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High density and high performance ECL: some design tips 高密度和高性能ECL:一些设计技巧
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123168
T. Lyon
Recent developments in ECL (emitter-coupled logic) circuit technology have led to a new generation of high-density and higher-performance gate arrays. The choice of an ECL ASIC (application-specific integrated circuit) technology is discussed with regard to the use of proven versus new technology, ASIC benchmarks, and second sourcing. Design issues considered are the optimization of density and performance, power limits, estimated versus actual interconnect delays, pulse shrinkage and clocking, packaging, and cooling.<>
ECL(发射器耦合逻辑)电路技术的最新发展导致了新一代高密度和高性能的门阵列。ECL ASIC(专用集成电路)技术的选择讨论了关于使用经过验证的新技术,ASIC基准和二次采购。考虑的设计问题是密度和性能的优化,功率限制,估计与实际的互连延迟,脉冲收缩和时钟,封装和冷却。
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引用次数: 2
In-circuit-emulation in ASIC architectural core designs ASIC架构核心设计中的电路仿真
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123206
D. Pasternak, T. Hike
Software development and system integration in designs with microprocessors and microcontrollers is often accomplished with the aid of an in-circuit-emulator (ICE). Designs incorporating an architectural microcontroller core cell and peripheral cells embedded in an application-specific integrated circuit (ASIC) present additional challenges in software development and system integration. A description is given of the ASIC UCS51 family and a fully functional ICE that supports it. The core and peripheral cells are emulated with multiple ICs, and the user logic is emulated with programmable logic devices. Results of the first customer application and use are included.<>
在微处理器和微控制器的设计中,软件开发和系统集成通常借助于电路仿真器(ICE)来完成。将架构微控制器核心单元和嵌入特定应用集成电路(ASIC)的外围单元相结合的设计在软件开发和系统集成方面提出了额外的挑战。描述了ASIC UCS51系列和支持它的全功能ICE。核心和外围单元用多个ic进行仿真,用户逻辑用可编程逻辑器件进行仿真。包括第一个客户应用和使用的结果
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引用次数: 1
Analog macrocell layout generation 模拟宏单元格布局生成
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123228
R. Bowman
An object-oriented imaging model that automatically generates the physical layout of commonly used analog circuit macrocells based on input from an annotated net list is discussed. It provides information on constructed cells sufficient for parasitic element extraction. the imaging model is technology independent within fundamental process families (CMOS, bipolar, etc.) and currently includes a library of CMOS analog macrocells and associated physical templates. Templates are described by synthesis rules and graphics operators for two-dimensional shape generation.<>
讨论了一种面向对象的成像模型,该模型基于带注释的网络表输入自动生成常用模拟电路宏单元的物理布局。它提供了足以用于寄生元素提取的构造细胞的信息。成像模型在基本工艺家族(CMOS,双极等)中是技术独立的,目前包括CMOS模拟宏单元库和相关的物理模板。模板由合成规则和图形运算符描述,用于二维形状生成。
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引用次数: 1
A user-configurable RAM compiler for gate arrays 用户可配置的门阵列RAM编译器
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123239
R. L. Steinweg, M. Zampaglione, P. Lin
A flexible RAM compiler for gate arrays that is fully integrated into the user design tools is described. The various hardware and software features of the compiler are described, including variable aspect ratio with automatic selection, along with the design tool integration. The RAM compiled for minimum area came out with the 32 words in the core organized as 32 words down by one word across. It has a typical access time of about 10 ns. The RAM compiled for most square aspect ratio ended up with a core organization of 16 words down by 2 words across and an access time of about 8 ns. The RAM compiled for minimum access time has a core organization of 8 words down by 4 words across, and an access time of about 7 ns. If desired, other aspect ratio variations than those chosen automatically using the optimization criteria can be compiled by using the manual override option to specify the core organization directly.<>
描述了完全集成到用户设计工具中的门阵列灵活的RAM编译器。描述了该编译器的各种硬件和软件功能,包括可变长宽比和自动选择,以及设计工具的集成。为最小面积编译的RAM将内核中的32个单词按一个单词的顺序组织为32个单词。它的典型存取时间约为10ns。对于大多数方形宽高比编译的RAM,最终的核心组织是16个单词,每个单词有2个单词,访问时间约为8 ns。为最小访问时间而编译的RAM具有8个字的核心组织,每个字宽4个字,访问时间约为7 ns。如果需要,可以通过使用手动覆盖选项直接指定核心组织来编译使用优化标准自动选择的其他长宽比变化。
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引用次数: 2
Incremental netlist compilation for IKOS hardware logic simulator IKOS硬件逻辑模拟器的增量网表编译
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123223
K. Wang, J. Chen
Incremental compilation is desirable to avoid recompiling a large network when only a few modules are modified. An algorithm that partitions a network in a hierarchical manner is described. The linker links together separately compiled or linked modules to generate machine codes for the IKOS hardware simulator. The machine codes generated for the duplicate subnetworks (or logic blocks) need not be reproduced and can be loaded to the simulator for the times of occurrences by adjusting for the base offsets.<>
增量编译是可取的,以避免在只修改了几个模块时重新编译大型网络。描述了一种以分层方式划分网络的算法。链接器将单独编译或链接的模块链接在一起,以生成IKOS硬件模拟器的机器码。为重复的子网(或逻辑块)生成的机器码不需要被复制,并且可以通过调整基本偏移量来加载到模拟器中。
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引用次数: 0
Case study: an NTSC imaging system timing gate array design 案例研究:一种NTSC成像系统时序门阵列设计
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123214
J. Vincent
A case study of the design of a timing generator ASIC (application-specific integrated circuit) for an NTSC-compatible imaging system is presented. The case history includes many of the classic problems in this type of design. Consideration is given to the problems of changing specifications during the design process, adding special functionality while minimizing testability enhancements, the pressure of timeliness, and the importance of thoroughly verifying every part of the design.<>
介绍了一种用于ntsc兼容成像系统的定时发生器ASIC(专用集成电路)的设计实例。案例历史包括这种类型的设计中的许多经典问题。考虑到在设计过程中改变规格的问题,在减少可测试性增强的同时增加特殊功能,及时性的压力,以及彻底验证设计的每个部分的重要性。
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引用次数: 0
Creation of an undergraduate curriculum in ASIC design ASIC设计本科课程的创建
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123248
M.J.S. Smith, R. Jorgenson, C. Portmann, P. Tschang, C. Anagnostopoulos, R. Rao, P. Valdenaire, H. Ching
A VLSI program at the University of Hawaii initiated in 1987 is discussed. Since this time, the curriculum has been expanded to offer undergraduate classes in analog and digital VLSI design. The expansion and development of this new curriculum are described.<>
讨论了1987年在夏威夷大学发起的一个超大规模集成电路项目。从那时起,课程已经扩展到提供模拟和数字VLSI设计的本科课程。介绍了新课程的扩展和发展。
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引用次数: 0
PIMM1, an image processing ASIC based on mathematical morphology 基于数学形态学的图像处理专用集成电路PIMM1
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123209
J. Klein, R. Peyrard
To meet image analysis requirements in terms of processing speed and computing capacities, the authors have developed an ASIC (application-specific integrated circuit) with a programmable architecture, supporting the latest algorithms of mathematical morphology. Designed in 1.5- mu m CMOS technology, the ASIC can process 8-b images at a 20-MHz pixel frequency, in pipeline or in parallel. The architecture of PIMM1 is discussed, along with two multiprocessor organizations.<>
为了满足图像分析在处理速度和计算能力方面的要求,作者开发了一种具有可编程架构的专用集成电路(ASIC),支持最新的数学形态学算法。ASIC采用1.5 μ m CMOS技术设计,可以处理20mhz像素频率的8-b图像,可以流水线或并行处理。讨论了PIMM1的体系结构,以及两个多处理器组织。
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引用次数: 15
GaAs ASIC design case study GaAs ASIC设计案例研究
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123167
J. A. Heise
A design experience with GaAs ASICs (application-specific integrated circuits) is presented from the user's point of view. Vendor selection criteria, design experience, board considerations, and testings are discussed in detail. It is shown that through the application of GaAs ASICs a much greater understanding of what is required to implement them into a system has been achieved. Generally, these requirements do not differ greatly from those of other technologies, but there are some important differences to consider. It is concluded that the greater speed, temperature range, and radiation tolerance of GaAs, combined with the functionality and space-saving of ASICs, justify the additional design time.<>
从用户的角度介绍了GaAs专用集成电路的设计经验。详细讨论了供应商选择标准、设计经验、电路板考虑和测试。它表明,通过GaAs asic的应用,已经实现了对将它们实现到系统中所需的更多理解。一般来说,这些需求与其他技术的需求没有太大的不同,但是有一些重要的差异需要考虑。结论是,GaAs具有更高的速度、温度范围和辐射耐受性,加上asic的功能和节省空间,证明了额外的设计时间是合理的。
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引用次数: 0
GaAs ASIC technology GaAs ASIC技术
Pub Date : 1989-09-25 DOI: 10.1109/ASIC.1989.123166
A. Conoscenti
The state of the GaAs IC industry is summarized from an application-specific product perspective. Presently available products, packaging technology, applications, reliability, and future product directions are discussed.<>
从特定应用产品的角度总结了GaAs集成电路产业的现状。讨论了目前可用的产品、封装技术、应用、可靠性和未来的产品方向。
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引用次数: 0
期刊
Proceedings., Second Annual IEEE ASIC Seminar and Exhibit,
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