control data in the method I increases for anisotropic rough surface under the condition that the angle between measuring direction and lay orientation of asperities is less than 15•K . (2)The measuring length for control data in the method II decreases as the coefficient k2 depending on a stylus speed decreases. (3)Both of the measuring length and the objective function showing measuring time in the method II are shorter than those in the method I for isotropic and anisotropic rough surfaces . Finally, the method II is better technique than the method I .
{"title":"Correction of specimen orientation in three-dimensional measurement of surface roughness with small waviness by contact stylus instrument (2nd report) : simulation and experimental verification","authors":"N. Cho, T. Tsukada, M. Takahashi","doi":"10.2493/JJSPE.60.549","DOIUrl":"https://doi.org/10.2493/JJSPE.60.549","url":null,"abstract":"In this paper, the method I is compared with the method II. The method I is developed in the 1st report to control surface orientation by using two measuring lines perpendicular to each other and the method II by two parallel measuring lines. The results are as follows . (1)The measuring length for control data in the method I increases for anisotropic rough surface under the condition that the angle between measuring direction and lay orientation of asperities is less than 15•K . (2)The measuring length for control data in the method II decreases as the coefficient k2 depending on a stylus speed decreases. (3)Both of the measuring length and the objective function showing measuring time in the method II are shorter than those in the method I for isotropic and anisotropic rough surfaces . Finally, the method II is better technique than the method I .","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"4 1","pages":"253-258"},"PeriodicalIF":0.0,"publicationDate":"1994-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90049486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Micro-cracks were mechanically induced in the CVD coating layers on a cemented carbide tool . With decreasing mean value of distance between cracks from 200 ƒÊm to 20 ƒÊm, tensile residual stress in the coating decreased from 0.55 GPa to 0.05 GPa, the initiation time of thermal fatigue cracks in face milling became longer, and the chipping resistance in interrupted cutting tripled. It seems that the improvement of tool performance is closely related to the relief of tensile residual stress in the coating.
{"title":"Effect of Micro-cracks in Layer on Performance of CVD Coating Carbide Cutting Tool.","authors":"S. Katayama, Masayuki Hashimura","doi":"10.2493/JJSPE.60.124","DOIUrl":"https://doi.org/10.2493/JJSPE.60.124","url":null,"abstract":"Micro-cracks were mechanically induced in the CVD coating layers on a cemented carbide tool . With decreasing mean value of distance between cracks from 200 ƒÊm to 20 ƒÊm, tensile residual stress in the coating decreased from 0.55 GPa to 0.05 GPa, the initiation time of thermal fatigue cracks in face milling became longer, and the chipping resistance in interrupted cutting tripled. It seems that the improvement of tool performance is closely related to the relief of tensile residual stress in the coating.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"21 1","pages":"124-127"},"PeriodicalIF":0.0,"publicationDate":"1994-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77788694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents the new technique to measure the surface roughness profiles correcting an orientation of specimen surface in one operation. The contact stylus profilometer is equipped with the table whose inclination is controlled by the computer. The positioning of the stylus tip in the vertical direction is corrected at the same time. For assuring to measure profiles in length of 5.6mm, the surface profile data for control is demanded to be obtained in the length of 1mm. This measuring length varies depending on form errors such as the waviness. Then this paper gives the new technique to correspond the above-mentioned problem.
{"title":"Measurement of surface roughness with small waviness by contact stylus instrument correcting specimen orientation","authors":"N. Cho, T. Tsukada, Masaaki Takahashi","doi":"10.2493/JJSPE.59.1871","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1871","url":null,"abstract":"This paper presents the new technique to measure the surface roughness profiles correcting an orientation of specimen surface in one operation. The contact stylus profilometer is equipped with the table whose inclination is controlled by the computer. The positioning of the stylus tip in the vertical direction is corrected at the same time. For assuring to measure profiles in length of 5.6mm, the surface profile data for control is demanded to be obtained in the length of 1mm. This measuring length varies depending on form errors such as the waviness. Then this paper gives the new technique to correspond the above-mentioned problem.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"148 1","pages":"74-79"},"PeriodicalIF":0.0,"publicationDate":"1993-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77341215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Higashiki, T. Tojo, M. Tabata, T. Nishizaka, H. Yoshino, S. Saito
This paper describes studies on the alignment error budgets caused by a TTL (through the lens) alignment optical system (SMART : separated mark TTL alignment) for an excimer laser aligner. Alignment error factors, such as the optical phase fluctuation of the alignment beam, the inclination variation of the alignment incident beam, the tilt of the wafer and the reticle, and the defocus of the reticle, have been analyzed and estimated. It was demonstrated that the total error of the alignment optical system was required to be better than 0.02 μm in order to satisfy the positioning strategy of the excimer laser aligner with a 0.05 μm (3σ) overlay accuracy. Several compensation methods have been developed and adopted to SMART. As a result, it was obtained experimentally that the total error of the alignment optical system became better than 0.02 μm. It has met the development goal. The new SMART optical system which was adopted to the KrF excimer laser aligner showed an excellent performance with a better than 0.05 μm (3σ) overlay accuracy.
{"title":"The Estimation and Improvement of TTL Alignment Error Budgets for an Excimer Laser Aligner.","authors":"T. Higashiki, T. Tojo, M. Tabata, T. Nishizaka, H. Yoshino, S. Saito","doi":"10.2493/jjspe.59.1331","DOIUrl":"https://doi.org/10.2493/jjspe.59.1331","url":null,"abstract":"This paper describes studies on the alignment error budgets caused by a TTL (through the lens) alignment optical system (SMART : separated mark TTL alignment) for an excimer laser aligner. Alignment error factors, such as the optical phase fluctuation of the alignment beam, the inclination variation of the alignment incident beam, the tilt of the wafer and the reticle, and the defocus of the reticle, have been analyzed and estimated. It was demonstrated that the total error of the alignment optical system was required to be better than 0.02 μm in order to satisfy the positioning strategy of the excimer laser aligner with a 0.05 μm (3σ) overlay accuracy. Several compensation methods have been developed and adopted to SMART. As a result, it was obtained experimentally that the total error of the alignment optical system became better than 0.02 μm. It has met the development goal. The new SMART optical system which was adopted to the KrF excimer laser aligner showed an excellent performance with a better than 0.05 μm (3σ) overlay accuracy.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"5 1","pages":"1331-1336"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73245109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents the fundamentals for eliminating overshoot and vibration produced by dynamic loading, especially impact force in material tests. Overshoot and vibration are usually eliminated from original values with dampers and filters, since they prevent determination of true loading values. The fundamentals make it possible to determine values for eliminating undesirable phenomena.Three model sensors based on the above fundamentals were made to confirm effectiveness. From experimental results, the validity of the fundamentals as a load sensor for eliminating the overshoot and vibration was confirmed practically.
{"title":"Study on Vibration-Free Load Sensor -Fundamental Principle-","authors":"A. Tanifuji","doi":"10.2493/JJSPE.59.89","DOIUrl":"https://doi.org/10.2493/JJSPE.59.89","url":null,"abstract":"This paper presents the fundamentals for eliminating overshoot and vibration produced by dynamic loading, especially impact force in material tests. Overshoot and vibration are usually eliminated from original values with dampers and filters, since they prevent determination of true loading values. The fundamentals make it possible to determine values for eliminating undesirable phenomena.Three model sensors based on the above fundamentals were made to confirm effectiveness. From experimental results, the validity of the fundamentals as a load sensor for eliminating the overshoot and vibration was confirmed practically.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"22 1","pages":"68-73"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74217241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper discusses about critical exposure value for the three dimensional photofabrication. Critical exposure is one of the important parameters for photopolymers to explain solidified depth in a conventional model. In this paper, critical exposures of several photopolymers are measured and the results show that the critical exposure is not constant value contrary to the conventional model but the laser power and scan speed have non-linear relationship. The fact that critical exposure is not constant value affected by exposure condition makes it difficult to compare between experiments under conventional model. This paper also discusses the reason of this non-linear experimental results with the consideration of the extent of reaction of photopolymers.
{"title":"Shape Analysis of Solidified Photopolymer for the Three Dimensional Photofabrication -Measurement of Critical Exposure-","authors":"H. Narahara, Katsumasa Saito","doi":"10.2493/JJSPE.59.1477","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1477","url":null,"abstract":"This paper discusses about critical exposure value for the three dimensional photofabrication. Critical exposure is one of the important parameters for photopolymers to explain solidified depth in a conventional model. In this paper, critical exposures of several photopolymers are measured and the results show that the critical exposure is not constant value contrary to the conventional model but the laser power and scan speed have non-linear relationship. The fact that critical exposure is not constant value affected by exposure condition makes it difficult to compare between experiments under conventional model. This paper also discusses the reason of this non-linear experimental results with the consideration of the extent of reaction of photopolymers.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"111 1","pages":"311-316"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79022726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electron theory based on quantum mechanics in future precision engineering","authors":"Y. Mori","doi":"10.2493/jjspe.59.869","DOIUrl":"https://doi.org/10.2493/jjspe.59.869","url":null,"abstract":"","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"1 1","pages":"311-314"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83014550","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents the development of an LED with an Fresnel lens to be used in an optical sensor. In a conventional LED a lens and an element are separated, and so must be aligned. Using an LED with a Fresnel lens, both parts are combined so alignment is not necessary. The Fresnel lens was developed because of its thin structure and good optical characteristics. Conventionally, the Fresnel lens has been fabricated by means of electron beam lithography, but it was very time consuming. To solve this problem and fabricate an LED with a Fresnel lens, a diamond turning machine was developed. This machine is used to fabricate molds for Fresnel lenses. By using these molds and inserting LED chips during the injection molding process, an LED with a Fresnel lens can be fabricated. Compared to a conventional LED with a spherical lens, the thickness of the LED is reduced by 70%, and its volume by 50%. Also the LED with a Fresnel lens emits three times as much light as a conventional LED. It is expected that when this LED is used in an optical sensor, its reduced thickness and good optical characteristics will result in a thinner sensor with improved sensitivity.
{"title":"Development of an LED with a Fresnel lens","authors":"Yuji Yamazaki, Kazuhito Nakamura, H. Hashimoto","doi":"10.2493/jjspe.59.655","DOIUrl":"https://doi.org/10.2493/jjspe.59.655","url":null,"abstract":"This paper presents the development of an LED with an Fresnel lens to be used in an optical sensor. In a conventional LED a lens and an element are separated, and so must be aligned. Using an LED with a Fresnel lens, both parts are combined so alignment is not necessary. The Fresnel lens was developed because of its thin structure and good optical characteristics. Conventionally, the Fresnel lens has been fabricated by means of electron beam lithography, but it was very time consuming. To solve this problem and fabricate an LED with a Fresnel lens, a diamond turning machine was developed. This machine is used to fabricate molds for Fresnel lenses. By using these molds and inserting LED chips during the injection molding process, an LED with a Fresnel lens can be fabricated. Compared to a conventional LED with a spherical lens, the thickness of the LED is reduced by 70%, and its volume by 50%. Also the LED with a Fresnel lens emits three times as much light as a conventional LED. It is expected that when this LED is used in an optical sensor, its reduced thickness and good optical characteristics will result in a thinner sensor with improved sensitivity.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"50 1","pages":"126-131"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82262991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Tool entry process in three dimensional cutting is simulated by finite element method. Since the chip forming process is one of large deformation problems, geometrical nonlinearity due to the change of shape is introduced into finite element formulation. Constant strain tetrahedra element is used and over-constraint of incompressibility on the deformation of the finite elements in plastic region is relaxed using Nagategaal-Rice functional to make the elements as deformable as real continuum. The chip formation from tool entry to steady state is realized in the analysis and stress and strain distributions in chip and machined surfaces are also obtained. Lower shear angle at side surface of the work, side flow and chip flow direction predicted are in good agreement with experimental results of cutting of plasticine.
{"title":"FEM analysis on three dimensional cutting: analysis on large deformation problem of tool entry","authors":"H. Sasahara, T. Obikawa, T. Shirakashi","doi":"10.2493/JJSPE.59.1275","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1275","url":null,"abstract":"Tool entry process in three dimensional cutting is simulated by finite element method. Since the chip forming process is one of large deformation problems, geometrical nonlinearity due to the change of shape is introduced into finite element formulation. Constant strain tetrahedra element is used and over-constraint of incompressibility on the deformation of the finite elements in plastic region is relaxed using Nagategaal-Rice functional to make the elements as deformable as real continuum. The chip formation from tool entry to steady state is realized in the analysis and stress and strain distributions in chip and machined surfaces are also obtained. Lower shear angle at side surface of the work, side flow and chip flow direction predicted are in good agreement with experimental results of cutting of plasticine.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"61 4 1","pages":"1275-1280"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86800942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Focused ion beam (FIB) milling is widely used for circuit repair, mask repair, and SEM sample prepair for cross-section observation. In the circuit repair application, it is important to achive a higher material selectivity of Al/SiO2, and a higher milling rate. In order to realize both of these, focused ion beam assisted etching (FIBAE), where a chlorine containing gas is injected towards the milling site, was performed. Using Cl2 gas only caused a significant side etch, though the etching rate of aluminum was quite high. When etching Al-Cu-Si alloy with a chlorine containing gas, a residue of Cu-Cl compound was formed. This can be decreased by heating the sample as high as 200°C. An etching selectivity (Al/SiO2) of 100 was achived, without side-etching, by a gas mixture of SiCl4 (95%) and Cl2 (5%).
{"title":"Focused Ion Beam Assisted Etching of Aluminum.","authors":"F. Itoh, Junzo Azuma, S. Haraichi, A. Shimase","doi":"10.2493/JJSPE.59.1531","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1531","url":null,"abstract":"Focused ion beam (FIB) milling is widely used for circuit repair, mask repair, and SEM sample prepair for cross-section observation. In the circuit repair application, it is important to achive a higher material selectivity of Al/SiO2, and a higher milling rate. In order to realize both of these, focused ion beam assisted etching (FIBAE), where a chlorine containing gas is injected towards the milling site, was performed. Using Cl2 gas only caused a significant side etch, though the etching rate of aluminum was quite high. When etching Al-Cu-Si alloy with a chlorine containing gas, a residue of Cu-Cl compound was formed. This can be decreased by heating the sample as high as 200°C. An etching selectivity (Al/SiO2) of 100 was achived, without side-etching, by a gas mixture of SiCl4 (95%) and Cl2 (5%).","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"22 1","pages":"211-216"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86506480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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