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1993 (5th) International Conference on Indium Phosphide and Related Materials最新文献

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Selective MOVPE growth and its applications to optical devices 选择性MOVPE生长及其在光学器件中的应用
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380714
T. Sasaki, M. Kitamura, I. Mito
Selective metalorganic vapor phase epitaxial growth of InGaAsP/InP structures on mask-patterned planar InP substrates was studied. Ridge structures with widths around 2 /spl mu/m were selectively formed on open stripe regions between pairs of mask stripes. For such narrow regions, not only lateral gas phase diffusion but also surface migration contribute to enhanced growth rate compared to growth on unmasked wafers. The surface migration processes of metalorganic species were investigated to obtain flat top surfaces in the ridge structures. Selectively grown InGaAs/InGaAsP MQW structures with flat interfaces were obtained. Composition shifts in selectively grown InGaAs layers provided an additional bandgap energy shift in thickness-modulated InGaAs quantum wells. A shift as large as 200 nm in the photoluminescence peak wavelength was obtained for simultaneously grown multiple quantum well ridge structures while maintaining flat interfaces.<>
研究了InGaAsP/InP结构在掩模平面InP衬底上的选择性金属有机气相外延生长。在掩膜条纹对之间的开放条纹区选择性地形成宽度约为2 /spl mu/m的脊状结构。在这种狭窄的区域中,除了横向气相扩散外,表面迁移也有助于提高晶圆的生长速度。研究了金属有机物质的表面迁移过程,以获得脊状结构中的平顶表面。获得了具有平面接口的选择性生长InGaAs/InGaAsP MQW结构。选择性生长的InGaAs层中的成分位移在厚度调制的InGaAs量子阱中提供了额外的带隙能量位移。在保持平面界面的情况下,同时生长的多量子阱脊结构的光致发光峰值波长偏移达200 nm
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引用次数: 0
Etching of low loss mirrors for photonic ICs 光子集成电路低损耗反射镜的蚀刻
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380568
S. Ojha, S. Clements
The requirements for etching low loss mirrors and the dry etching techniques used for realizing these mirrors in photonic devices are reviewed. The effect of carbon dioxide and nitrous oxide additions to CH/sub 4//H/sub 2/ on the etch characteristics of double heterostructure layers is discussed. Vertical mirror profiles were obtained by using a CO/sub 2/ based etch process. Parabolic mirror elements having 1.2 dB loss were etched in an integrated InGaAsP/InP demultiplexer by using a CH/sub 4//H/sub 2//CO/sub 2/ reactive ion etching process. Loading effects were found to be dominant in methane/hydrogen based processes and were found to affect verticality of the quaternary layers.<>
综述了在光子器件中蚀刻低损耗反射镜的要求和用于实现这些反射镜的干式蚀刻技术。讨论了CH/sub - 4/ H/sub - 2/中添加二氧化碳和氧化亚氮对双异质结构层蚀刻特性的影响。采用CO/ sub2 /基蚀刻工艺获得了垂直镜面轮廓。采用CH/sub 4//H/sub 2//CO/sub 2/反应离子刻蚀工艺,在集成InGaAsP/InP解复用器中刻蚀了损耗为1.2 dB的抛物面镜元件。加载效应在甲烷/氢基过程中占主导地位,并影响第四系地层的垂直度。
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引用次数: 2
Interdiffusion of InGaAs/InGaAsP quantum wells InGaAs/InGaAsP量子阱的相互扩散
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380718
R. Glew
The author studied the interdiffusion between the InGaAs wells and InGaAs barriers as a function of phosphine and arsine pressure. The effect of strain and substrate etch pit density was explored. The interdiffusion rates for unstrained and strained quantum wells were similar, whether grown on low or high etch pit density substrates. The interdiffusion mechanism has been shown to be not due to the group V vacancies.<>
作者研究了砷化镓阱与砷化镓势垒间的相互扩散随磷化氢压力和砷化镓压力的变化。探讨了应变和衬底蚀刻坑密度的影响。无论生长在低或高蚀刻坑密度的衬底上,非应变和应变量子阱的互扩散速率是相似的。相互扩散机制已被证明不是由V族空位引起的
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引用次数: 3
Application of surface passivation techniques and an in-situ hydrogen plasma for regrowth of InP by GSMBE 表面钝化技术及原位氢等离子体在GSMBE再生InP中的应用
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380701
P. Hofstra, D. A. Thompson, B. Robinson, G. Hollinger, R. Streater
To minimize defects at re-grown interfaces, in InP grown by gas source molecular beam epitaxy, surface passivation techniques were combined with an in-situ cleaning using a H-plasma. Surfaces were passivated by either a UV-ozone treatment or a monolayer of sulfur. Re-grown interfaces in Si-doped InP that had been UV-ozone and plasma cleaned contained virtually no electrically active defects (<5 /spl times/ 10/sup 10/ cm/sup -2/). Re-grown interfaces in Be-doped material that had been given the same treatment contained a defect concentration of 8 /spl times/ 10/sup 11/ cm/sup -2/. Secondary ion mass spectroscopy results material that was sulfur passivated and plasma cleaned contained an interfacial defect concentration of 8 /spl times/ 10/sup 11/ cm/sup -2/.<>
为了最大限度地减少再生长界面上的缺陷,在气源分子束外延生长的InP中,表面钝化技术与使用h等离子体的原位清洗相结合。表面通过紫外臭氧处理或单层硫钝化。经过uv -臭氧和等离子体清洗的si掺杂InP的再生界面几乎没有电活性缺陷(>)
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引用次数: 0
Crystal growth of low EPD S-doped <100> InP by facet formation 低EPD s掺杂InP的晶面生长
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380611
R. Hirano, T. Kanazawa, Y. Itoh, T. Itokawa, H. Onodera, M. Nakamura
The authors have developed a modified liquid encapsulated Czochralski method with a double thermal baffle, by which low etch pitch density (EPD) S-doped InP crystals with lower carrier concentration can be grown. The low EPD S-doped InP crystals became rectangular in shape. When the faceted surfaces were clearly seen on the body, the dislocation density decreased drastically. The solid-liquid interface shape of the crystal investigated by A-B etching, scanning photoluminescence and infrared macrograph was flatter than that of the conventional crystals. The facet growth of the {111} planes was observed on the body of the newly developed crystal.<>
本文提出了一种改进的双热挡板液体封装法,可以生长出低蚀刻间距密度(EPD)、低载流子浓度的掺杂InP晶体。低EPD掺s的InP晶体呈矩形。当体表清晰可见刻面时,位错密度急剧下降。通过A-B刻蚀、扫描光致发光和红外宏像分析,该晶体的固液界面形状比常规晶体平坦。在新形成的晶体体上观察到{111}面的小面生长。
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引用次数: 2
Charge transfer phenomena in semi-insulating InP:Fe 半绝缘InP:Fe中的电荷转移现象
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380644
G. Wittmann, R. Fasbender, M. Thoms, A. Winnacker
Charge transfer phenomena are studied in semi-insulating InP:Fe. It is shown that the Fe-absorption is changed under exposure to near IR-light due to pumping of charge carriers into traps other than Fe. This process may affect the determination of the Fe-distribution in InP:Fe by optical absorption. From the change in Fe-absorption the absolute concentration of traps can be estimated. The spectral dependence of the charge transfer process reveals that mainly electron traps are active above 80K.<>
研究了半绝缘InP:Fe中的电荷转移现象。结果表明,在近红外光照射下,铁的吸收发生了变化,这是由于将载流子泵入除铁以外的阱中。这一过程可能影响用光学吸收法测定InP:Fe中铁的分布。从铁吸收的变化可以估计出陷阱的绝对浓度。电荷转移过程的光谱依赖性表明,在80K以上,电子陷阱主要是活跃的。
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引用次数: 1
High resolution X-ray diffraction and transmission electron microscopy investigation on As and P incorporation in MOCVD and CBE grown In(GaAs)P/InP 'false' multi quantum wells in (GaAs)P/InP“假”多量子阱生长的MOCVD和CBE中As和P掺杂的高分辨x射线衍射和透射电镜研究
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380675
C. Ferrari, L. Lazzarini, G. Salviati, L. Gastaldi, F. Taiarol, G. Schiavini, C. Rigo
The problem of interface sharpness, both for composition and planarity, is important in InGaAs(P)/InP multiple quantum wells (MQWs) based optoelectronic devices. Composition variations arise due to the need to protect the interfaces from thermal degradation with a group V atom flux during growth interruptions and their effect depends on the growth technique. To understand the influence of such compositional variations on both InP/InGaAs and InGaAs/InP interfaces separately, false MQWs (FMQWs) were intentionally grown. The FMQWs result from the incorporation of protecting group V species different to that present in the growing layer during the periods of growth interruptions. The effects of different atoms of group V (As,P) on interface roughness and compositional changes in InP(As)/InP and InGaAs(P)/InGaAs FMQWs grown at different growth temperatures and with different growth interruption times by chemical beam epitaxy and metal organic chemical vapor deposition have been studied. This work has been performed by combining high resolution transmission electron microscopy and high resolution X-ray diffraction techniques.<>
在基于InGaAs(P)/InP多量子阱(mqw)的光电器件中,组成和平面性的界面清晰度问题非常重要。由于需要在生长中断期间保护界面不受V族原子通量的热降解而产生成分变化,其影响取决于生长技术。为了了解这种组合变化对InP/InGaAs和InGaAs/InP接口的影响,有意地生长假mqw (fmqw)。FMQWs是由于在生长中断期间与生长层中存在的保护组V物种不同而产生的。采用化学束外延法和金属有机化学气相沉积法,研究了不同V族原子(As,P)对不同生长温度和不同生长中断时间下生长的InP(As)/InP和InGaAs(P)/InGaAs FMQWs界面粗糙度和成分变化的影响。这项工作是通过结合高分辨率透射电子显微镜和高分辨率x射线衍射技术来完成的。
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引用次数: 0
Semi-insulating InP:Fe by GSMBE: Optimal growth conditions GSMBE半绝缘InP:Fe:最佳生长条件
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380688
S. Salaun, A. Le Corre, M. Gauneau, D. Lecrosnier
The authors studied the quality of gas source molecular beam epitaxy (GSMBE) InP:Fe epitaxial layers as a function of growth conditions using secondary ion mass spectroscopy and resistivity measurements. Varying the growth temperature and the phosphine (PH/sub 3/) flow rate allows control of the atom surface mobility during growth, hence permitting decrease of the interactions between iron atoms, to improve their incorporation in the InP layers. For optimized growth conditions, a semi-insulating behavior of GSMBE InP:Fe epitaxial layers is demonstrated with resistivities in excess of 10/sup 8/ /spl Omega/.cm for an iron concentration above 10/sup 17/ cm/sup -3/.<>
作者利用二次离子质谱和电阻率测量研究了气源分子束外延(GSMBE) InP:Fe外延层的质量与生长条件的关系。改变生长温度和磷化氢(PH/sub 3/)流速可以控制生长过程中原子的表面迁移率,从而减少铁原子之间的相互作用,从而改善它们在InP层中的结合。在优化的生长条件下,证明了GSMBE InP:Fe外延层的半绝缘性能,电阻率超过10/sup / 8/ /spl ω /。铁浓度高于10/sup时,Cm为17/ Cm /sup -3/ >
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引用次数: 1
Improved breakdown-speed tradeoff of InP/InGaAs single heterojunction bipolar transistor using a novel p/sup -/-n/sup -/ collector structure 采用新颖的p/sup -/-n/sup -/集电极结构改善了InP/InGaAs单异质结双极晶体管的击穿速度权衡
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380719
H. Chau, D. Pavlidis, G. Ng, K. Tomizawa, D. M. Baker, C. Meaton, J. N. Tothill
A novel p/sup -/-n/sup -/ collector design is presented for InP/InGaAs heterostructure bipolar transistors (HBTs). It shows a speed advantage over conventional n/sup -/ collector designs without at the same time being handicapped in terms of breakdown voltage as would normally be the case of traditional special collector designs. The speed and breakdown-speed tradeoff superiority of the p/sup -/-n/sup -/ HBT over the conventional designs are shown and discussed theoretically and experimentally.<>
针对InP/InGaAs异质结构双极晶体管(HBTs),提出了一种新颖的p/sup -/-n/sup /集电极设计。与传统的n/sup /集电极设计相比,它具有速度优势,同时不会像传统的特殊集电极设计那样受到击穿电压的限制。从理论上和实验上论证了p/sup -/-n/sup -/ HBT相对于传统设计的速度和击穿速度权衡优势。
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引用次数: 0
Noise in integrated optical receiver front-ends employing InP/InGaAs HBTs 采用InP/InGaAs HBTs集成光接收机前端的噪声
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380595
Q. Liu, D. Pulfrey
The authors present calculations of the equivalent input noise current spectral density in both tuned and untuned front-ends employing InP/InGaAs heterostructure bipolar transistors (HBTs) and identify the dominant transistor-related components of the noise. The receiver sensitivity will depend ultimately on the front-end noise. Results are presented for receivers based on InP/InGaAs HBTs as used in either 1 GB/s or 10 GB/s demonstration units. The small-signal parameters for these transistors are shown.<>
作者介绍了采用InP/InGaAs异质结构双极晶体管(HBTs)在调谐和未调谐前端的等效输入噪声电流谱密度的计算,并确定了与晶体管相关的主要噪声分量。接收机的灵敏度最终取决于前端噪声。给出了基于InP/InGaAs HBTs的接收器在1gb /s或10gb /s演示单元中使用的结果。这些晶体管的小信号参数如图所示。
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引用次数: 0
期刊
1993 (5th) International Conference on Indium Phosphide and Related Materials
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