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Proceedings of the 1988 Bipolar Circuits and Technology Meeting,最新文献

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Characterization of polysilicon contacts by photoconductance measurements 用光电导测量方法表征多晶硅触点
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51062
B. Jalali, E. S. Yang
The confinement property of polysilicon contacts, leading to storage of minority carriers, has been studied using the photoconductivity technique. Steady-state and transient optical measurement show a considerable increase of stored carriers by these contacts. A model has been developed that allows the extraction of contact parameters.<>
利用光电导技术研究了多晶硅触点的约束特性,从而导致少量载流子的存储。稳态和瞬态光学测量表明,这些接触大大增加了存储载流子的数量。已经开发了一个可以提取接触参数的模型。
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引用次数: 0
The effect of emitter sidewall isolation on the emitter junction in a double layer polysilicon bipolar process 双层多晶硅双极工艺中发射极侧壁隔离对发射极结的影响
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51063
M. C. Wilson, D. Gold, P. Hunt, G. Booker
The 2D equi-concentration dopant contours are revealed for the first time for a cross-section through a 1 mu m double-layer polysilicon bipolar device. The planarity of the emitter junction is shown to be dependent on the presence of emitter sidewall spacer filters. Implications for ultrashallow junction devices are presented.<>
首次揭示了1 μ m双层多晶硅双极器件横截面的二维等浓度掺杂物轮廓。发射极结的平面度取决于发射极侧壁间隔滤波器的存在。提出了对超浅结器件的影响。
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引用次数: 5
Scaling issues in the evolution of ExCL bipolar technology ExCL双极技术发展中的尺度问题
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51061
J. Brighton, D. Verret, T.T. Ten Eyck, M.T. Welch, R. E. McMann, M. Torreno, A. Appel, M. Keleher
Several issues encountered in scaling ExCL technology are discussed. It is shown that doping profile scaling below 0.15 mu m base width puts severe restrictions on process latitude. It is demonstrated that the polysilicon emitter resistance can be significantly reduced by rapid thermal annealing. Capacitance calculations show that interconnect-related parasitics do not scale below 3 mu m pitch, and intralevel coupling may provide the ultimate limitation of interconnect scaling. Finally, the ExCL metallization scheme is proven to be scalable to 2 mu m metal pitch.<>
讨论了扩展ExCL技术时遇到的几个问题。结果表明,在0.15 μ m基宽以下掺杂谱线缩放会严重限制工艺纬度。结果表明,快速热退火可以显著降低多晶硅发射极电阻。电容计算表明,互连相关的寄生效应在3 μ m间距以下不会缩放,电平内耦合可能是互连缩放的最终限制。最后,ExCL金属化方案被证明可扩展到2 μ m的金属间距。
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引用次数: 7
CML III bipolar standard cell library CML III双极标准细胞库
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51073
B. Tufte
A 1.25 mu m current mode logic (CML) bipolar standard cell library with subnanosecond loaded gate delays is discussed. Unique computer-aided design CAD tools that produce accurate models of the library cells and optimize designs for area, speed, and power are also discussed. The interplay between the library and the tools can produce higher speed, lower power chips, at less cost.<>
讨论了一个具有亚纳秒负载门延迟的1.25 μ m电流模式逻辑(CML)双极标准单元库。独特的计算机辅助设计CAD工具,产生准确的模型库细胞和优化设计的面积,速度和功率也进行了讨论。库和工具之间的相互作用可以产生更高的速度,更低的功耗芯片,以更低的成本
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引用次数: 2
Energy-gap and electron-affinity contractions and their importance in bipolar device simulators 能隙和电子亲和收缩及其在双极装置模拟器中的重要性
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51076
F. Lindholm, B. Wu
Simulations using bipolar device simulators show that moderate injection can exist in heavily doped portions of a transistor base and that very high injection can exist throughout a current-extended or pushed out part of a quasineutral base layer of a high-speed digital device. Physical models now in bipolar device simulators neglect the dependence of the effective intrinsic density and the corresponding effective energy-gap contraction on high concentrations of mobile electrons and holes. Further they assume that the conduction-band and valence-band shifts are equal in magnitude and thus equal to half of the magnitude of the generalized electron-affinity contraction. New results from experiment and theory demonstrate the incompleteness of these physical models, and the engineering significance of this incompleteness is assessed.<>
使用双极器件模拟器的模拟表明,中等注入可以存在于晶体管基极的高掺杂部分,而非常高的注入可以存在于高速数字器件的准中性基极层的整个电流扩展或推出部分。目前双极器件模拟器中的物理模型忽略了有效本征密度和相应的有效能隙收缩对高浓度移动电子和空穴的依赖。此外,他们假设电导带和价带位移的幅度相等,因此等于广义电子亲和收缩幅度的一半。新的实验和理论结果证明了这些物理模型的不完全性,并对这种不完全性的工程意义进行了评价。
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引用次数: 3
Package design for a microwave laser driver 微波激光驱动器的封装设计
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51068
M. Caggiano
A transmission line approach was employed in the design of the package for the laser driver. Two configurations were needed for routing the RF signal paths for the inputs and outputs. A modified microstrip, with ground shielding on both sides, was used to route the signal from the external lead to the central part of the package. A via, centered between two rows of ground vias, was used to route the signal path up to the chip level in the package. The results of electrical measurements performed on the four RF signal leads of the package are included. The measurements were made employing an HP-8510B network analyzer calibrated with a set of TRL fixtures. The results showed that the package would be good to 4.3 GHz for a return loss of -20 dB.<>
采用传输线的方法设计激光驱动器的封装。为输入和输出路由射频信号路径需要两种配置。一个改进的微带,两侧有接地屏蔽,用于将信号从外部引线路由到封装的中心部分。位于两排接地过孔中间的一个过孔,用于将信号路径路由到封装中的芯片级。包括对封装的四个射频信号引线进行的电气测量结果。测量采用HP-8510B网络分析仪校准一套TRL夹具。结果表明,在回波损耗为-20 dB.>的情况下,该封装可以很好地工作在4.3 GHz
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引用次数: 0
Electron recombination at the silicided base contact of an advanced self-aligned poly-silicon emitter 先进自对准多晶硅发射极硅化基极接触处的电子复合
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51079
J. de Jong, R. Lane, J. de Groot, G. Conner
An advanced self-aligned high-speed bipolar transistor (HS4) with a polysilicon emitter is presented. The silicided external base region is separated from the polysilicon emitter by an oxide sidewall spacer. The effect of the spacer width and the dopant concentration underneath this spacer on the electron recombination current at the base contact is described.<>
提出了一种具有多晶硅发射极的自对准高速双极晶体管(HS4)。所述硅化的外基极区域通过氧化物侧壁间隔层与所述多晶硅发射极分离。描述了间隔层宽度和间隔层下掺杂物浓度对基极接触处电子复合电流的影响。
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引用次数: 11
Optimization and temperature dependence of current gain in polysilicon-emitter-contacted bipolar transistors 多晶硅发射体-接触双极晶体管电流增益的优化及温度依赖性
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51043
C.L. Williams, D.M. Kim, C. Clawson
Presented herein are the results of an experimental and theoretical investigation of the factors influencing the current gain of a polysilicon-emitter-contacted bipolar transistor (PEC transistor). Specifically, the temperature behavior of gain and its optimization are comprehensively discussed. The results show that the PEC transistor exhibits a stronger temperature dependence when compared with conventional transistors. This is attributed to the diffusion length of minority carriers (holes) in the polysilicon. The modeling of the gain (h/sub fe/) reveals that the mobility and the recombination lifetime of the minority carriers in the polysilicon are the key parameters for optimizing h/sub fe/ in PEC transistors.<>
本文对影响多晶硅发射体-接触双极晶体管电流增益的因素进行了实验和理论研究。具体来说,对增益的温度特性及其优化进行了全面的讨论。结果表明,与传统晶体管相比,PEC晶体管表现出更强的温度依赖性。这归因于多晶硅中少数载流子(空穴)的扩散长度。对增益(h/sub fe/)的建模表明,多晶硅中少数载流子的迁移率和复合寿命是优化PEC晶体管中h/sub fe/的关键参数。
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引用次数: 3
A precision op amp with +/-80 mA output current, 200 v/usec slew rate, and a gain-bandwidth product of 0.7 GHz 高精度运算放大器,输出电流为+/- 80ma,转换速率为200v /usec,增益带宽积为0.7 GHz
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51049
T. Ngo, R. Hester
A three-stage operational amplifier has been designed and fabricated on a conventional process that achieves an unprecedented combination of performance for a precision operational amplifier. The amplifier provides high speed, wide bandwidth, precision DC characteristics, and high-output current drive capability. It also has the highest open-loop voltage gain and smallest chip size recorded for a precision op amp.<>
采用传统工艺设计和制造了一种三级运算放大器,实现了精密运算放大器前所未有的性能组合。该放大器提供高速、宽带宽、精确的直流特性和高输出电流驱动能力。它还具有最高的开环电压增益和最小的芯片尺寸记录的精密运放。
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引用次数: 0
JFET-input, high speed comparator standard cell designed on a new series of analog arrays jfet输入,高速比较器标准单元设计在一系列新的模拟阵列上
Pub Date : 1988-09-12 DOI: 10.1109/BIPOL.1988.51050
M. Metcalf
A monolithic JFET input comparator with performance that far exceeds any prior art has been designed on a semicustom IC. The use of the analog array provided benefits in design effort, manufacturing time and layout versatility without sacrificing excellence performance.<>
在半定制集成电路上设计了一种性能远远超过现有技术的单片JFET输入比较器。使用模拟阵列在设计工作,制造时间和布局通用性方面提供了好处,而不会牺牲卓越的性能。
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引用次数: 1
期刊
Proceedings of the 1988 Bipolar Circuits and Technology Meeting,
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