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Voltage Controlled Magnetic Anisotropy at Fe 1- x Co x Pd/MgO Interface 电压控制fe1 - x Co x Pd/MgO界面磁各向异性
Pub Date : 2017-08-08 DOI: 10.7567/ssdm.2017.k-8-05
A. Shukla, M. Goto, K. Nawaoka, Joko Suwardy, S. Miwa, Yoshikazu Suzuki
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引用次数: 0
Lowering Minimum Operation Voltage (V min ) in SRAM Array by Post-Fabrication Self-Improvement of Cell Stability by Multiple Stress Application 通过多重应力提高电池稳定性,降低SRAM阵列的最小工作电压
Pub Date : 2017-08-08 DOI: 10.7567/ssdm.2017.e-5-04
T. Mizutani, K. Takeuchi, T. Saraya, M. Kobayashi, T. Hiramoto
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引用次数: 0
Evaluation of Hall Effect Mobility for SiC MOSFETs with Increasing Nitrogen Implantation into Channel Region 沟道区氮注入增加对SiC mosfet霍尔效应迁移率的影响
Pub Date : 2017-08-08 DOI: 10.7567/SSDM.2017.PS-14-09
M. Noguchi
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引用次数: 0
Effect of Surface Roughness of Trench Sidewalls on Channel Mobility in 4H-SiC Trench MOSFETs 沟槽侧壁表面粗糙度对4H-SiC沟槽mosfet沟道迁移率的影响
Pub Date : 2017-08-08 DOI: 10.7567/ssdm.2017.o-1-06
K. Kutsuki
Abstract The effect of the surface roughness of trench sidewalls on electrical properties have been investigated for improving channel mobility in 4H-SiC trench MOSFETs. The surface roughness was evaluated by atomic force microscopy (AFM). The characteristics of channel mobility were analyzed based on the mobility model including optical phonon scattering. The results revealed that surface roughness scattering had small contribution to channel mobility, and there was no correlation between the experimental RMS values and surface roughness scattering. On the other hand, it was necessary to pay attention to the surface morphology from the view point of device reliability.
为了提高4H-SiC沟槽mosfet的沟道迁移率,研究了沟槽侧壁表面粗糙度对电学性能的影响。采用原子力显微镜(AFM)对表面粗糙度进行了评价。基于包含光学声子散射的迁移率模型,分析了通道迁移率特性。结果表明,表面粗糙度散射对通道迁移率的影响较小,实验均方根值与表面粗糙度散射之间不存在相关性。另一方面,从器件可靠性的角度出发,需要注意表面形貌。
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引用次数: 0
Dependence of Channel Mobility on Substrate Impurity Concentration for Metal Source/Drain Ge MOSFETs 金属源极/漏极Ge mosfet沟道迁移率与衬底杂质浓度的关系
Pub Date : 2017-08-08 DOI: 10.7567/ssdm.2017.k-3-06
T. Sakaguchi
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引用次数: 0
[No-show]Paramagnetic Property in Two-Dimensional Titanium Carbides via Surface Modifications 基于表面改性的二维碳化钛的顺磁性能
Pub Date : 2017-08-08 DOI: 10.7567/SSDM.2017.PS-13-18
Y. Yoon
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引用次数: 0
Normally-off MOSFET Properties Fabricated on Mg Implanted GaN Layers 在Mg注入GaN层上制备正常关断的MOSFET特性
Pub Date : 2017-08-08 DOI: 10.7567/SSDM.2017.PS-14-10
S. Takashima, K. Ueno, R. Tanaka, H. Matsuyama, M. Edo, K. Nakagawa
Normally-off MOSFET properties fabricated on Mg implanted GaN layers 富士電機 1, 山梨大 2 高島信也 ,上野勝典 ,田中亮 ,松山秀昭 ,江戸雅晴 , 中川清和 2 Fuji Electric, Univ. of Yamanashi Shinya Takashima, Katsunori Ueno, Ryo Tanaka, Hideaki Matsuyama, Masaharu Edo, Kiyokazu Nakagawa E-mail: takashima-shinya@fujielectric.com [はじめに] GaN 系 FET は GaN の優れた物性値から次世代の低損失パワースイッチング素子とし て期待され、近年は自立基板の普及に伴い縦型パワーデバイス実現に向けた研究開発が活発に進 められている。パワー用途でのスイッチングデバイスには絶縁ゲート駆動でノーマリーオフ型が 望まれ、これらを実現可能な MOS チャネルの特性制御は重要な要素技術である。我々は、これまで に p型GaNエピ層上にてMg濃度によるMOSFET特性制御が可能であることを明らかにした[1]。 縦型 MOSFET 実現に向けては、イオン注入により形成した p型層の適用が好ましい。そこで、本 発表では、Mg注入 GaN層上にて形成した横型MOSFET の特性を報告する。 [実験方法] +c面 n-GaN自立基板上 undope-GaNエピに、500 nm深さまで 1×10 cm濃度となる BOXプロファイルにてMg を全面にイオン注入し、1200~1400°Cで活性化熱処理を行った。その 後、n+ソース/ドレイン領域に Siをイオン注入し、1100°Cで活性化処理を行った。ゲート絶縁膜と して、TEOS を用いたリモートプラズマ CVD 法で SiO2 100 nmを成膜し、アルミ電極を形成して図 1 に示す横型 MOSFET を Mg注入層上に作製した。 [結果] 作製した横型 MOSFET の Id-Vg特性を図 2 に示す。しきい値が約 10 V のノーマリーオフ MOSFET 動作が確認された。Idは Mg 活性化温度を上げるに従い増加した。Id-Vg特性から算出し た電界効果移動度カーブを図 3 に示す。活性化処理温度が高いほど移動度が向上し、1400°C活性 化処理層上では約 50 cm/Vsに達した。詳細については当日議論する。 [謝辞] 本研究の一部は、総合科学技術・イノベーション会議の SIP(戦略的イノベーション創造 プログラム)「次世代パワーエレクトロニクス」(管理法人:NEDO)によって実施されました。 [1] S. Takashima et al., International Workshop on Nitride Semiconductors, C0.5.03 (2016).
Normally-off MOSFET properties fabricated on Mg implanted GaN layers富士电机1,山梨大2高岛信也,上野胜典,田中亮,松山秀昭,江户雅晴,中川清和2 Fuji Electric, Univ. of Yamanashi Shinya Takashima,Katsunori Ueno, Ryo Tanaka, Hideaki Matsuyama, Masaharu Edo, Kiyokazu Nakagawa邮箱:takashima-shinya@fujielectric.com[前言]GaN基FET是由于GaN的优异物性值而成为新一代低损耗功率开关元件近年来,随着自立基板的普及,面向实现纵向功率器件的研究开发取得了积极进展。功率应用中的开关器件需要采用绝缘门驱动的普通断开型,能够实现这些的MOS信道特性控制是关键技术。到目前为止,我们已经发现在p型GaN依比层上可以实现基于Mg浓度的MOSFET特性控制[1]。为了实现立式MOSFET,应用离子注入形成的p型层是首选。因此,本报告报告了在Mg注入GaN层上形成的横向MOSFET的特性。在c面n-GaN自立底板上的undope-GaN衬底上,在1×10厘米浓度的BOX配置文件中,直到500nm, Mg全面注入离子,在1200~1400°C进行活化热处理。然后,在n+源极/漏极区域注入离子Si,在1100°C进行激活处理。作为栅极绝缘膜,使用TEOS的远程等离子CVD方法将SiO2 100nm沉积,形成铝电极,在Mg注入层上制备如图1所示的横向MOSFET。[结果]所制备的横向MOSFET的Id-Vg特性如图2所示。确认了阈值约为10v的正常截止MOSFET操作。Id随着Mg激活温度的升高而增加。根据Id-Vg特性计算出的场效应移动性曲线如图3所示。激活处理温度越高迁移率越高,在1400°C激活处理层上迁移率达到约50cm /Vs。详细内容将在当天讨论。[致谢]本研究的一部分是由综合科学技术创新会议的SIP(战略性创新创造计划)“新一代电力电子”(管理法人:NEDO)实施的。[1] S. Takashima et al., Nitride Semiconductors国际工作坊,c0.5.03(2016)。
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引用次数: 1
[No-Show]Mid-Infrared Si-photonic Devices Based on 340 nm SOI Platform 基于340nm SOI平台的中红外硅光子器件
Pub Date : 2017-07-28 DOI: 10.7567/SSDM.2017.H-8-03
H. Wang
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引用次数: 0
Comprehensive Analysis of Low-frequency Noise Variability Components in Bulk and FDSOI (SOTB) MOSFETs 体和FDSOI (SOTB) mosfet中低频噪声变异性成分的综合分析
Pub Date : 2017-07-28 DOI: 10.7567/SSDM.2017.E-1-02
K. Maekawa, H. Makiyama, Yoshiki Yamamoto, T. Hasegawa, S. Okanishi, K. Sonoda, H. Shinkawata, T. Yamashita, S. Kamohara, Y. Yamaguchi
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引用次数: 0
Voltage-Control Spintronics Memory (VoCSM) having a potential of high write-efficiency 电压控制自旋电子学存储器(VoCSM)具有高写入效率的潜力
Pub Date : 2017-07-28 DOI: 10.7567/SSDM.2017.A-6-01
M. Shimizu
We designed a voltage-control spintronics memory unit-cell, VoCSM, with high write-efficiency to prove a potential to reduce writing energy per bit. By optimizing a self-aligned spin-Hall structure, the cell has the critical switching current (Ic) of 200 μA at 20 nsec for an MTJ size of 50×150 nm 2 . The value is comparable to that for matured STT-MRAM with the similar dimension. By applying a voltage to the MTJ, Ic was modulated due to the voltage-controlled magnetic anisotropy (VCMA) effect and the Ic reduction was 50 μA at -0.8 V. It is concluded that using both the spin Hall effect and the VCMA effect, the VoCSM has a potential of high write-efficiency.
我们设计了一种电压控制自旋电子学存储单元,VoCSM,具有高写入效率,证明了降低每比特写入能量的潜力。通过优化自对准自旋-霍尔结构,该电池在20 nsec下的临界开关电流(Ic)为200 μA, MTJ尺寸为50×150 nm 2。该数值与相同尺寸的成熟STT-MRAM相当。通过对MTJ施加电压,利用压控磁各向异性(VCMA)效应对Ic进行调制,在-0.8 V时Ic降低了50 μA。结果表明,利用自旋霍尔效应和VCMA效应,VoCSM具有较高的写入效率。
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引用次数: 0
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