N. Kikuiri, J. Nishida, T. Nishizaka, O. Kuwabara, N. Uchida
This paper describes a mask-to-wafer fine gap setting method for an X-ray stepper. A capacitance micrometer on the wafer chuck and those on the mask chuck are used in this method. The mask and wafer surfaces are positioned parallel to the travel plane of the wafer x-y stage so that the gap does not vary with the step and repeat motion of the wafer stage. Therefore, gap setting is required only once for each wafer, and the throughput becomes better. This method has the following two additional merits. A complex gap measurement optics is not required and the setting value of the gap is variable. The gap setting error caused by mask unflatness, wafer unflatness and travel error of the wafer x-y stage was analyzed. Experiments were carried out using mask and wafer stages both with 6-axes. A gap setting accuracy better than •}1.5 pm at the exposure positions of 5 wafers has been achieved for 30 pm and 20 pm
{"title":"A mask-to-wafer fine gap setting method","authors":"N. Kikuiri, J. Nishida, T. Nishizaka, O. Kuwabara, N. Uchida","doi":"10.2493/JJSPE.59.2067","DOIUrl":"https://doi.org/10.2493/JJSPE.59.2067","url":null,"abstract":"This paper describes a mask-to-wafer fine gap setting method for an X-ray stepper. A capacitance micrometer on the wafer chuck and those on the mask chuck are used in this method. The mask and wafer surfaces are positioned parallel to the travel plane of the wafer x-y stage so that the gap does not vary with the step and repeat motion of the wafer stage. Therefore, gap setting is required only once for each wafer, and the throughput becomes better. This method has the following two additional merits. A complex gap measurement optics is not required and the setting value of the gap is variable. The gap setting error caused by mask unflatness, wafer unflatness and travel error of the wafer x-y stage was analyzed. Experiments were carried out using mask and wafer stages both with 6-axes. A gap setting accuracy better than •}1.5 pm at the exposure positions of 5 wafers has been achieved for 30 pm and 20 pm","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"69 1","pages":"56-61"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81355370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Akiyama, Masayoshi Serizawa, F. Mizuno, M. Ikota, K. Takami, Seigo Ema
An on-machine printing system for a spatial filter has been developed to detect small particles on the memory-mat of a 0.3 μm LSI. A minicopy film is used for the base of spatial filters. A pattern on the filter is printed by a thermal head using a ribbon painted with ink of synthetic resin. The maximum size of the printed spatial filter is 16 × 16 mm. The transmission factors of printed and transparent parts are 0.92% and 92% respectively. The printing time is 5 seconds. The signal obtained at memory-mat decreases to 4% using this spatial filter and 0.6 μm standard particles are detected at an SN ratio of 3.
{"title":"Development of on-machine printing system for spatial filter","authors":"N. Akiyama, Masayoshi Serizawa, F. Mizuno, M. Ikota, K. Takami, Seigo Ema","doi":"10.2493/JJSPE.59.1114","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1114","url":null,"abstract":"An on-machine printing system for a spatial filter has been developed to detect small particles on the memory-mat of a 0.3 μm LSI. A minicopy film is used for the base of spatial filters. A pattern on the filter is printed by a thermal head using a ribbon painted with ink of synthetic resin. The maximum size of the printed spatial filter is 16 × 16 mm. The transmission factors of printed and transparent parts are 0.92% and 92% respectively. The printing time is 5 seconds. The signal obtained at memory-mat decreases to 4% using this spatial filter and 0.6 μm standard particles are detected at an SN ratio of 3.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"10 1","pages":"1114-1120"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87234115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Higashiki, T. Tojo, M. Tabata, T. Nishizaka, H. Yoshino, S. Saito
This paper presents a real-time SMART (separated mark TTL alignment) technique for optical lithography systems. The new TTL alignment optical system corrects lateral chromatic aberration which has made impossible reticle-to-wafer real-time alignment (during exposure) at all mark positions. The optical method of correcting lateral chromatic aberration is described. This correcting method was applied to a KrF excimer laser optical lithography aligner to demonstrate the principle of this alignment method. The simulation results of alignment beam positions were similar to the experimental results. At each alignment mark
{"title":"TTL alignment for excimer laser aligner. Real-time SMART with correcting lateral chromatic aberration","authors":"T. Higashiki, T. Tojo, M. Tabata, T. Nishizaka, H. Yoshino, S. Saito","doi":"10.2493/jjspe.59.101","DOIUrl":"https://doi.org/10.2493/jjspe.59.101","url":null,"abstract":"This paper presents a real-time SMART (separated mark TTL alignment) technique for optical lithography systems. The new TTL alignment optical system corrects lateral chromatic aberration which has made impossible reticle-to-wafer real-time alignment (during exposure) at all mark positions. The optical method of correcting lateral chromatic aberration is described. This correcting method was applied to a KrF excimer laser optical lithography aligner to demonstrate the principle of this alignment method. The simulation results of alignment beam positions were similar to the experimental results. At each alignment mark","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"124 1","pages":"101-106"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87829251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper describes the development of Moving Coil Actuator for Automatic Piano. To obtain the desired tone volume, the servo system is performed by a follow-up control which uses the signal wave form. The capacity of the actuator has a torque of 1.33Nm/A, a thrust of 13.3N/A at the swing stroke point, and the frequency responses up to 60Hz. As a result of the experiments, the actuator is capable of generating enough force up to attain saturation of a movement of a piano's action, and of controlling a wide range of hammer struck string velocity down to the smallest tone volume. Also, the optimum signal wave form is found by analyzing the motion of the key and the hammer. The actuator is realized to produce the stable tone to the smallest tone volume and to perform the repetition of the sound pressure range of about 18 dB at 15 Hz.
{"title":"Development of a moving coil actuator for an automatic piano","authors":"Eiji Hayashi, M. Yamane, H. Mori","doi":"10.2493/JJSPE.59.667","DOIUrl":"https://doi.org/10.2493/JJSPE.59.667","url":null,"abstract":"This paper describes the development of Moving Coil Actuator for Automatic Piano. To obtain the desired tone volume, the servo system is performed by a follow-up control which uses the signal wave form. The capacity of the actuator has a torque of 1.33Nm/A, a thrust of 13.3N/A at the swing stroke point, and the frequency responses up to 60Hz. As a result of the experiments, the actuator is capable of generating enough force up to attain saturation of a movement of a piano's action, and of controlling a wide range of hammer struck string velocity down to the smallest tone volume. Also, the optimum signal wave form is found by analyzing the motion of the key and the hammer. The actuator is realized to produce the stable tone to the smallest tone volume and to perform the repetition of the sound pressure range of about 18 dB at 15 Hz.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"1 1","pages":"164-169"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78966302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Design Decision Making of Machine Structures for Minimizing Variation of the Structural Characteristics Based on Design Sensitivity Analysis Masataka YOSHIMURA This paper proposes design decision making methods of machine structures based on design sensitivity analyses for minimizing the influence of variations in the manufacturing processes on the structural characteristics (product performance). Design decisions are made so that smaller design sensitivity coefficients of the characteristics are given for areas that have been estimated to have a great potential for variation in the design variables. First, fundamental design principles are established for minimizing variations of the characteristics. Then, the practical procedures are presented for decreasing the variations of the product performance. The proposed method in which the minimization of variations of the product performance is the main objective corresponds to a maximization of the product performance and also brings about a decrease of the manufacturing cost. Finally, the effectiveness of the design decision making methods are demonstrated for designing a machine tool structure.
{"title":"Design decision making of machine structures for minimizing variation of the structural characteristics based on design sensitivity analysis","authors":"M. Yoshimura","doi":"10.2493/JJSPE.59.1215","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1215","url":null,"abstract":"Design Decision Making of Machine Structures for Minimizing Variation of the Structural Characteristics Based on Design Sensitivity Analysis Masataka YOSHIMURA This paper proposes design decision making methods of machine structures based on design sensitivity analyses for minimizing the influence of variations in the manufacturing processes on the structural characteristics (product performance). Design decisions are made so that smaller design sensitivity coefficients of the characteristics are given for areas that have been estimated to have a great potential for variation in the design variables. First, fundamental design principles are established for minimizing variations of the characteristics. Then, the practical procedures are presented for decreasing the variations of the product performance. The proposed method in which the minimization of variations of the product performance is the main objective corresponds to a maximization of the product performance and also brings about a decrease of the manufacturing cost. Finally, the effectiveness of the design decision making methods are demonstrated for designing a machine tool structure.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"105 1","pages":"1215-1220"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81284777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An Excimer Laser Stepper with Through-the-Lens Alignment.","authors":"N. Uchida, O. Kuwabara, T. Tojyo, T. Higashiki, Yoshihiko Takahashi, H. Yoshino","doi":"10.2493/JJSPE.59.1257","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1257","url":null,"abstract":"線幅0.5μm以下のLSIのデバイス開発を目的として,エキシマレーザ露光装置を試作し,その性能を評価した.本装置では,これまでエキシマレーザ露光装置では困難と考えられていたTTLアライメント系を搭載しアライメント性能の向上を計った.さらに,位置決め精度の向上のために,ウエハステージ系には露光ごとにウエハの傾きを補正する機構やXYステージの走行性能を補償するためのヨーイング補正機構を設けた.この結果,露光領域全域について0.35μm程度のパターンが解像し,0.1μmより良い重ね合わせ精度が得られた.これにより,本装置が線幅0.5μm以下のデバイス開発に有効であることが実証できた.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"32 1","pages":"1257-1262"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75237310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Okuyama, Tokuhiko Nishihara, S. Kawamura, S. Hanasaki
Thermal deformation of a workpiece attracted by a magnetic chuck in traverse grinding is theoretically investigated by a finite element method. The results are compared with the measured profiles of ground surfaces. Necessary force of a magnetic chuck to constrain the warp of workpiece bottom surface is also computed. The main results are as follows:(1) Central part of the workpiece bottom surface separates from the magnetic chuck by the thermal stress due to the grinding heat. (2) The local thermal deformation at the central part of a workpiece increases with the number of grinding passes. Around the entrance and exit part of each grinding pass, the local thermal bending deformation occurs. (3) The separation of the workpiece bottom surface and the local thermal deformation lead to a concave profile of the ground surface. (4) When a workpiece of 10×60×40(mm) in dimension is ground under a condition of 10 μm down feed and 5mm cross feed per a pass, the necessary constraining force is about 12MPa.
{"title":"Study on the Geometrical Accuracy in Surface Grinding. Thermal Deformation of Workpiece in Traverse Grinding.","authors":"S. Okuyama, Tokuhiko Nishihara, S. Kawamura, S. Hanasaki","doi":"10.2493/JJSPE.59.1145","DOIUrl":"https://doi.org/10.2493/JJSPE.59.1145","url":null,"abstract":"Thermal deformation of a workpiece attracted by a magnetic chuck in traverse grinding is theoretically investigated by a finite element method. The results are compared with the measured profiles of ground surfaces. Necessary force of a magnetic chuck to constrain the warp of workpiece bottom surface is also computed. The main results are as follows:(1) Central part of the workpiece bottom surface separates from the magnetic chuck by the thermal stress due to the grinding heat. (2) The local thermal deformation at the central part of a workpiece increases with the number of grinding passes. Around the entrance and exit part of each grinding pass, the local thermal bending deformation occurs. (3) The separation of the workpiece bottom surface and the local thermal deformation lead to a concave profile of the ground surface. (4) When a workpiece of 10×60×40(mm) in dimension is ground under a condition of 10 μm down feed and 5mm cross feed per a pass, the necessary constraining force is about 12MPa.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"55 1","pages":"1145-1150"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77417480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optical interferometry for nanometer measurement of a large step","authors":"Y. Takahashi, M. Kiso, T. Ishii, H. Teramoto, K. Iwata","doi":"10.2493/JJSPE.59.755","DOIUrl":"https://doi.org/10.2493/JJSPE.59.755","url":null,"abstract":"白色干渉法とヘテロダイン干渉法を併用することによって, mmオーダの大段差をnmオーダの精度で計測することを試みた.まず最初にnm計測の誤差要因と要因別に誤差を列挙した.そして, これらの総合誤差が1.3nm程度に収まることを示した.つぎに, 5個の試料にっき8回の繰返し計測を実施した結果, データのばらつきは標準偏差で0.9nmであった.この値は, 各種の振動や試料の取付け姿勢等の影響を含んだものであり, 空気除振台と一体化鏡筒の利用による振動の低減, アクリルカバーによる空気のゆらぎと周囲騒音の低減, ステージ送り変動分の減算補正によって, 得られたものである.このほかに, 本方法では2個のウォラストンブリズムを背面対称に配列することによってアライメント調整が容易になり, かっ, ワークディスタンスを大きく自在に取れるという特長を得ることができた.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"30 1","pages":"755-760"},"PeriodicalIF":0.0,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73889744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. Yabuuchi, Y. Kuroshima, M. Masuda, Minoru Kubobuti, Y. Ikawa
A spray forming technique, which can produce semi-finished products with high density and rapid solidification structure in a single operation, has been developed recently. This method is called the Osprey process. This process can control size and distribution of carbides and takes lower production cost than powder metallurgy (P/M) process owing to a single operation. In this paper the cutting performance of high-speed steel (HSS) end mill produced by Osprey process was investigated by comparison with conventional ingot metallurgy (I/M) and P/M ones. This Osprey HSS end mill exhibited superior wear resistance to I/M and P/M ones in milling tool steel (SKD 11), but some chippings and fracture appeared at the end cutting edge in milling stainless steel (SUS 304) in small feed rate.
{"title":"The cutting performance of high-speed steel end mill produced by spray forming process","authors":"E. Yabuuchi, Y. Kuroshima, M. Masuda, Minoru Kubobuti, Y. Ikawa","doi":"10.2493/JJSPE.58.1203","DOIUrl":"https://doi.org/10.2493/JJSPE.58.1203","url":null,"abstract":"A spray forming technique, which can produce semi-finished products with high density and rapid solidification structure in a single operation, has been developed recently. This method is called the Osprey process. This process can control size and distribution of carbides and takes lower production cost than powder metallurgy (P/M) process owing to a single operation. In this paper the cutting performance of high-speed steel (HSS) end mill produced by Osprey process was investigated by comparison with conventional ingot metallurgy (I/M) and P/M ones. This Osprey HSS end mill exhibited superior wear resistance to I/M and P/M ones in milling tool steel (SKD 11), but some chippings and fracture appeared at the end cutting edge in milling stainless steel (SUS 304) in small feed rate.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"54 1","pages":"1203-1208"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87385063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
F. Itoh, A. Shimase, Haraichi Satoshi, Takahashi Takahiko
During debugging logic LSIs, a period to reproduce LSI in order to change the logic design is becoming longer. To reduce the period from several weeks down to one day, an on-chip direct wiring modification system, using the focused ion beam (FIB) milling and the laser CVD, has been developed.This paper describes a precise FIB milling technique for cutting the wirings and making the via holes to the wirings of the LSI. Milling depth control by monitoring the ion induced photo-emissions and the milling strategy to overcome the surface steps of the LSI resulted in the milling depth accuracy of ±0.25μm. The system, consist of the FIB milling described in this paper and the laser CVD, has been applied to the logic modification of the LSIs of Hitachi M880 mainframe computer. Several tens of cuts, vias on an LSI chip were made by FIB, and the several jumper wirings were made by laser CVD. The average yield of modified LSI chips of 91.8% was achieved.
{"title":"Focused ion beam milling technology for on-chip wiring modification system for LSI","authors":"F. Itoh, A. Shimase, Haraichi Satoshi, Takahashi Takahiko","doi":"10.2493/JJSPE.58.1161","DOIUrl":"https://doi.org/10.2493/JJSPE.58.1161","url":null,"abstract":"During debugging logic LSIs, a period to reproduce LSI in order to change the logic design is becoming longer. To reduce the period from several weeks down to one day, an on-chip direct wiring modification system, using the focused ion beam (FIB) milling and the laser CVD, has been developed.This paper describes a precise FIB milling technique for cutting the wirings and making the via holes to the wirings of the LSI. Milling depth control by monitoring the ion induced photo-emissions and the milling strategy to overcome the surface steps of the LSI resulted in the milling depth accuracy of ±0.25μm. The system, consist of the FIB milling described in this paper and the laser CVD, has been applied to the logic modification of the LSIs of Hitachi M880 mainframe computer. Several tens of cuts, vias on an LSI chip were made by FIB, and the several jumper wirings were made by laser CVD. The average yield of modified LSI chips of 91.8% was achieved.","PeriodicalId":14336,"journal":{"name":"International Journal of The Japan Society for Precision Engineering","volume":"29 3 1","pages":"1161-1166"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78064638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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