Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484358
M. Aardal
What is CIM? What is the role of CIM in manufacturing? What is the value of CIM and how can it be measured? How much CIM do we need? How can the impact of CIM be communicated to manufacturing management? SEMATECH and its member companies have been wrestling with these questions for several years. Several programs have addressed these questions and, as a result, we are in a much better position to provide the answers. Leveraging the results of SEMATECH programs and other related works, this paper introduces a new "model based" approach to the challenge of comprehensively explaining CIM and its impact on manufacturing. This CIM model is being developed at SEMATECH and is entitled the CIM Evolution Model (CEM).
{"title":"A model of CIM","authors":"M. Aardal","doi":"10.1109/ASMC.1995.484358","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484358","url":null,"abstract":"What is CIM? What is the role of CIM in manufacturing? What is the value of CIM and how can it be measured? How much CIM do we need? How can the impact of CIM be communicated to manufacturing management? SEMATECH and its member companies have been wrestling with these questions for several years. Several programs have addressed these questions and, as a result, we are in a much better position to provide the answers. Leveraging the results of SEMATECH programs and other related works, this paper introduces a new \"model based\" approach to the challenge of comprehensively explaining CIM and its impact on manufacturing. This CIM model is being developed at SEMATECH and is entitled the CIM Evolution Model (CEM).","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126749689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484359
E. Schorn-DiSalvi, R. Liquigan, B. Peters, J.S. Smith
Considerable academic research has investigated the topic of scheduling in manufacturing systems. This research investigates the available academic literature and commercial scheduling systems with respect to their applicability in semiconductor manufacturing systems. It recommends a design of an "intelligent scheduler" that attempts to use global information about the fab status and combines the applicable analytical methods from the academic literature with a simulation based evaluation tool into a decision support environment.
{"title":"Development of an intelligent scheduler for semiconductor manufacturing facilities","authors":"E. Schorn-DiSalvi, R. Liquigan, B. Peters, J.S. Smith","doi":"10.1109/ASMC.1995.484359","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484359","url":null,"abstract":"Considerable academic research has investigated the topic of scheduling in manufacturing systems. This research investigates the available academic literature and commercial scheduling systems with respect to their applicability in semiconductor manufacturing systems. It recommends a design of an \"intelligent scheduler\" that attempts to use global information about the fab status and combines the applicable analytical methods from the academic literature with a simulation based evaluation tool into a decision support environment.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"363 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115977623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484374
H. Benson-Woodward, E. Hanson, S. Moreau
A step-by-step control methodology for targeting and controlling plasma enhanced tetraethylorthosilicate (PETEOS) and phosphosilicate glass (PSG) deposition processes in a single wafer PECVD chamber has been developed. Initially, PSG and PETEOS processes were characterized using two full factorial design of experiments processed through a single CVD reaction chamber utilizing RF power, TEOS ampule temperature, electrode spacing and TMP flow as the control factors, and deprate, film uniformity, film stress, and wt%phos content of the PSG film as responses. Based upon results obtained from the RS/1 analysis of both DOEs, additional experiments were processed to investigate the interactions of significant effects for both films. Using this information, a process control hierarchy was developed for the PETEOS process in the order of adjustment electrode spacing, TEOS ampule temperature and RF power to center PETEOS uniformity, deprate and stress. A similar hierarchy was developed for PSG. Generous limits were established to control the PSG process until long-term interactions between the two processes could be defined. Once these effects were characterized, a combined process methodology for both processes was developed, and PSG control limits for deprate were reduced by +/-50%. The final step was the organization of the combined methodology into a step-by-step procedure for targeting both PETEOS and PSG processes simultaneously. Benefits of this method of process control include increased compliance to SPC limits for both processes and a reduction in the amount of time required for problem troubleshooting.
{"title":"Process control methodology for PSG and PETEOS films in a highly interactive multiprocess CVD system","authors":"H. Benson-Woodward, E. Hanson, S. Moreau","doi":"10.1109/ASMC.1995.484374","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484374","url":null,"abstract":"A step-by-step control methodology for targeting and controlling plasma enhanced tetraethylorthosilicate (PETEOS) and phosphosilicate glass (PSG) deposition processes in a single wafer PECVD chamber has been developed. Initially, PSG and PETEOS processes were characterized using two full factorial design of experiments processed through a single CVD reaction chamber utilizing RF power, TEOS ampule temperature, electrode spacing and TMP flow as the control factors, and deprate, film uniformity, film stress, and wt%phos content of the PSG film as responses. Based upon results obtained from the RS/1 analysis of both DOEs, additional experiments were processed to investigate the interactions of significant effects for both films. Using this information, a process control hierarchy was developed for the PETEOS process in the order of adjustment electrode spacing, TEOS ampule temperature and RF power to center PETEOS uniformity, deprate and stress. A similar hierarchy was developed for PSG. Generous limits were established to control the PSG process until long-term interactions between the two processes could be defined. Once these effects were characterized, a combined process methodology for both processes was developed, and PSG control limits for deprate were reduced by +/-50%. The final step was the organization of the combined methodology into a step-by-step procedure for targeting both PETEOS and PSG processes simultaneously. Benefits of this method of process control include increased compliance to SPC limits for both processes and a reduction in the amount of time required for problem troubleshooting.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"109 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130660073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484332
W. Rowe
Summary form only given. Controlling the rapidly increasing costs of semiconductor wafer fabricators presents a serious challenge to the semiconductor industry. SEMATECH, in cooperation with its members and SEMI/SEMATECH suppliers has developed a methodology to maintain the historic price per function decline rate for semiconductor products. A series of 0.25 micron generation fab cost models were developed at SEMATECH. The models incorporated advanced logic and DRAM processes, operational and financial inputs and equipment cost and performance goals. Wafer processing costs from the model were compared to affordable costs developed by the SEMATECH Competitive Analysis Group. The result of this process has been a set of mutually agreed upon cost and performance targets for the 0.25 micron generation of equipment. Equipment meeting those targets will be more cost effective than that currently available. High operating efficiency as measured by overall equipment effectiveness (OEE) is essential to achieving improved capital productivity goals.
{"title":"Capital productivity-challenge and opportunity","authors":"W. Rowe","doi":"10.1109/ASMC.1995.484332","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484332","url":null,"abstract":"Summary form only given. Controlling the rapidly increasing costs of semiconductor wafer fabricators presents a serious challenge to the semiconductor industry. SEMATECH, in cooperation with its members and SEMI/SEMATECH suppliers has developed a methodology to maintain the historic price per function decline rate for semiconductor products. A series of 0.25 micron generation fab cost models were developed at SEMATECH. The models incorporated advanced logic and DRAM processes, operational and financial inputs and equipment cost and performance goals. Wafer processing costs from the model were compared to affordable costs developed by the SEMATECH Competitive Analysis Group. The result of this process has been a set of mutually agreed upon cost and performance targets for the 0.25 micron generation of equipment. Equipment meeting those targets will be more cost effective than that currently available. High operating efficiency as measured by overall equipment effectiveness (OEE) is essential to achieving improved capital productivity goals.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128732501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484343
Scott Edward Beck, A. G. Gilicinski
A variety of surface analytical tools are currently available. With each of these tools come hidden pitfalls that one map encounter in the process of doing surface analysis. Examples of the use of X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), total reflection X-ray fluorescence (TXRF), and atomic force microscopy (AFM) in the development of a novel vapor phase cleaning methodology are used to illustrate many of these pitfalls. Suggestions are made to assist users of these techniques in avoiding these pitfalls.
{"title":"Avoiding the pitfalls in the use of surface analysis in the IC industry","authors":"Scott Edward Beck, A. G. Gilicinski","doi":"10.1109/ASMC.1995.484343","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484343","url":null,"abstract":"A variety of surface analytical tools are currently available. With each of these tools come hidden pitfalls that one map encounter in the process of doing surface analysis. Examples of the use of X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), total reflection X-ray fluorescence (TXRF), and atomic force microscopy (AFM) in the development of a novel vapor phase cleaning methodology are used to illustrate many of these pitfalls. Suggestions are made to assist users of these techniques in avoiding these pitfalls.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134150489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484369
K. Kanzawa, J. Kitano
Pollutants which are said to affect LSI yields include not only particles, but also gaseous chemicals. As semiconductor devices are recently miniaturized and highly integrated, great importance is placed on the control and elimination of chemicals, such as a trace of ions and organic substances, that arise from clean rooms, manufacturing equipment components, agents, gases, people, and whatever exists in manufacturing environments. As an example, let us consider the NH/sub 3/ component in clean rooms. Since this component raises problems with the use of chemically amplified resists (hereinafter referred to as CA resists) and could cause the generation of post-process particles in some film forming equipment, the NH/sub 3/ concentration in the process environment must be reduced. The use of chemical filters is of help as a means for removing such gaseous chemicals. However, since the clean room environment is in a wide range of variety, it is necessary to understand various characteristics of chemical filters as used in various conditions (including the pollutant concentration, humidity, and other factors in the clean room). It is expected that local measures, including a means for satisfying cost reduction requirements, will be necessary for cleaning process environments. This means that greater importance will be placed on atmospheric pollution control technology that is aimed to assure stable operation of manufacturing equipment. This paper discusses our efforts for evaluating NH/sub 3/ eliminating filters and controlling ion pollution using these filters.
{"title":"A semiconductor device manufacturer's efforts for controlling and evaluating atmospheric pollution","authors":"K. Kanzawa, J. Kitano","doi":"10.1109/ASMC.1995.484369","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484369","url":null,"abstract":"Pollutants which are said to affect LSI yields include not only particles, but also gaseous chemicals. As semiconductor devices are recently miniaturized and highly integrated, great importance is placed on the control and elimination of chemicals, such as a trace of ions and organic substances, that arise from clean rooms, manufacturing equipment components, agents, gases, people, and whatever exists in manufacturing environments. As an example, let us consider the NH/sub 3/ component in clean rooms. Since this component raises problems with the use of chemically amplified resists (hereinafter referred to as CA resists) and could cause the generation of post-process particles in some film forming equipment, the NH/sub 3/ concentration in the process environment must be reduced. The use of chemical filters is of help as a means for removing such gaseous chemicals. However, since the clean room environment is in a wide range of variety, it is necessary to understand various characteristics of chemical filters as used in various conditions (including the pollutant concentration, humidity, and other factors in the clean room). It is expected that local measures, including a means for satisfying cost reduction requirements, will be necessary for cleaning process environments. This means that greater importance will be placed on atmospheric pollution control technology that is aimed to assure stable operation of manufacturing equipment. This paper discusses our efforts for evaluating NH/sub 3/ eliminating filters and controlling ion pollution using these filters.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"79 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131319347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484391
D. Abercrombie, R. Jacob, R. Meredorf, J. Warner, S. Murthy
Customer Linking, also known as Supply Chain Assessment, provides the opportunity to evaluate the entire supply chain, from the customer's needs through delivery and follow up of the final product. This type of assessment identifies imperfections that add unnecessary cost and cycle time to the entire supply chain. By eliminating redundant steps or redesigning steps to improve efficiencies, cost and cycle time can be reduced. Most supply chain assessment activities are internal. That is, they infrequently extend past the boundaries of a manufacturing or service organization. In order to fully understand what opportunities exist, it is key to look "outside the box" at each customer/supplier interface throughout the entire chain. For example, Du Pont Photomasks and Motorola are both suppliers and customers to each other, as far as flow of information and products are concerned. Motorola design groups supply circuit data to Du Pont Photomasks and Du Pont Photomasks supplies photomasks containing the circuit data images to Motorola fabs. As part of Du Pont Photomasks' re-engineering activities, a Customer Linking exercise was conducted with Motorola in December of 1993. This exercise attempted to examine the flow of information and products from Motorola's High Performance Embedded Systems Division in Oak Hill, TX, through Du Pont Photomasks' mask facilities and into Motorola's MOS-8 wafer fab in Austin, TX. This paper will share the procedures, results and findings of this assessment to illustrate the extreme need for improved customer/supplier relationships in critical path situations within the semiconductor industry.
{"title":"Customer linking: A Motorola/Du Pont Photomasks supply chain assessment","authors":"D. Abercrombie, R. Jacob, R. Meredorf, J. Warner, S. Murthy","doi":"10.1109/ASMC.1995.484391","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484391","url":null,"abstract":"Customer Linking, also known as Supply Chain Assessment, provides the opportunity to evaluate the entire supply chain, from the customer's needs through delivery and follow up of the final product. This type of assessment identifies imperfections that add unnecessary cost and cycle time to the entire supply chain. By eliminating redundant steps or redesigning steps to improve efficiencies, cost and cycle time can be reduced. Most supply chain assessment activities are internal. That is, they infrequently extend past the boundaries of a manufacturing or service organization. In order to fully understand what opportunities exist, it is key to look \"outside the box\" at each customer/supplier interface throughout the entire chain. For example, Du Pont Photomasks and Motorola are both suppliers and customers to each other, as far as flow of information and products are concerned. Motorola design groups supply circuit data to Du Pont Photomasks and Du Pont Photomasks supplies photomasks containing the circuit data images to Motorola fabs. As part of Du Pont Photomasks' re-engineering activities, a Customer Linking exercise was conducted with Motorola in December of 1993. This exercise attempted to examine the flow of information and products from Motorola's High Performance Embedded Systems Division in Oak Hill, TX, through Du Pont Photomasks' mask facilities and into Motorola's MOS-8 wafer fab in Austin, TX. This paper will share the procedures, results and findings of this assessment to illustrate the extreme need for improved customer/supplier relationships in critical path situations within the semiconductor industry.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131885715","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484405
K. Floyd
In early 1990, the IBM Microelectronics Division Semiconductor Manufacturing facility in Essex Junction, Vermont was operating eight-hour shifts around-the-clock. To reduce cost and fulfill an ever increasing demand for its products, it became imperative that this traditional three-shift operation be refocused to more efficiently maximize the use of the facility's physical assets and the effectiveness of its people. After studying the work schedules of numerous companies in the United States and Europe, it was determined that a 12-hour shift schedule would result in a significant reduction in overtime and increased productivity, both key goals of site management. To implement such a dramatic change of schedules, however, would require an in-depth understanding of its effect on employees and their families. To achieve such an understanding, manufacturing employees were asked to participate in round table discussions, opinion surveys and discussions with middle and first-level managers. Some of the areas examined were travel time to work, arrangements for child care, spousal work schedules, sleeping habits and the overall status of an individual's health. A pilot program was launched before actually changing schedules. Compensation adjustments were reviewed during this program to determine the most flexible and attractive approach for employees, one that: also contributed to overall savings for the corporation. This approach to compensation has been changed only once since its inception. During the first half of 1990, IBM's semiconductor fabricators began their migration to the 12-hour, alternate work schedules (AWS). Productivity improvements and overall benefits of an alternate work schedule relative to the IBM manufacturing community will also be reviewed.
{"title":"IBM alternate work schedules (AWS)","authors":"K. Floyd","doi":"10.1109/ASMC.1995.484405","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484405","url":null,"abstract":"In early 1990, the IBM Microelectronics Division Semiconductor Manufacturing facility in Essex Junction, Vermont was operating eight-hour shifts around-the-clock. To reduce cost and fulfill an ever increasing demand for its products, it became imperative that this traditional three-shift operation be refocused to more efficiently maximize the use of the facility's physical assets and the effectiveness of its people. After studying the work schedules of numerous companies in the United States and Europe, it was determined that a 12-hour shift schedule would result in a significant reduction in overtime and increased productivity, both key goals of site management. To implement such a dramatic change of schedules, however, would require an in-depth understanding of its effect on employees and their families. To achieve such an understanding, manufacturing employees were asked to participate in round table discussions, opinion surveys and discussions with middle and first-level managers. Some of the areas examined were travel time to work, arrangements for child care, spousal work schedules, sleeping habits and the overall status of an individual's health. A pilot program was launched before actually changing schedules. Compensation adjustments were reviewed during this program to determine the most flexible and attractive approach for employees, one that: also contributed to overall savings for the corporation. This approach to compensation has been changed only once since its inception. During the first half of 1990, IBM's semiconductor fabricators began their migration to the 12-hour, alternate work schedules (AWS). Productivity improvements and overall benefits of an alternate work schedule relative to the IBM manufacturing community will also be reviewed.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133810916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484375
Suraj Rao, Andrzej J. Strojwas, John Lehoczky, Schervish
We have developed a process monitoring system, in a Bayesian framework, which is designed to be used for monitoring VLSIC and other multi-stage manufacturing processes. For a single step process, the Bayesian monitor is at least as good as the Shewhart-CUSUM combination charts for detecting changes in the distribution of the in-lines collected from the step. For a multi-stage process, however, the Bayesian monitor can significantly reduce the detection time by using in-line correlation information from earlier stages.
{"title":"Monitoring VLSIC fabrication processes: a Bayesian approach","authors":"Suraj Rao, Andrzej J. Strojwas, John Lehoczky, Schervish","doi":"10.1109/ASMC.1995.484375","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484375","url":null,"abstract":"We have developed a process monitoring system, in a Bayesian framework, which is designed to be used for monitoring VLSIC and other multi-stage manufacturing processes. For a single step process, the Bayesian monitor is at least as good as the Shewhart-CUSUM combination charts for detecting changes in the distribution of the in-lines collected from the step. For a multi-stage process, however, the Bayesian monitor can significantly reduce the detection time by using in-line correlation information from earlier stages.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116596390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-11-13DOI: 10.1109/ASMC.1995.484352
R. Leachman
Formal definitions for the components of efficiency and capacity, mathematical formulas for computing overall efficiency, and data collection strategies are proposed for rigorous measurement of equipment efficiency and equipment capacity. Measurement of overall equipment efficiency (OEE) under the TPM paradigm is extended to support the maintenance of capacity parameters for production planning. The weaknesses of equipment analyses based on utilization and aggregate UPH (units per hour) figures are contrasted against the robustness of the proposed approach. Implementation in semiconductor factories is described.
{"title":"Closed-loop measurement of equipment efficiency and equipment capacity","authors":"R. Leachman","doi":"10.1109/ASMC.1995.484352","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484352","url":null,"abstract":"Formal definitions for the components of efficiency and capacity, mathematical formulas for computing overall efficiency, and data collection strategies are proposed for rigorous measurement of equipment efficiency and equipment capacity. Measurement of overall equipment efficiency (OEE) under the TPM paradigm is extended to support the maintenance of capacity parameters for production planning. The weaknesses of equipment analyses based on utilization and aggregate UPH (units per hour) figures are contrasted against the robustness of the proposed approach. Implementation in semiconductor factories is described.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130171685","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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