Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893117
Rong-Liang Cai, Cheng-rui Zhang, Liang Zhou
This study demonstrated the fabrication integration process of two cascaded GaAs MMICs using BCB films in order to achieve heterogeneous integration. Thermal-mechanical analysis has been simulated and performed to investigate the distributions of the temperature and stress. It has been found that the maximum temperature in the packaging depended on the dissipated power of the RF medium power amplifier. Although the temperature would not exceed the channel temperature of the dies in this case, the materials may also exceed their yield strength which will cause the reliability issues. This research will help to understand significant thermal and mechanical issues of high density IC packaging.
{"title":"Thermal-mechanical analysis of packaged power amplifiers based on heterogeneous integrations using photosensitive BCB","authors":"Rong-Liang Cai, Cheng-rui Zhang, Liang Zhou","doi":"10.1109/EDAPS.2016.7893117","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893117","url":null,"abstract":"This study demonstrated the fabrication integration process of two cascaded GaAs MMICs using BCB films in order to achieve heterogeneous integration. Thermal-mechanical analysis has been simulated and performed to investigate the distributions of the temperature and stress. It has been found that the maximum temperature in the packaging depended on the dissipated power of the RF medium power amplifier. Although the temperature would not exceed the channel temperature of the dies in this case, the materials may also exceed their yield strength which will cause the reliability issues. This research will help to understand significant thermal and mechanical issues of high density IC packaging.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131552456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893146
Jongin Ryu, Hae Jin Kim, Se-Hoon Park, J. Chul
This paper presents a compact module for a Bluetooth Low Energy (BLE) by embedding all passive components as capacitors, inductors, and resistors. Passive or active components are embedded in printed-circuit-board (PCB) as called as System-on-Package (SoP). A proposed module is composed of a BLE IC, a memory, a 3-axis sensor, a crystal, inductors, capacitors, and resistors. In side view, ICs and a PCB with passive components are sequentially located from top and bottom. Capacitors, inductors and resistors are embedded in PCB. In order to check the performance and size for embedded modules, two representative modules for BLE with SMT and with SoP are designed and compared. The size of module with SMT and SoP are as 11 mm × 8 mm and 6 mm × 8 mm, respectively. Almost 44.5 % size reduction is obtained by SoP. Measured Tx power in Bluetooth are given as −2.0 dBm and BLE has good performance. This paper presented that SoP technology was better than SMT technology in a view of size. Implemented module had good performance and slim size.
{"title":"A miniaturized module for Bluetooth low energy by embedding all passive components","authors":"Jongin Ryu, Hae Jin Kim, Se-Hoon Park, J. Chul","doi":"10.1109/EDAPS.2016.7893146","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893146","url":null,"abstract":"This paper presents a compact module for a Bluetooth Low Energy (BLE) by embedding all passive components as capacitors, inductors, and resistors. Passive or active components are embedded in printed-circuit-board (PCB) as called as System-on-Package (SoP). A proposed module is composed of a BLE IC, a memory, a 3-axis sensor, a crystal, inductors, capacitors, and resistors. In side view, ICs and a PCB with passive components are sequentially located from top and bottom. Capacitors, inductors and resistors are embedded in PCB. In order to check the performance and size for embedded modules, two representative modules for BLE with SMT and with SoP are designed and compared. The size of module with SMT and SoP are as 11 mm × 8 mm and 6 mm × 8 mm, respectively. Almost 44.5 % size reduction is obtained by SoP. Measured Tx power in Bluetooth are given as −2.0 dBm and BLE has good performance. This paper presented that SoP technology was better than SMT technology in a view of size. Implemented module had good performance and slim size.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134086087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893141
M. Yoshikawa, Y. Nozaki
The damage caused by counterfeits of semiconductors has become a serious problem. Recently, a physical unclonable function (PUF) has attracted attention as a technique to prevent counterfeiting. The present study investigates an arbiter PUF, which is a typical PUF. The vulnerability of a PUF against machine-learning attacks has been revealed. It has also been indicated that the output of a PUF is inverted from its normal output owing to the difference in environmental variations, such as the changes in power supply voltage and temperature. The resistance of a PUF against machine-learning attacks due to the difference in environmental variation has seldom been evaluated. The present study evaluated the resistance of an arbiter PUF against machine-learning attacks due to the difference in environmental variation. By performing an evaluation experiment using a simulation, the present study revealed that the resistance of an arbiter PUF against machine-learning attacks due to environmental variation was slightly improved. However, the present study also successfully predicted more than 95% of the outputs by increasing the number of learning cycles. Therefore, an arbiter PUF was revealed to be vulnerable to machine-learning attacks even after environmental variation.
{"title":"Tamper resistance evaluation of PUF in environmental variations","authors":"M. Yoshikawa, Y. Nozaki","doi":"10.1109/EDAPS.2016.7893141","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893141","url":null,"abstract":"The damage caused by counterfeits of semiconductors has become a serious problem. Recently, a physical unclonable function (PUF) has attracted attention as a technique to prevent counterfeiting. The present study investigates an arbiter PUF, which is a typical PUF. The vulnerability of a PUF against machine-learning attacks has been revealed. It has also been indicated that the output of a PUF is inverted from its normal output owing to the difference in environmental variations, such as the changes in power supply voltage and temperature. The resistance of a PUF against machine-learning attacks due to the difference in environmental variation has seldom been evaluated. The present study evaluated the resistance of an arbiter PUF against machine-learning attacks due to the difference in environmental variation. By performing an evaluation experiment using a simulation, the present study revealed that the resistance of an arbiter PUF against machine-learning attacks due to environmental variation was slightly improved. However, the present study also successfully predicted more than 95% of the outputs by increasing the number of learning cycles. Therefore, an arbiter PUF was revealed to be vulnerable to machine-learning attacks even after environmental variation.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133331533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893153
Y. K. Negi, N. Balakrishnan, S. Rao, D. Gope
In this paper, a preconditioning technique based on the Schur complement method is presented to accelerate the convergence of fast near-linear complexity iterative Method of Moments (MoM) solution. The Schur complement method diagonalizes the near field blocks to a block-diagonal form which can be used as an effective preconditioner to expedite the iterative solver convergence. Numerical experiments demonstrate a significant advantage over ILUT or recently published null-field based methods.
{"title":"Schur complement preconditioner for fast 3D full-wave MoM package-board extraction","authors":"Y. K. Negi, N. Balakrishnan, S. Rao, D. Gope","doi":"10.1109/EDAPS.2016.7893153","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893153","url":null,"abstract":"In this paper, a preconditioning technique based on the Schur complement method is presented to accelerate the convergence of fast near-linear complexity iterative Method of Moments (MoM) solution. The Schur complement method diagonalizes the near field blocks to a block-diagonal form which can be used as an effective preconditioner to expedite the iterative solver convergence. Numerical experiments demonstrate a significant advantage over ILUT or recently published null-field based methods.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123987533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893164
Tianjian Lu, Jianming Jin
A coupled electrical-thermal-fluid simulation technique is developed based on the finite element method. The coupled simulation, which integrates the full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses into an iterative scheme, is devised for circuit designs with integrated micro channel cooling. The motion of fluid flow is decoupled from temperature under the assumption of incompressible and fully developed flows. The full-wave electromagnetic and the transient conjugate heat transfer analyses are coupled through temperature-dependent material properties. The efficiency of the coupled simulation is enhanced through several numerical techniques including an adaptive time stepping scheme, a domain decomposition scheme called the finite element tearing and interconnecting (FETI), and FETI-enabled parallel computing. The capability and the efficiency of the coupled simulation are demonstrated through a numerical example.
{"title":"Coupled electrical-thermal-fluid simulation for large-scale circuits with integrated microchannels","authors":"Tianjian Lu, Jianming Jin","doi":"10.1109/EDAPS.2016.7893164","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893164","url":null,"abstract":"A coupled electrical-thermal-fluid simulation technique is developed based on the finite element method. The coupled simulation, which integrates the full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses into an iterative scheme, is devised for circuit designs with integrated micro channel cooling. The motion of fluid flow is decoupled from temperature under the assumption of incompressible and fully developed flows. The full-wave electromagnetic and the transient conjugate heat transfer analyses are coupled through temperature-dependent material properties. The efficiency of the coupled simulation is enhanced through several numerical techniques including an adaptive time stepping scheme, a domain decomposition scheme called the finite element tearing and interconnecting (FETI), and FETI-enabled parallel computing. The capability and the efficiency of the coupled simulation are demonstrated through a numerical example.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126371527","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893161
Raffi Toukhtarian, D. Tannir, F. Nabki, R. Khazaka
As the complexity of radio frequency circuits increases, the generation of macromodels for circuit blocks that can be used in system simulations has become increasingly useful and even necessary. Recently X-parameters1 have been proposed as an extension to the concept of S-Parameters in order to create a macromodel that captures some of the key nonlinearities in the circuit. In this paper, an efficient semi-analytical approach for the computation of X-parameters is presented. More specifically, a clear relation between the X-parameters and the circuit moments is developed, which in turn facilitates the application of moments to further improve the efficiency of X-parameter generation.
{"title":"Simulation based generation of X-parameters using the harmonic balance first moment","authors":"Raffi Toukhtarian, D. Tannir, F. Nabki, R. Khazaka","doi":"10.1109/EDAPS.2016.7893161","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893161","url":null,"abstract":"As the complexity of radio frequency circuits increases, the generation of macromodels for circuit blocks that can be used in system simulations has become increasingly useful and even necessary. Recently X-parameters1 have been proposed as an extension to the concept of S-Parameters in order to create a macromodel that captures some of the key nonlinearities in the circuit. In this paper, an efficient semi-analytical approach for the computation of X-parameters is presented. More specifically, a clear relation between the X-parameters and the circuit moments is developed, which in turn facilitates the application of moments to further improve the efficiency of X-parameter generation.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127920452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893142
Youngbong Han, H. Huynh, Soyoung Kim
As the market of wearable and internet of things (IoT) expands, there is a strong demand of shrinking the size of System-on-Package (SoP). In this paper, we propose a new electromagnetic bandgap structure (EBG) to mitigate the noise coupling within SoPs. EBGs have been widely used in printed circuit boards (PCB). Thus, the EBG size reduction is critical for integrating it in the package. The proposed structure has a unique noise suppressing pinwheel meander perforated plane structure (PMPP) that can be used in small size package. Critical problem of EBG's size reduction is shifting the suppression frequency to higher. Therefore, we propose to combine the EBG structure, meander-line, and pinwheel shaped patch to reduce size of EBG unit cell from 12.2mm×12.2mm to 2.44mm×2.44mm while maintaining the suppression frequency and bandwidth. The stop band bandwidth of proposed structure is 3.58∼12.83GHz.
{"title":"A new pinwheel meander-perforated plane structure for noise suppression in system-on-package","authors":"Youngbong Han, H. Huynh, Soyoung Kim","doi":"10.1109/EDAPS.2016.7893142","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893142","url":null,"abstract":"As the market of wearable and internet of things (IoT) expands, there is a strong demand of shrinking the size of System-on-Package (SoP). In this paper, we propose a new electromagnetic bandgap structure (EBG) to mitigate the noise coupling within SoPs. EBGs have been widely used in printed circuit boards (PCB). Thus, the EBG size reduction is critical for integrating it in the package. The proposed structure has a unique noise suppressing pinwheel meander perforated plane structure (PMPP) that can be used in small size package. Critical problem of EBG's size reduction is shifting the suppression frequency to higher. Therefore, we propose to combine the EBG structure, meander-line, and pinwheel shaped patch to reduce size of EBG unit cell from 12.2mm×12.2mm to 2.44mm×2.44mm while maintaining the suppression frequency and bandwidth. The stop band bandwidth of proposed structure is 3.58∼12.83GHz.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"417 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133251938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893135
K. Sharma, S. Agili, Stephen B. Smith
Differentially-routed traces on printed circuit boards typically incorporate loose in-pair coupling when compared to the coupling between the traces and the ground planes. Loose coupling facilitates in-pair skew correction without affecting the differential-mode impedance. However, practical channels combine printed circuit boards with other components that have different degrees of in-pair coupling which could affect the crosstalk among adjacent pairs. This paper examines the effects of different degrees of in-pair coupling on near end crosstalk in the absence of in-pair skew. The analysis will help printed circuit board designers to choose the desired degree of in-pair coupling to achieve targeted near end crosstalk performance.
{"title":"Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs","authors":"K. Sharma, S. Agili, Stephen B. Smith","doi":"10.1109/EDAPS.2016.7893135","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893135","url":null,"abstract":"Differentially-routed traces on printed circuit boards typically incorporate loose in-pair coupling when compared to the coupling between the traces and the ground planes. Loose coupling facilitates in-pair skew correction without affecting the differential-mode impedance. However, practical channels combine printed circuit boards with other components that have different degrees of in-pair coupling which could affect the crosstalk among adjacent pairs. This paper examines the effects of different degrees of in-pair coupling on near end crosstalk in the absence of in-pair skew. The analysis will help printed circuit board designers to choose the desired degree of in-pair coupling to achieve targeted near end crosstalk performance.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130297610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893137
Sangyeol Oh, B. Shin, Jaehyuk Lim, Seungjin Lee, Jaehoon Lee
In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below −20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.
{"title":"Differential-to-common mode conversion noise suppression with unit cell EBG structure for bended differential lines","authors":"Sangyeol Oh, B. Shin, Jaehyuk Lim, Seungjin Lee, Jaehoon Lee","doi":"10.1109/EDAPS.2016.7893137","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893137","url":null,"abstract":"In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below −20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"726 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121803604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893110
Shinyoung Park, Jinwook Song, Subin Kim, Manho Lee, Jonghoon J. Kim, Joungho Kim
In this paper, we first propose a ground network model of an arbitrary shaped multi-layer printed circuit board (PCB)/chassis for accurate and efficient analysis of audio frequency ground noise coupled from a time division multiple access (TMDA) RF power amplifier (PA) to an audio circuit in a smartphone system. We designed test vehicles with varied extent in the ground noise coupling. We successfully verified the proposed model by comparing the ground noise coupling levels obtained from the model, 3-D electromagnetic (EM) simulation and measurement in time and frequency domain. We further discussed the performance of the proposed model by comparing the accuracy of its transfer ground impedance (ZG12) and analysis time with those of from the EM simulation. The proposed model showed high performance with the ZG12 agreed 91.7 % with the EM simulation, and the analysis time 95.5 % reduced compared to the simulation.
{"title":"Audio frequency ground integrity modeling and measurement for a TDMA smartphone system","authors":"Shinyoung Park, Jinwook Song, Subin Kim, Manho Lee, Jonghoon J. Kim, Joungho Kim","doi":"10.1109/EDAPS.2016.7893110","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893110","url":null,"abstract":"In this paper, we first propose a ground network model of an arbitrary shaped multi-layer printed circuit board (PCB)/chassis for accurate and efficient analysis of audio frequency ground noise coupled from a time division multiple access (TMDA) RF power amplifier (PA) to an audio circuit in a smartphone system. We designed test vehicles with varied extent in the ground noise coupling. We successfully verified the proposed model by comparing the ground noise coupling levels obtained from the model, 3-D electromagnetic (EM) simulation and measurement in time and frequency domain. We further discussed the performance of the proposed model by comparing the accuracy of its transfer ground impedance (ZG12) and analysis time with those of from the EM simulation. The proposed model showed high performance with the ZG12 agreed 91.7 % with the EM simulation, and the analysis time 95.5 % reduced compared to the simulation.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127437977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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