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1993 (5th) International Conference on Indium Phosphide and Related Materials最新文献

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A quantitative study of oxygen contamination in InGaAs grown by MBE MBE生长InGaAs中氧污染的定量研究
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380545
J. Harmand, M. Juhel
The contamination by oxygen in the molecular beam epitaxy of InGaAs was studied. The oxygen concentrations were measured by secondary ion mass spectroscopy in samples grown with interruptions. Quantitative estimations of O bulk concentrations were deduced with a very low detection limit. Correlations with growth conditions and electrical properties were observed.<>
研究了InGaAs分子束外延过程中氧的污染。用二次离子质谱法测定了中断生长样品中的氧浓度。在极低的检出限下,推导出了O体积浓度的定量估计。观察到与生长条件和电性能的相关性。
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引用次数: 0
Performance of AlInAs/GaInAs/InP microwave DHBTs AlInAs/GaInAs/InP微波DHBTs性能研究
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380721
W. Stanchina, T. Liu, D. Rensch, P. Macdonald, M. Hafizi, W. Hooper, M. Lui, Y. K. Allen, T. V. Kargodorian, R. Wong-Quen, F. Williams
The authors report the experimental characteristics obtained from AlInAs/GaInAs/InP double heterojunction bipolar transistors (DHBTs) grown by gas source molecular beam epitaxy. They describe the fabrication and measured performance of two AlInAs/GaInAs/InP DHBT structures, one having a relatively thin 390 nm collector and the other having a relatively thick 1200 nm collector. Their performance results are presented within the context of their application to linear ICs and microwave power amplification. The results include the first reported microwave power measurements on this InP-based DHBT structure featuring a continuous wave output power density of 3.3 W/mm at 4 GHz.<>
本文报道了气源分子束外延生长AlInAs/GaInAs/InP双异质结双极晶体管(dhbt)的实验特性。他们描述了两种AlInAs/GaInAs/InP DHBT结构的制造和测量性能,一种具有相对较薄的390 nm集热器,另一种具有相对较厚的1200 nm集热器。介绍了它们在线性集成电路和微波功率放大中的应用。结果包括首次报道的在这种基于inp的DHBT结构上的微波功率测量,该结构在4 GHz波段的连续波输出功率密度为3.3 W/mm
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引用次数: 4
Incorporation of group III elements in chemical beam epitaxy of GaInAsP alloys GaInAsP合金化学束外延中III族元素的掺入
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380660
J. Carlin, A. Rudra, M. Ilegems
The authors describe quantitatively the incorporation of group III elements during the chemical beam epitaxy (CBE) growth of GaInAsP alloys. They report key parameters that influence CBE growth of GaInAsP alloys when TEGa, TMIn, AsH/sub 3/ and PH/sub 3/ sources are used in the 480/spl deg/C-520/spl deg/C substrate temperature range. The indium incorporation ratio is quasi-insensitive to the growth conditions. In contrast, two main factors must be taken into account for the gallium incorporation. The factors are (1) a strong inhibition due to the presence of indium. This mechanism is not very dependent on the substrate temperature. (2) A strong temperature dependence when phosphorus is present. A set of linear relations to describe these effects is proposed.<>
作者定量地描述了GaInAsP合金化学束外延生长过程中III族元素的加入。他们报告了在480/spl°C-520/spl°C衬底温度范围内使用TEGa、TMIn、AsH/sub - 3/和PH/sub - 3/源时影响GaInAsP合金CBE生长的关键参数。铟掺入比对生长条件几乎不敏感。相比之下,两个主要因素必须考虑到镓掺入。这些因素是:(1)由于铟的存在有很强的抑制作用。这一机制不太依赖于衬底温度。(2)有磷存在时,对温度有很强的依赖性。提出了一组描述这些效应的线性关系。
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引用次数: 0
MOVPE of strained InGaAsP/InGaAsP MQW structures for laser applications 用于激光应用的InGaAsP/InGaAsP MQW结构的移动特性
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380563
P. Wiedemann, M. Klenk, G. Laube, R. Weinmann, E. Zielinski
The authors present basic studies about the properties of compressively strained multi-quantum well (MQW) structures and their optimization for laser applications. Epitaxial growth of strained InGaAsP/InGaAsP MQW structures was performed in standard low pressure metal organic vapor phase epitaxial equipment. High resolution diffractometry measurements showed excellent agreement with simulations. Secondary ion mass spectrometry measurements showed good well to well homogeneity. By optimizing growth pauses and strain a best threshold current density was achieved.<>
作者对压缩应变多量子阱(MQW)结构的性质及其在激光应用中的优化进行了基础研究。在标准的低压金属有机气相外延设备上进行了应变InGaAsP/InGaAsP MQW结构的外延生长。高分辨率衍射测量结果与模拟结果非常吻合。二次离子质谱测量显示良好的井间均匀性。通过优化生长暂停和应变,获得了最佳阈值电流密度。
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引用次数: 0
Effect of rapid thermal annealing on electrical properties of capped InP for MISFET device application 快速热退火对用于MISFET器件的封盖InP电性能的影响
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380643
A. Kadoun, G. Brémond, D. Barbier, A. Laugier, J. Tardy, M. Gendry
InP is a promising substrate material for many microelectronic device applications. However, a crucial step in the process of fabrication of these devices is the post implantation annealing. Owing to phosphorous volatility, the InP surface is very sensitive to heat treatment, especially when high temperatures are required. An annealing procedure has been previously used in the process of fabrication of an InP MISFET which showed excellent static performance. This method consists of growth of a one micron thick lattice matched InGaAs layer by molecular beam epitaxy (MBE). This layer acts at the same time as an implantation mask and a protecting cap for the channel area during the high temperature post implantation annealing. Capacitance-voltage measurements and deep level transient spectroscopy analysis have been implemented for the purpose of investigating the effects of thermal treatments on the properties of the channel area underneath the InGaAs capping layer for this new method of encapsulation of InP. Thermal treatments involved in this particular technology are post implantation rapid thermal annealing, and the high temperature stage during the epitaxial growth.<>
在许多微电子器件的应用中,InP是一种很有前途的衬底材料。然而,在制造这些器件的过程中,一个关键的步骤是植入后退火。由于磷的挥发性,InP表面对热处理非常敏感,特别是在需要高温时。在制备具有优异静态性能的InP MISFET过程中,已经采用了退火方法。该方法是通过分子束外延(MBE)生长一微米厚的晶格匹配InGaAs层。在高温注入后退火过程中,该层同时作为注入掩膜和通道区域的保护帽。通过电容电压测量和深能级瞬态光谱分析,研究了热处理对InGaAs封盖层下通道区域性能的影响。在这种特殊技术中涉及的热处理是植入后快速热退火和外延生长期间的高温阶段。
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引用次数: 0
Growth and properties of InGaAs ternary bulk crystals InGaAs三元体晶的生长与性质
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380649
K. Nakajima, T. Kusunoki, K. Kitahara, H. Ishikawa
The authors have developed a double crucible liquid encapsulated Czochralski (LEC) method with a continuous supply of solute elements. The controllability of the supply of solute elements can be improved by this method. A 5 cm long InGaAs ternary bulk crystal has been grown at a constant temperature by the LEC method with a supply of only GaAs to growth melt. The X-ray, electrical and optical results imply that the quality of the InGaAs bulk crystals is as high as the LEC grown GaAs crystals on the market.<>
提出了一种连续供应溶质元素的双坩埚液体包封法(LEC)。该方法可提高溶质元素供给的可控性。用LEC法在恒温条件下生长出了长5cm的InGaAs三元体晶体,生长熔体中只供应GaAs。x射线,电学和光学结果表明,InGaAs体晶体的质量与市场上LEC生长的GaAs晶体一样高。
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引用次数: 0
A new pseudomorphic In/sub 0.2/Ga/sub 0.8/As layers HEMT using Al/sub 0.52/In/sub 0.48/P as barrier layer 一种以Al/sub 0.52/In/sub 0.48/P为势垒层的新型准晶In/sub 0.2/Ga/sub 0.8/As层HEMT
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380573
G. Ng, Y. Chan, D. Pavlidis, Y. Kwon, T. Brock, J. Kuo
A new pseudomorphic AlInP/InGaAs high electron mobility transistor (HEMT) grown by gas-source molecular-beam epitaxy has been demonstrated. This new pseudomorphic HEMT design offers: (i) a larger /spl Delta/E/sub c/ than pseudomorphic Al/sub 0.22/Ga/sub 0.78/As/I with the same channel composition and thus better confinement, (ii) reduction of DX-center related problems (J. M. Kuo et al., 1993), and (iii) high etching selectivity between GaAs/InGaAs and AlInP and thus improved threshold voltage uniformity due to better gate recess control. The DC and microwave characteristics of submicron gate-length Al/sub 0.52/In/sub 0.48/P HEMTs are presented.<>
利用气源分子束外延技术制备了一种新型假晶AlInP/InGaAs高电子迁移率晶体管(HEMT)。这种新的伪晶HEMT设计提供:(i)比伪晶Al/sub 0.22/Ga/sub 0.78/As/ i具有更大的/spl Delta/E/sub c/,具有相同的通道组成,从而更好的约束,(ii)减少了x -中心相关问题(J. M. Kuo等,1993),以及(iii) GaAs/InGaAs和AlInP之间的高蚀刻选择性,从而由于更好的栅极凹槽控制而改善了阈值电压均匀性。介绍了亚微米门长Al/sub 0.52/In/sub 0.48/P hemt的直流和微波特性。
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引用次数: 2
Effect of interface properties on the characteristics of InP/GaInAs high electron mobility transistors 界面特性对InP/GaInAs高电子迁移率晶体管特性的影响
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380599
A. Kohl, A. M. Kusters, R. Muller, S. Brittner, K. Heime, J. Finders, M. Keuter, J. Geurts
To overcome problems due to Al-containing layers the authors have developed a double heterostructure high electron mobility transistor (HEMT) design which only contains p- and n-doped InP and GaInAs. The layers were grown by low pressure metal organic vapor phase epitaxy (LP-MOVPE). These devices show very good performance. This material system suffers from problems with the abruptness of the interface. Therefore the effect of gas switching sequencies of the reactive gases was investigated using Raman spectroscopy. Based on these results a series of HEMTs was fabricated to investigate the impact of different interface configurations on device performance. It is shown that Hall mobilities of carriers, g/sub mext/, f/sub T/ and I/sub DSS/ can be improved by a proper adjustment of gas switching sequencies.<>
为了克服含al层所带来的问题,作者开发了一种双异质结构高电子迁移率晶体管(HEMT)设计,该晶体管仅含有p和n掺杂的InP和GaInAs。采用低压金属有机气相外延法(LP-MOVPE)生长薄膜。这些器件表现出非常好的性能。这种材料体系存在着界面突然性的问题。因此,利用拉曼光谱研究了反应气体开关顺序的影响。在此基础上,制作了一系列的hemt,以研究不同的接口配置对器件性能的影响。结果表明,g/sub next /、f/sub T/和I/sub DSS/等载流子的霍尔迁移率可以通过适当调整气体开关顺序来提高。
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引用次数: 1
Aerosol deposition and combined dry/wet etching techniques for fabrication of InP-based quantum dot structures 气溶胶沉积和干湿联合蚀刻技术用于制造基于inp的量子点结构
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380541
I. Maximov, A. Gustafsson, H. Hansson, L. Samuelson, W. Seifert, A. Wiedensohler
The authors present a novel technology for the fabrication of quantum dots (QDs) structures based on the deposition of ultrafine aerosol Ag particles onto the surface of Ga/sub 0.47/In/sub 0.53/As/InP quantum well structures grown by metal organic vapor phase epitaxy. The quantum well structures consisted of 3 quantum wells (QWs) with nominal thickness of 3, 8 and 18 monolayers with the thinnest QW being on top of the structure. A reference layer of Ga/sub 0.47/In/sub 0.53/As was grown below QWs for lattice matching control. The QWs were separated by 15 nm barriers of InP and the cladding layer was about 66 nm in thickness. Silver particles 40 nm in diameter were used as an etching mask. QW thickness dependence of quenching of QD luminescence was observed.<>
本文提出了一种利用金属有机气相外延在Ga/sub 0.47/In/sub 0.53/As/InP量子阱表面沉积超细气溶胶银粒子的量子点(QDs)结构新技术。量子阱结构由3个量子阱(QW)组成,其标称厚度分别为3层、8层和18层,最薄的量子阱位于结构顶部。在量子阱下方生长了Ga/sub 0.47/In/sub 0.53/As的参考层,用于晶格匹配控制。两个量子阱被15 nm的铟磷阻挡层隔开,包层厚度约为66 nm。采用直径为40 nm的银颗粒作为蚀刻掩膜。观察了QW厚度对QD发光猝灭的依赖性。
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引用次数: 0
Minority carrier diffusion length and edge surface-recombination velocity in InP InP中少数载流子扩散长度和边缘表面复合速度
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380613
R. Hakimzadeh, S. Bailey
A scanning electron microscope was used to obtain electron-beam-induced current (EBIC) profiles in InP specimens containing a Schottky barrier perpendicular to the scanned edge surface. An independent technique was used to measure the edge surface-recombination velocity (V/sub s/). These values were used in a fit of the experimental EBIC data with a theoretical expression for normalized EBIC (C. Donolato, 1982) to obtain the electron minority carrier diffusion length (L/sub n/).<>
利用扫描电子显微镜对含有垂直于扫描边缘表面的肖特基势垒的InP样品进行了电子束感应电流(EBIC)分布。采用独立技术测量边缘表面复合速度(V/sub /s /)。这些值用于将实验EBIC数据与归一化EBIC的理论表达式(C. Donolato, 1982)拟合,以获得电子少数载流子扩散长度(L/sub n/)。
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引用次数: 4
期刊
1993 (5th) International Conference on Indium Phosphide and Related Materials
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