Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893110
Shinyoung Park, Jinwook Song, Subin Kim, Manho Lee, Jonghoon J. Kim, Joungho Kim
In this paper, we first propose a ground network model of an arbitrary shaped multi-layer printed circuit board (PCB)/chassis for accurate and efficient analysis of audio frequency ground noise coupled from a time division multiple access (TMDA) RF power amplifier (PA) to an audio circuit in a smartphone system. We designed test vehicles with varied extent in the ground noise coupling. We successfully verified the proposed model by comparing the ground noise coupling levels obtained from the model, 3-D electromagnetic (EM) simulation and measurement in time and frequency domain. We further discussed the performance of the proposed model by comparing the accuracy of its transfer ground impedance (ZG12) and analysis time with those of from the EM simulation. The proposed model showed high performance with the ZG12 agreed 91.7 % with the EM simulation, and the analysis time 95.5 % reduced compared to the simulation.
{"title":"Audio frequency ground integrity modeling and measurement for a TDMA smartphone system","authors":"Shinyoung Park, Jinwook Song, Subin Kim, Manho Lee, Jonghoon J. Kim, Joungho Kim","doi":"10.1109/EDAPS.2016.7893110","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893110","url":null,"abstract":"In this paper, we first propose a ground network model of an arbitrary shaped multi-layer printed circuit board (PCB)/chassis for accurate and efficient analysis of audio frequency ground noise coupled from a time division multiple access (TMDA) RF power amplifier (PA) to an audio circuit in a smartphone system. We designed test vehicles with varied extent in the ground noise coupling. We successfully verified the proposed model by comparing the ground noise coupling levels obtained from the model, 3-D electromagnetic (EM) simulation and measurement in time and frequency domain. We further discussed the performance of the proposed model by comparing the accuracy of its transfer ground impedance (ZG12) and analysis time with those of from the EM simulation. The proposed model showed high performance with the ZG12 agreed 91.7 % with the EM simulation, and the analysis time 95.5 % reduced compared to the simulation.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127437977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893137
Sangyeol Oh, B. Shin, Jaehyuk Lim, Seungjin Lee, Jaehoon Lee
In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below −20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.
{"title":"Differential-to-common mode conversion noise suppression with unit cell EBG structure for bended differential lines","authors":"Sangyeol Oh, B. Shin, Jaehyuk Lim, Seungjin Lee, Jaehoon Lee","doi":"10.1109/EDAPS.2016.7893137","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893137","url":null,"abstract":"In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below −20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"726 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121803604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893114
Ting-Yi Lin, Tzong-Lin Wu
A compact balanced bandpass filter using two types of LC resonator and quarter-wavelength resonator is proposed in this paper. By taking the advantage of the property of quarter-wavelength resonator and symmetry of the proposed circuit, a bandpass response can be achieved while the band stop response can be achieved at the same frequency band. Parallel LC resonator shunt to the ground is used for the differential bandpass response and series LC resonator shunt to the ground via a resistor is used for the common-mode suppression response. For the purpose of a non-reflected suppression of the common mode noise, a resistor matching to the port impedance is connected to the end of a series LC resonator. By doing so, a single frequency point common-mode noise suppression can be achieved at the desired band. The proposed circuit is analyzed and experimented carefully. The validity of this structure is demonstrated by the experiment result on a 2.4GHz filter.
{"title":"Balanced bandpass filter with reflectionless common-mode suppression","authors":"Ting-Yi Lin, Tzong-Lin Wu","doi":"10.1109/EDAPS.2016.7893114","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893114","url":null,"abstract":"A compact balanced bandpass filter using two types of LC resonator and quarter-wavelength resonator is proposed in this paper. By taking the advantage of the property of quarter-wavelength resonator and symmetry of the proposed circuit, a bandpass response can be achieved while the band stop response can be achieved at the same frequency band. Parallel LC resonator shunt to the ground is used for the differential bandpass response and series LC resonator shunt to the ground via a resistor is used for the common-mode suppression response. For the purpose of a non-reflected suppression of the common mode noise, a resistor matching to the port impedance is connected to the end of a series LC resonator. By doing so, a single frequency point common-mode noise suppression can be achieved at the desired band. The proposed circuit is analyzed and experimented carefully. The validity of this structure is demonstrated by the experiment result on a 2.4GHz filter.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"84 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130630780","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893111
A. Engin, I. Ndip, K. Lang, J. Aguirre
Power/ground planes are used for low IR-drop and inductance, but they also cause switching noise coupling globally across chip packages and printed circuit boards. The switching noise coupling is a concern for mixed-signal boards, high-speed I/Os, and electromagnetic compatibility. In GHz frequency regime, switching noise cannot be controlled by off-chip discrete decoupling capacitors due to their inductance. In this paper we introduce the non-overlapping power/ground planes design methodology for filtering of GHz power plane noise. Unlike existing approaches, our approach is simple, has wide bandwidth, and does not increase IR-drop or inductance.
{"title":"Non-overlapping power/ground planes for localized power distribution network design","authors":"A. Engin, I. Ndip, K. Lang, J. Aguirre","doi":"10.1109/EDAPS.2016.7893111","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893111","url":null,"abstract":"Power/ground planes are used for low IR-drop and inductance, but they also cause switching noise coupling globally across chip packages and printed circuit boards. The switching noise coupling is a concern for mixed-signal boards, high-speed I/Os, and electromagnetic compatibility. In GHz frequency regime, switching noise cannot be controlled by off-chip discrete decoupling capacitors due to their inductance. In this paper we introduce the non-overlapping power/ground planes design methodology for filtering of GHz power plane noise. Unlike existing approaches, our approach is simple, has wide bandwidth, and does not increase IR-drop or inductance.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116562340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893143
Junjie Li, T. Shi, Xing Yu, Chaoliang Cheng, Jinhu Fan, G. Liao, Zirong Tang
In this paper, a novel Cu-Cu bonding method with Ag doped Cu nanosolder paste is proposed. The Cu nanoparticles were synthesized with an efficient method, and the nanosolder paste was fabricated by mixing synthesized Cu nanoparticles, commercial used Ag nanoparticles and organic solution. The shear strengths of Cu-Cu bonding with Ag doped Cu nanosolder paste and pure Cu nanosolder paste at the bonding temperature of 250 °C have been compared, and the highest shear strength in this work could achieve 20.32 MPa, which is suitable for 3D-IC packaging industry. The good performance showed by Ag doped Cu nanosolder paste makes it become a promising substitute of traditional Sn-Ag-Cu solder.
{"title":"Low temperature and low pressure Cu-Cu bonding with Ag doped Cu nanosolder paste","authors":"Junjie Li, T. Shi, Xing Yu, Chaoliang Cheng, Jinhu Fan, G. Liao, Zirong Tang","doi":"10.1109/EDAPS.2016.7893143","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893143","url":null,"abstract":"In this paper, a novel Cu-Cu bonding method with Ag doped Cu nanosolder paste is proposed. The Cu nanoparticles were synthesized with an efficient method, and the nanosolder paste was fabricated by mixing synthesized Cu nanoparticles, commercial used Ag nanoparticles and organic solution. The shear strengths of Cu-Cu bonding with Ag doped Cu nanosolder paste and pure Cu nanosolder paste at the bonding temperature of 250 °C have been compared, and the highest shear strength in this work could achieve 20.32 MPa, which is suitable for 3D-IC packaging industry. The good performance showed by Ag doped Cu nanosolder paste makes it become a promising substitute of traditional Sn-Ag-Cu solder.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130325186","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893138
H. Huynh, S. Joo, Soyoung Kim
In this paper, the EMI problem of the DC-DC converter is discussed. The power spectrums of the DC-DC converter's nodes are analyzed and the noise scanner method is used to prove that the switching node of the DC-DC converter is the dominant source of EMI. To reduce EMI of DC-DC converters, frequency hopping technique can be applied. The DC-DC converter with frequency hopping technique is fabricated using 180nm CMOS process. The test chip results by IC-stripline and noise scanner methods show a significant improvement in EMI. The EMI reduction amount is 6.87 dB at fundamental switching frequency by applying the frequency hopping technique with IC-stripline measurement.
{"title":"An experimental study of EMI reduction of DC-DC converter with frequency hopping technique","authors":"H. Huynh, S. Joo, Soyoung Kim","doi":"10.1109/EDAPS.2016.7893138","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893138","url":null,"abstract":"In this paper, the EMI problem of the DC-DC converter is discussed. The power spectrums of the DC-DC converter's nodes are analyzed and the noise scanner method is used to prove that the switching node of the DC-DC converter is the dominant source of EMI. To reduce EMI of DC-DC converters, frequency hopping technique can be applied. The DC-DC converter with frequency hopping technique is fabricated using 180nm CMOS process. The test chip results by IC-stripline and noise scanner methods show a significant improvement in EMI. The EMI reduction amount is 6.87 dB at fundamental switching frequency by applying the frequency hopping technique with IC-stripline measurement.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"159 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116422238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893118
Chun-Wen Lin, Chi-Kai Shen, Tzong-Lin Wu
An absorptive frequency selective surface (AFSS) which allows signals transmitted in some specific bands is proposed. The transmitting characteristic is rare among AFSS design in the past and can be used to shield the whole package of mixed signal systems. The proposed AFSS provides above 97% absorption at 5.6 GHz in the Wi-Fi band and allows at least half power transmission below 1.84 GHz and above 8.95 GHz, which covers GPS band, most of GSM bands and X-band. Additionally, the proposed work is polarization independent and stable for oblique incident waves up to 45 degrees for both TE and TM polarizations. It is worth to note that clear design concepts and closed-form formulae based on a simple equivalent circuit model are provided, as well as useful design procedures.
{"title":"Design and modeling of an absorptive frequency selective surface with several transmissive bands","authors":"Chun-Wen Lin, Chi-Kai Shen, Tzong-Lin Wu","doi":"10.1109/EDAPS.2016.7893118","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893118","url":null,"abstract":"An absorptive frequency selective surface (AFSS) which allows signals transmitted in some specific bands is proposed. The transmitting characteristic is rare among AFSS design in the past and can be used to shield the whole package of mixed signal systems. The proposed AFSS provides above 97% absorption at 5.6 GHz in the Wi-Fi band and allows at least half power transmission below 1.84 GHz and above 8.95 GHz, which covers GPS band, most of GSM bands and X-band. Additionally, the proposed work is polarization independent and stable for oblique incident waves up to 45 degrees for both TE and TM polarizations. It is worth to note that clear design concepts and closed-form formulae based on a simple equivalent circuit model are provided, as well as useful design procedures.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121006716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893136
Z. Zhou, X. Huang, M. Tong
We propose a three dimensional circuit model that is used for characterizing big power nets in complex flip chip packages. The model is based on block division of a multilayered package. Besides, the model breaks the package into three parts along the z-dimension according to layer stack ups. The model parameters can be evaluated individually and thus rapidly by using commercial software. The model is easy to maintain and update by reassigning power grid.
{"title":"A 3D circuit model for power distribution networks in complex package structures","authors":"Z. Zhou, X. Huang, M. Tong","doi":"10.1109/EDAPS.2016.7893136","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893136","url":null,"abstract":"We propose a three dimensional circuit model that is used for characterizing big power nets in complex flip chip packages. The model is based on block division of a multilayered package. Besides, the model breaks the package into three parts along the z-dimension according to layer stack ups. The model parameters can be evaluated individually and thus rapidly by using commercial software. The model is easy to maintain and update by reassigning power grid.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"31 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126003274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/edaps.2016.7893158
R. Achar, Ammar B. Kouki
{"title":"CAD techniques","authors":"R. Achar, Ammar B. Kouki","doi":"10.1109/edaps.2016.7893158","DOIUrl":"https://doi.org/10.1109/edaps.2016.7893158","url":null,"abstract":"","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121592965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/EDAPS.2016.7893134
Venkatesh Avula, A. Zadehgol
Frequency-domain models are often need to be converted to macromodels by approximating them as rational functions. Pole/Residue Equivalent System Solver (PRESS) is a method for such fitting of frequency response as poles/residues. In this paper, a modified PRESS method using non-consecutive sample subset based local fitting is presented. The proposed method reduces the number of iterations required, consequently improving the model order. A test case of package — signal and power plane interconnects — is demonstrated. The results show that the proposed method generates compact macromodels.
{"title":"Coarse-to-fine malleable Pole/Residue Equivalent System Solver (COMPRESS)","authors":"Venkatesh Avula, A. Zadehgol","doi":"10.1109/EDAPS.2016.7893134","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893134","url":null,"abstract":"Frequency-domain models are often need to be converted to macromodels by approximating them as rational functions. Pole/Residue Equivalent System Solver (PRESS) is a method for such fitting of frequency response as poles/residues. In this paper, a modified PRESS method using non-consecutive sample subset based local fitting is presented. The proposed method reduces the number of iterations required, consequently improving the model order. A test case of package — signal and power plane interconnects — is demonstrated. The results show that the proposed method generates compact macromodels.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127816797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：